200849448 九、發明說明： 【發明所屬之技術領域】 本發明係關於一般半導體裝置製造，尤其係關於感剛 承載件中基板之方法及設備。 【先前技術】 傳統半導體製造設施包含許多處理系統（「工具」）， 其中在工件（矽基板、玻璃板等等）上執行一系列處理步 驟。這些步驟可包含拋光、沈積、蝕刻、光微影、熱處理 等。一般而言，這些處理都在製造設施内許多位置上執行 並且因此需要在設施内將基板從一處理位置輸送至另— 位 置。 傳統上在類似密閉艙、卡匣、容器等之基板承载件内 將基板從一處理位置輸送至另一位置。傳統上也運用自動 化基板承載件運輸裝置，像是自動導引車輛、頂置傳輪系 統、基板承載件處理機器人等，在製造設施内自一位 夏移 動基板承載件至另一位置，或運輸數個基板承载件來回於 一個基板承载件運輸裝置。 在傳統自動化基板處理系統内’將基板承載件運輪 J至 載入口，在此末端效應器（例如機器手臂）可將基板裁入承 載件或從承载件中取出。傳統載入口必須打開承载件門， 以便感測承载件内基板是否存在。打開承載件門要花時 間，並且也潛在暴露承載件内部遭受污染的風險。因此， 需要一種在載入口上不用打開承載件門就可感測承載件内 5 200849448 具有基板之方法及設備。 【發明内容】 在本發明的第一態樣内，提供一種對映基板承 容的方法。該方法包含（1)將一承載件移動至一感满 及（2)利用該感測器根據該承載件内一基板夾的位 該承載件内是否有一基板存在。 在本發明的第二態樣内，提供一種基板承載件 含（1) 一凹槽，其調適成支撐一基板；以及（2) 一基 構’其調適成將該基板固定在該凹槽内，並且調適 基板放入該凹槽内時從一第一位置換至一第二位置 該基板承載件關閉時可偵測到該第一與第二位置 〇 在本發明的第三態樣内，提供一種設備，其 一載入口；以及（2)—基板承載件，其具有（a)一凹柄 適成支撐一基板；以及（b)—基板夾結構，其調適成 y 板固定在該凹槽内，並且調適成當該基板放入該凹 從一第一位置換至一第二位置。當該基板承载件輕 載入口並且該基板承載件關閉時，可偵測該第一和 置至少之一。 ， 在本發明的第四態樣内，提供一種設備，其 一基板承載件，其具有一本體，該本體上有一或多 增加該承載件高度的通道；（2)一載入口，其具有一 構’該開門機構具有一或多突出物，可調適裝入該 载件内 丨器；以 置決定 ’其包 板夾結 成當該 ，其中 至少之 包含（1) ^，其調 將該基 槽内時 合至該 第二位 包含（1) 個不會 開門機 基板承 6 200849448 载件的該一或多通道内；以及（3)一光感測器， 開門機構的一或多該突出物，該光感測器在當 件耦合至該載入口時調適以偵測該基板承载件 一基板。在此提供其他許多態樣。 從下列實施方式、後附申請專利範圍以及 會更清楚了解到本發明的其他特徵與態樣。 【實施方式】 本發明的具體實施例提供不用打開承载件 承載件内是否具有基板之方法及設備。在某些 内，將基板放置在承載件内導致一或多個旗標 每一旗標與將基板固定在承載件特定凹槽内的 聯。因此特定旗標的位置指示承載件内與其相 否有基板存在。這種位置可用許多方式偵測而 載件，如下所說明。 根據本發明的第一具體實施例（第丨A圖至 利用將穿過承載件的光束遮斷來感測承载件内 某些具體實施例内，光束來源與偵測器都在承 如此不用打開承載件就可偵測承載件内的基板 根據本發明的第二具體實施例（第2 的移動導致$成包含承載㈣導電_的電路 到連載人口時’不用打開承載件就可價測到承 板0 根據本發明的第三具體實施例（第3圖）， 其輕合至該 該基板承栽 内是否存在 附圖中，將 門就可感測 具體實施例 移動，其中 特定夾相關 關位置上是 不用打開承 第1F圖）， 有基板。在 載件之外， 〇 基板夾旗標 。當承载件 載件内有基 基板夾旗標 7 200849448 的移動導致磁致開關關閉，因此完成包含承載件内導電路 徑的電路。當承载件到達载入口時，不用打開承载件就可 偵測到承載件内有基板。 根據本發明其他幾個具體實施例（第4A圖至第4c 圖）’承载件與載入口一起形成一系統，用於偵測承载件内 是否有基板存在而不用打開承載件。該系統可配置成根據 中斷的光路徑或完整的電路來偵測基板。 第1A圖至第1B圖圖解說明本發明的第一具體實施 例。第1A圖為根據本發明所提供的基板承載件1 〇丨之正 視圖（也就是，當承載件移動至载入口裝載或卸載基板時從 載入口看向基板承载件）。第圖為根據本發明所提供載 入口（未顯示）的開門機構102之正視圖。開門機構1〇2包 含支推構件107，其調適成當承載件1〇1前往载入口進行 裝載或却载操作時，接觸並支撐基板承載件1〇1的門。在 某些具體實施例内，承載件1〇1其内具有通道1〇3，通道 的大小和位置分別和光源及感測器組件i 〇5a、吻合， 該組件固定在、形成於或耦合至支撐構件1〇7，如第圖 内所示。 如第1B圖内所示，由固定在感測器組件i〇5b内的感 測器111偵測感測器組件1〇5a内光源（例如未分開顯示的 LED或其他光源）所產生的光束1〇9。承載件ι〇1 (或至少 其窗口部分103 a)由光束109可穿透的材料製成❶窗口部 分103a可由塑膠或任何其他合適的材料所製成。 第1C圖至第1E圖為根據本發明基板承載件1〇1停靠 8 200849448 在載入口 1〇6上的圖解俯視圖。如第1B圖至第ie圖内所 示，感測器組件1〇5a、1〇5b透過突出物或固定物1〇8從開 門機構107突出，如此當成載件1〇1運送至載入口 1〇6並 且定位成與載入口 106相鄰來裝載或卸載基板，則感測器 組件105a、105b延伸超過承載件1〇1的區域與承載件ι〇ι 的門115相鄰，並且光束1〇9直接穿過承载件ι〇ι。在某 些具體實施例内，若承载件1〇1上沒有基板11〇，則光束 109穿過承載件1〇1並且在感測器ln上偵測到光束（第m 圖）。若基板110存在於承载件1〇1内，則基板11〇或與將 基板11〇固定在承载件101的凹槽106内之固定夾相 關之旗標113a將遮斷光束109，因此導致感測器lu產生 信號指示基板110存在。在其他具體實施例内，承載件ι〇ι 内存在有基板110將導致基板110以及/或相關固定失 固定基板110,讓光束丨09穿過承载件1〇1。如第1C圖至 第1E圖内所示，在某些具體實施例内，開門機構1〇7會 接觸承載件門115，支撐門115 ,然後隨門115與承載件 101剩餘部份分離，允許進入承载件1〇1内。基板存在以 及/或位置可在門115打開以及/或移除之前、之時以及/或 之後決定。承載件1〇1、開門機構1〇7或兩者都會移動。 第1?圖為根據本發明其中裝置基板110的承載件1〇1 之圖解俯視圖。位於承載件門1 1 5附近的基板夾i i 3將基 板11〇固定在凹槽116内。在某些具體實施例内，基板炎 113合併有旗標U3a，用於在固定夾113固定基板時遮斷 光束109。在其他具體實施例内，旗標n3a只有在基板不 200849448 在承载件101内時遮斷光束109。旗標113a可為基板夾機 構的附屬物，如第1F圖内所示。另外，旗標1 1 3 a可個別 形成並且用機械連桿連接至固定夾113，或與固定夾113 機械分離但是當機板裝載入承載件凹槽116時配置為移 吾人應該注意，承載件1 〇 1可設計成固定許多基板， 如此包含許多具有對應旗標的固定夾。在某些具體實施例 内，這些旗標的位置彼此錯開，如此當基板裴載在連接到 旗標11 3 a的固定夾1 1 3内，任何已知的旗標遮斷個別光束 到達特定感測器（或感測器圖案），或允許個別光束到達特 定感測器。因此，遮斷或通過的光束圖案不僅可指示承载 件101内有基板，而且指示承載件101中哪些凹槽内有基 板。 在其他具體實施例内，圖解顯示在第2圖内，每一基 板夾113都提供電路201，用來感測固定夾113所固定的 基板存在。固定夾113的一部分（例如旗標i13a)包含電接 點203。在某些具體實施例内，當基板裝載入承載件1〇1 内並由固定夾113固定，如此導致固定夾113移動，這樣 接點203、205會關閉，因此完成承載件門115上或承载件 101上任何其他合適位置上點207和209之間的導電路# (為了清晰起見，顯示在將基板裝載入固定夾而接點2〇3、 205關閉之前）。