200841526 九、發明說明： 【發明所屬之技術領域】 種用於行動電話上之 本發明是關於一種容置機構，特別是一 SIM卡的容置機構。 【先前技術】 隨著通訊科技的進步，行動電話已經漸漸成為必備的生活 =。目前，摘電話是使用SIM卡（Subscriberident__ie200841526 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a housing mechanism, and more particularly to a housing for a SIM card. [Prior Art] With the advancement of communication technology, mobile phones have gradually become a must-have life. Currently, picking up the phone is using a SIM card (Subscriberident__ie
Card)來朗戶的身分進行辨認’ GSM行動電話必須裝上 此SIM卡才可撥打。一般來說，行動電話的機殼上 以供SIM卡的插置。 曰 請參照圖1A細1B，圖1A_ 1B分職示兩種不同型態 =SIM卡。圖1 A所繪示為普通規格之卿卡，此普通規格之觀 卡10包括-晶片11與-基板12，晶片U設置在基板12上，且 此晶片11主要是用於記載與用戶相關的資訊，而基板12除了用 於承載晶411外並無其他_途，丨B_示為小型規格之_ 卡’此小型規格之SIM卡10,包括一晶Μ，與一基板12,，晶片 11與圖1 A所示之晶片心有相同的大小與規格。因此，普通規 格之SIM卡10與小型規格之SIM卡1〇，的惟一差異在於：基板 12與基板12’的形狀尺寸並不相同。在圖u中，基板12的尺寸 為25 mn^ mm，而在圖1B中，基板12，的尺寸為15 2麵犯1 mm ° 在市面上’之所以會存在有不同尺寸的sim卡的原因在於： 不同國家或地區之電信服務商會使科同尺寸的sim卡。例如， 5 200841526 台灣與香港的電信服務細使用的濯卡為圖！ A所緣示的普通 」 規格之SIM卡10,而印度的電信服務商所使用的讀卡為圖ΐβ 所、·曰示的小型規格之SIM卡1〇,。然而，針對不同規格的圖卡， 便必須在機電話的機殼上設計不同的_。如此―來，行動電 話的機殼之製造者便需開發出不_模具，以製造出具有不同規 格之插槽的機殼。然而，只因為插槽的不同而必須開發出一套新 的模具並不符合成本效益。 因此，如何使機殼之製造者無需為了因應不同規格之幻乂卡 而設計不_機殼，是值得本倾具有通常知識者去思量地。 【發明内容】 本發明之目的在於提供-種SIM卡的容置麟，#由此容置 機構，可減少機殼之製造者的製造成本。 根據上述目的與其他目的’本發贿供—種SIM卡的容置機 構、，適於容置-第-規格的SIM卡。此SIM卡的容置機構裝設於 -通訊裝置的殼體中’軌裝置具有SIM卡讀取接點且殼體且有 -插槽，此插槽適於容置-第二規格之SIM卡，第二規格之sim 卡狀寸_第-規格之SIM卡的尺寸還大，但第二規格之sm 卡與第-規格之SIM卡上皆具有相同規格的晶片。而且，容置機 構是組合在插射，其中容置機構包括—凹槽，凹槽的形狀大小 與第-規格之SIM卡相同，且凹槽的底部具有―開口，開口的位 置疋位於SIM卡讀取接點的上方，當第一規格之SIM卡裝設於凹 槽中日年，SIM卡項取接點藉由開口而與第一規格之SIM卡上的晶 片相接觸。 於上述之SIM卡的容置機構中，插槽具有多個卡槽結構，而 200841526 於上述之SIM卡的容置機構中，其， 而於容置機構上則開設有多個定位孔， 合0 於容置機制職贼有梅勾，卡懈槪構絲卡接。 其中插槽具有多個定位凸塊， L，這些定位孔與凸塊互相配Card) to identify the identity of the landlord' GSM mobile phone must be equipped with this SIM card to dial. Generally, the mobile phone is mounted on the casing of the mobile phone for insertion of the SIM card.曰 Refer to Figure 1A for detail 1B. Figure 1A-1B shows two different types = SIM card. FIG. 1A shows a card of a general specification. The card 10 of the general specification includes a wafer 11 and a substrate 12, and the wafer U is disposed on the substrate 12, and the wafer 11 is mainly used for recording related to the user. Information, and the substrate 12 has no other way than the carrier 411, 丨B_ is shown as a small size _ card 'this small size SIM card 10, including a wafer, and a substrate 12, wafer 11 It has the same size and specifications as the wafer core shown in Figure 1A. Therefore, the only difference between the conventional standard SIM card 10 and the small-sized SIM card 1 is that the shape and size of the substrate 12 and the substrate 12' are not the same. In Fig. u, the size of the substrate 12 is 25 mn^mm, and in Fig. 1B, the size of the substrate 12 is 15 2 faces and 1 mm ° is on the market. 