JP2009045763A - Substrate module having three-dimensional structure formed on its surface and its manufacturing method - Google Patents
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本発明は、基材モジュール及びその作製方法に関し、特に、表面に３次元構造（３Ｄ構造）が成形された基材モジュール及びその作製方法に関する。 The present invention relates to a substrate module and a manufacturing method thereof, and more particularly, to a substrate module having a three-dimensional structure (3D structure) formed on a surface and a manufacturing method thereof.
情報科学技術時代の到来に伴い、通信ネットワーク技術は大きな進歩を遂げている。
携帯電話（または単に「携帯」と呼ばれることもある）は、現在、最も良く見られる通信ツールの一つになっている。携帯電話製品は、その体積が小さく、軽く、携帯するのに便利であることに加えて、必要とされる機能を十分に備え、価額が日々低廉化しているため、益々多くの消費者に愛用されるようになっている。
一般に、消費者は、携帯電話を選んで買おうとする際、携帯電話の機能や外形を考慮することが多く、マーケティングにおいても、消費者の傾向に応じて機能を充実させ、また、新規な外形デザインを備える携帯電話が続々と発売されている。
With the advent of the information science and technology era, communication network technology has made great progress.
Mobile phones (or sometimes simply called “mobile”) have now become one of the most common communication tools. In addition to its small volume, light weight, and convenience in carrying, mobile phone products are fully equipped with the required functions and are becoming cheaper on a daily basis. It has come to be.
In general, consumers often consider mobile phone functions and outlines when choosing and purchasing mobile phones. In marketing, functions are enhanced according to consumer trends, and new outlines are introduced. Mobile phones with designs are on the market one after another.
図１及び図１Ａ〜図１Ｄを参照する。図１は、従来の表面に３次元構造が成形された基材モジュールの製造方法のフローチャートである。図１Ａ〜図１Ｄは、それぞれ、表面に３次元構造が成形された基材モジュールの従来の製造手順を示す図である。
図１のフローチャート並びに図１Ａを併せて参照すると、表面に３次元構造が成形された基材モジュールの従来の製造方法は、基材層（１）及び内型空間（internal mold space）（２０）を有する不透光金型（２）を提供するとともに非固形樹脂（３）を不透光金型（２）の内型空間（２０）内に充填する工程を備える（Ｓ１００）。
Please refer to FIG. 1 and FIGS. 1A to 1D. FIG. 1 is a flowchart of a conventional method for manufacturing a substrate module having a three-dimensional structure formed on a surface. 1A to 1D are diagrams showing a conventional manufacturing procedure of a base module having a three-dimensional structure formed on the surface thereof.
Referring also to the flowchart of FIG. 1 and FIG. 1A, a conventional manufacturing method of a substrate module having a three-dimensional structure formed on the surface thereof is a substrate layer (1) and an internal mold space (20). And providing a non-transparent resin (3) in the inner mold space (20) of the non-transparent mold (2) (S100).
次に、図１のフローチャート並びに図１Ｂを併せて参照すると、表面に３次元構造が成形された基材モジュールの従来の製造方法は、紫外光（Ｌ）を基材層（１）に照射し、紫外光（Ｌ）が基材層（１）を透過することにより、基材層（１）の下面に非固形樹脂（３）を硬化させ、この硬化した非固形樹脂（３）により３次元構造層（３’）を形成する工程を備える（Ｓ１０２）。
最後に、表面に３次元構造が成形された基材モジュールの従来の製造方法は、図１Ｃ及び図１Ｄに示すように、基材層（１）の上面に色層（４）を塗布する工程を備える（Ｓ１０４）。これら工程を経て、表面に３次元構造（すなわち、３次元構造層（３’））が成形された基材モジュール（Ｍ）の製造工程を完了する。これら工程により、設計者はクライアントのニーズに応じて、異なる造型のボタン構造を設計できる。
Next, referring also to the flowchart of FIG. 1 and FIG. 1B, the conventional manufacturing method of the base module having a three-dimensional structure formed on the surface irradiates the base layer (1) with ultraviolet light (L). The ultraviolet light (L) is transmitted through the base material layer (1), whereby the non-solid resin (3) is cured on the lower surface of the base material layer (1), and the cured non-solid resin (3) is used for three dimensions. A step of forming a structural layer (3 ′) is provided (S102).