在其他具體實施例内，當由固定夾丨丨3固 定基板時接點203、205會打開。 在载入口上（例如在支撐構件1 07上，第2圖内未顯示） 10 200849448 提供合適的電接點，來與接點2〇7、2〇9匹配。當 件101並與載入口的支撐構件107接觸，若關閉3^ 205則形成完整電路。然後電路2〇1内的電流指 夾113相關的承載件101凹槽内存在有基板。在 實施例内，具有多基板凹槽的多基板承載件的每 具有固定夾以及/或旗標’而接點207、209對應 別固定夾11 3。因此，從承載件門丨丨5到載入口 流過特定接點組的電流指示多基板承載件的特定 裝載基板’如此不用打開承载件門丨丨5就可偵測承 内基板的存在與位置。 在前述具體實施例内，固定夾丨丨3的實際移 接點203、205直接關閉或打開。在其他具體實施 解顯示在第3圖内，使用與一部分固定夾113相 磁鐵303來啟動電路301。例如：當基板11〇裝 件101的凹槽内並且由固定夾113固定，則固定 移動將磁鐵303帶至足夠接近磁鐵305，如此磁 致磁鐵305往箭頭307的方向移動。磁鐵305由 械連桿連接至電接點309，如此磁鐵305往方向 導致接點309、311關閉，在承载件門115上（或承 其他合適位置上）點313與315之間形成導電路徑 瞭解，磁鐵305與接點309、311 —起形成磁致電 可具有許多可能組態。在某些具體實施例内，承 内存在基板可導致接點3 09、311分離。磁斥力也 開或關閉接點309、311。 帶來承載 秦點203、 出與固定 某些具體 一凹槽都 至每一個 (未顯示） 凹槽内已 載件1 0 1 動導致電 例内，圖 關的永久 载入承載 夾113的 性相吸導 4適的機 307移動 载件1 0 1 。吾人將 開關，其 载件凹槽 可用於打 11 200849448 如先前具體實施例内所示，在載入口上（例如在支撐構 件1〇7上’第3圖内未顯示)提供合適的電接點，來與接點 313、315匹配。當帶來承載件ι〇ι並與載入口的支撐構件 107接觸，若關閉接點3〇9、3 路301内的電流指出承载件 板。在某些具體實施例内，具 件的每一凹槽都具有固定夾以 對應至每一個別固定夾丨丨3。 入口（未顯示）流過特定接點組 特定凹槽内已裝載基板，如此 偵測承载件1 〇 1内基板的存在 11則形成完整電路。然後電 101内存在（或不存在）有基 有多基板凹槽的多基板承载 及/或旗標，而接點3 1 3、3 1 5 因此，從承载件門1 1 5到載 的電流指出多基板承載件的 不用打開承載件門11 5就可 與位置。200849448 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to the manufacture of general semiconductor devices, and more particularly to a method and apparatus for a substrate in a rigid carrier. [Prior Art] A conventional semiconductor manufacturing facility includes a number of processing systems ("tools") in which a series of processing steps are performed on a workpiece (a substrate, a glass plate, etc.). These steps may include polishing, deposition, etching, photolithography, heat treatment, and the like. In general, these processes are performed at a number of locations within the manufacturing facility and therefore require the substrate to be transported from one processing location to another within the facility. The substrate is conventionally transported from one processing location to another in a substrate carrier such as a closed capsule, cassette, container or the like. Traditionally, automated substrate carrier transport devices, such as automated guided vehicles, overhead transport systems, substrate carrier handling robots, etc., have been used to move substrate carriers from one location to another in a manufacturing facility, or to transport A plurality of substrate carriers are transported back and forth to a substrate carrier transport device. In the conventional automated substrate processing system, the substrate carrier is transported to the loading port where the end effector (e.g., robotic arm) can cut the substrate into or out of the carrier. The conventional loading port must open the carrier door to sense the presence of the substrate within the carrier. Opening the carrier door takes time and also potentially exposes the interior of the carrier from the risk of contamination. Therefore, there is a need for a method and apparatus for sensing a substrate in a carrier without opening the carrier door. SUMMARY OF THE INVENTION In a first aspect of the invention, a method of entraining a substrate is provided. The method includes (1) moving a carrier to a sense of presence and (2) utilizing the sensor to determine whether a substrate is present in the carrier based on the position of a substrate holder within the carrier. In a second aspect of the present invention, there is provided a substrate carrier comprising: (1) a recess adapted to support a substrate; and (2) a substrate adapted to secure the substrate in the recess And adjusting the