'The reason why there are different sizes of sim cards exists. It is: Telecom service providers in different countries or regions will make sim cards of the same size. For example, 5 200841526 The use of Leica in telecommunications services in Taiwan and Hong Kong is a picture! The SIM card 10 of the "normal" specification indicated by A, and the card reader used by the telecommunications service provider in India is a small-sized SIM card of the figure ΐβ. However, for different specifications of the graphics card, you must design a different _ on the chassis of the phone. In this way, the manufacturer of the mobile phone's casing needs to develop a mold that does not have a mold to create a slot with different specifications. However, it is not cost effective to develop a new mold simply because of the different slots. Therefore, how to make the manufacturer of the casing do not need to design a non-chassis in order to respond to different specifications of the illusion card, it is worthwhile to think about the ordinary knowledge. SUMMARY OF THE INVENTION An object of the present invention is to provide a accommodating mechanism for a SIM card, which can reduce the manufacturing cost of the manufacturer of the casing. According to the above-mentioned objects and other purposes, the present invention is suitable for housing a SIM card of a SIM card. The accommodating mechanism of the SIM card is installed in the housing of the communication device. The rail device has a SIM card reading contact and the housing has a slot. The slot is suitable for accommodating the SIM card of the second specification. The sim card of the second specification _ the size of the SIM card of the first specification is also large, but the sm card of the second specification and the SIM card of the first specification have the same specification of the chip. Moreover, the accommodating mechanism is combined in the insertion, wherein the accommodating mechanism comprises a groove, the shape of the groove is the same as that of the SIM card of the first specification, and the bottom of the groove has an opening, and the position of the opening is located at the SIM card. Above the read contact, when the SIM card of the first specification is installed in the recess, the SIM card contact point is in contact with the wafer on the SIM card of the first specification by the opening. In the accommodating mechanism of the above-mentioned SIM card, the slot has a plurality of card slot structures, and 200841526 is in the accommodating mechanism of the SIM card described above, and a plurality of positioning holes are formed in the accommodating mechanism. 0 In the arbitrage mechanism, the thief has a plum hook, and the card is smashed and smashed. The slot has a plurality of positioning bumps, L, and the positioning holes and the bumps are matched with each other.
— ..........顯易懂，下文將以 實施例並配合所附圖示，作詳細說明如下。 【實施方式】 下述之第一規格之SIM卡將以圖1B所示的小型規格之sim 卡1〇’為例’第二規格之SIM卡將以圖ία所示的普通規格之SIM 卡10為例，而通訊裝置將以行動電話為例。然而，本領域具有通 常知識者應可明白這只是舉例，第一規格之SIM卡並不限於圖1B 所不的小型規格之SIM卡1〇，，第二規格之SIM卡並不限於圖1A 所不的普通規格之SIM卡1 〇，而通訊裝置也不僅只限於行動電話。 請參閱圖2A，圖2A所繪示為本實施例的一行動電話 的立體圖。為了表示的方便，圖2A並未繪示出行動電話 1000的電池與電池蓋。此行動電話1000包括有一天線蓋 1100與一下殼體12〇〇,而下殼體1200則具有一插槽1220, 此插槽1220適於容置第二規格之siM卡1〇 (請參照圖2B， 圖2B所繪示為插置有第二規格之SIM卡的行動電話），當第二 7 200841526 規格之SIM卡10插置於插槽1220後，第二規格之SIM卡10 的晶片11會與此行動電話1000的SIM卡讀取接點1400相接 觸，以使行動電話1000能讀取SIM卡10的晶片11 (圖1A ' 所示）中所儲存的資料。 接著，請同時參閱圖2A、圖2B與圖3，圖3所繪示為 圖2A之行動電話的下殼體之立體圖。在下殼體1200中， 插槽1220的尺寸大小與第二規格之SIM卡10相配合，所以 使用者可精確地將第二規格之SIM卡10插置於插槽1220 ； 中，而不會造成SIM卡10偏位的情形。然而，若使用者將 第一規格之SIM卡10,（圖1B所示）直接插置於插槽1220 中，因SIM卡10’的尺寸小於插槽1220，所以容易造成SIM 卡10’發生偏位的情形，而使SIM卡讀取接點1400無法讀取到 晶片11’中所儲存的資料。 因此，可在插槽1220上設置一種SIM卡的容置機構1300 (如圖4所示，圖4所繪示為組裝有容置機構13〇〇的下殼體 1200)，以解決上述問題。接著，請參照圖5，圖5所繪示 f 為本實施例之容置機構的立體圖。此容置機構1300包括有一凹槽 1320 ’此凹槽1320的形狀大小與第一規格之SIM卡10,相同，且 凹槽1320的底部具有一開口丨34〇。此外，容置機構13〇〇的兩旁 還分別設置有卡勾1360與卡勾1360，，且容置機構13〇〇的下端部 分還設置有多個定位孔1380。 再來’請同時參照圖3、圖4與圖5，插槽1220的兩旁 分別設置有卡槽結構1222與卡槽結構1222，。藉由卡槽結構1222、 1222’與卡勾1360、1360,的互相卡接，可使容置機構13〇〇組合在 插槽1220中。另外，在插槽122〇上還設置有多個定位凸塊 8 200841526 1224，這些定位凸塊1224與定位孔1380互相配合。在組裝容置 機構1300日守’藉由定位凸塊1224與定位孔138〇，可方便組裝者 對谷置機構1300進行定位，而增加組裝的速度。 _請^照圖6A’圖6A所繪示為容置機構已組裝在行動電話上 的不意圖。由圖6A可知，當容置機構13〇〇組裝在行動電話 1000上後’ SIM卡讀取接點14〇〇會藉由開口 1340而向外露出， 因此當第一規格之SIM卡10,插置於容置機構13〇〇的凹槽132〇 後（請參照圖6B，圖6B所繪示為第一規格之SIM卡組裝在容 ( 置機構上的示意圖），SIM卡讀取接點14〇〇便會透過開口 134〇 而與SIM卡10,的晶片11，相接觸。由圖6B可知，由於容置 機構1300的凹槽1320與第一規格之SIM卡1〇，具有相同的尺 寸，所以當SIM卡1〇,組裝在凹槽132〇時，SIM+ 1〇，並不會產 生偏移的現象，所以不會造成SIM卡讀取接點14〇〇無法讀取到 SIM卡10’的晶片11，（如圖1B)之情形。 綜上所述，藉由本發明的容置機構13〇〇，原本適於插置第 二規格之SIM卡1〇的下殼體12〇〇,便可插置第一規格之siM 丨卡10’。因此，下殼體1200的製造者便只需開發出一套模 具，而無需針對不同規格之SIM卡而開發出不同的模具。如 此一來，便可將製造成本降低。 此外，上述之容置機構1300是藉由卡勾1360、1360,與卡槽結 構1222、1222’而組裝在插槽122〇上，但本領域具有通常知識 者也可使用其他的方式將容置機構1300組合在插槽1220上； 例如，利用鎖合的方式將容置機構丨3〇〇組合在插槽122〇上。 而且，上述之下殼體1200與天線蓋11〇〇雖是不同的元件， 但本領域具有通常知識者也可將下殼體12〇〇與天線蓋 9 200841526 1100整合成一殼體，而將插槽1220設置在該殼體上。 本發明以實施例說明如上，然其並非用以限疋本杏f = 主張之專利權利範圍。其專利保護範圍當視後附之申巧 利範圍及其等同領域而定。凡本領域具有通常知識者’ 不脫離本專利精神或範圍内，所作之更動或潤飾，均屬於 本發明所揭示精神下所完成之等效改變戒設計，且應包含 在下述之申請專利範圍内。 【圖式簡單說明】 圖1 A所繪示為普通規格之SIM卡，圖所繪系為小逛规 格之SIM卡； 圖2A所繪示為本實施例的一行動電話的立艘圖 圖2B所繪示為插置有第二規格之SIM卡的行動電# 圖3所繪示為圖之行動電話的下殼艨之立雜圖， 圖4所繪示為組裝有容置機構的下殼體； 圖5所繪示為本實施例之容置機構的立體圖； 圖6A所繪示為容置機構已組裝在行動電話上的米意®’ 圖6B所緣示為第一規格之siM卡組裝在容f機構上的厂、 意圖。 【主要元件符號說明】 10 :普通規格之SIM卡 200841526 12、12’ ··基板 10’ ：普通規格之SIM卡 1000 :行動電話 1100 :天線蓋 1200 :下殼體 1220 :插槽 1222、1222’ ：卡槽結構 1224 :定位凸塊 1300 :容置機構 1320 :凹槽 1340 :開口 1360、1360’ ：卡勾 1380 :定位孔 1400 : SIM卡讀取接點 11— .......... It is obvious that the following description will be made in detail by way of examples and with the accompanying drawings. [Embodiment] The SIM card of the first specification described below will be exemplified by the SIM card of the small size shown in FIG. 1B. The SIM card of the second specification will be the SIM card 10 of the general specification shown in FIG. For example, the communication device will take a mobile phone as an example. However, those skilled in the art should understand that this is only an example. The SIM card of the first specification is not limited to the SIM card of the small size shown in FIG. 1B, and the SIM card of the second specification is not limited to the one shown in FIG. 1A. The SIM card of the normal specification is not 〇, and the communication device is not limited to the mobile phone. Referring to FIG. 2A, FIG. 2A is a perspective view of a mobile phone according to the embodiment. For convenience of presentation, FIG. 2A does not depict the battery and battery cover of the mobile phone 1000. The mobile phone 1000 includes an antenna cover 1100 and a lower housing 12〇〇, and the lower housing 1200 has a slot 1220. The slot 1220 is adapted to receive a second-sized siM card 1 (refer to FIG. 2B). FIG. 2B shows a mobile phone with a SIM card of a second specification. When the SIM card 10 