Finally, in the conventional manufacturing method of the base module having a three-dimensional structure formed on the surface, as shown in FIG. 1C and FIG. 1D, a step of applying a color layer (4) on the upper surface of the base layer (1) (S104). Through these steps, the manufacturing process of the base module (M) in which the three-dimensional structure (that is, the three-dimensional structure layer (3 ′)) is formed on the surface is completed. Through these steps, the designer can design different shaped button structures according to the needs of the client.
しかしながら、表面に３次元構造が成形された基材モジュール（Ｍ）の従来の製造方法は、以下の欠点を有する。
１．先に、基材層（１）の下面に３次元構造層（３’）を形成してから、基材層（１）の上面に色層（４）をさらに塗布しなければならないため、基材モジュール（Ｍ）の歩留まりが低下し、製造コストが増大することになる。
２．従来の不透光金型（２）は、ともに不透光材質を用いるため、紫外光（Ｌ）は、基材層（１）しか透過できない。
３．紫外光Ｌは、基材層（１）しか透過できないため、基材モジュール（Ｍ）（完成品）は、基材モジュール（Ｍ）の片面にしか３次元構造層（３’）を有さない。
However, the conventional manufacturing method of the substrate module (M) having a three-dimensional structure formed on the surface has the following drawbacks.
1. First, after forming the three-dimensional structure layer (3 ′) on the lower surface of the base material layer (1), the color layer (4) must be further applied on the upper surface of the base material layer (1). The yield of the material module (M) decreases, and the manufacturing cost increases.
2. Since both the conventional opaque molds (2) use an opaque material, the ultraviolet light (L) can only pass through the base material layer (1).
3. Since the ultraviolet light L can only pass through the base material layer (1), the base material module (M) (finished product) has a three-dimensional structure layer (3 ′) only on one side of the base material module (M). .
以上から分かるように、従来技術に係る表面に３次元構造が成形された基材モジュールは、実際の製造において、明らかに不便な点や問題点を有し、その改善が求められている。 As can be seen from the above, the base material module having a three-dimensional structure formed on the surface according to the prior art clearly has inconveniences and problems in actual production, and improvements are required.
そのため、本発明者は、前記欠点が改良することを目的として、長年以来この領域で積み立てた経験により、専念な観察かつ研究をし、さらに学術理論を適用し、合理な設計且つ前記の欠点を有効に改善する本発明を提案する。 For this reason, the present inventor has made extensive observations and researches based on experience accumulated in this area since many years for the purpose of improving the above drawbacks, applied academic theory, rational design and the above disadvantages. The present invention is proposed to improve effectively.
本発明が解決しようとする技術的課題は、表面に３次元構造が成形された基材モジュール及びその製造方法を提供することにある。
本発明は、透光金型を用いることで、紫外光の照射方向が基材層しか透過できないことに限られないようにすることができる。すなわち、紫外光は基材側にしか照射できないことに限られない。そのため、本発明は、従来の製造プロセスにおける基材側が透光しなければならないという欠点（従来では先に色層を塗布できない欠点）を解決できるとともに、基材モジュール（完成品）の両面ともに３次元構造を有するように製造できる。
The technical problem to be solved by the present invention is to provide a substrate module having a three-dimensional structure formed on its surface and a method for manufacturing the same.
In the present invention, by using a translucent mold, the irradiation direction of the ultraviolet light can be limited to that only the base material layer can be transmitted. That is, the ultraviolet light is not limited to being irradiated only on the substrate side. For this reason, the present invention can solve the disadvantage that the substrate side in the conventional manufacturing process has to be transparent (conventional defect that the color layer cannot be applied first), and the both sides of the substrate module (finished product) are 3 It can be manufactured to have a dimensional structure.
前記技術的課題を解決するため、本発明に係る一の実施形態において、色層と、基材層と、第１の３次元構造層とを含む表面に３次元構造が成形された基材モジュールが提供される。この基材モジュールにおいて、基材層は、色層の下面に成形される。第１の３次元構造層は、第１の透光金型により成形される。この実施形態において、紫外光は、第１の透光金型を透過するように照射され、この結果、一層の３次元構造が形成される。また、第１の３次元構造層は、基材層の下面に成形される。 In order to solve the technical problem, in one embodiment according to the present invention, a substrate module in which a three-dimensional structure is formed on a surface including a color layer, a substrate layer, and a first three-dimensional structure layer Is provided. In this base material module, the base material layer is formed on the lower surface of the color layer. The first three-dimensional structure layer is formed by the first translucent mold. In this embodiment, the ultraviolet light is irradiated so as to pass through the first translucent mold, and as a result, a one-dimensional three-dimensional structure is formed. Further, the first three-dimensional structure layer is formed on the lower surface of the base material layer.
