200848662 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種具有燈反射罩之背光模組及燈反射罩製造 方法’並且_地，本發明侧於—種伽魏產生低反域 之燈反射罩及其製造方法。 【先前技術】 心由於液晶顯示技術成熟，製造成本大幅降低，大多的顯示器 已採用液晶顯示器。並且由於液晶面板係非主動式元件，因此需 要^光模組以提供均勻的燈源，進而使得液晶面板的顯示功能得 、匕目f背光模組可概分兩類，一是側光式，一是直下式。側光 燈反射罩係設置於導光板之側邊。為使從燈源發射 ^先線不相，燈反射罩需盡可鮮鱗光板的表面 '然而，縱 貼導光板的表面，在與導光板表面接觸的燈反射罩 卜有漏光的現象。因此，目_解決方法是在燈反射罩 邊緣ΐ ’佈樹脂類材料或其他低反射材料以覆蓋該處 的反射層，使得該處不再反射光線而避免漏光的現象。 之此ΑΑΒ，圖一八係緣示先前技術之一具體實施例 之不意圖’圖—Β係緣示圖一中圓圈χ之放大示意 ^ 1包含—導光板12、—燈反射罩14、—燈源16、 勺Α—其，18、—擴散板2G以及—稜鏡片22。其中燈反射罩14 反射層144以及—低反射層146。該低反射 身1# 146 低反射材料。若無塗佈低反射材料，亦即該低反 反i罩14盘it板貝1ί亥ί之ί反射層144即可發揮反射功能。燈 即因反射作用而緣’即圖一Β中標示γ所指之處， 4見出較壳的現象，此即前述之漏光現象。此漏 200848662 也你田件ϋ光模組1無法全面地提㈣的光齡供液晶顯示面 =二，是說，在液晶顯示面板上會有—道較亮的光痕跡。 此a c; 6 燈反射罩14之邊緣、約lmm至3mm的區域上塗 佈低反射材料’亦即該低反射層146，以消除前述的漏光現象。 、*和!^》閱圖C ’ ® — C係身示该具體實施例之反射罩之製造 進廠時’其上多已有一反射層，並且為保護該反 射層上覆蓋—膠膜，用以保護該反射層。此外，為增 刷的穩定度以及後續加卫的參考基準，在網版印刷 進彳τ定位孔沖孔。在驗印職財，因為原材料上 ϋΐίί ’所以需先將膠膜暫時移除，待網版印刷完成後，再 Ιί =。ΐ而，在網版印刷製程中，需對塗佈的樹脂類材料 二玄溫卻容易使原材料產生變形。並且，重新覆蓋的 t膜亦與原材料進廠時的情況不同，甚至產生反射層剝離的現 印刷製程後’尚需對原材料進行沖壓成型。然而，前 如變形、剝離等)對精密的沖壓成型製程卻是極為不穩 疋的因素，致使製程難度升高，良率不易提 題 口此有而要设计一種新的燈反射罩製造方法以解決上述問 【發明内容】 反射ΐίϊί;射在於提供—種具紐反射罩之料模組及燈 燈反=^$在於提供—種使_產生低反射區域之 該反射板包 本發明之燈反射罩製造方法包含提供一反射板 200848662 含一基板以及一反射層。該反射層位於該基板上，該反射層包含 一邊緣以及一包含該邊緣之區域。該燈反射罩製造方法並且包含 使用一雷射照射該區域，使得該區域具有一低反射率。其中該反 射板可進一步包含一膠膜於該反射層上以保護該反射層，該雷射 為一紫外線雷射。該反射層可為銀或其他高反射材料。此外，該 燈反射罩製造方法於該雷射照射之後或之前，進一步包含折彎成 型該反射板。 二本發明之燈反射罩包含一基板以及一反射層。該反射層位於 該基板上，該反射層包含一邊緣以及一包含該邊緣之區域，其中 該^域係以一雷射照射而形成並具有一低反射率。該反射層上可 覆蓋一膠膜以保護該反射層。其中該反射層可為銀或其他高反射 材料。該燈反射罩可由前述燈反射罩製造方法製成。 本發明之背光模、 组包含-燈反射罩、—導光板以及一燈源。 該燈反射罩即前述之燈反射罩。該導光板具有—侧邊以及一表 其中紐反射罩之該基板包覆該繼致使紐射層朝向該侧 該燈反射罩之腿域纽緊餘表面。該燈源置於該反 =層與該侧邊之間。該燈反鮮之反射層可為銀或其他高反射材 料0 及射射照射可不必暫時剝離膠膜，而可保持膠膜與該 ίϊί間魏者力。並且，使用雷射照射可僅對局部加工，盆產 被控制，不致過度影響其他非被照射區域，不會有‘ 缺f。另外，因為網版印刷製程通常需要由原來的工 加工’越多的運送代表著越高的成本和越高 ϊΐΐί ’本發日狀肢料及錄造方法不僅克服先前 技術的缺點’並且大幅減少製造流程崎低成本並提升良率。 式得點與精神可以勤以τ的㈣詳述及所附圖 8 200848662 【實施方式】 ’圖二^轉示根據—較佳具體實施例之 ^ S ，圖二B係纷示圖二A中圓圈X,之放大示 如I—A及B所不，本發明之背光模組3包含包含一導光 ί射罩34、一燈源36、一底反射板38、一擴散板40 ild片42。燈反射罩34包含—基板342以及一反射層 344。反射層344位於基板342上，反射層344包含一邊緣擁 ，及-包j緣3442之區域S。區域s經一紫外線雷射照射以形 成-低反射層346 ’亦即區域S因此具有低反射率。該紫外線雷 射可為Nd:YAG騎，其可使用的波長為遍m、355nm、 266nm、213nm 〇200848662 IX. Description of the Invention: [Technical Field] The present invention relates to a backlight module having a lamp reflector and a method for manufacturing a reflector, and the present invention is directed to a low-anti-domain Lamp reflector and method of manufacturing the same. [Prior Art] Since the liquid crystal display technology is mature, the manufacturing cost is greatly reduced, and most displays have adopted liquid crystal displays. Moreover, since the liquid crystal panel is a non-active component, a light module is required to provide a uniform light source, and thus the display function of the liquid crystal panel is obtained, and the backlight module can be divided into two types, one is a side light type. One is straight down. The sidelight reflector is disposed on the side of the light guide. In order to make the first line out of the light source, the lamp reflector needs to be as good as the surface of the fresh scale plate. However, the surface of the light guide plate is longitudinally attached to the lamp reflector which is in contact with the surface of the light guide plate. Therefore, the solution is to fabricate a resin-like material or other low-reflection material at the edge of the lamp reflector to cover the reflective layer at that point so that light is no longer reflected there to avoid light leakage. In this case, FIG. 18 is not intended to be a schematic embodiment of the prior art. FIG. 1 is a magnified schematic of the circle χ in the first embodiment. The light guide plate 12, the lamp reflector 14 is provided. Light source 16, scoop - 18, - diffuser 2G and - 22 . The lamp reflector 14 has a reflective layer 144 and a low reflective layer 146. The low reflection body 1# 146 low reflection material. If the low-reflection material is not coated, that is, the low-reflection i-cover 14 plate can be used as a reflection function. The lamp is due to the reflection of the edge ‘where the γ is indicated in the figure ,, 4 sees the phenomenon of the shell, which is the aforementioned light leakage phenomenon. This leak 200848662 also you can not fully mention (4) the light age for the liquid crystal display surface = two, that is, there will be a bright light trace on the liquid crystal display panel. The light-reflecting cover 14 is coated with a low-reflecting material ‘that is, the low-reflecting layer 146 on the edge of the lamp reflector 14 to eliminate the aforementioned light leakage phenomenon. , * and !^" Read Figure C ' ® - C shows that the reflector of this embodiment is manufactured at the factory when it has more than one reflective layer on it, and to protect the reflective layer from covering - the film, To protect the reflective layer. In addition, in order to increase the stability of the brush and the reference reference for subsequent reinforcement, the screen printing hole is punched in the screen printing. In the inspection of the business, because the raw materials on the ϋΐ ίί ‘ so the film must be temporarily removed, after the screen printing is completed, then Ι ί =. However, in the screen printing process, it is necessary to apply a resin material to the coating material, but it is easy to deform the raw material. Moreover, the re-covered t film is also different from the case when the raw material enters the factory, and even after the current printing process for peeling off the reflective layer, the raw material needs to be stamped. However, before the deformation, peeling, etc.) is a very unstable factor for the precision stamping process, which makes the process more difficult, and the yield is not easy to mention. Therefore, a new lamp reflector manufacturing method should be designed. Solving the above problem [invention] the reflection ΐ ϊ ϊ 射 射 射 射 射 射 提供 提供 ; ; ; ; 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 纽 ^ ^ ^ ^ ^ ^ ^ ^ ^ The mask manufacturing method includes providing a reflector 200848662 comprising a substrate and a reflective layer. The reflective layer is on the substrate, the reflective layer comprising an edge and a region comprising the edge. The lamp reflector manufacturing method and includes illuminating the region with a laser such that the region has a low reflectivity. The reflective plate may further comprise a film on the reflective layer to protect the reflective layer, the laser being an ultraviolet laser. The reflective layer can be silver or other highly reflective material. Further, the lamp reflector manufacturing method further includes bending the reflector after or before the laser irradiation. The lamp reflector of the present invention comprises a substrate and a reflective layer. The reflective layer is on the substrate, the reflective layer comprising an edge and a region comprising the edge, wherein the region is formed by a laser illumination and has a low reflectivity. The reflective layer may be covered with a film to protect the reflective layer. Wherein the reflective layer can be silver or other highly reflective material. The lamp reflector can be made by the aforementioned lamp reflector manufacturing method. The backlight module, the group of the present invention comprises a lamp reflector, a light guide plate and a light source. The lamp reflector is the aforementioned lamp reflector. The light guide plate has a side edge and a substrate of the reflector, wherein the substrate envelops the rear surface of the lamp reflector toward the side of the lamp reflector. The light source is placed between the opposite layer and the side. The reflective layer of the lamp can be silver or other highly reflective material 0 and the radiation can be used to prevent the film from being temporarily peeled off, and the film can be kept in contact with the film. Moreover, the use of laser irradiation can only be performed on local processing, and the pot production is controlled without excessively affecting other non-irradiated areas, and there is no deficiencies. In addition, because the screen printing process usually needs to be processed by the original work, the more the transportation represents the higher the cost and the higher the size, the 'the daily hair and the recording method not only overcome the shortcomings of the prior art' and greatly reduce the manufacturing. Processes are low cost and increase yield. The formula and the spirit can be diligently described in detail by (4) and FIG. 8 200848662. [Embodiment] FIG. 2 is reproduced according to the preferred embodiment, and FIG. 2B is shown in FIG. The circle X is enlarged as shown in I-A and B. The backlight module 3 of the present invention comprises a light guide illuminator 34, a light source 36, a bottom reflector 38, and a diffusion plate 40 ild 42. . The lamp reflector 34 includes a substrate 342 and a reflective layer 344. The reflective layer 344 is located on the substrate 342, and the reflective layer 344 includes a region S and a region S of the edge J42. The region s is irradiated with an ultraviolet laser to form a low reflection layer 346', i.e., the region S thus has a low reflectance. The ultraviolet laser can be a Nd:YAG rider, and the wavelengths that can be used are m, 355 nm, 266 nm, and 213 nm.
導光板32具有一側邊322以及一表面324。基板342包覆侧 邊322致使反射層344朝向側邊322，並且區域§大致緊靠表面 324。燈源36置於反射層344與侧邊322之間。底反射板％設 置於導光板32與該表面324相對之表面。於實際設計中，底反 射板38可與燈反射罩34 -體成型。此外，f光模組3之擴散板 4〇與稜鏡;i 42侧喊生光學擴散效果及提高f光模組3的輝 度，此係習知技術，在此不再贅述。因此，由於區域s具有低反 射率:所以在燈反射罩34與導光板32之接面邊緣處，即圖二B 中標不Y’所指之處，不會產生漏光現象。補充說明的是，反射層 344_之區域S被照射的深度不以完全貫穿為必要，亦即如圖二B 所示’至少區域S之表面形成低反射層346。區域S之範圍通常 包含距邊緣3442約1mm至3mm。 、另外，值得一提的是，反射層344不以覆蓋完全的基板342 為必要。亦即，盡管圖二B中顯示出反射層344之邊緣3442與 基板342之邊緣3422對齊，但是於實際設計中，反射層344之 邊緣3442與基板342之邊緣3422間可有一段距離。此外，由於 本發明之低反射層346本質上係反射層344之一部分，因此燈反 9 200848662 射罩34與導光板32可平整地接觸，進而燈反射罩34與導光板 32之接面，即圖二b中標示G’所指之處，不會有如圖一 B中反 射層I44與導光板^間的間隙G，進而提供更佳的反射效果。 一補充說明的是，燈反射罩34之形狀不以圖二A或B中所 不。於實際設計中，：t登反射| %之形狀亦可配合燈源％，以獲 取更佳的反射效率，如圖二C所示。 睛參閱圖三，圖三係繪示背光模組3之燈反射罩34之製造 方法之流賴。本發明之燈反射賴造方法包含提供—反射^， 如步驟sioo。該反射板即後續製成燈反射罩34之素材。因此該 反射板包含基板342以及反射層344，反射層344位於基板342 上並包含區域S，已如前述，在此不再贅述。 接著，於該反射板上沖出複數個定位孔用以供後續的製程定 位之用，如步驟S102。再接著，使用雷射照射區域s以形成低反 射層346，如步驟S104。最後，折彎該反射板以成型燈反射罩 34，如步驟S106。此步驟S106可於步驟S104之前實施，進而可 能與步驟S102整合在同一製程實施。此外，於整個燈反射罩製 造方法中，該反射板包含一覆蓋於反射層344上之膠膜(未顯示於 圖中）’以避免反射層344被刮傷。因此，此膠膜在組裝前仍宜保 持在燈反射罩34上。 ’、 綜上所述，因為使用雷射照射可不必暫時剝離膠膜，而可保 持膠膜與反射層344間的附著力。並且，使用雷射照射可僅對局 部加工，其產生的熱可被控制，不致過度影響其他非被照射區 域，不會有因烘烤而產生的缺點。也就是說，膠膜可不必暫時移 除，燈反射罩34亦不會因雷射照射而產生變形，反射層344亦 不會因雷射照射而產生剝離現象。另外，因為網版印刷製程通常 品要由原來的工廢運送至另一個工廠加工，越多的運送代表著越 高的成本和越高的不良率。因此，本發明之燈反射罩及其製造方 200848662 法不僅克服先前技術的缺點，並且大幅減少製造流程以降低成本 並提升良率。 恭日日藉由，上較佳具體實施例之詳述，係希望能更加清楚描述本 i私精神，而並非以上述所揭露的較佳具體實施例來對 及^相等艮制。相反地，其目的是希望能涵蓋各種改變 廣的解釋聽根據上作最寬 使其涵盍所有可能的改變以及具相等性的安排。 200848662 【圖式簡單說明】 圖一 A係繪示先前技術之一具體實施例之背光模組之示意 圖一 B係繪示圖一中圓圈χ之放大示意圖。 圖一C係繪示該具體實施例之燈反射罩之製造流程圖。 圖一A係繪示根據一較佳具體實施例之背光模組之示意圖。 圖二B係繪示圖二a中圓圈X，之放大示意圖。 圖二C係繪示燈反射罩之另一結構示意圖。 圖二係繪示背光模組之燈反射罩之製造方法之流程圖。 【主要元件符號說明】 1、3 :背光模組 12、32 :導光板 16、36 :燈源 20、40 :擴散板 322 ·•侧邊 142、342 :基板 146、346 :低反射層 S :區域 I4、34、34,：燈反射罩 18、38 :底反射板 22、42 :稜鏡片 324 :表面 144、344 :反射層 3422、3442 :邊緣 G:間隙 12 200848662 G’ ：接面 S100〜S106 :步驟 γ、Yf ••接面邊緣 13The light guide plate 32 has a side 322 and a surface 324. Substrate 342 envelops side 322 such that reflective layer 344 faces side 322 and region § abuts surface 324. Light source 36 is placed between reflective layer 344 and side 322. The bottom reflector % is disposed on the surface of the light guide plate 32 opposite to the surface 324. In a practical design, the bottom reflector 38 can be formed integrally with the lamp reflector 34. In addition, the diffusion plate 4〇 and 稜鏡 of the f-light module 3; the optical diffusion effect of the i 42 side and the improvement of the luminance of the f-light module 3 are not described herein. Therefore, since the region s has a low reflectance: no light leakage occurs at the junction edge of the lamp reflector 34 and the light guide plate 32, that is, where the mark in Fig. 2B is not indicated by Y'. It is to be noted that it is necessary that the depth of the region S of the reflective layer 344_ is not completely penetrated, that is, as shown in Fig. 2B, at least the surface of the region S forms the low reflection layer 346. The extent of the region S typically comprises about 1 mm to 3 mm from the edge 3442. In addition, it is worth mentioning that the reflective layer 344 is not necessary to cover the complete substrate 342. That is, although the edge 3442 of the reflective layer 344 is shown aligned with the edge 3422 of the substrate 342 in Figure 2B, in actual design, the edge 3442 of the reflective layer 344 may have a distance from the edge 3422 of the substrate 342. In addition, since the low-reflection layer 346 of the present invention is essentially a part of the reflective layer 344, the lamp cover 9 200848662 can be smoothly contacted with the light guide plate 32, and the junction between the lamp reflector 34 and the light guide plate 32, that is, In Figure 2b, where G' is indicated, there will be no gap G between the reflective layer I44 and the light guide plate as shown in Fig. 1B, thereby providing a better reflection effect. It is added that the shape of the lamp reflector 34 is not as shown in Figure 2A or B. In the actual design, the shape of the t-reflection | % can also match the lamp source % for better reflection efficiency, as shown in Figure 2C. Referring to FIG. 3, FIG. 3 is a diagram showing the manufacturing method of the lamp reflector 34 of the backlight module 3. The lamp reflection method of the present invention comprises providing a reflection ^, as in the step sioo. The reflector is subsequently made into the material of the lamp reflector 34. Therefore, the reflector comprises a substrate 342 and a reflective layer 344. The reflective layer 344 is located on the substrate 342 and includes a region S, as described above, and will not be described herein. Then, a plurality of positioning holes are punched out on the reflector for subsequent process positioning, as in step S102. Next, the laser irradiation region s is used to form the low reflection layer 346 as by step S104. Finally, the reflector is bent to form the lamp reflector 34, as by step S106. This step S106 can be implemented before step S104, and may be implemented in the same process as step S102. Further, in the entire lamp reflector manufacturing method, the reflecting plate includes a film (not shown) covering the reflecting layer 344 to prevent the reflecting layer 344 from being scratched. Therefore, the film should remain on the lamp reflector 34 before assembly. As described above, since the laser irradiation is used, it is not necessary to temporarily peel the film, and the adhesion between the film and the reflective layer 344 can be maintained. Moreover, the use of laser irradiation can be performed only for local processing, and the heat generated can be controlled without excessively affecting other non-irradiated areas without the disadvantages caused by baking. That is to say, the film does not have to be temporarily removed, the lamp reflector 34 is not deformed by the laser irradiation, and the reflection layer 344 is not peeled off by the laser irradiation. In addition, because the screen printing process is usually shipped from the original waste to another factory, the more transportation represents the higher cost and higher defect rate. Accordingly, the lamp reflector of the present invention and its manufacturer 200848662 not only overcome the disadvantages of the prior art, but also substantially reduce the manufacturing process to reduce cost and increase yield. It is to be understood that the detailed description of the preferred embodiments of the present invention is intended to provide a clearer description of the present invention and is not intended to be equivalent to the preferred embodiments disclosed herein. Rather, its purpose is to be able to cover a wide variety of interpretations based on the widest possible to cover all possible changes and equivalence arrangements. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram showing a backlight module according to a specific embodiment of the prior art. FIG. 1B is an enlarged schematic view showing a circle χ in FIG. Figure 1C is a flow chart showing the manufacture of the lamp reflector of the embodiment. FIG. 1A is a schematic diagram of a backlight module according to a preferred embodiment. Figure 2B is an enlarged schematic view of the circle X in Figure 2a. Figure 2C is a schematic view showing another structure of the lamp reflector. FIG. 2 is a flow chart showing a method of manufacturing a lamp reflector of a backlight module. [Main component symbol description] 1, 3: backlight module 12, 32: light guide plate 16, 36: light source 20, 40: diffuser plate 322 · side edges 142, 342: substrate 146, 346: low reflection layer S: Areas I4, 34, 34, lamp reflectors 18, 38: bottom reflectors 22, 42: dies 324: surfaces 144, 344: reflective layers 3422, 3442: edge G: gap 12 200848662 G': junction S100~ S106: Step γ, Yf •• Junction edge 13