of the second 7 200841526 is inserted into the slot 1220, the chip 11 of the SIM card 10 of the second specification will be The SIM card reading contact 1400 of the mobile phone 1000 is brought into contact so that the mobile phone 1000 can read the data stored in the chip 11 (shown in FIG. 1A') of the SIM card 10. Next, please refer to FIG. 2A, FIG. 2B and FIG. 3 simultaneously. FIG. 3 is a perspective view of the lower casing of the mobile phone of FIG. 2A. In the lower casing 1200, the size of the slot 1220 is matched with the SIM card 10 of the second specification, so that the user can accurately insert the SIM card 10 of the second specification into the slot 1220; without causing The case where the SIM card 10 is biased. However, if the user inserts the SIM card 10 of the first specification (shown in FIG. 1B) directly into the slot 1220, since the size of the SIM card 10' is smaller than the slot 1220, the SIM card 10' is likely to be biased. In the case of a bit, the SIM card read contact 1400 cannot read the data stored in the wafer 11'. Therefore, a housing mechanism 1300 for the SIM card (shown in FIG. 4, which is illustrated as a lower housing 1200 in which the housing mechanism 13 is assembled) can be disposed on the slot 1220 to solve the above problem. Next, please refer to FIG. 5. FIG. 5 is a perspective view of the receiving mechanism of the embodiment. The receiving mechanism 1300 includes a recess 1320'. The recess 1320 has the same shape as the first size SIM card 10, and the bottom of the recess 1320 has an opening 34. In addition, a hook 1360 and a hook 1360 are respectively disposed on both sides of the accommodating mechanism 13 。, and a plurality of positioning holes 1380 are further disposed at a lower end portion of the accommodating mechanism 13 。. Referring again to FIG. 3, FIG. 4 and FIG. 5, the slot 1220 is provided with a card slot structure 1222 and a card slot structure 1222, respectively. The receiving mechanism 13 is assembled in the slot 1220 by the mutual engagement of the card slot structures 1222, 1222' and the hooks 1360, 1360. In addition, a plurality of positioning protrusions 8 200841526 1224 are disposed on the slot 122 , and the positioning protrusions 1224 and the positioning holes 1380 cooperate with each other. By arranging the mounting mechanism for 1300 days, by positioning the projections 1224 and the positioning holes 138, it is convenient for the assembler to position the valley mechanism 1300 to increase the speed of assembly. _Please refer to FIG. 6A' FIG. 6A as a schematic illustration of the arrangement in which the accommodating mechanism has been assembled on the mobile phone. As can be seen from FIG. 6A, when the accommodating mechanism 13 is assembled on the mobile phone 1000, the SIM card reading contact 14 is exposed outward through the opening 1340, so when the SIM card 10 of the first specification is inserted, After the recess 132 of the accommodating mechanism 13A is placed (refer to FIG. 6B, FIG. 6B shows the SIM card of the first specification assembled on the device), and the SIM card read contact 14 The cymbal is in contact with the wafer 11 of the SIM card 