また、基材モジュールは、さらに、第２の３次元構造層を備える。第２の３次元構造層の成形には、第２の透光金型が用いられる。紫外光を第２の透光金型に照射し、この第２の透光金型を紫外光が透過することにより、一層の３次元構造物たる第２の３次元構造層が形成される。第２の３次元構造層は、色層の上面に成形される。このように、基材モジュールの下面と上面は、それぞれ、第１の３次元構造層及び第２の３次元構造層を有する。 The base module further includes a second three-dimensional structure layer. A second translucent mold is used for forming the second three-dimensional structure layer. By irradiating the second light transmitting mold with ultraviolet light and transmitting the ultraviolet light through the second light transmitting mold, a second three-dimensional structure layer which is a one-dimensional three-dimensional structure is formed. The second three-dimensional structure layer is formed on the upper surface of the color layer. In this way, the lower surface and the upper surface of the base module have the first three-dimensional structure layer and the second three-dimensional structure layer, respectively.
上述した技術的課題を解決するため、本発明に係る一の実施形態によれば、基材層の上面に色層を形成する工程と、第１の透光金型により第１の３次元構造層を基材層の下面に形成する工程と、第１の透光金型を透過する紫外光の照射により第１の３次元構造層を硬化させる工程とを含む表面に３次元構造が成形された基材モジュールの製造方法が提供される。 In order to solve the above-described technical problem, according to one embodiment of the present invention, a step of forming a color layer on the upper surface of a base material layer, and a first three-dimensional structure by a first translucent mold A three-dimensional structure is formed on the surface including a step of forming a layer on the lower surface of the base material layer and a step of curing the first three-dimensional structure layer by irradiation with ultraviolet light that passes through the first translucent mold. A method for manufacturing a substrate module is provided.
また、基材モジュールの製造方法は、さらに、第２の透光金型により第２の３次元構造層を前記色層の上面に形成する工程と、第２の透光金型を透過する紫外光の照射により第２の３次元構造層を硬化させる工程とを含む。これら工程を経て、基材モジュールの下面と上面は、それぞれ、前記第１の３次元構造層、前記第２の３次元構造層を有するものとなる。 Moreover, the manufacturing method of the substrate module further includes a step of forming a second three-dimensional structure layer on the upper surface of the color layer by a second light transmitting mold, and an ultraviolet light that passes through the second light transmitting mold. Curing the second three-dimensional structure layer by light irradiation. Through these steps, the lower surface and the upper surface of the base module have the first three-dimensional structure layer and the second three-dimensional structure layer, respectively.
上記に示される本発明が提供する表面に３次元構造が成形された基材モジュール及びその製造方法は、以下の利点がある。
１．本発明は、先に基材層の上面に色層を成形し、その後、前記第１の３次元構造層を前記基材層の下面にさらに作製できる（または、前記第２の３次元構造層を前記色層の上面に作製できる）ため、本発明の基材モジュールの歩留まりが向上し、製造コストが低下することになる。
２．本発明の第１の透光金型及び第２の透光金型は、ともに透光材質で作製されるため、該紫外光（Ｌ）の照射方向は、「前記第１の透光金型及び前記第２の透光金型を透過する」、または、「基材層（従来のプロセスを適用する場合と同様）を透過する」の何れかの方向に選択できる。
３．前記紫外光の照射方向は、該基材層しか透過できないことに限られないため、該基材モジュール（完成品）の表裏のいずれの面にも３次元構造層（第１の３次元構造層＋第２の３次元構造層）が形成される。
The base module in which the three-dimensional structure is formed on the surface provided by the present invention described above and the manufacturing method thereof have the following advantages.
1. In the present invention, the color layer is first formed on the upper surface of the base material layer, and then the first three-dimensional structure layer can be further formed on the lower surface of the base material layer (or the second three-dimensional structure layer). Therefore, the yield of the substrate module of the present invention is improved and the manufacturing cost is reduced.
2. Since both the first translucent mold and the second translucent mold of the present invention are made of a translucent material, the irradiation direction of the ultraviolet light (L) is “the first translucent mold”. And “transmits through the second translucent mold” or “transmits through the base material layer (as in the case of applying a conventional process)”.
3. Since the irradiation direction of the ultraviolet light is not limited to transmitting only the base material layer, a three-dimensional structure layer (first three-dimensional structure layer) is formed on either side of the base module (finished product). + Second three-dimensional structure layer) is formed.
本発明が所定の目的を達成するために採用する技術、手段及びその効果をさらに詳細に且つ具体的に説明するために、以下に本発明に関する詳細な説明及び添付図面を参照することにより、深く且つ具体的な理解を得られるが、それらの添付図面は、参考及び説明のみに使われ、本発明の技術的範囲を狭く解釈することに用いられたり、これら具体例に限定解釈したりすべきものでないことは言うまでもないことである。 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to describe in more detail and specifically the techniques, means and effects that the present invention adopts in order to achieve a predetermined object, a detailed description will be given below with reference to the detailed description of the present invention and the accompanying drawings. The accompanying drawings are used only for reference and explanation, and should be used for narrowly interpreting the technical scope of the present invention or limited to these specific examples. It goes without saying that it is not.
図２及び図２Ａ〜図２Ｄを参照する。
図２は、本発明に係る表面に３次元構造が成形された基材モジュールの製造方法の第１実施例のフローチャートであり、図２Ａ〜図２Ｄは、それぞれ、本発明に係る表面に３次元構造が成形された基材モジュールの第１実施例の製造手順を示す図である。
Please refer to FIG. 2 and FIGS. 2A to 2D.
FIG. 2 is a flowchart of a first embodiment of a method for manufacturing a substrate module having a three-dimensional structure formed on the surface according to the present invention. FIGS. 2A to 2D are respectively three-dimensionally illustrated on the surface according to the present invention. It is a figure which shows the manufacture procedure of 1st Example of the base material module by which the structure was shape | molded.
図２のフローチャートから分かるように、本発明に係る第１実施例は、表面に３次元構造が成形された基材モジュールの製造方法を提供する。
まず、図２Ａに示すように、基材層（１ａ）の上面に色層（４ａ）を形成する（ステップ（Ｓ２００））。色層（４ａ）は、「少なくとも一つの色を有し」または「複数の色からなる」のである。第１実施例において、色層（４ａ）は、赤色層（Ｒ）、緑色層（Ｇ）及び青色層（Ｂ）からなる。
As can be seen from the flowchart of FIG. 2, the first embodiment according to the present invention provides a method for manufacturing a substrate module having a three-dimensional structure formed on the surface.
First, as shown to FIG. 2A, a color layer (4a) is formed in the upper surface of a base material layer (1a) (step (S200)). The color layer (4a) is “having at least one color” or “consisting of a plurality of colors”. In the first embodiment, the color layer (4a) includes a red layer (R), a green layer (G), and a blue layer (B).
次に、図２Ｂ〜図２Ｃに示すように、非固形樹脂（３ａ）を第１の透光金型（２ａ）の内型空間（２０ａ）内に充填し、その後、第１の透光金型（２ａ）を透過する光線（例えば、紫外光（Ｌ１））の照射により、基材層（１ａ）の下面に非固形樹脂（３ａ）を硬化させることで第１の３次元構造層（３ａ’）を形成する。 Next, as shown in FIGS. 2B to 2C, the non-solid resin (3a) is filled in the inner mold space (20a) of the first translucent mold (2a), and then the first translucent gold The first three-dimensional structure layer (3a) is cured by curing the non-solid resin (3a) on the lower surface of the base material layer (1a) by irradiation with light rays (for example, ultraviolet light (L1)) that passes through the mold (2a). ') Form.
言い換えれば、このステップ（Ｓ２００）の後に、第１の透光金型（２ａ）により第１の３次元構造層（３ａ’）を基材層（１ａ）の下面に形成し（Ｓ２０２）、その後、第１の透光金型（２ａ）を透過する紫外光（Ｌ１）の照射により、第１の３次元構造層（３ａ’）を硬化させる（Ｓ２０４）。ここでは、第１の３次元構造層（３ａ’）は樹脂であり、かつ第１の透光金型（２ａ）は、第１の３次元構造層（３ａ’）と同じ形状の内型空間（２０ａ）を有する。 In other words, after this step (S200), the first three-dimensional structure layer (3a ′) is formed on the lower surface of the base material layer (1a) by the first translucent mold (2a) (S202), and then The first three-dimensional structure layer (3a ′) is cured by irradiation with ultraviolet light (L1) that passes through the first translucent mold (2a) (S204). Here, the first three-dimensional structure layer (3a ′) is a resin, and the first translucent mold (2a) is an inner space having the same shape as the first three-dimensional structure layer (3a ′). (20a).
図２Ｄに示すように、ステップ（Ｓ２００）〜ステップ（Ｓ２０４）を経て、第１の実施例に係る表面に３次元構造が成形された基材モジュール（Ｍ１）の製造が可能となる。そのため、基材モジュール（Ｍ１）は、色層（４ａ）と、基材層（１ａ）と、第１の３次元構造層（３ａ’）とを含む。 As shown in FIG. 2D, the base module (M1) having a three-dimensional structure formed on the surface according to the first embodiment can be manufactured through steps (S200) to (S204). Therefore, the base module (M1) includes a color layer (4a), a base layer (1a), and a first three-dimensional structure layer (3a ').
上記の第１実施例においては、基材層（１ａ）は色層（４ａ）の下面に成形される。第１の３次元構造層（３ａ’）は、第１の透光金型（２ａ）により成形されるとともに第１の透光金型（２ａ）を透過する紫外光（Ｌ１）の照射により形成された一層の３次元構造であり、かつ、上記の第１の３次元構造層（３ａ’）は、基材層（１ａ）の下面に成形される。 In said 1st Example, a base material layer (1a) is shape | molded on the lower surface of a color layer (4a). The first three-dimensional structure layer (3a ′) is formed by irradiation with ultraviolet light (L1) that is formed by the first light-transmitting mold (2a) and is transmitted through the first light-transmitting mold (2a). The first three-dimensional structure layer (3a ′) is formed on the lower surface of the base material layer (1a).
図３及び図３Ａ〜図３Ｃを参照する。
図３は、本発明に係る表面に３次元構造が成形された基材モジュールの製造方法の第２実施例のフローチャートであり、図３Ａ〜図３Ｃは、それぞれ、本発明に係る表面に３次元構造が成形された基材モジュールの第２実施例の製造手順を示す図である。
Please refer to FIG. 3 and FIGS. 3A to 3C.
FIG. 3 is a flowchart of a second embodiment of a method for manufacturing a base module in which a three-dimensional structure is formed on the surface according to the present invention. FIGS. 3A to 3C are respectively three-dimensional on the surface according to the present invention. It is a figure which shows the manufacture procedure of 2nd Example of the base material module by which the structure was shape | molded.
図３のフローチャートから分かるように、本発明に係る第２実施例は、表面に３次元構造が成形された基材モジュールの製造方法を提供する。
まず、図２Ａに示すように、基材層（１ａ）の上面には色層（４ａ）が形成される（ステップ（Ｓ３００））。
As can be seen from the flowchart of FIG. 3, the second embodiment according to the present invention provides a method for manufacturing a substrate module having a three-dimensional structure formed on the surface.
First, as shown to FIG. 2A, a color layer (4a) is formed in the upper surface of a base material layer (1a) (step (S300)).
次に、図３Ａ〜図３Ｃに示すように、非固形樹脂（３ａ、３ｂ）を第１の透光金型（２ａ）の内型空間（２０ａ）内、第２の透光金型（２ｂ）の内型空間（２０ｂ）内にそれぞれ充填し、その後、第１の透光金型（２ａ）及び第２の透光金型（２ｂ）を透過する光線（例えば、紫外光（Ｌ１、Ｌ２））の照射により、基材層（１ａ）の下面及び色層（４ａ）の上面に非固形樹脂（３ａ、３ｂ）を硬化させることで第１の３次元構造層（３ａ’）及び第２の３次元構造層（３ｂ’）を形成することができる。 Next, as shown in FIGS. 3A to 3C, the non-solid resin (3a, 3b) is placed in the inner mold space (20a) of the first translucent mold (2a), and the second translucent mold (2b). ) In the inner mold space (20b), and then light rays (for example, ultraviolet light (L1, L2) transmitted through the first light transmitting mold (2a) and the second light transmitting mold (2b). )), The non-solid resin (3a, 3b) is cured on the lower surface of the base material layer (1a) and the upper surface of the color layer (4a), whereby the first three-dimensional structure layer (3a ′) and the second layer are cured. The three-dimensional structure layer (3b ′) can be formed.
言い換えれば、ステップ（Ｓ３００）の後に、続いてそれぞれ第１の透光金型（２ａ）及び第２の透光金型（２ｂ）により第１の３次元構造層（３ａ’）と第２の３次元構造層（３ｂ’）を基材層（１ａ）の下面、色層（４ａ）の上面にそれぞれ形成し（Ｓ３０２）、その後、第１の透光金型（２ａ）と第２の透光金型（２ｂ）をそれぞれ透過する紫外光（Ｌ１、Ｌ２）の照射により、第１の３次元構造層（３ａ’）及び第２の３次元構造層（３ｂ’）を硬化させる（Ｓ３０４）。ここでは、第１の３次元構造層（３ａ’）と第２の３次元構造層（３ｂ’）のいずれもが樹脂である。また、第１の透光金型（２ａ）は、第１の３次元構造層（３ａ’）と同じ形状の内型空間（２０ａ）を有し、第２の透光金型（２ｂ）は、第２の３次元構造層（３ｂ’）と同じ形状の内型空間（２０ｂ）を有する。 In other words, after the step (S300), the first three-dimensional structure layer (3a ′) and the second light transmission mold (2a) and the second light transmission mold (2b) are respectively connected. A three-dimensional structure layer (3b ′) is formed on the lower surface of the base material layer (1a) and the upper surface of the color layer (4a) (S302), and then the first light-transmitting mold (2a) and the second light-transmitting mold are formed. The first three-dimensional structure layer (3a ′) and the second three-dimensional structure layer (3b ′) are cured by irradiation with ultraviolet light (L1, L2) that respectively passes through the optical mold (2b) (S304). . Here, both the first three-dimensional structure layer (3a ') and the second three-dimensional structure layer (3b') are resin. The first translucent mold (2a) has an inner mold space (20a) having the same shape as the first three-dimensional structure layer (3a ′), and the second translucent mold (2b) The inner space (20b) has the same shape as the second three-dimensional structure layer (3b ′).
図３Ｃに示すように、ステップ（Ｓ３００）〜ステップ（Ｓ３０４）を経て、第２の実施例に係る表面に３次元構造が成形された基材モジュール（Ｍ２）の製造をすることが可能となる。そのため、基材モジュール（Ｍ２）は、色層（４ａ）と、基材層（１ａ）と、第１の３次元構造層（３ａ’）と、第２の３次元構造層（３ｂ’）とを含む。 As shown in FIG. 3C, the base module (M2) having a three-dimensional structure formed on the surface according to the second embodiment can be manufactured through steps (S300) to (S304). . Therefore, the substrate module (M2) includes a color layer (4a), a substrate layer (1a), a first three-dimensional structure layer (3a ′), and a second three-dimensional structure layer (3b ′). including.
上記した第２実施例においては、基材層（１ａ）は色層（４ａ）の下面に成形される。
第１の３次元構造層（３ａ’）は、第１の透光金型（２ａ）により成形されるとともに、第１の透光金型（２ａ）を透過する紫外光（Ｌ１）の照射により形成された一層の３次元構造であり、かつ、第１の３次元構造層（３ａ’）は、基材層（１ａ）の下面に成形される。
第２の３次元構造層（３ｂ’）は、第２の透光金型（２ｂ）により成形されるとともに第２の透光金型（２ｂ）を透過する紫外光（Ｌ２）の照射により形成された一層の３次元構造であり、かつ、第２の３次元構造層（３ｂ’）は、色層（４ａ）の上面に成形される。
In the second embodiment described above, the base material layer (1a) is formed on the lower surface of the color layer (4a).
The first three-dimensional structure layer (3a ′) is formed by the first light transmitting mold (2a) and irradiated with ultraviolet light (L1) that passes through the first light transmitting mold (2a). The formed one-dimensional three-dimensional structure and the first three-dimensional structure layer (3a ′) are formed on the lower surface of the base material layer (1a).
The second three-dimensional structure layer (3b ′) is formed by irradiation with ultraviolet light (L2) that is formed by the second light transmitting mold (2b) and transmits through the second light transmitting mold (2b). The one-dimensional three-dimensional structure and the second three-dimensional structure layer (3b ′) are formed on the upper surface of the color layer (4a).
