200848252 九、發明說明： 【發明所屬之技術領域】 本發明係有關於—插里u ^ ^ ^ ^ ^ ^ ^ m種基材杈組及其製作方法，尤指_ 種录面成形有立體社播r .u 1 、、口 構（3D structure )之基材模組 (substrate module )及其製作方法。 、、、且 【先前技術】 、按，隨著資訊科技時代的到來，再加上通信網路技術 的進步下動電話（或稱為手機）已成為目前最常見之 通吼^具之一。行動電話產品以其體積輕小、攜帶方便、 功能背全、及價格日益低廉下，已受到越來越多消費者之 喜愛。一般消費者在選購手機上，大都會已以手機之功能 和外形作為考量，而市面上也因應消費者的趨向，推出功 能齊全、外形新穎之手機。 明參閱弟一圖、及弟'一 A圖至第一D圖所示，其中第 一圖係為習知表面成形有立體結構（3D structure )之基 材模組（substrate module)的製作方法之流程圖，第_ a 圖至第一 D圖係分別為習知表面成形有立體結構（3D structure)之基材模組（substrate module)的製作流程示 意圖。由第一圖之流程圖可知，習知表面成形有立體結構 (3D structure)之基材模組（substrate module)的製作方 法係包括：首先，請配合第一 A圖所示，提供一基材層 (substrate layer ) 1 及一具有一内模空間（internal mold space) 2 0之非透光模具（opaque tooling) 2，並且填 6 200848252 充非固怨樹脂（non-solid state resin ) 3於該非选光模具 2之内模空間2 〇内（S100)。 接著，請配合第一 B圖所示，透過紫外光（UV light) L穿透該基材層1的照射（curing)，以硬化（hardening) 該非固態樹脂3於該基材層1之下表面，並且該硬化後的 非固態樹脂3係形成一立體結構層3，（S102);最後， μ麥閱第一 C圖及第一 D圖所示，塗佈一顏色層（c〇l〇r layer) 4於该基材層1之上表面（si 〇4)，以完成該表面 成形有立體結構（即為該立體結構層3 /)之基材模組Μ 的製作流程。因此，設計者可隨著客戶的需求，而設計出 不同造型之按鍵結構。 “:、而省知表面成形有立體結構（3D structure )之 基材模組（substrate module) Μ的製作方法尚有下例之缺 點存在： 一、因為必須先製作立體結構層3 /於該基材層1之 下表面’然後再塗佈該顏色層4於該基材層1之上表面， 所以造成該基材模組Μ的良率降低，進而增加製造成本。 ^ 二、因為習知之非透光模具2皆使用非透光材質製 造’所以該紫外光L的照射方向受到只能穿透該基材層1 的限制。 二、由於該紫外光L的照射方向受到只能穿透該基材 層1的限制’所以該基材模組Μ(完成品）只能具有單面 之立體結構層3 /。 200848252 是以，由上可知，上述習知表面成形有立體結構（3D structure )之基材模組（substrate module )，在實際製作上， 顯然具有不便與問題存在，而可待加以改善者。 緣是，本發明人有感上述缺失之可改善，且依據多年 來從事此方面之相關經驗，悉心觀察且研究之，並配合學 理之運用，而提出一種設計合理且有效改善上述缺失之本 發明。 【發明内容】 本發明所要解決的技術問題，在於提供一種表面成形 有立體結構（3D structure)之基材模組（substrate m〇dule ) 及其製作方法。本發明係利用透光模具的使用，以使得紫 外光（UV light)的照射方向可不受限於只能穿透基材層 (亦即，紫外光不受限於只能照射於基材侧）。因此，本 發明可解決傳統製程之基材側必須透光之缺點（習知無法 先行塗佈顏色層之缺點），並且同時< 製造出基材模组（完 成品）的正反兩面皆具有立體結構。 為了解決上述技術問題，根據本發明之其中一種方 案，提供一種表面成形有立體結構（3D structure)之基 材模組（substrate module )，其包括·一顏色層（c〇l〇r layer )、一基材層（substrate layer )、及一弟一立體結構層 (first 3D structure layer)。其中’該基材層係成形於δ亥顏 色層之下表面。該第一立體結構層係為一層同時透過一第 8 200848252 一透光模具（first transparent tooling)的成形（forming) 及透過紫外光（UV light)穿透該第一透光模具的照射 (curing)所形成之立體結構，並且該第一立體結構層係 成形於該基材層之下表面。 再者，該基材模組更進一步包括：一第二立體結構層 (second 3D structure layer )，其係為一層同時透過一第二 透光模具（second transparent tooling )的成形（forming ) 及透過紫外光（UV light)穿透該第二透光模具的照射 (curing)所形成之立體結構，並且該第二立體結構層係 成形於該顏色層之上表面。因此，該基材模組之下表面及 上表面係分別具有該第一立體結構層及該第二立體結構 0 為了解決上述技術問題，根據本發明之其中一種方 案，提供一種表面成形有立體結構（3D structure)之基 材模組（substrate module )的製作方法，其步驟包括：首 先，形成一顏色層（color layer)於一基材層（substrate layer )之上表面；接著，透過一第一透光模具（first transparent tooling )，將一第一立體結構層（first 3D structure layer)形成於該基材層之下表面；最後，透過紫 外光（UV light)穿透該第一透光模具之照射（curing)， 以硬化（hardening)該第一立體結構層。 再者，該基材模組之製作方法更進一步包括：首先， 透過一第二透光模具（second transparent tooling)，將一 第二立體結構層（second 3D structure layer)形成於該顏 9 200848252 色層之上表面；然後，读、网 、系上傲透過紫外光（UVIight)穿透該第 立體結構層。因此，兮美二以硬化（hardenmg)該第 17亥基材杈組之下表面及上表面係分 別具有_-立舰構層及㈣二讀結構層。 ’”不上所述纟發明所提供之表面成形有立體結構（3D structure)之基材模組（substrate m〇dule)及其製作方法， 其係具有下例之優點： 一、 因為本發明可先成形該顏色層於該基材層上，然 後再製作該第-立體結構層於該基材層之下表面（或製作 該第^立體結構層於該顏色層之上表面），所以本發明之 基材模組的良率增加，進而降低製造成本。 二、 因為本發明之第—透光模具及$二透光模具 用透光性材質製造，所以該紫外夹的日”身 ^ 外7^的_方向可任意選擇 為牙透该弟—透光模具及該第二透 基材層（應用於傳統製程時）」皆可。 」，飞牙透石玄 υ 材外光的照射方向不會受到只能穿透該基 材層的限制’所以該基材模組（完成品 有立體結構層（第—立俨社盖厗 反兩面白具 罘立體結構層加乐二立體結構層）。 為了能更進—步瞭解本發明為達成預定 之技術、手段及功效，請參_下有 羊二 與附圖，相信本發明之目的、特徵與_ 明 ,入且具體之料，然而_圖式僅提供 並非用來對本發明加以限制者。 一 ° 10 200848252 【實施方式】 請參閱第二圖、及第二A圖至第二D圖所示，其中第 二圖係為本發明表面成形有立體結構（3D structure )之 基材模組（substrate module)的製作方法之第一實施例之 流程圖，第二A圖至弟二D圖係分別為本發明表面成形有 立體結構（3D structure)之基材模組（substrate module) 的第一實施例之製作流程示意圖。 由第二圖之流程圖可知，本發明之第一實施例係提供 一種表面成形有立體結構（3D structure )之基材模組 (substrate module)的製作方法，其步驟包括：首先，請 配合第二A圖所示’形成一顏色層（color layer) 4 a於 一基材層（substrate layer) 1 a之上表面（S200 )，其中 5亥頭色層4 a係可為「具有至少一種顏色」或「由多種顏 色所組成」。