TW200833225A - Thermal module of composite structure - Google Patents

Thermal module of composite structure

Info

Publication number
TW200833225A
TW200833225A TW96102423A TW96102423A TW200833225A TW 200833225 A TW200833225 A TW 200833225A TW 96102423 A TW96102423 A TW 96102423A TW 96102423 A TW96102423 A TW 96102423A TW 200833225 A TW200833225 A TW 200833225A
Authority
TW
Taiwan
Prior art keywords
composite structure
thermal conductivity
thermal module
high thermal
disclosure relates
Prior art date
Application number
TW96102423A
Other languages
Chinese (zh)
Inventor
Shun-Tian Lin
Tzu-Hao Hsu
Jyun-Wei Huang
Original Assignee
Tysun Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tysun Inc filed Critical Tysun Inc
Priority to TW96102423A priority Critical patent/TW200833225A/en
Publication of TW200833225A publication Critical patent/TW200833225A/en

Links

Abstract

This disclosure relates to a composite structure composed of metallic materials of high thermal conductivity and ceramic materials of high thermal conductivity. This composite structure possesses not only dielectric behavior but also high thermal conductivity, and is suitable being used as thermal modules for high power electronic chips or components.
TW96102423A 2007-01-23 2007-01-23 Thermal module of composite structure TW200833225A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96102423A TW200833225A (en) 2007-01-23 2007-01-23 Thermal module of composite structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96102423A TW200833225A (en) 2007-01-23 2007-01-23 Thermal module of composite structure

Publications (1)

Publication Number Publication Date
TW200833225A true TW200833225A (en) 2008-08-01

Family

ID=44819060

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96102423A TW200833225A (en) 2007-01-23 2007-01-23 Thermal module of composite structure

Country Status (1)

Country Link
TW (1) TW200833225A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI676778B (en) * 2016-02-19 2019-11-11 德商賀利氏德國有限兩合公司 Heat spreader plate with at least one cooling fin, method for producing a heat spreader plate with at least one cooling fin, electronic module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI676778B (en) * 2016-02-19 2019-11-11 德商賀利氏德國有限兩合公司 Heat spreader plate with at least one cooling fin, method for producing a heat spreader plate with at least one cooling fin, electronic module

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