そのため、本発明の第２実施例と第１の実施例との最も大きな違いは、第２実施例において、第１の透光金型（２ａ）に加え第２の透光金型（２ｂ）も同時に使用することによって、第１の３次元構造層（３ａ’）と第２の３次元構造層（３ｂ’）を基材層（１ａ）の下面、色層（４ａ）の上面にそれぞれ形成することができるようになる点である。 Therefore, the biggest difference between the second embodiment and the first embodiment of the present invention is that in the second embodiment, in addition to the first light transmitting mold (2a), the second light transmitting mold (2b). Are simultaneously used to form the first three-dimensional structure layer (3a ′) and the second three-dimensional structure layer (3b ′) on the lower surface of the base layer (1a) and the upper surface of the color layer (4a), respectively. This is the point where you will be able to.
以上のように、本発明においては、透光金型（２ａまたは２ｂ）を用いることで、紫外光（Ｌ１またはＬ２）の照射方向が基材層しか透過できないことに限られないようにすることができる（すなわち、紫外光は基材側にしか照射できないことに限られない）。そのため、本発明においては、従来のプロセスにおける基材側が透光しなければならない欠点（従来では先に色層を塗布できない欠点）を解決できるとともに、基材モジュール（完成品）（Ｍ２）の表裏のいずれの面にも３次元構造を有するように構成できる。 As described above, in the present invention, by using the light transmitting mold (2a or 2b), the irradiation direction of the ultraviolet light (L1 or L2) is not limited to being able to transmit only the base material layer. (That is, ultraviolet light can be irradiated only to the substrate side). For this reason, in the present invention, it is possible to solve the disadvantage that the substrate side in the conventional process has to be transparent (the disadvantage that the conventional color layer cannot be applied first), and the front and back of the substrate module (finished product) (M2) Any of these surfaces can be configured to have a three-dimensional structure.
また、本発明に係る表面に３次元構造が成形された基材モジュール及びその製造方法は、以下の利点を有する。
１．本発明は、先に基材層（１ａ）の上面に色層（４ａ）を成形し、その後、第１の３次元構造層（３ａ’）を基材層の下面にさらに作製できる（または、第２の３次元構造層（３ｂ’）を色層（４ａ）の上面に作製できる）ため、本発明の基材モジュール（Ｍ１）、（Ｍ２）の歩留まりが向上され、製造コストが低下することになる。
２．本発明の第１の透光金型（２ａ）と第２の透光金型（２ｂ）とのいずれもが透光材質で作製されるため、紫外光（Ｌ１、Ｌ２）の照射方向は、「第１の透光金型（２ａ）及び該第２の透光金型（２ｂ）を透過する」、または、「基材層（１）（図１Ｂに示すように、従来のプロセスを適用する場合と同様）を透過する」の何れかの方向に選択できる。
３．紫外光（Ｌ１、Ｌ２）の照射方向は、基材層（１ａ）しか透過できないことに限られないため、該基材モジュール（完成品）（Ｍ１、Ｍ２）の表裏の何れの面にも３次元構造層（第１の３次元構造層（３ａ’）＋第２の３次元構造層（３ｂ’））を有する。
Moreover, the base material module in which the three-dimensional structure is formed on the surface according to the present invention and the manufacturing method thereof have the following advantages.
1. In the present invention, the color layer (4a) is first formed on the upper surface of the base material layer (1a), and then the first three-dimensional structure layer (3a ′) can be further formed on the lower surface of the base material layer (or Since the second three-dimensional structure layer (3b ′) can be produced on the upper surface of the color layer (4a), the yield of the substrate modules (M1) and (M2) of the present invention is improved and the manufacturing cost is reduced. become.
2. Since both the first translucent mold (2a) and the second translucent mold (2b) of the present invention are made of a translucent material, the irradiation direction of the ultraviolet light (L1, L2) is “Transmit through the first translucent mold (2a) and the second translucent mold (2b)” or “Substrate layer (1) (applying the conventional process as shown in FIG. 1B) Can be selected in either direction of “transmitting through” as in the case of.
3. Since the irradiation direction of the ultraviolet light (L1, L2) is not limited to being able to transmit only the base material layer (1a), it is 3 on either side of the base material module (finished product) (M1, M2). It has a three-dimensional structure layer (first three-dimensional structure layer (3a ′) + second three-dimensional structure layer (3b ′)).
しかし、前記の説明は、単に本発明の好ましい具体的な実施例の詳細な説明及び図面に過ぎず、本発明の特許請求の範囲を制限するものではなく、本発明の主張する技術的範囲は、添付の特許請求の範囲に基づくべきであり、いずれの当該分野における通常の知識を有する当業者が本発明の分野の中で、適当に変更や改良などを実施できるが、それらの実施形態が本発明の主張する技術的範囲内に収まるべきことは言うまでもないことである。 However, the foregoing description is merely a detailed description of the preferred specific embodiments and drawings of the present invention, and is not intended to limit the scope of the claims of the present invention. The present invention should be based on the appended claims, and those skilled in the art having any ordinary knowledge in the field can make appropriate modifications and improvements within the field of the present invention. It goes without saying that it should be within the technical scope claimed by the present invention.
Ｍ・・・・・・・基材モジュール
１・・・・・・・基材層
２・・・・・・・不透光金型
２０・・・・・・内型空間
３・・・・・・・非固形樹脂
３’・・・・・・３次元構造層
４・・・・・・・色層
Ｌ・・・・・・・紫外光
Ｍ１、Ｍ２・・・基材モジュール
１ａ・・・・・・基材層
２ａ・・・・・・第１の透光金型
２０ａ・・・・・内型空間
２ｂ・・・・・・第２の透光金型
２０ｂ・・・・・内型空間
３ａ・・・・・・非固形樹脂
３ａ’・・・・・第１の３次元構造層
３ｂ’・・・・・第２の３次元構造層
４ａ・・・・・・色層
Ｒ・・・・・・・赤色層
Ｇ・・・・・・・緑色層
Ｂ・・・・・・・青色層
Ｌ１、Ｌ２・・・紫外光
M ········ Base module 1 ········· Base layer 2 ····
Claims (14)
前記色層の下面に成形される基材層と、
第１の透光金型により成形されるとともに、第１の透光金型を透過する光線の照射により形成された一層の第１の３次元構造とを備え、
前記第１の３次元構造は、前記基材層の下面に成形される第１の３次元構造層であることを特徴とする表面に３次元構造が成形された基材モジュール。 Color layers,
A base material layer formed on the lower surface of the color layer;
A first three-dimensional structure formed by irradiating with a light beam that passes through the first translucent mold, and is formed by the first translucent mold;
The first three-dimensional structure is a first three-dimensional structure layer formed on a lower surface of the base material layer, and the substrate module having a three-dimensional structure formed on a surface thereof.
前記第２の３次元構造が、前記色層の上面に成形される第２の３次元構造層であることを特徴とする請求項１記載の表面に３次元構造が成形された基材モジュール。 Further, the second light-transmitting mold is formed, and the second light-transmitting mold is formed by irradiation with light rays that pass through the second light-transmitting mold.
2. The substrate module having a three-dimensional structure formed on a surface according to claim 1, wherein the second three-dimensional structure is a second three-dimensional structure layer formed on an upper surface of the color layer.
第１の透光金型により第１の３次元構造層を前記基材層の下面に形成する工程と、
第１の透光金型を透過する光線の照射により第１の３次元構造層を硬化させる工程を含むことを特徴とする表面に３次元構造が成形された基材モジュールの製造方法。 Forming a color layer on the upper surface of the base material layer;
Forming a first three-dimensional structure layer on the lower surface of the base material layer with a first translucent mold;
A method for producing a substrate module in which a three-dimensional structure is formed on a surface, the method including the step of curing the first three-dimensional structure layer by irradiation with light rays that pass through a first translucent mold.
第２の透光金型を透過する光線の照射により第２の３次元構造層を硬化させる工程を含むことを特徴とする請求項８記載の表面に３次元構造が成形された基材モジュールの製造方法。 A step of forming a second three-dimensional structure layer on the upper surface of the color layer by a second translucent mold;
9. The substrate module having a three-dimensional structure formed on a surface according to claim 8, further comprising a step of curing the second three-dimensional structure layer by irradiation with light rays that pass through the second light-transmitting mold. Production method.
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| US9097306B2 (en) | 2010-08-30 | 2015-08-04 | Kobe Steel, Ltd. | Steel wire rod for high-strength spring excellent in wire drawability, manufacturing method therefor, and high-strength spring |
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| JPH05297225A (en) * | 1992-04-22 | 1993-11-12 | Dainippon Printing Co Ltd | Method and device for duplication of two-sided relief pattern |
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| JPH05297225A (en) * | 1992-04-22 | 1993-11-12 | Dainippon Printing Co Ltd | Method and device for duplication of two-sided relief pattern |
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| US9097306B2 (en) | 2010-08-30 | 2015-08-04 | Kobe Steel, Ltd. | Steel wire rod for high-strength spring excellent in wire drawability, manufacturing method therefor, and high-strength spring |
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