以第一實施例而言，該顏色層4 a係由紅色 層R、綠色層G、及藍色層B所組成。 接著，請配合第二B圖至第二c圖所示，先將非固態 樹脂（non-solid state resin) 3 a填充於該第一透光模具 (first transparent tooling ) 2 a 之内模空間（internal mold space) 2 0 a内，然後再透過光線（例如：紫外光（uv light) L 1 )穿透該第一透光模具2 a的照射（curing)， 以硬化（hardening)該非固態樹脂3 a於該基材層1 a之 下表面，並且該非固態樹脂3 a硬化後係形成一第一立體 結構層3 a /。 200848252 換&之’該步驟S200之後，緊接著透過一第一透光 模具（first transparent tooling) 2 a，將一第一立體結構 層（first 3D structure layer) 3 a ^ 形成於該基材層 1 a 之下表面（S202);然後，透過紫外光l 1穿透該第一透 光模具2 a之照射（curing)，以硬化（hardening)該第 一立體結構層3 a ' (S204)。其中，該第一立體結構層 3 a 係為樹脂（resin) ’並且該第一透光模具2 a係具 有一與該第一立體結構層3 a —相同形狀之内模空間2 0 a ° 請配合第二D圖所示，經過該步驟S2〇Q至該步驟 S204後，即可完成第一實施例所提供之一種表面成形有 立體結構（3D structure)之基材模組（substrate module) Μ 1之製作。因此，該基材模組μ 1係包括：一顏色層 (color layer) 4 a、一基材層（substrate layer) 1 a、 及一第一立體結構層（first 3D structure layer) 3 a 〆。 其中，該基材層1 a係成形於該顏色層4 a之下表 面。該第一立體結構層3 a /係為一層同時透過一第一透 光模具（first transparent tooling) 2 a 的成形（forming) 及透過紫外光（UV light) L 1穿透該第一透光模具2 a 的照射（curing)所形成之立體結構，並且該第一立體結 構層3 a /係成形於該基材層1 a之下表面。 請參閱第三圖、及第三A圖至第三C圖所示，其中第 三圖係為本發明表面成形有立體結構（3D structure)之 基材模組（substrate module )的製作方法之第二實施例之 12 200848252 流程圖；第三A圖至第三C圖係分別為本發明表面成形有 立體結構（3D structure)之基材模組（substrate module) 的第二實施例之製作流程示意圖。 由第三圖之流程圖可知，本發明之第二實施例係提供 一種表面成形有立體結構（3D structure )之基材模組 (substrate module)的製作方法，其步驟包括：首先，請 配合第二A圖所示，形成一顏色層（color layer ) 4 a於 一基材層（substrate layer) 1 a 之上表面（S300)。 接著’請配合第三A圖至第三B圖所示，先將非固態 樹脂（non-solid state resin) 3 a、3 b分別填充於該第 一透光模具（first transparent tooling) 2 a 之内模空間 (internal mold space) 2 0 a 及該第二透光模具（secorid transparent tooling ) 2 b 之内模空間（internal mold space ) 2 0 b内，然後再透過光線（例如：紫外光（UV light) L 1、L 2)分別穿透該第一透光模具2 a及該第二透光 模具2 b的照射（curing)，以分別硬化（hardening)該 非固態樹脂3 a、3 b於該基材層1 a之下表面及該顏色 層4 a之上表面’並且該非固態樹脂3 a、3 b硬化後係 分別形成一第一立體結構層3 a /及一第二立體結構層 3b、 換言之，該步驟S300之後，緊接著分別透過一第一 透光模具（first transparent tooling) 2 a 及一第二透光模 具（second transparent tooling) 2 b，將一第一立體結構 層（first 3D structure layer) 3 a > 及一第二立體結構層 13 200848252 ( (second 3D structure layer) 3 b 〜刀v別形成於該基 13之下表面及該顏色層43之上表面（83()2); : 透過’、外光L· 1、L 2分別穿透該第—透光模具2 a 第二透光模具2 b之照射（curing )，以分別硬= (hardening)該第一立體結構層3 a >及該第二立酽社 層3b^ (S304)。其中，該第一立體結構層3a , = ^ 弟一立體結構層3 b皆為樹脂（resin )。再者，兮第 透光模具2 a係具有一與該第一立體結構層3 a —相 形狀之内模空間2 0 a，並且該第二透光模具2 b係具有 一與該第二立體結構層3 b —相同形狀之内模空間2' 〇 b 〇 請配合第三C圖所示，經過該步驟S300至該步驟 S304後，即可完成第二實施例所提供之一種表面成形有 立體結構（3D structure)之基材模組（subsiratem〇dule) Μ 2之製作。因此，該基材模組M2係包括：一顏色層 (colorlayer) 4 a、一基材層（substratelayer)丄 a、曰 一弟一立體結構層（first 3D structure layer) 3 a ^、及 一第二立體結構層（second3D structure layer) 3b 一。 其中，該基材層1 a係成形於該顏色層4 a之下表 面。该第一立體結構層3 a係為一層同時透過一第一透 光模具（first transparent tooling) 2 a 的成形（f0rming) 及透過紫外光（UV light) L 1穿透該第一透光模具2 a 的照射（curing)所形成之立體結構，並且該第一立體結 構層3 a係成形於該基材層1 a之下表面。該第二立體 14 200848252 結構層3 b係為-層同時透過一第二透光模具 t—tt〇〇llng) 2 b的成形（f〇rmmg)及透過紫外光 (UV light ) L 2穿透該第二透光模具2 b的照射 (curmg)所形成之立體結構，並且該第二立體結構層3 ^ 係成形於该顏色層4 a之上表面。 .因此’本發明第二實施例與第—實施例最大的不同在200848252 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a substrate group of u ^ ^ ^ ^ ^ ^ ^ m and a method for fabricating the same, and particularly for forming a three-dimensional society A substrate module of a r.u 1 , a 3D structure, and a method of fabricating the same. [, prior art], press, with the advent of the information technology era, coupled with the advancement of communication network technology, mobile phones (or mobile phones) have become one of the most common devices. Mobile phone products have been favored by more and more consumers because of their