201015948 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種積體電路晶片，尤指一種整合多積 體電路晶片間的擴充裝置。 【先前技術】 用戶識別模組卡（Subscriber Identity Module Card, SIM Card)係為一種應用於行動通訊裝置的智慧卡（Smart Card)，其係作為儲存用戶身分辨識資料、電話號碼、簡訊 等使用。由於用戶識別模組卡（SIM卡）得以儲存使用者進行 通訊時所需要大部分的資料，且已標準規範化’因此’用 戶僅需移動該SIM卡即可應用於不同行動通訊裝置上。除 了上述資料之外，SIM卡仍儲存了其他資料，包括如國際 移動用戶識別碼（International Mobile Subscriber Identity, IMSI)、臨時識別瑪（Temporary Mobile Subscriber Identity， TMSI)、確認金餘（Ki)、個人識別碼（Personal Identification Number, PIN)、SIM 卡解鎖密碼（PIN un-block key，PUK)、 IC 卡識別瑪（Integrated Circuit Card ID，ICC-ID)以及 SIM 卡 應用工具組（SIM Tool Kit，STK)等。 一般SIM卡在出廠時已經儲存營運業者事先所燒錄的 IMSI及Ki等識別資料，也就是說，使用者所使用的SIM 卡無法使用其他營運業者的行動通訊服務。對於跨營運業 商的使用者而言，必須攜帶多張SIM卡或者多隻行動通訊 裝置，相當不便。此外，STK的下載亦受限於營運業者’ 使用者無法下載其他營運商所提供的STK，造成行動通訊 市場的阻隔，限制了行動通訊服務的發展。且SIM卡的儲 存空間疋相當有限的，且沒有擴充的可能，使用者往往因 3 201015948 為容量的問題被迫刪除重要的電話或簡訊。上述問題，對 於曰趨倚賴行動通訊裝置的.使用者而言，確實存在著相當 大的不方便性，且限制了行動通訊系統發展的可能。 - ^習知如中華民國公告第496621號、第55804〇號以及 證書第M283446號專利案，揭露多種手機雙卡擴充裝置。 主要係將一薄膜電路板將二SIM卡相互電性連接，再藉由 一與該薄膜電路板耦接的控制晶片卡，或者將薄臈電路板 上的二SIM卡對折後，插設入手機内的SIM卡固定座上， • 使該手機得以具備雙SIM卡的功能並獲得不同行動通訊業 者的服務。然而，相較於傳統單一 SIM卡，上述技術無疑 是增加了相當多的體積。一般手機裝設SIM卡的固定座係 位於背部空間，該背部空間大部分係為電池所佔據，沒有 多餘的空間能夠增設其他裝置。欲使用上述擴充裝置，勢 必要搭配具有足夠背部空間的行動通訊裝置，限制了該擴 充裝置的使用範圍。若強制裝設該擴充裝置，恐造成電池 ^榫的損毁、電池與手機間接觸不良，甚至手機結構的破 壞等問題。 ® 再請參閱其他SIM卡擴充裝置，如中華民國公告第 585374號、證書第M275641號、第M298847號專利^所 示，該些SIM卡擴充裝置之外觀大小與一般SIM卡相同， 主要包含二卡槽，以及位於卡槽底部的電路板。為避免增 加過多體積，SIM卡須經過剪裁的手段，將晶片取下後置 入該卡槽中，晶片之間可藉由電路板相互連結。最後，利 用一滑蓋裝置於該擴充裝置外部。該滑蓋的兩侧具有一體 彎折成形的滑軌，該滑執可供該擴充裝置滑入該滑蓋中， 以保護裝設於該擴充裝置内的二晶片。於前揭技術中，該 擴充裝置裝設於原本SIM卡的固定座中，不需額外增加^ 設空間，亦不會造成電池裝設的問題。然而，位於該滑執 201015948 底側的凸起長條結構，則使得整體厚度增加，讓擴充裝置 無法順利裝設入該固定座中，甚至導致受壓力道的不同而 ' 破壞晶月。此外’該凸起長條結構亦容易與其他構件相互 鉤結，而造成滑軌的損壞。 【發明内容】201015948 VI. Description of the Invention: [Technical Field] The present invention relates to an integrated circuit chip, and more particularly to an expansion device for integrating a multi-integrated circuit chip. [Prior Art] A Subscriber Identity Module Card (SIM Card) is a smart card used in a mobile communication device, and is used as a storage user identification data, a telephone number, a short message, and the like. Since the subscriber identity module card (SIM card) is capable of storing most of the data required by the user for communication, and has been standardized as a standard, the user only needs to move the SIM card to apply to different mobile communication devices. In addition to the above information, the SIM card still stores other information, including, for example, International Mobile Subscriber Identity (IMSI), Temporary Mobile Subscriber Identity (TMSI), Confirmation Jin Yu (Ki), and individuals. Personal Identification Number (PIN), SIM Un-block key (PUK), Integrated Circuit Card ID (ICC-ID), and SIM Tool Kit (STK) )Wait. Generally, the SIM card stores the identification data such as IMSI and Ki that the operator has previously burned at the factory. That is to say, the SIM card used by the user cannot use the mobile communication service of other operators. For users across the business, it is quite inconvenient to carry multiple SIM cards or multiple mobile communication devices. In addition, the download of STK is also limited by the fact that operators cannot download STKs provided by other operators, which hinders the mobile communication market and limits the development of mobile communication services. Moreover, the storage space of the SIM card is quite limited, and there is no possibility of expansion. The user is often forced to delete important calls or text messages due to the capacity problem of 201015948. The above problems are quite inconvenient for users who tend to rely on mobile communication devices, and limit the possibility of the development of mobile communication systems. - ^Zizhi, such as the Republic of China Announcement No. 496621, No. 55804, and Certificate No. M283446, discloses a variety of mobile phone dual card expansion devices. The main method is to electrically connect two SIM cards to each other by a thin film circuit board, and then insert a control chip card coupled to the thin film circuit board or fold the two SIM cards on the thin circuit board to be inserted into the mobile phone. On the SIM card holder, • enables the phone to have dual SIM capabilities and access to different mobile operators. However, the above technique undoubtedly adds considerable volume compared to conventional single SIM cards. In general, the fixed seat of the SIM card installed in the mobile phone is located in the back space, and most of the back space is occupied by the battery, and there is no extra space to add other devices. In order to use the above expansion device, it is necessary to use a mobile communication device with sufficient back space, which limits the scope of use of the expansion device. If the expansion device is forcibly installed, it may cause damage to the battery, poor contact between the battery and the mobile phone, and even damage to the structure of the mobile phone. ® Please refer to other SIM card expansion devices, such as the Republic of China Announcement No. 585374, Certificate No. M275641, and No. M298847. The appearance of these SIM card expansion devices is the same as that of a general SIM card, mainly including two cards. The slot, as well as the board at the bottom of the card slot. In order to avoid excessive volume, the SIM card must be cut off and placed in the card slot, and the chips can be connected to each other by a circuit board. Finally, a slide cover device is used outside the expansion device. Both sides of the slider have an integrally bent slide rail, and the slide allows the expansion device to slide into the slide cover to protect the two wafers installed in the expansion device. In the prior art, the expansion device is installed in the fixing seat of the original SIM card, and no additional space is required, and the battery installation problem is not caused. However, the raised strip structure on the bottom side of the slipper 201015948 increases the overall thickness, making the expansion device not fit smoothly into the mount, and even causing damage to the crystal moon due to the different pressure paths. In addition, the raised strip structure is also easily hooked to other members, causing damage to the slide rails. [Summary of the Invention]
本發月之主要目的，在於擴充單一 SIM卡的功能，並 使其得以廣泛應用於各種行動通訊裝置。為達上述目的， 本發明提供一種積體電路晶片擴充裝置包括有一承載體 以及蓋體。5亥承載體包含有一承載面以及一位於該承載 體外周緣之接设面，該承載面上凹設有至少一供積體電路 晶片設置的裝設槽，該接設面上則設有至少一第一固定 部。該蓋體包含有-覆蓋於該承載面上之上蓋部以及一位 於該接設面相對位置的接設部，該接設部上具有至少一與 "亥第固疋部對應卡扣之第二固定部，使該蓋體固定於該 承載體上方以保護該積體電路晶片。 其中，該承載體包含一形成該裝設槽之框架，以及一 ==局的薄膜電路板。該薄膜電路板上具有電性連 =積體電路晶片的電性端子。此外，該薄膜電路板上具 或者路佈局㈣於該積體電路晶片的控制晶片； 薄膜i路板曰曰直接設置於該框架内，並電性連接於該 :晶片可内建有-無線通訊模組或者-二第承載面相對位置各具有-第-穿孔 設於SIM卡固定座内1該蓋體具有挽性而方便本發明插 弧段。疋座内’於該蓋體之接設部具有至少一内凹 藉此’本發明積體電 並無出現凸起的#構，卩，片擴充裝置於外觀結構上， 構传以平順裝設於行動通訊裝置用來 5 201015948 裝設SIM卡的固定座内。不會因為結構上的阻礙，而造成 裝設上的困難。因此，得以應用於各種行動通訊裝置上， - 以達到SIM卡擴充的功能。 【實施方式】 有關本發明之詳細說明及技術内容，現就配合圖式說 明如下： 請參閱『圖1』、『圖2』及『圖3-1』所示，係本發明 一較佳實施例之外觀立體、結構分解及結構剖面示意圖， 如圖所示：本發明係為一種積體電路晶片擴充裝置，包括 ® 有一承載體10以及一蓋體20。於本實施例中，該承載體 _ 10與該蓋體20組合後之規格相符於一般SIM卡之規格。 該承載體10包含一框架11以及一位於該框架丨丨底部的薄 膜電路板12’該框架11主要包含有一承載面I]以及一位 於該承載面13外周緣的接設面14,並於該承載面13上凹 設至一裝設槽131 ’該薄膜電路板12具有一電路佈局121， 並於該裝設槽131内的位置設有電性端子122。於本實施例 中，係以單一裝設槽131為例，該裝設槽131供一積體電 φ 路晶片30設置’該積體電路晶片30可為用戶識別模組 (Subscriber Identity Module，SIM)晶片、通用用戶識別模組 (Universal Subscriber Identity Module，USIM)晶片、使用者 識別模組（User Identity)晶片或者可移除式使用者識別模組 (RemovableUserIdentityModule，RUIM)晶片等。該積體電 路晶片30與該裝設槽13 1内的電性端子122接觸後，透過 該薄膜電路板12上的電路佈局121相互麵接。 此外，於本發明中，該承載體10内設有一控制晶片 3 1。於『圖2』所示’該控制晶片3 1係設置於該薄膜電路 板12上’並利用該電路佈局121耦接於該積體電路晶片 201015948 30’於該框架11相對應於該控制晶片3i具有—嵌設槽 133，以供該控制晶片31嵌設。或者，於另實施例中，該 控制晶片31可直接内設於該框架11内，並電性連接於該 薄膜電路板12 ’使該控制晶片3 1不需外露。前述控制晶片 31包含有一記憶體，如電子抹除式可程式化唯讀記憶體 (Electrically Erasable Programmable Read-On Memory, EEPROM)或快閃記憶體（Flash Mem〇ry)，使得該控制晶片 31具有儲存的功能。該控制晶片31得以提供該積體電路晶 片30額外的功能，甚至可以取得其他營運業者或第三方（如 銀行或電子商家）的服務，諸如轉帳、交易、產生動態密碼、 身分確認等。此外，該控制晶片31更可包含有一無 模組，如藍芽無線通訊模組等’使用者得以不經由營運業 者的方式，自行下载或傳輸資訊至該控制晶片Η中。 為保護設置於該承載體10内的積體電路晶片3〇以及 該控制晶片3卜該蓋體2G設置於該承舰1()上。該蓋體 2〇包含有-覆蓋於該承載面13上之上蓋部21以及一位於 該接設面14相對位置的接設部22。該接設部㈣一體連 接於社蓋部2卜其端緣可位於該接設面14的區間，或者 可在下延伸㈣齊於該接設面14的底端 該接設部22之端緣係位 ^ 於減叹面14的區間内為例，如 圖-』所不。如此，當該蓋體2〇與該承載體1〇相互組 σ，於整體外觀上不會出 設於行動通訊裝置中。 的、。構，而阻礙本發明裝 除此之外，該承裁體 設部22各具有至少—相_=叹面14與該蓋體20之接 固定邻221，如『 應卡扣的第—固定部141與第二 〇 圖3·2』所示。該第一固定部141係為一 201015948 凹陷結構，該第二固定部221係為與該凹陷結構相對之突 起結構。當該蓋體20與該承載體10相互組合，該第一固 定部141與該第二固定部221得以相互卡扣，而避免該蓋 • 體20與該承載體10相互脫離。 於本發明中，該上蓋部21與該承載面13相對位置各 具有第穿孔211以及一第二穿孔132,使用者得以藉由 一尖狀物穿過該第一穿孔211以及該第二穿孔132後，施 力拖拉或推壓該承載體10及該蓋體2〇，方便將本發明組合 〇 或脫離於行動通訊裝置的SIM卡固定座内。而為方便該框 • 架11的開模製造’該第二穿孔132—體連通於該裝設槽131 , 以及該嵌設槽13'3。此外，為能使本發明具備有一定程度的 撓性得以裝設於行動通訊裝置的SIM卡固定座内，該蓋體 2〇之接設部22具有至少一内凹弧段222 ’如『圖2』所示， 使該蓋體20得以因應插設於SIM卡固定座而進行些微的彎 折。 本發明亦可應用於多卡擴充架構，請參閱『圖4』所示， 該承載體10之框架11上具有二裝設槽131、131a，可供二 ® 積體電路晶片30、3(^設置，其中，於該裝設槽131、131& 内係利用該薄膜電路板12的電路佈局121耦接於該控制晶 片31，並整合該控制晶片31所附加的功能，如此可達到多 卡擴充的效果。 綜上所述’本發明積體電路晶片擴充裝置中，該蓋體 的接設部端緣係位於接設面的區間範圍，或者與該接設面 底端對齊。因此，本發明整體外觀並無突出的結構，當裝 設於行動通訊裝置時，不會造成結構上的阻礙，或者因為 壓迫而破壤晶片。此外，本發明得以擴充傳統單一 SIM晶 201015948 =功^❹者得以有彈性獲得更廣泛的服務，有利於 無線通訊錢服務时展。因此树明極錢步性及符合 申請發明專利之要件，爰依法接 准專利，實感德便。 祈肖局早曰賜The main purpose of this month is to expand the functionality of a single SIM card and make it widely available in a variety of mobile communication devices. To achieve the above object, the present invention provides an integrated circuit wafer expansion device including a carrier and a cover. The 5H carrier includes a bearing surface and a connecting surface on the outer periphery of the bearing body. The bearing surface is recessed with at least one mounting groove for the integrated circuit chip, and the connecting surface is provided with at least one The first fixing portion. The cover body includes a cover portion covering the upper surface of the support surface and a connecting portion at an opposite position of the connection surface, the connection portion having at least one corresponding buckle with the "Haidi fixed portion The fixing portion fixes the cover over the carrier to protect the integrated circuit chip. Wherein, the carrier comprises a frame forming the mounting groove, and a thin film circuit board of ==. The thin film circuit board has an electrical connection = an electrical terminal of the integrated circuit chip. In addition, the thin film circuit board has a circuit layout (4) on the control chip of the integrated circuit chip; the thin film i-channel board is directly disposed in the frame, and is electrically connected to the chip: the chip can be built-in-wireless communication The module or the second bearing surface has a relative position, each of which has a first through hole provided in the SIM card holder. The cover body has a property to facilitate the arcing segment of the present invention. In the squatting seat, the connecting portion of the cover body has at least one recessed thereby. The present invention has no protruding structure, and the cymbal expansion device is arranged on the outer structure. The mobile communication device is used in the fixed seat of the 5 201015948 SIM card. It will not cause difficulties in installation due to structural obstacles. Therefore, it can be applied to various mobile communication devices - to achieve the SIM card expansion function. [Embodiment] The detailed description and technical contents of the present invention will be described below with reference to the drawings: Please refer to FIG. 1 , FIG. 2 and FIG. 3-1 for a preferred embodiment of the present invention. For example, the appearance of the three-dimensional, structural decomposition and structural cross-sectional view, as shown in the figure: The present invention is an integrated circuit wafer expansion device, including a carrier 10 and a cover 20. In this embodiment, the combination of the carrier _ 10 and the cover 20 conforms to the specifications of a general SIM card. The carrier 10 includes a frame 11 and a film circuit board 12' located at the bottom of the frame. The frame 11 mainly includes a bearing surface I] and a connecting surface 14 on the outer periphery of the bearing surface 13, and The carrying surface 13 is recessed to a mounting groove 131. The thin film circuit board 12 has a circuit layout 121, and an electrical terminal 122 is disposed at a position in the mounting groove 131. In the embodiment, the single mounting slot 131 is used as an example, and the mounting slot 131 is provided for an integrated electrical circuit wafer 30. The integrated circuit chip 30 can be a subscriber identification module (Subscriber Identity Module, SIM). A chip, a Universal Subscriber Identity Module (USIM) chip, a User Identity chip or a Removable User Identity Module (RUIM) chip, or the like. The integrated circuit wafer 30 is in contact with the electrical terminals 122 in the mounting trench 13 1 and then is in surface contact with each other through the circuit layout 121 on the thin film circuit board 12. Further, in the present invention, a control wafer 31 is disposed in the carrier 10. The control chip 31 is disposed on the thin film circuit board 12 and is coupled to the integrated circuit chip 201015948 30' by the circuit layout 121 corresponding to the control chip. The 3i has an embedding groove 133 for embedding the control wafer 31. Alternatively, in another embodiment, the control wafer 31 can be directly disposed in the frame 11 and electrically connected to the thin film circuit board 12' so that the control wafer 31 does not need to be exposed. The control chip 31 includes a memory, such as an electrically erasable programmable read-only memory (EEPROM) or a flash memory (Flash Mem〇ry), so that the control chip 31 has Stored features. The control chip 31 provides additional functionality to the integrated circuit chip 30 and may even be serviced by other operators or third parties such as banks or electronic merchants, such as transfers, transactions, dynamic password generation, identity verification, and the like. In addition, the control chip 31 can further include a module, such as a Bluetooth wireless communication module, and the user can download or transfer information to the control chip without the operator. In order to protect the integrated circuit chip 3A disposed in the carrier 10 and the control wafer 3, the cover 2G is disposed on the carrier 1(). The cover 2 includes a cover portion 21 covering the support surface 13 and a connecting portion 22 at a position opposite to the connection surface 14. The connecting portion (4) is integrally connected to the cover portion 2, and the end edge thereof may be located in the interval of the connecting surface 14, or may be extended downward (4) at the bottom end of the connecting surface 14 The position ^ is in the interval of the stunner 14 as an example, as shown in the figure - 』. Thus, when the cover body 2〇 and the carrier body 1〇 are combined with each other, the overall appearance is not provided in the mobile communication device. of,. In addition to hindering the present invention, the cutting body portions 22 each have at least a phase _=single surface 14 and a fixed portion 221 of the cover body 20, such as a first fixing portion to be buckled. 141 and the second figure are shown in Figure 3.2. The first fixing portion 141 is a recessed structure of 201015948, and the second fixing portion 221 is a protruding structure opposite to the recessed structure. When the cover body 20 and the carrier body 10 are combined with each other, the first fixing portion 141 and the second fixing portion 221 are mutually latched to prevent the cover body 20 from being detached from the carrier body 10. In the present invention, the upper cover portion 21 and the bearing surface 13 respectively have a first through hole 211 and a second through hole 132. The user can pass through the first through hole 211 and the second through hole 132 by a pointed object. Thereafter, the carrier 10 and the cover 2 are dragged or pushed to facilitate the assembly or detachment of the present invention into the SIM card holder of the mobile communication device. To facilitate the mold opening of the frame 11, the second through hole 132 is in communication with the mounting groove 131, and the embedded groove 13'3. In addition, in order to enable the present invention to have a certain degree of flexibility to be installed in the SIM card holder of the mobile communication device, the connector portion 22 of the cover body 2 has at least one concave arc segment 222' as shown in the figure. 2", the cover 20 is slightly bent in response to being inserted into the SIM card holder. The present invention can also be applied to a multi-card expansion architecture. As shown in FIG. 4, the frame 11 of the carrier 10 has two mounting slots 131 and 131a for the two-product integrated circuit chips 30 and 3 (^ The device is configured to be coupled to the control chip 31 by using the circuit layout 121 of the thin film circuit board 12, and integrate the functions added by the control chip 31, so that the multi-card expansion can be achieved. In the above, in the integrated circuit wafer expansion device of the present invention, the edge of the connecting portion of the cover is located in the interval of the connecting surface or is aligned with the bottom end of the connecting surface. Therefore, the present invention The overall appearance has no outstanding structure. When installed in a mobile communication device, it does not cause structural obstruction or breaks the wafer due to compression. In addition, the present invention can expand the traditional single SIM crystal 201015948. It is flexible to obtain a wider range of services, which is conducive to the wireless communication money service exhibition. Therefore, it is extremely cost-effective and meets the requirements for applying for invention patents, and it is legally qualified to accept patents.
以上已將本發明做一詳細說明，惟以上所述者，僅爲 發明之較佳實施例而已，當不能限定本發明實施之範 卩凡依本發㈣晴|agI所作之均等變化與修飾等，皆 應仍屬本發明之專利涵蓋範圍内。【圖式簡單說明】 圖1’係本發明積體電路晶 立體示意圖 片擴充裝置一較佳實施例之外觀 圖2’係本發明積體電路晶片擴充裝 分解示意圖 置一較佳實施例之結構 :3小係本發明積體電路晶片擴充裝置一較佳實施例之結 構剖面示意圖 圖3-2 ’係圖3-1局部放大圖The present invention has been described in detail above, but the above is only a preferred embodiment of the invention, and the equivalent variation and modification of the invention may not be limited by the implementation of the invention. All should remain within the scope of the patent of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an external view of a preferred embodiment of a solid crystal image expansion device of the present invention. FIG. 2 is a schematic view of an integrated circuit chip expansion assembly of the present invention. 3 is a schematic cross-sectional view of a preferred embodiment of the integrated circuit chip expansion device of the present invention. FIG. 3-2 is a partial enlarged view of FIG.
圖4，係本發明積體電路晶片擴充裝 構分解示意圖 置多卡擴充實施例之結 【主要元件符號說明】 10 ........ 11 . 12 ......... 121 , 122........ 13 ·....... 131 、 13la ..... 132........ .....承載體 .....框架 .....薄膜電路板 .....電路佈局 .....電性端子 .....承載面 .....裝設槽 .....第二穿孔 9 201015948 133.............嵌設槽 14.............接設面 141.............第一固定部 20 .............蓋體 21 .............上蓋部 211.............第一穿孔 22 .............接設部 221 .............第二固定部4 is a schematic exploded view of the integrated circuit of the integrated circuit of the present invention. The knot of the multi-card expansion embodiment [main component symbol description] 10 ........ 11 . 12 ......... 121, 122........ 13 ·....... 131 , 13la ..... 132........ ..... Carrier .....film circuit board.....circuit layout.....electrical terminal.....bearing surface.....installation slot.....second perforation 9 201015948 133. ............Inlay groove 14.............Connection surface 141.............First fixed part 20 ............. cover 21 ............. upper cover 211.............first perforation 22 .............Connecting part 221..................Second fixed part
222 .............内凹弧段 30、30a.............積體電路晶片 31.............控制晶片222 ............. concave arc segments 30, 30a............ integrated circuit chips 31........... .. control chip