TW200833765A - Resin composition for forming coating with high flattening property - Google Patents

Resin composition for forming coating with high flattening property

Info

Publication number
TW200833765A
TW200833765A TW096132498A TW96132498A TW200833765A TW 200833765 A TW200833765 A TW 200833765A TW 096132498 A TW096132498 A TW 096132498A TW 96132498 A TW96132498 A TW 96132498A TW 200833765 A TW200833765 A TW 200833765A
Authority
TW
Taiwan
Prior art keywords
films
resin composition
flattening
compound
forming coating
Prior art date
Application number
TW096132498A
Other languages
Chinese (zh)
Other versions
TWI431061B (en
Inventor
Tadashi Hatanaka
Original Assignee
Nissan Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Ind Ltd filed Critical Nissan Chemical Ind Ltd
Publication of TW200833765A publication Critical patent/TW200833765A/en
Application granted granted Critical
Publication of TWI431061B publication Critical patent/TWI431061B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • C08F222/402—Alkyl substituted imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/20—Manufacture of shaped structures of ion-exchange resins
    • C08J5/22—Films, membranes or diaphragms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
    • C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • C08L39/06—Homopolymers or copolymers of N-vinyl-pyrrolidones

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Optical Filters (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

To provide a resin composition for forming flatting films which have high transparency and high flattening effect and are suitable for protection films and flattening films for the electrode or color filter to be used in liquid crystal displays, organic EL displays and so on; and cured flattening films. A resin composition for forming flattening films which comprises (A) an acrylic polymer having a number-average molecular weight of 2,000 to 25,000, (B) a compound having two or more unsaturated double bonds in one molecule, (C) a compound capable of generating an acid on heating, (D) a heat-crosslinking compound except ones capable of crosslinking by the catalysis of the acid generated from the component (C) and (E) a solvent; and cured films made from the composition.
TW096132498A 2006-09-01 2007-08-31 Resin composition for forming coating with high flattening property TWI431061B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006237693 2006-09-01

Publications (2)

Publication Number Publication Date
TW200833765A true TW200833765A (en) 2008-08-16
TWI431061B TWI431061B (en) 2014-03-21

Family

ID=39157137

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096132498A TWI431061B (en) 2006-09-01 2007-08-31 Resin composition for forming coating with high flattening property

Country Status (4)

Country Link
JP (1) JP5488779B2 (en)
KR (1) KR101411294B1 (en)
TW (1) TWI431061B (en)
WO (1) WO2008029706A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI666256B (en) * 2014-07-24 2019-07-21 日商日產化學工業股份有限公司 Color filter underlayer film forming resin composition

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8828651B2 (en) 2005-07-25 2014-09-09 Nissan Chemical Industries, Ltd. Positive-type photosensitive resin composition and cured film manufactured therefrom
EP2109001B1 (en) 2007-01-22 2012-01-11 Nissan Chemical Industries, Ltd. Positive photosensitive resin composition

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781061B2 (en) * 1986-08-15 1995-08-30 エヌオーケー株式会社 Acrylic elastomer composition
JPH0798854B2 (en) * 1988-12-28 1995-10-25 積水化学工業株式会社 Thermosetting sheet
JPH02302403A (en) * 1989-05-18 1990-12-14 Hitachi Chem Co Ltd Photosensitive polymer composition and photosensitive film using the same composition
JPH07103245B2 (en) * 1990-07-30 1995-11-08 積水化学工業株式会社 Method of manufacturing coated products
CA2048232A1 (en) * 1990-09-05 1992-03-06 Jerry W. Williams Energy curable pressure-sensitive compositions
JPH1045849A (en) * 1996-07-31 1998-02-17 Nippon Shokubai Co Ltd Heat-resistant resin and its production
JPH09255755A (en) * 1996-03-21 1997-09-30 Mitsubishi Rayon Co Ltd Cross-linkable resin composition and method for curing the same
JPH10148938A (en) * 1996-11-19 1998-06-02 Hitachi Chem Co Ltd Photosensitive film for precise metal working, and method for manufacturing pattern by using the film
JP3770689B2 (en) * 1997-03-26 2006-04-26 旭電化工業株式会社 Curable composition
JP3929105B2 (en) * 1997-04-18 2007-06-13 株式会社Ａｄｅｋａ Curable composition
JP2001163940A (en) 1999-12-08 2001-06-19 Kansai Paint Co Ltd Curable composition
JP4306060B2 (en) * 1999-12-09 2009-07-29 Ｊｓｒ株式会社 Radiation-sensitive resin composition for spacer and spacer
JP4534341B2 (en) * 2000-11-07 2010-09-01 Ｊｓｒ株式会社 Curable resin composition and antireflection film
JP4051538B2 (en) * 2001-02-22 2008-02-27 日産化学工業株式会社 Antireflection film forming composition for lithography
DE10115505B4 (en) * 2001-03-29 2007-03-08 Basf Coatings Ag Thermal and actinic radiation curable aqueous dispersions, process for their preparation and their use
JP2003064236A (en) * 2001-08-28 2003-03-05 Canon Inc Colored resin composition, color filter using the same, method of manufacturing color filter and liquid crystal element using color filter
JP3935182B2 (en) * 2004-09-14 2007-06-20 積水化学工業株式会社 Curable resin composition for column spacer, column spacer, and liquid crystal display element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI666256B (en) * 2014-07-24 2019-07-21 日商日產化學工業股份有限公司 Color filter underlayer film forming resin composition
US10634999B2 (en) 2014-07-24 2020-04-28 Nissan Chemical Industries, Ltd. Resin composition for forming color filter underlayer film

Also Published As

Publication number Publication date
KR101411294B1 (en) 2014-06-26
JP5488779B2 (en) 2014-05-14
TWI431061B (en) 2014-03-21
WO2008029706A1 (en) 2008-03-13
JPWO2008029706A1 (en) 2010-01-21
KR20090071568A (en) 2009-07-01

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