small size, convenient carrying capacity, full functionality and low price. In general, consumers are choosing mobile phones. Metropolis has taken into account the functions and appearance of mobile phones, and the market has also introduced mobile phones with complete functions and novel appearances in response to consumer trends. Referring to the drawings of the younger brother and the younger brothers, from the first graph to the first graph D, the first graph is a method for fabricating a substrate module having a three-dimensional structure formed by a conventional surface. Flowchart, the first to the first D drawings are schematic diagrams showing the manufacturing process of a substrate module having a 3D structure formed on the surface. It can be seen from the flow chart of the first figure that the method for fabricating a substrate module having a three-dimensional structure (3D structure) includes: first, providing a substrate as shown in FIG. a substrate layer 1 and an opaque tooling 2 having an internal mold space 20, and filling 6 200848252 with a non-solid state resin 3 The inner mold space 2 of the optical selection mold 2 is inside (S100). Next, as shown in FIG. B, the curing of the substrate layer 1 is performed by ultraviolet light (L light) L to harden the non-solid resin 3 on the lower surface of the substrate layer 1. And the hardened non-solid resin 3 forms a three-dimensional structural layer 3, (S102); finally, the first C picture and the first D picture are coated with a color layer (c〇l〇r) The layer 4 is on the upper surface (si 〇 4) of the substrate layer 1 to complete the fabrication process of the substrate module 成形 having a three-dimensional structure (that is, the three-dimensional structure layer 3 /). Therefore, the designer can design different key structure according to the needs of the customer. ":, and the method of fabricating a substrate module having a three-dimensional structure (3D structure) is known to have the following disadvantages: 1. Since the three-dimensional structure layer 3 must be fabricated first. The lower surface of the material layer 1 is then coated with the color layer 4 on the upper surface of the substrate layer 1, so that the yield of the substrate module is lowered, thereby increasing the manufacturing cost. ^ Second, because of the conventional The light-transmissive mold 2 is made of a non-transparent material. Therefore, the irradiation direction of the ultraviolet light L is limited by the penetration of the substrate layer 1. The irradiation direction of the ultraviolet light L is only able to penetrate the base. The limitation of the material layer 1 is such that the substrate module 完成 (finished product) can only have a single-sided three-dimensional structure layer 3 /. 200848252 Therefore, as described above, the above-mentioned conventional surface is formed with a three-dimensional structure (3D structure). In the actual production, the substrate module obviously has inconvenience and problems, and can be improved. The reason is that the inventor feels that the above-mentioned defects can be improved, and based on the past years, Relevant experience Observing and researching, and in conjunction with the application of the theory, a present invention which is reasonable in design and effective in improving the above-mentioned defects is proposed. SUMMARY OF THE INVENTION The technical problem to be solved by the present invention is to provide a surface formed with a three-dimensional structure (3D structure). Substrate module and method of fabricating the same. The invention utilizes the use of a light transmissive mold so that the direction of ultraviolet light irradiation is not limited to only penetrate the substrate layer (ie, The ultraviolet light is not limited to being irradiated only on the side of the substrate. Therefore, the present invention can solve the disadvantage that the substrate side of the conventional process must be transparent (the shortcoming that the color layer cannot be coated first), and at the same time < The front and back sides of the substrate module (finished product) are manufactured to have a three-dimensional structure. In order to solve the above technical problem, according to one aspect of the present invention, a substrate module having a three-dimensional structure (3D structure) is provided ( Substrate module ), including a color layer (c〇l〇r layer), a substrate layer, and a three-dimensional structure layer (first 3D structu) Re layer), wherein the substrate layer is formed on the lower surface of the δ 颜色 color layer. The first singular layer is a layer that is simultaneously formed through a first transparent tooling of 8200848252. And a three-dimensional structure formed by the curing of the first light-transmissive mold by ultraviolet light, and the first three-dimensional structure layer is formed on the lower surface of the substrate layer. Furthermore, the substrate module further includes: a second 3D structure layer which is formed by a second transparent tooling and transmitted through the ultraviolet The light light penetrates the three-dimensional structure formed by the curing of the second light-transmitting mold, and the second three-dimensional structure layer is formed on the upper surface of the color layer. Therefore, the lower surface and the upper surface of the substrate module respectively have the first three-dimensional structure layer and the second three-dimensional structure. In order to solve the above technical problem, according to one aspect of the present invention, a three-dimensional structure is formed on the surface. a method for fabricating a substrate module (3D structure), the method comprising: first, forming a color layer on a surface of a substrate layer; and then transmitting a first a first transparent tooling, a first 3D structure layer is formed on the lower surface of the substrate layer; finally, the first light transmissive mold is penetrated by ultraviolet light. Curing to harden the first three-dimensional structure layer. Furthermore, the method for fabricating the substrate module further includes: first, forming a second 3D structure layer on the color through a second transparent tooling; The upper surface of the layer; then, the read, the net, and the arrogant penetrate the third solid structural layer through ultraviolet light (UVIight). Therefore, the lower surface and the upper surface of the 17th-thick substrate are respectively hardened to have a _-ship structure and a (four) second-read structure layer. A substrate module having a three-dimensional structure formed on the surface of the invention and a method for fabricating the same, which have the following advantages: 1. Because the invention can Forming the color layer on the substrate layer, and then fabricating the first-dimensional structure layer on the lower surface of the substrate layer (or fabricating the first three-dimensional structure layer on the upper surface of the color layer), so the present invention The yield of the substrate module is increased, thereby reducing the manufacturing cost. 2. Since the first light-transmissive mold and the two-transparent mold of the present invention are made of a light-transmitting material, the ultraviolet clip of the day is outside the body 7 The direction of ^ can be arbitrarily chosen to be the tooth-transparent mold - the light-transmissive mold and the second through-substrate layer (when applied to a conventional process). "The direction of the external light of the flying tooth is not limited by the penetration of the substrate layer." Therefore, the substrate module (the finished product has a three-dimensional structure layer) Two-sided white three-dimensional structure layer Jiale two three-dimensional structure layer). In order to further understand the present invention in order to achieve the predetermined technology, means and effects, please refer to the following paragraphs and drawings, I believe the purpose of the present invention And the details are not limited to the invention. 1° 10 200848252 [Embodiment] Please refer to the second figure, and the second picture A to the second D The second figure is a flow chart of a first embodiment of a method for fabricating a substrate module having a three-dimensional structure (3D structure) on the surface of the present invention, and the second embodiment is shown in FIG. The drawing is a schematic diagram of the manufacturing process of the first embodiment of the substrate module having the three-dimensional structure formed on the surface of the present invention. The first embodiment of the present invention is known from the flow chart of the second figure. Provide a surface forming The method for manufacturing a substrate module of a three-dimensional structure includes the following steps: first, forming a color layer 4 a to a substrate layer as shown in FIG. Substrate layer 1 a upper surface (S200), wherein the 5th color layer 4a may be "having at least one color" or "consisting of a plurality of colors." In the first embodiment, the color layer 4 a is composed of a red layer R, a green layer G, and a blue layer B. Next, please fill the non-solid state resin 3 a first as shown in the second B to the second c. Passing through the first mold space 2 a within the internal mold space 2 a, and then transmitting the first through light (for example, uv light L 1 ) Curing of the optical mold 2a to harden the non-solid resin 3a on the lower surface of the substrate layer 1a, and the non-solid resin 3a is hardened to form a first three-dimensional structural layer 3a/ 200848252 Change & 'after this step S200, then through a first light transmission First transparent tooling 2 a, forming a first 3D structure layer 3 a ^ on the lower surface of the substrate layer 1 a (S202); then, penetrating through the ultraviolet light l 1 Curing of the first light-transmitting mold 2a to harden the first three-dimensional structural layer 3a' (S204). Wherein, the first three-dimensional structural layer 3a is a resin and the first transparent mold 2a has an inner mold space of the same shape as the first three-dimensional structural layer 3a. With the step S2 〇Q to the step S204, the substrate module having a three-dimensional structure (3D structure) provided by the first embodiment can be completed. 