TW200833234A - Manufacturing method of heat-dissipating module - Google Patents

Manufacturing method of heat-dissipating module

Info

Publication number
TW200833234A
TW200833234A TW97110649A TW97110649A TW200833234A TW 200833234 A TW200833234 A TW 200833234A TW 97110649 A TW97110649 A TW 97110649A TW 97110649 A TW97110649 A TW 97110649A TW 200833234 A TW200833234 A TW 200833234A
Authority
TW
Taiwan
Prior art keywords
heat
dissipating
dissipating fin
coating
manufacturing
Prior art date
Application number
TW97110649A
Other languages
Chinese (zh)
Other versions
TWI411384B (en
Inventor
Huan-Xiao Feng
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW97110649A priority Critical patent/TWI411384B/en
Publication of TW200833234A publication Critical patent/TW200833234A/en
Application granted granted Critical
Publication of TWI411384B publication Critical patent/TWI411384B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A manufacturing method of heat-dissipating module, which is to apply a local film coating on a heat-dissipating fin and the a heat-conducting pipe, made of two different metal materials, by the physical vapor deposition method, followed by coating a solder onto the local film-coating portion, and heat up to the melting point of the solder to apply welding so that the heat-dissipating fin and the heat conducting pipe can be assembled to form a heat-dissipating module structure; by means of the method of exerting the local coating layer to the heat-dissipating fin, the heat-dissipating fin and the heat-conducting pipe of two different metal materials can be welded, so that the two can be firmly combined to have excellent heat conducting efficacy.
TW97110649A 2008-03-26 2008-03-26 Manufacturing method of heat dissipation module TWI411384B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97110649A TWI411384B (en) 2008-03-26 2008-03-26 Manufacturing method of heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97110649A TWI411384B (en) 2008-03-26 2008-03-26 Manufacturing method of heat dissipation module

Publications (2)

Publication Number Publication Date
TW200833234A true TW200833234A (en) 2008-08-01
TWI411384B TWI411384B (en) 2013-10-01

Family

ID=44819065

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97110649A TWI411384B (en) 2008-03-26 2008-03-26 Manufacturing method of heat dissipation module

Country Status (1)

Country Link
TW (1) TWI411384B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113843583A (en) * 2021-08-30 2021-12-28 祥博传热科技股份有限公司 Processing technology of radiator with insulating property

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI237756B (en) * 2003-03-13 2005-08-11 Cpumate Inc Method improvement for integration of heat dissipation module and heat conduction tube
TW200730785A (en) * 2006-02-15 2007-08-16 Asia Vital Components Co Ltd Manufacture method for flat heat pipe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113843583A (en) * 2021-08-30 2021-12-28 祥博传热科技股份有限公司 Processing technology of radiator with insulating property
CN113843583B (en) * 2021-08-30 2022-08-16 祥博传热科技股份有限公司 Processing technology of radiator with insulating property

Also Published As

Publication number Publication date
TWI411384B (en) 2013-10-01

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