10 through the opening 134. As can be seen from FIG. 6B, since the recess 1320 of the accommodating mechanism 1300 has the same size as the SIM card of the first specification, Therefore, when the SIM card is assembled, the SIM+1〇 is assembled in the recess 132〇, and there is no offset phenomenon, so the SIM card reading contact 14〇〇 cannot be read to the SIM card 10'. In the case of the wafer 11, (as shown in Fig. 1B), in summary, by the accommodating mechanism 13 of the present invention, the lower casing 12 of the SIM card 1 of the second specification can be inserted. The first size siM Leica 10' is inserted. Therefore, the manufacturer of the lower casing 1200 only needs to develop a set of molds without having to use SIM cards of different specifications. The different molds are developed, so that the manufacturing cost can be reduced. In addition, the above-mentioned accommodating mechanism 1300 is assembled in the slot 122 by the hooks 1360, 1360 and the card slot structures 1222, 1222'. However, those skilled in the art can also use other means to combine the accommodating mechanism 1300 on the slot 1220; for example, the accommodating mechanism 丨3〇〇 is combined on the slot 122 by means of a lock. Moreover, although the lower casing 1200 and the antenna cover 11 are different components, those skilled in the art can also integrate the lower casing 12 and the antenna cover 9 200841526 1100 into a casing, and insert the casing. The groove 1220 is disposed on the casing. The invention is described above by way of example, but it is not intended to limit the scope of patent rights claimed by the apricot f = claim. The scope of patent protection is to be attached to the scope of the application and its equivalent fields. Any changes or modifications made by those skilled in the art that do not depart from the spirit or scope of this patent are subject to the equivalent changes or designs made in the spirit of the present disclosure and should be included in the following application. BRIEF DESCRIPTION OF THE DRAWINGS [Simplified illustration of the drawing] FIG. 1A shows a SIM card of a common specification, and the drawing is a SIM card of a small shopping specification; FIG. 2A shows a mobile phone of the present embodiment. Figure 2B shows the mobile phone with the SIM card of the second specification inserted. Figure 3 is a schematic diagram of the lower casing of the mobile phone shown in Figure 3, and Figure 4 shows the assembled housing. FIG. 5 is a perspective view of the accommodating mechanism of the present embodiment; FIG. 6A is a view showing the accommodating mechanism assembled on the mobile phone; FIG. 6B is shown as the first The specification of the siM card is assembled on the factory and the intention of the facility. [Main component symbol description] 10: Common specification SIM card 200841526 12, 12' ··Substrate 10': Common specification SIM card 1000: Mobile phone 1100: Antenna cover 1200: Lower case 1220: Slots 1222, 1222' : card slot structure 1224: positioning protrusion 1300: receiving mechanism 1320: groove 1340: opening 1360, 1360': hook 1380: positioning hole 1400: SIM card reading contact 11