TW200833234A - Manufacturing method of heat-dissipating module - Google Patents
Manufacturing method of heat-dissipating moduleInfo
- Publication number
- TW200833234A TW200833234A TW97110649A TW97110649A TW200833234A TW 200833234 A TW200833234 A TW 200833234A TW 97110649 A TW97110649 A TW 97110649A TW 97110649 A TW97110649 A TW 97110649A TW 200833234 A TW200833234 A TW 200833234A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- dissipating
- dissipating fin
- coating
- manufacturing
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A manufacturing method of heat-dissipating module, which is to apply a local film coating on a heat-dissipating fin and the a heat-conducting pipe, made of two different metal materials, by the physical vapor deposition method, followed by coating a solder onto the local film-coating portion, and heat up to the melting point of the solder to apply welding so that the heat-dissipating fin and the heat conducting pipe can be assembled to form a heat-dissipating module structure; by means of the method of exerting the local coating layer to the heat-dissipating fin, the heat-dissipating fin and the heat-conducting pipe of two different metal materials can be welded, so that the two can be firmly combined to have excellent heat conducting efficacy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97110649A TWI411384B (en) | 2008-03-26 | 2008-03-26 | Manufacturing method of heat dissipation module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97110649A TWI411384B (en) | 2008-03-26 | 2008-03-26 | Manufacturing method of heat dissipation module |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200833234A true TW200833234A (en) | 2008-08-01 |
TWI411384B TWI411384B (en) | 2013-10-01 |
Family
ID=44819065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97110649A TWI411384B (en) | 2008-03-26 | 2008-03-26 | Manufacturing method of heat dissipation module |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI411384B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113843583A (en) * | 2021-08-30 | 2021-12-28 | 祥博传热科技股份有限公司 | Processing technology of radiator with insulating property |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI237756B (en) * | 2003-03-13 | 2005-08-11 | Cpumate Inc | Method improvement for integration of heat dissipation module and heat conduction tube |
TW200730785A (en) * | 2006-02-15 | 2007-08-16 | Asia Vital Components Co Ltd | Manufacture method for flat heat pipe |
-
2008
- 2008-03-26 TW TW97110649A patent/TWI411384B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113843583A (en) * | 2021-08-30 | 2021-12-28 | 祥博传热科技股份有限公司 | Processing technology of radiator with insulating property |
CN113843583B (en) * | 2021-08-30 | 2022-08-16 | 祥博传热科技股份有限公司 | Processing technology of radiator with insulating property |
Also Published As
Publication number | Publication date |
---|---|
TWI411384B (en) | 2013-10-01 |
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