TW200834081A - Assembly for controlling the horizontal level of an electrical tester, electrical tester having the assembly, and method of controlling the horizontal level of an electrical tester using the assembly - Google Patents
Assembly for controlling the horizontal level of an electrical tester, electrical tester having the assembly, and method of controlling the horizontal level of an electrical tester using the assemblyInfo
- Publication number
- TW200834081A TW200834081A TW97105022A TW97105022A TW200834081A TW 200834081 A TW200834081 A TW 200834081A TW 97105022 A TW97105022 A TW 97105022A TW 97105022 A TW97105022 A TW 97105022A TW 200834081 A TW200834081 A TW 200834081A
- Authority
- TW
- Taiwan
- Prior art keywords
- assembly
- substrate
- electrical tester
- horizontal level
- controlling
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Mechanical Engineering (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
An electrical tester includes a first substrate, a second substrate and an assembly for controlling the horizontal level of the first substrate. The first substrate has a first face making contact with an object, and a second face opposite to the first face. The second substrate is arranged to face the second face of the first substrate. The assembly is inelastically combined between the first substrate and the second substrate. Thus, the horizontal level of the first substrate may be readily controlled by adjusting the inelastic combination between the first substrate and the second substrate.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070014714A KR100862887B1 (en) | 2007-02-13 | 2007-02-13 | Assembly for controlling uniformity of probe card and apparatus for inspecting electric condition having the same, and method for controlling uniformity using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200834081A true TW200834081A (en) | 2008-08-16 |
TWI355496B TWI355496B (en) | 2012-01-01 |
Family
ID=39690244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97105022A TWI355496B (en) | 2007-02-13 | 2008-02-13 | Assembly for controlling the horizontal level of a |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100862887B1 (en) |
TW (1) | TWI355496B (en) |
WO (1) | WO2008100053A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY179750A (en) * | 2014-03-06 | 2020-11-12 | Technoprobe Spa | High-planarity probe card for a testing apparatus for electronic devices |
TWI551844B (en) * | 2015-06-26 | 2016-10-01 | 創意電子股份有限公司 | Brightness calibration method and optical detection system |
KR101951254B1 (en) * | 2017-06-19 | 2019-02-22 | 리노공업주식회사 | A probe card |
KR20220071458A (en) | 2020-11-24 | 2022-05-31 | 현대자동차주식회사 | Manufacturing method of support for catalyst of fuel cell |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100984769B1 (en) * | 2003-12-12 | 2010-10-01 | 동부일렉트로닉스 주식회사 | Apparatus for leveling a head plate of a prober system |
KR100603513B1 (en) * | 2004-09-15 | 2006-07-20 | 임현철 | Electrode device for radiofrequency thermal ablation |
KR200380247Y1 (en) | 2005-01-06 | 2005-03-29 | 주식회사 유림하이테크산업 | Probe card for testing semiconductor |
KR100675487B1 (en) * | 2005-06-02 | 2007-01-30 | 주식회사 파이컴 | Probe card |
-
2007
- 2007-02-13 KR KR1020070014714A patent/KR100862887B1/en active IP Right Grant
-
2008
- 2008-02-12 WO PCT/KR2008/000810 patent/WO2008100053A1/en active Application Filing
- 2008-02-13 TW TW97105022A patent/TWI355496B/en active
Also Published As
Publication number | Publication date |
---|---|
KR100862887B1 (en) | 2008-10-13 |
TWI355496B (en) | 2012-01-01 |
KR20080075607A (en) | 2008-08-19 |
WO2008100053A1 (en) | 2008-08-21 |
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