1 production. Therefore, the substrate module μ 1 includes a color layer 4 a , a substrate layer 1 a , and a first 3D structure layer 3 a 〆. Wherein, the substrate layer 1a is formed on the surface below the color layer 4a. The first three-dimensional structural layer 3 a / is a layer that is simultaneously penetrated by a first transparent tooling 2 a and penetrates the first transparent mold through a UV light L 1 The three-dimensional structure formed by the curing of 2 a, and the first three-dimensional structural layer 3 a / is formed on the lower surface of the substrate layer 1 a. Please refer to the third figure, and the third A to the third C, wherein the third figure is the manufacturing method of the substrate module having the three-dimensional structure (3D structure) formed on the surface of the present invention. 12 embodiment of the present invention 200848252 flow chart; the third A to the third C drawings are respectively a schematic diagram of the manufacturing process of the second embodiment of the substrate module having the surface structure formed with the three-dimensional structure (3D structure) . It can be seen from the flowchart of the third figure that the second embodiment of the present invention provides a method for fabricating a substrate module having a three-dimensional structure (3D structure), the steps of which include: first, please cooperate with As shown in FIG. 2A, a color layer 4a is formed on a substrate layer 1a upper surface (S300). Then, please fill in the first transparent tooling 3 a, 3 b with the first transparent tooling 2 a, 3 b, respectively. Internal mold space 2 0 a and the second mold cavity (secorid transparent tooling) 2 b internal mold space 2 0 b, and then transmitted light (for example: ultraviolet light (UV) Light) L 1 , L 2) respectively penetrating the first transparent mold 2 a and the second transparent mold 2 b to harden the non-solid resin 3 a, 3 b respectively The lower surface of the substrate layer 1 a and the upper surface of the color layer 4 a and the non-solid resin 3 a, 3 b are hardened to form a first solid structure layer 3 a / and a second solid structure layer 3 b, respectively In other words, after the step S300, a first transparent structure (2a) and a second transparent tooling Layer 3 3 > and a second solid structure layer 13 2008 48252 ( (second 3D structure layer) 3 b ~ knife v is formed on the lower surface of the base 13 and the upper surface of the color layer 43 (83 () 2); : through ', external light L · 1, L 2 respectively Passing through the first light-transmitting mold 2 a curing of the second light-transmitting mold 2 b to harden the first three-dimensional structural layer 3 a > and the second vertical layer 3b ^ (S304), wherein the first three-dimensional structural layer 3a, = ^, the three-dimensional structural layer 3 b are all resin, and the first transparent optical layer 2 a has a first three-dimensional structural layer 3 a — the inner mold space 2 0 a of the phase shape, and the second light transmissive mold 2 b has an inner mold space 2′ 〇b of the same shape as the second solid structural layer 3 b 〇b As shown in FIG. C, after the step S300 to the step S304, the fabrication of a substrate module (subsiratem〇dule) 2 having a three-dimensional structure (3D structure) provided in the second embodiment can be completed. Therefore, the substrate module M2 includes: a color layer 4 a, a substrate layer 丄 a, a scorpion and a stereo structure layer (firs t 3D structure layer) 3 a ^, and a second 3D structure layer 3b. Wherein, the substrate layer 1a is formed on the surface below the color layer 4a. The first three-dimensional structure layer 3 a is a layer that is simultaneously penetrated through a first transparent tooling 2 a and penetrates the first light-transmitting mold 2 through a UV light L 1 . The three-dimensional structure formed by the curing of a, and the first three-dimensional structural layer 3a is formed on the lower surface of the substrate layer 1a. The second solid 14 200848252 structural layer 3 b is a layer and penetrates through a second transparent mold t-tt〇〇llng) 2 b forming (f〇rmmg) and transmitting through ultraviolet light (UV light) L 2 The second light-transmissive mold 2b is curcumized to form a three-dimensional structure, and the second three-dimensional structure layer is formed on the upper surface of the color layer 4a. Therefore, the greatest difference between the second embodiment of the present invention and the first embodiment is
於二在第二實施例中’可同時使用一第一透光模具2 a及 一第二透光模具2b ’以分別成形—第-立體結構層3 =體結構層3 b ^於該基材層1 a之下表 面及邊顏色層4 a之上表面。 杜綜上所述，本發明係利用透光模具（2 a或2 b )的 以使得紫外光（uvllght) (LWL2)的照射 2 ?透㈣層（亦即，紫外光不受限於 二Γ/、、、射於基材側）°因此，本發明可解決傳統製程之基 ^須透光之缺點（習知無法先行塗佈顏色層之缺 :而比亚且同日寸可製造出基材模組（完成品）M2的正反 兩面皆具有立體結構。In the second embodiment, a first light-transmissive mold 2a and a second light-transmitting mold 2b' can be simultaneously used to form a first-dimensional structure layer 3 = body structure layer 3 b ^ on the substrate The lower surface of layer 1 a and the upper surface of color layer 4 a. As described above, the present invention utilizes a light-transmissive mold (2 a or 2 b ) to cause ultraviolet (uvllght) (LWL2) illumination to pass through the (four) layer (i.e., the ultraviolet light is not limited to two /,,, shot on the substrate side) Therefore, the present invention can solve the shortcomings of the conventional process, such as light transmission (the conventional color coating cannot be applied first: and the same size can be used to manufacture the substrate) The module (finished product) M2 has a three-dimensional structure on both sides.
.+再者’本發明所提供之表面成形有立體結構（3D 盆你之基材模組（substratem〇dule)及其製作方法， 係具有下例之優點： 因為本發明可先成形該顏色層4a於該基材層工 a之後再製作該第—立體結構層3 a >於該基材層1 、面（或製作該第二立體結構層3 b，於該顏色層 15 200848252 率增加，進而降低製造本成之基材柄組M1、M2的良 2 b皆使口用^\^之弟—透光模具2 a及第二透光模具 照射=ΐ質製造，所以該紫外光L 1、L 2的 二透光模“ζΊΛ「穿透該第—透光模具2 a及該第 應用於傳統Li」;透可該基材層1(”^.+ Furthermore, the surface provided by the present invention has a three-dimensional structure (3D basin basement module and its manufacturing method), which has the following advantages: since the present invention can form the color layer first 4a after the substrate layer a, the third solid structure layer 3 a > is formed on the substrate layer 1 and the surface (or the second solid structure layer 3 b is formed, and the color layer 15 200848252 is increased, Further, the good 2 b of the substrate handle sets M1 and M2 for manufacturing the original ones is made by the mouth of the ^^^-transparent mold 2 a and the second transparent mold irradiation = tantalum, so the ultraviolet light L 1 , the two light transmissive molds of L 2 "" penetrate the first light-transmitting mold 2 a and the first applied to the conventional Li"; the substrate layer 1 ("^
L 2的照射方向不會受到只 所以該基材模組（完成品） 立體結構層（第一立體結構 b ^ )。 三、由於該紫外光L 1、 月匕牙透該基材層1 a的限制， Μ 1、Μ2之正反兩面皆具有 層3. a —加第二立體結構層3 所述’僅為本發明最佳之—的具體實施例之 七田现明與圖式，惟本發明之特徵並不侷限於此，並非用 本發明’本發明之財範圍應以下述之巾請專利範 圍^準，凡合於本發明申請專·圍之精神與其類似變化 2施例’皆應包含於本發明之範.中，任何熟悉該項技 ，者在本發明之領域内，可輕易思及之變化或修飾皆可涵 盍在以下本案之專利範圍。 【圖式簡單說明】 第一圖係為習知表面成形有立體結構（3D structure)之 ^ 基材模組（substrate module )的製作方法之流程圖； 苐A圖至弟一 D圖係分別為習知表面成形有立體結構 (3D structure)之基材模組（substrate module)的 16 200848252 製作流程示意圖； 第二圖係為本發明表面成形有立體結構（3D structure) 之基材模組（substrate module )的製作方法之第一 實施例之流程圖； 第二A圖至第二D圖係分別為本發明表面成形有立體結 構（3D structure)之基材模組（substrate module) 的第一實施例之製作流程示意圖； 第三圖係為本發明表面成形有立體結構（3D structure) 之基材模組（substrate module)的製作方法之第二 實施例之流程圖；以及 第三A圖至第三C圖係分別為本發明表面成形有立體結 構（3D structure)之基材模組（substrate module) 的第二實施例之製作流程示意圖。 【主要元件符號說明】 [習知] 基材模組 Μ 基材層 1 非透光模具 2 内模空間 非固態樹脂 3 立體結構層 3 ^ 顏色層 4 紫外光 L [本發明] 17 200848252 f 顏色層 基材模組 Μ 1 、M 2 基材層 1 a 第一透光模具 2 a 内模 空間 第二透光模具 2 b 内模 空間 非固態樹脂 3 a 非固態樹脂 3 b 第一立體結構層 3 a 第二立體結構層 3 b 紫外光 紫外光 4 a 紅色層 綠色層 藍色層 L 1 L 2The irradiation direction of L 2 is not affected by only the three-dimensional structural layer (first solid structure b ^ ) of the substrate module (finished product). 3. Due to the limitation of the ultraviolet light L1 and the lunar tooth through the substrate layer 1a, the front and back sides of the crucible 1 and the crucible 2 have a layer 3. a — plus a second solid structure layer 3 BEST MODE FOR CARRYING OUT THE INVENTION The present invention is not limited to the details of the present invention, and the invention is not limited to the scope of the invention. The spirit of the application and the similar changes of the present application 2 should be included in the scope of the present invention, and any one skilled in the art can easily change or modify it in the field of the present invention. All of them can be covered in the following patents of this case. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a flow chart of a method for fabricating a substrate module having a three-dimensional structure (3D structure); 苐A diagram to brother-D diagram are respectively A schematic diagram of a manufacturing process for forming a substrate module having a 3D structure, and a second embodiment is a substrate module having a three-dimensional structure (3D structure) formed on the surface of the present invention (substrate) A flowchart of a first embodiment of a method for fabricating a module; a second embodiment of the second embodiment to a second embodiment of the present invention are respectively a first embodiment of a substrate module having a three-dimensional structure (3D structure) formed thereon 3 is a flow chart of a second embodiment of a method for fabricating a substrate module having a three-dimensional structure (3D structure); and a third A to the The third C-picture is a schematic diagram of the manufacturing process of the second embodiment of the substrate module in which the three-dimensional structure (3D structure) is formed on the surface of the present invention. [Main component symbol description] [Practical] Substrate module 基材 Substrate layer 1 Non-transparent mold 2 Internal mold space Non-solid resin 3 Solid structure layer 3 ^ Color layer 4 Ultraviolet light L [Invention] 17 200848252 f Color Layer substrate module Μ 1 , M 2 substrate layer 1 a first light-transmissive mold 2 a inner mold space second light-transmitting mold 2 b inner mold space non-solid resin 3 a non-solid resin 3 b first solid structure layer 3 a second solid structure layer 3 b ultraviolet light ultraviolet light 4 a red layer green layer blue layer L 1 L 2