TW200833910A - Apparatus for opening and closing door of chamber - Google Patents

Apparatus for opening and closing door of chamber

Info

Publication number
TW200833910A
TW200833910A TW097103370A TW97103370A TW200833910A TW 200833910 A TW200833910 A TW 200833910A TW 097103370 A TW097103370 A TW 097103370A TW 97103370 A TW97103370 A TW 97103370A TW 200833910 A TW200833910 A TW 200833910A
Authority
TW
Taiwan
Prior art keywords
door
opening
chamber
closing
door panel
Prior art date
Application number
TW097103370A
Other languages
Chinese (zh)
Inventor
Byoung-Dae Lee
Jung-Suk Son
Original Assignee
Seer Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seer Technologies Inc filed Critical Seer Technologies Inc
Publication of TW200833910A publication Critical patent/TW200833910A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K3/00Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
    • F16K3/02Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
    • F16K3/16Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together
    • F16K3/18Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together by movement of the closure members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power-Operated Mechanisms For Wings (AREA)
  • Devices For Use In Laboratory Experiments (AREA)
  • Refrigerator Housings (AREA)
  • Auxiliary Devices For Machine Tools (AREA)

Abstract

The present invention relates to an apparatus for opening and closing a door of a chamber, and more specifically to an apparatus for opening and closing a door of a chamber that allows the door of the chamber to more easily perform opening and closing of the door and also makes a pair of door panels overlapping each other at the time of opening to minimize the amount of space occupied by the door in an open condition. The apparatus for opening and closing door of chamber in accordance with the present invention comprises: a first door panel and a second door panel that are arranged parallel for closing an opening of a chamber and a horizontal movement device that first moves the first door panel sideways and then moves the second door panel to overlap the first door panel.
TW097103370A 2007-02-12 2008-01-29 Apparatus for opening and closing door of chamber TW200833910A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070014430A KR100844352B1 (en) 2007-02-12 2007-02-12 Apparatus for opening and closing door of chamber

Publications (1)

Publication Number Publication Date
TW200833910A true TW200833910A (en) 2008-08-16

Family

ID=39823879

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097103370A TW200833910A (en) 2007-02-12 2008-01-29 Apparatus for opening and closing door of chamber

Country Status (2)

Country Link
KR (1) KR100844352B1 (en)
TW (1) TW200833910A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100997131B1 (en) * 2008-07-18 2010-11-29 (주) 예스티 Apparatus for openning and closing door of chamber
KR102168883B1 (en) * 2014-05-12 2020-10-23 주식회사 제우스 Heat treatment apparatus for substrate
KR101688596B1 (en) * 2016-03-30 2016-12-21 (주)블루이엔지 Door apparatus for semiconductor manufacturing chamber
KR101688597B1 (en) * 2016-03-30 2016-12-21 (주)블루이엔지 Door apparatus of free-fall type and semiconductor test apparatus having the same
KR101834133B1 (en) 2017-10-12 2018-02-28 장인재 Door apparatus for chamber
KR102214127B1 (en) * 2019-05-15 2021-02-09 (주) 예스티 Chamber apparatus for process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10303277A (en) 1997-04-28 1998-11-13 Toshiba Corp Door opening/closing device
JP2000342957A (en) * 1999-06-03 2000-12-12 Foi:Kk Plasma treatment apparatus
KR20030070373A (en) * 2002-02-25 2003-08-30 삼성전자주식회사 Ashing apparatus having door structure for semiconductor manufacturing
JP4210788B2 (en) 2002-09-24 2009-01-21 株式会社協真エンジニアリング Door opening / closing device for processing equipment

Also Published As

Publication number Publication date
KR100844352B1 (en) 2008-07-07

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