TW200900346A - Integrally formed micro extending type elastic probe - Google Patents
Integrally formed micro extending type elastic probe Download PDFInfo
- Publication number
- TW200900346A TW200900346A TW96122768A TW96122768A TW200900346A TW 200900346 A TW200900346 A TW 200900346A TW 96122768 A TW96122768 A TW 96122768A TW 96122768 A TW96122768 A TW 96122768A TW 200900346 A TW200900346 A TW 200900346A
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- spring
- micro
- needle
- type
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000005323 electroforming Methods 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 claims 1
- 230000037237 body shape Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 241001236652 Orthodon Species 0.000 description 1
- 241001494479 Pecora Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 235000021152 breakfast Nutrition 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008774 maternal effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 235000015170 shellfish Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96122768A TW200900346A (en) | 2007-06-23 | 2007-06-23 | Integrally formed micro extending type elastic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96122768A TW200900346A (en) | 2007-06-23 | 2007-06-23 | Integrally formed micro extending type elastic probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200900346A true TW200900346A (en) | 2009-01-01 |
| TWI324136B TWI324136B (https=) | 2010-05-01 |
Family
ID=44721334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96122768A TW200900346A (en) | 2007-06-23 | 2007-06-23 | Integrally formed micro extending type elastic probe |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200900346A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI395953B (zh) * | 2009-02-05 | 2013-05-11 | 京元電子股份有限公司 | 測試探針及探針座 |
| TWI866204B (zh) * | 2023-05-11 | 2024-12-11 | 中華精測科技股份有限公司 | 垂直式探針卡及其開放式探針 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014087906A1 (ja) * | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | 電気的接触子 |
-
2007
- 2007-06-23 TW TW96122768A patent/TW200900346A/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI395953B (zh) * | 2009-02-05 | 2013-05-11 | 京元電子股份有限公司 | 測試探針及探針座 |
| TWI866204B (zh) * | 2023-05-11 | 2024-12-11 | 中華精測科技股份有限公司 | 垂直式探針卡及其開放式探針 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI324136B (https=) | 2010-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |