200841449 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種被動元件接人彡士 _ r ^ ;υ丨卞丧σ結構，特別係有 關於一種可防止立碑效應之被動元件接合結構。 【先前技術】200841449 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a passive component accessing a gentleman _r^; υ丨卞 σ σ structure, in particular to a passive component joint that prevents the tomb effect structure. [Prior Art]
例如電容、電感或電阻等被動元件可整合在一半導 體封裝構造或其它主動式電子產品内，達到電流穩定與 元件保護的效果。然而在可微小化與高性能的半導體封 裝構造中’被整合的被動元件應是表面黏著型（或稱晶 片型）’藉由塗佈於一基板上的錫膏銲料將表面黏著型 被動元件之兩端表面電極以回銲方式固著在基板之接 合墊上。然而當錫膏塗佈量不均勻、過多、被動元件的 設置位置不準確或是基板的受熱面積不均勻等等，則在 回銲時銲料液化產生表面張力會在被動元件兩側表面 電極形成不同拉力而發生立碑或墓碑效應，或是發生被 動元件的位移問題。若在有限的空間中被動元件之位移 容易接觸至鄰近之元件或銲線進而發生短路。以下進一 步說明習知被動元件接合結構的基本架構。 請參閱第1圖，一種習知被動元件接合結構1〇〇主 要包含一基板110、一被動元件120以及銲料13〇。該 基板no係具有複數個接合墊⑴，以供接合該被動元 件120。該被動元件120係具有複數個電極ΐ2ι，該些 電極121係位於該被動元件12〇之兩相對側。通常該銲 料130在回銲前的錫膏係以塗佈或網版印刷方式^成 200841449 * 於該基板110之該些接合墊111上。該被動元件120係 藉由錫膏回鲜前的黏性’使該些電極12 1可暫時黏貼在 該些接合墊111上。再將該基板110與該被動元件12〇 同時進行回銲（reflowing)，使得錫膏熔融成該辉料13〇 而令該被動元件12 0固定於該基板11 〇上。由於錫膏塗 施量不均勻、過厚或者被動元件1 2 0貼附位置過於偏移 等製程參數的變化’當回銲時所形成之銲料“Ο會對被 動元件120之兩端表面電極121所產生不同拉力。請參 閱第2圖所示，受到較少銲料拉力的一端容易翹起而脫 離該基板110而發生立碑效應，該被動元件12〇之魅起 電極便無法與該基板1 1 〇達到電性連接，導致產品失 我國發明專利證號第1272048號「被動元件之接合 結構」提出一種限制被動元件位移的接合結構，其係利 用基板的防銲層設有一被動元件尺寸對應之開口，以限 制被動元件回銲時的位移，但無法解決立碑的問題，且 在一開始貼附該被動元件時的設置位置要相當準確，既 有的表面黏著機台可能無法滿足此一要求的極窄容許 誤差。Passive components such as capacitors, inductors, or resistors can be integrated into a half-conductor package or other active electronics for current stability and component protection. However, in a semiconductor package structure that can be miniaturized and high-performance, the passive component to be integrated should be a surface-adhesive type (or wafer type). The surface-adhesive passive element is soldered by a solder paste applied to a substrate. The surface electrodes at both ends are fixed to the bonding pads of the substrate by reflow. However, when the amount of solder paste is uneven, excessive, the position of the passive component is not accurate, or the heated area of the substrate is not uniform, etc., the surface tension of the solder liquefaction during reflow will form different electrodes on both sides of the passive component. A tombstone or tombstone effect occurs when tension occurs, or the displacement of a passive component occurs. If the displacement of the passive component in a limited space is easily accessible to an adjacent component or wire bond, a short circuit occurs. The basic structure of the conventional passive component joint structure will be further explained below. Referring to Fig. 1, a conventional passive component bonding structure 1b mainly includes a substrate 110, a passive component 120, and a solder 13A. The substrate no has a plurality of bonding pads (1) for bonding the passive components 120. The passive component 120 has a plurality of electrodes ΐ2ι, and the electrodes 121 are located on opposite sides of the passive component 12''. Usually, the solder paste of the solder 130 before reflow is applied by coating or screen printing to the bonding pads 111 of the substrate 110. The passive component 120 is temporarily adhered to the bonding pads 111 by the adhesiveness of the solder paste before it is freshened. The substrate 110 is reflowed simultaneously with the passive component 12, so that the solder paste is melted into the phosphor 13 to fix the passive component 120 to the substrate 11. The variation of the process parameters such as the uneven application of the solder paste, the excessive thickness, or the offset of the passive component 120 is too 'the solder formed when reflowing' will be the surface electrode 121 of the passive component 120. Different pull forces are generated. As shown in Fig. 2, the end that is subjected to less solder tension is easily lifted off the substrate 110 and the tombstoning effect occurs. The passive component 12 can not be connected to the substrate 1 〇 〇 〇 电 我国 我国 我国 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 In order to limit the displacement of the passive component during reflow, but the problem of the tombstone cannot be solved, and the setting position when the passive component is attached at the beginning is quite accurate, and the existing surface bonding machine may not meet this requirement. Extremely narrow tolerance.
成朝向該中心開槽集中而產生一往下的内聚引 以避免被動元件立碑問題發生。然其被動元件立碑 6 200841449 . 問題的根源在於焊接被動元件兩端表面電極 力不平衡，在表面黏著製程中無法預測另一個 容易產生弱接合力而特別設計出一中央開槽， 之銲塾皆設計有中央開槽，則内聚引力不平衡 是存在，僅能減小被動元件立碑的發生機率， 消除被動元件的立碑問題。 【發明内容】 _ 本發明之主要目的係在於提供一種被動元 構以及具有該結構之半導體封裝構造，藉由固定環 動元件，以完全消除被動元件的立碑效應或位 本發明之次一目的係在於提供一種被動元 構以及具有該結構之半導體封裝構造，可免用銲料 銲製程。 本發明的目的及解決其技術問題是採用以 案來實現的。依據本發明，一種被動元件接合 _ 包含一基板、一被動元件以及一第一固定環。 具有兩相鄰之一第一接合墊與一第二接合墊。 件係具有一第一電極與一第二電極。該第一固 合於該基板’用以機械性夾固該被動元件。此 明另揭示使用該被動元件接合結構之一半導 造、 本發明的目的及解決其技術問題還可採用 措施進一步實現。 在前述的被動元件接合結構中，該第一固 的内聚引 銲墊比較 若兩對應 的差值仍 無法完全 件接合結 以夾固被 移問題。 件接合結 以省略回 下技術方 結構主要 該基板係 該被動元 定環係結 外，本發 體封裝構 以下技術 定環係可 7 200841449 為金屬材質，該第' 一固定$ t . ^ ^ U&J衣係焊設在該第一接合墊並摩 擦力接觸該第一電極。 在前述的被動元件接合結構中，可另包含有一第一 固定環，其係為金屬材質，該第二固定環係焊設在該第 、 二接合墊並摩擦力接觸該第二電極。 / . 在前述的被動元件接合結構中，可另包含有銲料， 其係焊接該第二接合墊與該第二電極。 • 在前述的被動元件接合結構中，該第一固定環係可 為一開口朝上之c形扣。 在前述的被動元件接合結構中，該第一固定環係可 為一 口朝向該基板侧邊之C形扣或U形扣。 在刖述的被動元件接合結構中，該第一固定環係可 為一上方遮蓋之L形扣。 在前述的被動元件接合結構中，該被動元件之設置 方向係可斜向於連接該第一接合墊與該第二接合墊之 鲁 一中心線，以使該第一電極偏離於該第一接合墊。 在前述的被動元件接合結構中，該第二電極係可對 準於該第二接合墊。 【實施方式】 依據本發明之第一具體實施例，以第3圖、第4圖 與以下說明揭示一種被動元件接合結構。 請參閱第3圖所示，一種被動元件接合結構200主 要包含一基板210、一被動.元件220以及至少一固定 環。在本實施例中，該被動元件接合結構2 〇 〇係包含一 8 200841449 第一固定環230與一第二固定環240，其係對應於該基 板210兩相鄰之一第一接合墊2 11與一第二接合蟄2 12。 該基板210係更具有一封膠表面213，其中該第一 接合墊211與該第二接合墊212係位於該封膠表面213 上。該基板2 1 0更具有一防銲層2 1 4，其係形成於該封 膠表面213上並具有複數個開口 215，其係顯露該第一 接合墊211與該第一接合墊211，以供接合該被動元件 220 〇 該被動元件220係具有一第一電極221與一第二電 極222。一般而言，該第一電極221與該第二電極222 係位於該被動元件220之兩端，為端面表面電極。 請再參閱第3圖所示，該第一固定環230係結合於 該基板210，用以機械性夾固該被動元件220。該第一 固定環230係可為金屬材質，其中該第一固定環230係 焊設在該第一接合墊211並能摩擦力接觸該第一電極 221，使該被動元件220與該基板210之間形成電性連 接。請參閱第4圖所示，在本實施例中，該第一固定環 23 0係可為一開口 215朝上之C形扣。同樣地，該第二 固定環240亦可為金屬材質，該第二固定環240係焊設 在該第二接合墊212並能摩擦力接觸該第二電極222。 因此，利用該第一固定環230與該第二固定環24〇 夾固該被動元件220，可完全消除了該被動元件220會 發生位移或立碑效應的問題。此外，該第一固定環23 0 與該第二固定環240係直接嵌夹固定住該被動元件 200841449 220，故可免除習知焊接被動元件的回銲製程一 於-半導體封裝構造，冑減少一次熱處理二銲; 故可避免在封膠前的晶片或其電連接元件遭受製 染。 依據本發明之第-具體實施例，該被動元件接 構200可進一步應用於一半導體封裝構造，例如微 位保全卡（Micro SD card)、已知記憶卡或球格陣列 構造、或其它已知的封裝型態產品等等。請參閱第 所示，一種半導體封裝構造至少包含上述的被動元 合結構、一晶片3 1 0以及一封膠體3 2 〇。該晶片3 没置該基板2 1 0之該封膝表面2 1 3上，另可利用複 打線形成之銲線330電性連接該晶片31〇與該 210。當該第一固定環23 0與該第二固定環24〇固 被動元件220之後，該封膠體32〇係可形成於該 2 1 0之該封膠表面2 1 3上，以密封該晶片3 1 0、該 元件220、該第一固定環230與該第二固定環24G 再參閱第5圖所示，該基板210之一下表面係設有 個外接墊216或外接端子，可藉由卡片插接或其它 電性連接至一外部電子產品。請再參閱第5圖所示 第一固定環230與該第二固定環240係夾固該被動 220，故可避免發生立碑效應或位移，以提高該半 封裝構造之品質。 本發明另揭示一第二具體實施例，與上述第一 實施例之被動元件接合結構大體相同。請參閱第6 運用 驟， 程污 合結 型數 封裝 5圖 件接 〇係 數個 基板 定該 基板 被動 。請 複數 方式 ，該 元件 導體 具體 圖所 10 200841449 7F ’ 4被動元件接合結構主要包含^ 一基板2 1 0、一被動 元件220以及一固定環230。其中該固定環230係結合 於該基板210，並機械性夾固該被動元件220之第—電 極2 2 1。在本實施例中，導電膠2 5 〇係形成於該第二接 合墊212上並與該被動元件220之第二電極222黏接， 可免除回銲製程以電性連接該第二接合墊212與該第 二電極222。其中，藉由該固定環230之設置，可避免 該被動元件220發生位移或立碑效應，即使該被動元件 220之該第二電極222略有翹起時，該固定環會230限 制該被動元件220之位移而不會翹起，藉此完全避免發 生立碑效應。 依據本發明之第三具體實施例，揭示另一種被動元 件接合結構，請參閱第7圖所示，該被動元件接合結構 400主要包含一基板410、一被動元件420以及一第一 固定環43 0。該基板410係具有兩相鄰之一第一接合墊 411與一第二接合墊412。該被動元件420係具有一第 一電極421與一第二電極422。 該第一固定環430係結合於該基板410，用以機械 性夾固該被動元件420。其中該第一固定環430係可焊 設在該第一接合墊411並摩擦力接觸該第一電極421。 請再參閱第7圖所示，在本實施例中，該第一固定環 43 0係可為一開口朝向該基板4丨〇侧邊之c形扣或U形 扣。具體而言，該被動元件接合結構400可另包含有一 第二固定環440，其係焊設在該第二接合墊412並摩擦 11 200841449 力接觸該第二電極422。該第一固定環430與該第二固 定環440係可為金屬材質，以使該被動元件420輿該基 板4 1 0之間形成電性連接。因此，該被動元件接合結構 400可避免該被動元件420發生立碑效應或位移並可免 用銲料來焊接該被動元件420，不致碰觸至鄰近之其他 元件。 依據本發明之第四具體實施例，揭示另一種被動元 件接合結構，請參閱第8圖所示，該被動元件接合結構 500主要包含一基板510、一被動元件520以及一固定 環530。該基板510係具有兩相鄰之一第一接合墊511 與一第二接合墊512。該被動元件520係具有一第一電 極521與一第二電極522。請參閱第9圖所示，在本實 施例中’該被動元件5 2 0之設置方向係可斜向於連接該 第一接合塾511與該第二接合塾512之一中心線，以使 該第一電極521偏離於該第一接合墊511。該被動元件 520之該第二電極5 22係可對準於該第二接合墊512。 另可利用銲料540以回銲方式焊接該第二接合墊512與 該第二電極522。 該固定環5 3 0係結合於該基板5 1 〇，用以在回銲前 機械性失固該被動元件520之第一電極521。其中該固 定環5 3 〇係可為金屬材質，該固定環5 3 〇係焊設在該第 一接合墊511並摩擦力接觸該第一電極521。在本實施 例中，該固定環530係可為一上方遮蓋之l形扣。 因此’該固定環5 3 0可使該被動元件5 2 0於回銲過 12 200841449 程中無偏移之虞，同時，該固定冑53〇得有效將該被動 元件520壓固定於該基板5 10上，故T會有iL碑效應。 乂上所述，僅是本發明的較隹實施例而已，並非對 本發明作任何形式上的限制，本發明技術方案範圍當依 斤附申明專利範圍為準。任何熟悉本專業的技術人員可 利用上述揭示的技術内容作出些許更動或修飾為等同 ，化的等效實施例，但凡是未脫離本發明技術方案的内 f，依據本發明的技術實質對以上實施例所作的任何簡 單U等同變化與修飾，均仍屬於本發明技術方案的 範圍内。 ' 【圖式簡單說明】 第1圖：-種習知被動元件接合結構於回銲前之戴面示 意圖。 第2圖 習知被動元件接合結構中被動元件發生立碑效 應之截面示意圖。 第 依據本發明之第一具體實施例，一種被動元件 接合結構之截面示意圖。 第4圖·依據本發明之第一具體實施例，該被動元件接 合結構之侧面示意圖。 第5圖：依據本發明之第一具體實施例，該被動元件接 合結構應用於一半導體封裝構造之截面示意 圖。 第6圖··依據本發明之第二具體實施例，另一種被動元 件接合結構之截面示意圖。 13 200841449 第7圖：依據本發明之第三具體實施例，另一種被動元 件接合結構之截面示意圖。 第8圖：依據本發明之第四具體實施例，另一種被動元 件接合結構之截面示意圖。 第9圖：依據本發明之第四具體實施例，該被動元件接 合結構之頂面示意圖。Slotting toward the center concentrates to create a downward cohesion to avoid passive component tombstone problems. However, the passive component of the monument 6 200841449. The root of the problem lies in the imbalance of the surface electrode force at the two ends of the welding passive component. It is impossible to predict another easy-to-break weak bonding force in the surface adhesion process, and a central slot is specially designed. All designed with central slotting, the cohesive gravitational imbalance is present, which can only reduce the probability of the passive component tombstoning and eliminate the tombstone problem of passive components. SUMMARY OF THE INVENTION The main object of the present invention is to provide a passive element structure and a semiconductor package structure having the same structure, by fixing a ring-moving element to completely eliminate the tomb effect of the passive element or the second object of the present invention. It is to provide a passive element structure and a semiconductor package structure having the structure, which can be free of solder soldering process. The object of the present invention and solving the technical problems thereof are achieved by the use of the present invention. In accordance with the present invention, a passive component bond _ includes a substrate, a passive component, and a first retaining ring. There are two adjacent ones of the first bonding pads and one second bonding pads. The device has a first electrode and a second electrode. The first attachment to the substrate ' is used to mechanically clamp the passive component. It is further disclosed that the use of one of the passive component bonding structures, the purpose of the present invention, and the solution of the technical problems can be further achieved by measures. In the aforementioned passive component bonding structure, the first solid cohesive bonding pad is still unable to completely bond the junction to sandwich the displacement problem if the two corresponding differences are obtained. The joint of the piece is omitted to omit the structure of the lower part. The substrate is the passive element ring, and the following ring structure of the present invention can be made of metal material, the first fixed $t. ^ ^ The U&J clothing is soldered to the first bonding pad and frictionally contacts the first electrode. In the foregoing passive component bonding structure, a first fixing ring may be further included, which is made of a metal material, and the second fixing ring is soldered to the first and second bonding pads and frictionally contacts the second electrode. In the aforementioned passive component bonding structure, solder may be additionally included, which solders the second bonding pad and the second electrode. • In the aforementioned passive component engagement structure, the first retaining ring can be a c-shaped snap with an opening facing upward. In the aforementioned passive component engaging structure, the first retaining ring can be a C-shaped buckle or a U-shaped buckle facing the side of the substrate. In the passive component engagement structure described above, the first retaining ring system can be an L-shaped buckle that is covered upward. In the foregoing passive component bonding structure, the passive component is disposed in a direction obliquely connecting the first bonding pad and the second bonding pad to a center line, so that the first electrode is offset from the first bonding pad. In the aforementioned passive component bonding structure, the second electrode system can be aligned with the second bonding pad. [Embodiment] According to a first embodiment of the present invention, a passive component joint structure is disclosed in Figs. 3, 4 and the following description. Referring to FIG. 3, a passive component bonding structure 200 mainly includes a substrate 210, a passive component 220, and at least one fixing ring. In this embodiment, the passive component bonding structure 2 includes an 8 200841449 first fixing ring 230 and a second fixing ring 240 corresponding to the adjacent one of the first bonding pads 2 11 of the substrate 210. Engaged with a second 蛰 2 12 . The substrate 210 further has a glue surface 213, wherein the first bonding pad 211 and the second bonding pad 212 are located on the sealing surface 213. The substrate 2 1 0 further has a solder resist layer 2 14 formed on the encapsulation surface 213 and having a plurality of openings 215 for exposing the first bonding pad 211 and the first bonding pad 211 to The passive component 220 is coupled to the passive component 220. The passive component 220 has a first electrode 221 and a second electrode 222. Generally, the first electrode 221 and the second electrode 222 are located at opposite ends of the passive component 220 and are end surface electrodes. Referring to FIG. 3 again, the first fixing ring 230 is coupled to the substrate 210 for mechanically clamping the passive component 220. The first fixing ring 230 can be made of a metal material, wherein the first fixing ring 230 is soldered to the first bonding pad 211 and can frictionally contact the first electrode 221 to make the passive component 220 and the substrate 210 An electrical connection is formed between them. Referring to FIG. 4, in the embodiment, the first fixing ring 205 can be a C-shaped buckle with an opening 215 facing upward. Similarly, the second fixing ring 240 can also be made of a metal material. The second fixing ring 240 is soldered to the second bonding pad 212 and can frictionally contact the second electrode 222. Therefore, the use of the first fixing ring 230 and the second fixing ring 24 夹 to clamp the passive component 220 completely eliminates the problem that the passive component 220 may be displaced or tombstoned. In addition, the first fixing ring 230 and the second fixing ring 240 directly clamp and fix the passive component 200841449 220, so that the reflow process of the conventional soldering passive component can be eliminated. The heat treatment is secondarily welded; therefore, the wafer or its electrical connection elements before the sealing is prevented from being dyed. In accordance with a first embodiment of the present invention, the passive component connection 200 can be further applied to a semiconductor package construction, such as a micro SD card, a known memory card or a ball grid array configuration, or other known Package type products and so on. Referring to the first aspect, a semiconductor package structure includes at least the passive element structure described above, a wafer 310 and a gel 3 2 〇. The wafer 3 is not disposed on the knee surface 2 1 3 of the substrate 2 10 , and the bonding wires 330 formed by the bonding wires are electrically connected to the wafer 31 and the 210. After the first fixing ring 230 and the second fixing ring 24 are tamped the passive component 220, the sealing body 32 can be formed on the sealing surface 201 of the 210 to seal the wafer 3. The component 220, the first fixing ring 230 and the second fixing ring 24G are further shown in FIG. 5. The lower surface of the substrate 210 is provided with an external pad 216 or an external terminal, which can be inserted by a card. Connected or otherwise electrically connected to an external electronic product. Referring to FIG. 5 again, the first fixing ring 230 and the second fixing ring 240 clamp the passive 220, so that the tombstoning effect or displacement can be avoided to improve the quality of the semi-package structure. The present invention further discloses a second embodiment which is substantially identical to the passive element engagement structure of the first embodiment described above. Please refer to the 6th application procedure, the process of the number of packages, the number of packages, the number of substrates, and the number of substrates to make the substrate passive. In the plural mode, the component conductor structure 10 200841449 7F '4 passive component bonding structure mainly comprises a substrate 2 10 , a passive component 220 and a fixing ring 230 . The fixing ring 230 is coupled to the substrate 210 and mechanically clamps the first electrode 2 2 1 of the passive component 220. In this embodiment, the conductive paste 25 is formed on the second bonding pad 212 and adhered to the second electrode 222 of the passive component 220. The reflow process can be eliminated to electrically connect the second bonding pad 212. And the second electrode 222. Wherein, by the arrangement of the fixing ring 230, the displacement or the tombstoning effect of the passive component 220 can be avoided. Even if the second electrode 222 of the passive component 220 is slightly tilted, the fixing ring 230 limits the passive component. The displacement of 220 does not rise, thereby completely avoiding the tombstoning effect. According to the third embodiment of the present invention, another passive component bonding structure is disclosed. Referring to FIG. 7, the passive component bonding structure 400 mainly includes a substrate 410, a passive component 420, and a first fixing ring 43 0 . . The substrate 410 has two adjacent first bonding pads 411 and a second bonding pad 412. The passive component 420 has a first electrode 421 and a second electrode 422. The first fixing ring 430 is coupled to the substrate 410 for mechanically clamping the passive component 420. The first fixing ring 430 is soldered to the first bonding pad 411 and frictionally contacts the first electrode 421. Referring to FIG. 7 again, in the embodiment, the first fixing ring 430 may be a c-shaped buckle or a U-shaped buckle that opens toward the side of the substrate 4 。. Specifically, the passive component bonding structure 400 may further include a second fixing ring 440 soldered to the second bonding pad 412 and frictionally contacting the second electrode 422 with a force of 11 200841449. The first fixing ring 430 and the second fixing ring 440 may be made of a metal material to form an electrical connection between the passive component 420 and the substrate 410. Therefore, the passive component bonding structure 400 can prevent the passive component 420 from being instigated or displaced and can be soldered without solder to the passive component 420 without touching adjacent components. According to a fourth embodiment of the present invention, another passive component bonding structure is disclosed. Referring to FIG. 8, the passive component bonding structure 500 mainly includes a substrate 510, a passive component 520, and a fixing ring 530. The substrate 510 has two adjacent first bonding pads 511 and a second bonding pad 512. The passive component 520 has a first electrode 521 and a second electrode 522. Referring to FIG. 9 , in the embodiment, the direction of the passive component 520 is obliquely connected to a center line of the first joint 511 and the second joint 512 to enable the The first electrode 521 is offset from the first bonding pad 511. The second electrode 522 of the passive component 520 can be aligned with the second bonding pad 512. The second bonding pad 512 and the second electrode 522 may be soldered by solder 540 in a reflow manner. The fixing ring 530 is coupled to the substrate 5 1 〇 for mechanically damaging the first electrode 521 of the passive component 520 prior to reflow. The fixing ring 53 can be made of a metal material, and the fixing ring 53 is soldered to the first bonding pad 511 and frictionally contacts the first electrode 521. In this embodiment, the fixing ring 530 can be an over-covered buckle. Therefore, the fixing ring 530 can make the passive component 520 have no offset during the reflow process 12 200841 449, and at the same time, the fixing 胄 53 is effective to press and fix the passive component 520 to the substrate 5 . 10, so T will have iL monument effect. The present invention is not limited to the embodiments of the present invention, and the scope of the technical solutions of the present invention is subject to the scope of the patent application. Any person skilled in the art can make some modifications or modifications to the equivalent embodiments by using the technical content disclosed above, but the above embodiments are not deviated from the technical solutions of the present invention. Any simple U equivalent changes and modifications made by the examples are still within the scope of the technical solution of the present invention. ' [Simple description of the diagram] Figure 1: - A description of the wear surface of the passive component joint structure before reflow. Fig. 2 is a schematic cross-sectional view showing the effect of the toil effect of the passive component in the passive component joint structure. According to a first embodiment of the present invention, a schematic cross-sectional view of a passive component joint structure is provided. Fig. 4 is a side elevational view of the passive component joint structure in accordance with a first embodiment of the present invention. Figure 5 is a cross-sectional view of a passive component bonding structure applied to a semiconductor package structure in accordance with a first embodiment of the present invention. Fig. 6 is a schematic cross-sectional view showing another passive element joint structure in accordance with a second embodiment of the present invention. 13 200841449 Figure 7 is a schematic cross-sectional view of another passive component joint structure in accordance with a third embodiment of the present invention. Figure 8 is a cross-sectional view showing another passive element joint structure in accordance with a fourth embodiment of the present invention. Figure 9 is a top plan view of the passive component joint structure in accordance with a fourth embodiment of the present invention.
【主要元件符號說明】 100 被動元件接合結構 110 基板 111 接合墊 120 被動元件 121 電極 130 銲料 200 被動元件接合結構 210 基板 211 第一接合墊 212 第二接合墊 213 封膠表面 214 防銲層 215 開口 216 外接墊 220 被動元件 221 第一電極 222 第二電極 230 第一固定環 240 第二固定環 250 導電膠 310 晶片 320 封膠體 330 銲線 400 被動元件接合結構 410 基板 411 第一接合墊 412 第二接合墊 420 被動元件 421 第一電極 422 第二電極 430 第一固定環 440 第二固定環 500 被動元件接合結構 510 基板 511 第一接合墊 512 第二接合墊 520 被動元件 521 第一電極 522 第二電極 200841449 530固定環 540銲料[Main component symbol description] 100 passive component bonding structure 110 substrate 111 bonding pad 120 passive component 121 electrode 130 solder 200 passive component bonding structure 210 substrate 211 first bonding pad 212 second bonding pad 213 sealing surface 214 solder resist layer 215 opening 216 external pad 220 passive component 221 first electrode 222 second electrode 230 first fixing ring 240 second fixing ring 250 conductive adhesive 310 wafer 320 sealing body 330 bonding wire 400 passive component bonding structure 410 substrate 411 first bonding pad 412 second Bonding pad 420 Passive element 421 First electrode 422 Second electrode 430 First fixing ring 440 Second fixing ring 500 Passive element bonding structure 510 Substrate 511 First bonding pad 512 Second bonding pad 520 Passive element 521 First electrode 522 Second Electrode 200841449 530 fixing ring 540 solder
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