first and second positions in the third aspect of the present invention when the substrate carrier is closed from a first position to a second position when the substrate is placed in the recess, Providing an apparatus having a loading port; and (2) a substrate carrier having (a) a concave handle adapted to support a substrate; and (b) a substrate clamping structure adapted to be fixed to the y plate The recess is adapted to be changed from a first position to a second position when the substrate is placed in the recess. At least one of the first sum may be detected when the substrate carrier is lightly loaded into the port and the substrate carrier is closed. In a fourth aspect of the present invention, there is provided an apparatus, a substrate carrier having a body having one or more passages for increasing the height of the carrier; and (2) a loading port having The structure of the door opening mechanism has one or more protrusions, and is adapted to be loaded into the carrier device; the setting is determined by the fact that the package plate is sandwiched into the body, wherein at least the inclusion of (1) ^ The second position in the slot includes (1) one or more channels that do not open the base unit 6 200849448; and (3) a light sensor, one or more of the door opening mechanism The photo sensor is adapted to detect a substrate of the substrate carrier when the component is coupled to the carrier. Many other aspects are provided here. Further features and aspects of the present invention will become apparent from the following description of the appended claims. [Embodiment] A specific embodiment of the present invention provides a method and apparatus for having a substrate without opening the carrier carrier. In some cases, placing the substrate within the carrier results in one or more flags, each flag being associated with securing the substrate within a particular recess of the carrier. Therefore, the position of a particular flag indicates the presence of a substrate within the carrier. This position can be detected in a number of ways with the carrier as explained below. In accordance with a first embodiment of the present invention (Fig. A to the use of a beam that will traverse the beam of the carrier to sense the carrier, in some embodiments, the beam source and the detector are in such a way that they do not need to be opened The carrier can detect the substrate in the carrier according to the second embodiment of the present invention (the second movement causes the circuit to include the carrying (four) conductive_ to the serial population], and the price can be measured without opening the carrier. Plate 0 is in accordance with a third embodiment of the present invention (Fig. 3), which is lightly coupled to the presence or absence of the substrate in the drawing, and the door is sensed to move the specific embodiment, wherein the particular clip is associated with the closed position It is not necessary to open the 1F figure), there is a substrate. In addition to the carrier, the 〇 substrate clamp flag. When the carrier carrier has a base substrate clip flag 7 200849448 movement causes the magnetic switch to close, thus completing the load bearing The circuit of the conductive path in the piece. When the carrier reaches the loading port, the substrate in the carrier can be detected without opening the carrier. According to other specific embodiments of the present invention (Fig. 4A to Fig. 4c) The carrier and the carrier form a system for detecting the presence of a substrate in the carrier without opening the carrier. The system can be configured to detect the substrate based on the interrupted light path or the complete circuit. Figure 1 to Figure 1B illustrate a first embodiment of the present invention. Figure 1A is a front elevational view of a substrate carrier 1 according to the present invention (i.e., when the carrier is moved to the loading port for loading or unloading) The substrate is viewed from the loading port toward the substrate carrier.) The figure is a front view of the door opening mechanism 102 provided with a loading port (not shown) according to the present invention. The door opening mechanism 1〇2 includes a pushing member 107 adapted to When the carrier 1〇1 goes to the loading port for loading or loading operation, the door of the substrate carrier 1〇1 is contacted and supported. In some embodiments, the carrier 1〇1 has a channel 1〇3 therein. The size and position of the channel are respectively matched with the light source and sensor assembly i 〇 5a, which is fixed, formed or coupled to the support member 1〇7 as shown in the figure. As shown in FIG. 1B Fixed by the sensor assembly i〇5b The sensor 111 detects the light beam 1〇9 generated by the light source (for example, an LED or other light source that is not separately displayed) in the sensor assembly 1〇5a. The carrier ι〇1 (or at least its window portion 103 a) Made of a material transparent to the beam 109, the window portion 103a can be made of plastic or any other suitable material. Figures 1C to 1E show the substrate carrier 1〇1 docked according to the present invention 8 200849448 at the entrance A schematic plan view on 1〇6. As shown in Figures 1B to IE, the sensor assemblies 1〇5a, 1〇5b protrude from the door opening mechanism 107 through the protrusions or fixtures 1〇8, thus acting as carriers The carrier assembly 105a, 105b extends beyond the area of the carrier 1〇1 and the carrier ι〇ι1. The doors 115 are adjacent and the beam 1〇9 passes directly through the carrier ι〇ι. In some embodiments, if there is no substrate 11〇 on the carrier 1〇1, the beam 109 passes through the carrier 1〇1 and a beam is detected on the sensor ln (mth diagram). If the substrate 110 is present in the carrier 1〇1, the substrate 11〇 or the flag 113a associated with the fixing clip that fixes the substrate 11〇 in the recess 106 of the carrier 101 will block the light beam 109, thus causing sensing The device lu generates a signal indicating the presence of the substrate 110. In other embodiments, the presence of the substrate 110 in the carrier ι〇 will result in the substrate 110 and/or the associated fixed offset substrate 110, allowing the beam 丨 09 to pass through the carrier 〇1. As shown in Figures 1C-1E, in some embodiments, the door opening mechanism 1〇7 will contact the carrier door 115, support the door 115, and then separate the door 115 from the remainder of the carrier 101, allowing Enter the carrier 1〇1. The presence and/or position of the substrate can be determined before, during, and/or after the door 115 is opened and/or removed. The carrier 1〇1, the door opening mechanism 1〇7 or both will move. 1 is a diagrammatic plan view of a carrier 1〇1 of a device substrate 110 in accordance with the present invention. A substrate holder i i 3 located near the carrier door 1 1 5 secures the substrate 11〇 in the recess 116. In some embodiments, the substrate inflammation 113 incorporates a flag U3a for interrupting the beam 109 when the substrate is secured by the retaining clip 113. In other embodiments, flag n3a only blocks beam 109 when substrate is not 200849448 within carrier 101. The flag 113a can be an appendage of the substrate holder mechanism as shown in Figure 1F. In addition, the flag 1 1 3 a may be formed separately and connected to the fixed clip 113 by a mechanical link or mechanically separated from the fixed clip 113 but configured to be removed when the board is loaded into the carrier recess 116, the bearing Piece 1 〇1 can be designed to hold a large number of substrates, thus containing a number of retaining clips with corresponding flags. In some embodiments, the positions of the flags are staggered from each other such that when the substrate is loaded within the fixed clip 1 1 3 connected to the flag 113 a, any known flag intercepts the individual beam to reach a particular sensing (or sensor pattern), or allow individual beams to reach a particular sensor. Therefore, the beam pattern that is interrupted or passed can indicate not only the substrate in the carrier 101 but also which of the grooves in the carrier 101 have a substrate therein. In other embodiments, illustrated in Figure 2, each of the substrate clips 113 provides a circuit 201 for sensing the presence of a substrate to which the clips 113 are attached. A portion of the clip 113 (e.g., flag i13a) includes an electrical contact 203. In some embodiments, when the substrate is loaded into the carrier 1〇1 and secured by the retaining clip 113, the mounting clip 113 is moved such that the contacts 203, 205 are closed, thus completing the carrier door 115 or Guide circuit # between points 207 and 209 at any other suitable location on carrier 101 (for clarity, is shown before the substrate is loaded into the retaining clip and contacts 2〇3, 205 are closed). In other embodiments, the contacts 203, 205 will open when the substrate is secured by the fixed jaws 3. On the loading port (for example on the support member 107, not shown in Figure 2) 10 200849448 A suitable electrical contact is provided to match the contacts 2〇7, 2〇9. When the piece 101 is in contact with the support member 107 of the loading port, if the 3^205 is closed, a complete circuit is formed. Then, there is a substrate in the groove of the carrier 101 associated with the current finger 113 in the circuit 2〇1. In an embodiment, the multi-substrate carrier having the multi-substrate recesses has a retaining clip and/or flag' and the contacts 207, 209 correspond to the retaining clips 113. Therefore, the current flowing from the carrier threshold 5 to the loading inlet through the specific contact group indicates the specific loading substrate of the multi-substrate carrier. Thus, the presence of the inner substrate can be detected without opening the carrier threshold 5 position. In the foregoing specific embodiment, the actual transfer points 203, 205 of the fixed jaws 3 are directly closed or opened. In other embodiments, shown in Fig. 3, the circuit 301 is activated using a magnet 303 associated with a portion of the clip 113. For example, when the substrate 11 is recessed in the recess of the substrate 101 and fixed by the fixing clip 113, the fixed movement brings the magnet 303 close enough to the magnet 305, so that the magnet 305 moves in the direction of the arrow 307. The magnet 305 is connected to the electrical contact 309 by a mechanical linkage such that the magnet 305 causes the contacts 309, 311 to close in a direction, forming a conductive path between the points 313 and 315 on the carrier door 115 (or at other suitable locations). The magnet 305, together with the contacts 309, 311, can form a magnetic call with many possible configurations. In some embodiments, the presence of the substrate in the substrate can cause the contacts 3 09, 311 to separate. The magnetic repulsion also turns the contacts 309, 311 on or off. Bringing the bearing Qin point 203, out and fixing some specific one groove to each (not shown) in the groove, the loaded part 1 0 1 moves into the electric case, the figure is permanently loaded with the load clip 113 The phase suction machine 307 moves the carrier 1 0 1 . We will switch, the carrier groove can be used to hit 11 200849448 as shown in the previous embodiment, providing suitable electrical contacts on the loading port (eg not shown on the support member 1 ' 7 'not shown in Figure 3) , to match the contacts 313, 315. When the carrier ι〇 is brought into contact with the support member 107 of the load port, if the current in the contacts 3〇9, 3 is closed, the carrier plate is pointed. In some embodiments, each groove of the component has a retaining clip to correspond to each individual retaining clip 3. The inlet (not shown) flows through the specific contact group. The substrate is loaded in the specific groove, so that the presence of the substrate inside the carrier 1 侦测 1 is detected to form a complete circuit. Then there is (or does not exist) a multi-substrate bearing and/or flag with multi-substrate recesses in the electrical 101, and the contacts 3 1 3, 3 1 5 thus, the current from the carrier gate 1 1 5 It is pointed out that the multi-substrate carrier can be placed in position without opening the carrier door 115.
第4A圖至第4C圖說明根據本發明不用打開承載件就 可偵測承载件内基板是否存在之系統；這些系統包含承载 件ιοί和载入口 40卜第4A圖為顯示將承載件ι〇ι朝開門 機構403移動來開啟基板承載件1〇1的門之透視圖。 在某些具體實施例内，基板承载件1〇1使用葉片接收器 4〇5a、4〇5b和頂置傳輸凸緣4〇7支撐（如此允許基板承載 件高密度堆疊）。開門機構403包含支撐構件1〇7,該構件 調適成接觸並支撐基板承載件101的門115。在基板裝載/ 卸載操作期間，支撐構件107將承载件門115移動至開啟 位置（例如在某些具體實施例内將門旋轉至基板承載件 101剩餘部份之下，不過也可使用其他組態）。可運用直線 致動器或其他致動器409 (例如氣動、馬達驅動、液壓等等 致動器）相對於開門機構403來接駁/分離基板承載件1〇1。 12 200849448 第4B圖顯不第4A圖系統的示例性具體實施例之側視 圖’顯示載入口 4〇1的支撐構件1〇7之剖面。第4b圖圖 解說明其中載人σ 401上光電電路4ΐι配置成門ιΐ5不用 開啟就能指出承載# 101内是否存在基板之系統。在某些 具體實施例内’延伸物402將感測器組件1〇5&、1〇处固定 在支撐構件107的上半部與下半部。感測器組件！05a、105b 包含光束源以及摘測器413、415 (反之亦然），在至少部分 承載件ι〇1内部形成可遮斷的光路徑416。 如…内所示停泊在載入口 4〇1上，則根據=ι〇ι 的旗標以及/或固定夾放置位置來遮斷光路徑‘Μ (之前說 明過），指示承载件101特定凹槽内是否存在基板。 ϋ 第4C圖顯示第4A ®中系統的其他示例性側視圖。第 4C圖圖解說明運用本發明的系統，其中電路421配置成門 us不用開啟就能指出承載件1〇1内是否存在基板。在承 载件101内，根據與承載件101的凹槽相關的旗標以及/ 或固足夾放置位置（之前說明過），電接點423、425會接 通。接點423、425關閉導致在承載件門115的接點θ427 和429之間形成導電路徑。當承載件1〇1停泊在載入口 工 上，承載件ιοί的接點427、429分別與支撐構件1〇7的接 點43丨、433吻合，指示承載件特定凹槽内是否有基板。在 某些具體實施例内，可機械或磁性控制接點423、425的移 動（如之前所說明）。 在上列任何具體實施例内，可決定基板承载件的接點 或決定哪個基板承載件的凹槽包含基板之對映（例如可對 13 200849448 映承載件内容圖）。在¥此 ;隹杲些具體實施例内，在 内形成通道103，如此不备描上7 如此不會增加承载件1 0 1的' 許更大的堆疊密度）。 m說明僅揭巾本發明的示m生具體實施 通此技術的人士將可迅速瞭解位在本發明範嚕 備與方法之修改。例‘ · π # m4A to 4C illustrate a system for detecting the presence or absence of a substrate in a carrier without opening a carrier according to the present invention; these systems include a carrier ιοί and a loading port 40. FIG. 4A is a view showing the carrier ι The ι moves toward the door opening mechanism 403 to open the perspective view of the door of the substrate carrier 1〇1. In some embodiments, the substrate carrier 101 is supported using blade receivers 4〇5a, 4〇5b and overhead transfer flanges 4〇7 (so allowing the substrate carrier to be stacked at a high density). The door opening mechanism 403 includes a support member 1〇7 that is adapted to contact and support the door 115 of the substrate carrier 101. During the substrate loading/unloading operation, the support member 107 moves the carrier door 115 to the open position (eg, in some embodiments, the door is rotated below the remainder of the substrate carrier 101, although other configurations may be used) . The substrate carrier 1〇1 can be coupled/disengaged relative to the door opening mechanism 403 using a linear actuator or other actuator 409 (e.g., pneumatic, motor driven, hydraulic, etc. actuator). 12 200849448 Figure 4B shows a side view of an exemplary embodiment of the system of Figure 4A showing a section of the support member 1〇7 carrying the inlet 4〇1. Figure 4b illustrates the system in which the photoelectric circuit 4ΐι on the manned σ 401 is configured such that the gate ιΐ5 can be turned on to indicate whether or not the substrate is present in the #101. In some embodiments, the extension 402 secures the sensor assembly 1〇5&, 1〇 to the upper and lower halves of the support member 107. Sensor assembly! 05a, 105b includes a beam source and pickers 413, 415 (or vice versa) that form an occludable light path 416 within at least a portion of the carrier ι. If it is parked on the loading port 4〇1 as shown in the figure, the light path 'Μ (described earlier) is blocked according to the flag of =ι〇ι and/or the position of the fixing clip, indicating that the carrier 101 is specifically concave Whether there is a substrate in the tank. ϋ Figure 4C shows another exemplary side view of the system in Section 4A®. Fig. 4C illustrates a system in which the present invention is applied, wherein the circuit 421 is configured such that the door us can indicate whether or not the substrate is present in the carrier 1〇1 without opening. Within the carrier 101, the electrical contacts 423, 425 are turned on based on the flag associated with the recess of the carrier 101 and/or the fixed clip placement position (described previously). Closing of the contacts 423, 425 results in the formation of a conductive path between the contacts θ 427 and 429 of the carrier door 115. When the carrier member 1〇1 is parked on the loading port, the contacts 427, 429 of the carrier member are respectively coincident with the contacts 43A, 433 of the supporting member 1〇7, indicating whether there is a substrate in the specific groove of the carrier. In some embodiments, the movement of the contacts 423, 425 can be controlled mechanically or magnetically (as previously explained). In any of the specific embodiments listed above, the contacts of the substrate carrier or the substrate of the substrate carrier may be determined to be representative of the substrate (e.g., the map of the contents of the carrier of the 2008 20084848). In this embodiment, the channel 103 is formed therein so as not to increase the stacking density of the carrier 101. m is merely illustrative of the present invention. Those skilled in the art will be able to quickly understand the modifications of the present invention. Example ‘ · π # m
又例如·可使用更少或更多I 或可使用其他感測器位置。另外，可運用許多 (\ 及/或磁致接點配置。因此在示例性具體實施例 示之後’吾人可瞭解，其他具體實施例可落在 神與範疇内，如申請專利範圍所定義。 【圖式簡單說明】 第1A圖為根據本發明具體實施例提供的 之圖解正視圖。 第1B圖圖解說明根據本發明具體實施例 開門機構，該載入口包含一穿透光束感測器並 〇 1A圖的基板承載件耦合。 第1C圖至第1E圖為根據本發明基板承載 入口上的圖解俯視圖。 第1F圖為根據本發明具體實施例的基板 解俯視圖’該承載件包含具有旗標的基板夾， 載件内基板是否存在。 第2圖為根據本發明其他具體實施例的基 圖解俯視圖，該承载件包含電路用於指示承載 承載件1 0 1 每度（例如允 例。一般精 内的上述設 i測器以及/ 種電接點以 隨本發明揭 本發明的精 基板承载件 的载入口之 且適合與第 件停靠在栽 承載件之圖 用於偵測承 板承载件之 件内基板是 14 200849448 否存在。Also for example, fewer or more I can be used or other sensor locations can be used. In addition, many (\ and/or magnetically-coupled configurations are possible. Therefore, after the exemplary embodiments are shown, 'we understand that other specific embodiments may fall within the scope of God and the scope as defined in the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a schematic front elevational view of an embodiment of the present invention. FIG. 1B illustrates a door opening mechanism including a penetrating beam sensor and 〇1A according to an embodiment of the present invention. The substrate carrier of the figure is coupled. 1C to 1E are schematic plan views of the substrate carrying inlet according to the present invention. FIG. 1F is a top view of the substrate according to an embodiment of the present invention. The carrier includes a substrate holder with a flag. Figure 2 is a top plan view of a base according to other embodiments of the present invention, the carrier including circuitry for indicating the carrier carrying member 1 0 1 per degree (e.g., in the case of the general fine) Providing an i-detector and/or an electrical contact to expose the loading port of the fine substrate carrier of the present invention and to be suitable for docking the first member with the carrier member The inner substrate of the member for detecting the carrier is 14 200849448 No.
第3圖為根據本發明、& H 1進一步具體實施例的基板承载 之圖解俯視圖，該承載杜 、 具有永久磁鐵的基板央，用 於啟動一電路來指示承載件内基板是否存在。 第4A圖和第4B圖與第4C圖係根據本發明又其他具 體實施例的系統之透視圖和側視圖，該系統包含基板承戴 件與載入口。 【主要元件符號說明】 101 基板承載件 115 門 102 開門機構 116 凹槽 103 通道 201 電路 103a 窗口部分 203 電接點 105a 感測器組# 205 電接點 105b 感測器組 牛 207 接點 106 載入口 209 接點 107 支撐構件 303 永久磁鐵 107 開門機構 301 電路 108 固定物 305 磁鐵 109 光束 307 箭頭 110 基板 309 電接點 111 感測器 311 接點 113 固定夾 3 13 接點 113a 旗標 315 接點 15 200849448 401 載 入 α 415 偵 測 器 402 延 伸 物 416 光 路 徑 403 開 門 機 構 421 電 路 405a 葉 片 接 收 器 423 電 接 點 405b 葉 片 接 收 器 425 電 接 點 407 凸 緣 427 接 點 409 致 動 器 429 接 點 411 光 電 電 路 431 接 點 413 偵 測 器 433 接 點Figure 3 is a diagrammatic plan view of a substrate carrier in accordance with a further embodiment of the present invention, the carrier substrate having a permanent magnet for initiating a circuit to indicate the presence or absence of a substrate within the carrier. 4A and 4B and 4C are perspective and side views of a system in accordance with still other embodiments of the present invention, the system including a substrate receiving member and a loading port. [Main component symbol description] 101 substrate carrier 115 door 102 door opening mechanism 116 groove 103 channel 201 circuit 103a window portion 203 electrical contact 105a sensor group # 205 electrical contact 105b sensor group cattle 207 contact 106 Inlet 209 Contact 107 Support member 303 Permanent magnet 107 Door opening mechanism 301 Circuit 108 Fixing 305 Magnet 109 Beam 307 Arrow 110 Substrate 309 Electrical contact 111 Sensor 311 Contact 113 Retaining clip 3 13 Contact 113a Flag 315 Point 15 200849448 401 Load α 415 Detector 402 Extender 416 Light path 403 Door opening mechanism 421 Circuit 405a Blade receiver 423 Electrical contact 405b Blade receiver 425 Electrical contact 407 Flange 427 Contact 409 Actuator 429 Point 411 Photoelectric circuit 431 Contact 413 Detector 433 Contact
G 16G 16