TW200833727A - Lead frame fixing material, lead frame and semiconductor device - Google Patents

Lead frame fixing material, lead frame and semiconductor device

Info

Publication number
TW200833727A
TW200833727A TW096148288A TW96148288A TW200833727A TW 200833727 A TW200833727 A TW 200833727A TW 096148288 A TW096148288 A TW 096148288A TW 96148288 A TW96148288 A TW 96148288A TW 200833727 A TW200833727 A TW 200833727A
Authority
TW
Taiwan
Prior art keywords
lead frame
fixing material
semiconductor device
frame fixing
lead
Prior art date
Application number
TW096148288A
Other languages
Chinese (zh)
Other versions
TWI427092B (en
Inventor
Yoshihiko Takada
Akihiro Kubota
Original Assignee
Shiima Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shiima Electronics Inc filed Critical Shiima Electronics Inc
Publication of TW200833727A publication Critical patent/TW200833727A/en
Application granted granted Critical
Publication of TWI427092B publication Critical patent/TWI427092B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49558—Insulating layers on lead frames, e.g. bridging members
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Epoxy Resins (AREA)

Abstract

To provide a lead frame fixing material and the like for excellently and simply fixing lead frames. Provided are a lead frame fixing material having a viscosity of 0.01-10Pas at 80 DEG C, a lead frame using such lead frame fixing material, and a semiconductor device using such lead frame.
TW096148288A 2006-12-18 2007-12-17 Wire frame fixing material, lead frame and semiconductor device TWI427092B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006339691 2006-12-18

Publications (2)

Publication Number Publication Date
TW200833727A true TW200833727A (en) 2008-08-16
TWI427092B TWI427092B (en) 2014-02-21

Family

ID=39536285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148288A TWI427092B (en) 2006-12-18 2007-12-17 Wire frame fixing material, lead frame and semiconductor device

Country Status (5)

Country Link
JP (1) JP5634024B2 (en)
KR (1) KR101442864B1 (en)
CN (1) CN101563776B (en)
TW (1) TWI427092B (en)
WO (1) WO2008075655A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5905303B2 (en) * 2012-03-12 2016-04-20 日東電工株式会社 Epoxy resin composition for forming optical waveguide, curable film for forming optical waveguide obtained therefrom, and flexible printed board for optical transmission

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1030083A (en) * 1996-07-15 1998-02-03 Yokohama Rubber Co Ltd:The Electrically insulating and heat-resistant adhesive
JPH10178149A (en) * 1996-12-16 1998-06-30 Dainippon Printing Co Ltd Lead frame member and its manufacturing method
JP2884336B2 (en) * 1997-04-21 1999-04-19 トヨタ自動車株式会社 Coolant composition
TWI257935B (en) * 1999-10-06 2006-07-11 Nitto Denko Corp Resin composition for sealing semiconductor and semiconductor device using the same and method for producing semiconductor device
JP2002069157A (en) * 2000-08-24 2002-03-08 Nitto Denko Corp Resin composition for semiconducor sealing, semiconductor device using the same, semiconductor wafer and mounting structure of semiconductor device
EP1731545A4 (en) * 2004-03-31 2008-11-12 Asahi Kasei Chemicals Corp Hardener for epoxy resin and epoxy resin composition

Also Published As

Publication number Publication date
KR20090094439A (en) 2009-09-07
CN101563776B (en) 2011-12-07
WO2008075655A1 (en) 2008-06-26
TWI427092B (en) 2014-02-21
JP5634024B2 (en) 2014-12-03
KR101442864B1 (en) 2014-09-22
CN101563776A (en) 2009-10-21
JPWO2008075655A1 (en) 2010-04-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees