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Application filed by Tysun IncfiledCriticalTysun Inc
Priority to TW96102423ApriorityCriticalpatent/TW200833225A/en
Publication of TW200833225ApublicationCriticalpatent/TW200833225A/en
This disclosure relates to a composite structure composed of metallic materials of high thermal conductivity and ceramic materials of high thermal conductivity. This composite structure possesses not only dielectric behavior but also high thermal conductivity, and is suitable being used as thermal modules for high power electronic chips or components.
TW96102423A2007-01-232007-01-23Thermal module of composite structure
TW200833225A
(en)
Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module