200831922 九、發明說明： 【發明所屬之技術領域】 本發明係關於—種積體電路封裝晶片分類裝置以及 一種積體電路㈣晶片燒«置，尤其關於-種可任音更 之積體電路封裝晶片分類裝置以及積體電路封 I晶片燒錄裝置。 【先前技術】 明參考弟1圖，積體電路封裝晶片⑽燒錄裝置工主 要疋由控制器ll(contn)1lei〇、> 刀犬員為12(handler)以及燒錄 口. 13(Wnter)所組成。控制器 务士曰Μ Μ終λ ^ 王要用以控制積體電路封 衣曰曰片的輸入/輸出，積體電 卜銘#^丸士 包吩玎衣日日片則可在分類器12 ° *積體電路封裝晶片到達預定位置時 錄益13進行寫人資料或測試的動作^ ① 習知積體電路封奘曰 導 十衣曰日片燒錄爰置1之分類器12是由 以及真空纟⑵所組成，其是利用真 式來控制積體電路封f a '、 ' 此，習知之… 上移動或靜止。因 出言g #體琶路封裝晶片燒錄裝置1大多是以整機輸 出，亦即控制器J J 执物 體電路封=:針對不同封裝型態(package ty二的積 燒錄裝置=有與其搭配之積體電路封裝晶片 產成本。且，：:::堇降低生產彈性，同時大大地提高生 此欲將分類哭！:：之'類器12包含了真空泵12 2，因 屬不易，且機控制A 11或燒錄^ 13分離或組裝亦 械體不易小型化。 台機器。如…：類…及燒錄器13是整合成 200831922 綜上所述’如何將積带 制器' 分類器以及燒錄器可農晶片燒錄裝置中之控 種封裝型態之積體電路封装晶；:二及!=用於多 標。 乃便疋目刖極需努力的目 【發明内容】 針對上述問題，本發明之 電路封裝晶片分類茫置 、之一在於提供一種積體 置，其可任意更換不同型式之八魅d電路封衣晶片燒錄裝 封裝型態之積體電路封裝晶片^為’使其可適用於多種 為達上述目的，本發 _每 分類裝置係用以與一燒錄器配電路封裝晶片 進行自動化燒錄。該積體電路封穿^積體電路封裝晶片 制器以及-分類器。控制琴用以：：“類裝置包含-控 穿曰K夕终λ /认 ° Λ才工制—欲燒錄積體電路封 衣曰曰片之輸入/輸出。分類器則接受 路封 制欲燒錄積體電路封裳晶片之移動。发:#制訊號以控 器是以可簡單拆卸的方式進行連接設^。’分類器與控制 再者，本發明一實施例之積體^路 包含-控制器、—分類器以及_燒錄哭二晶片燒錄裝置 制-欲燒錄積體電路封裝晶片之：入；。：控制器用以控 制器之控制訊號以控制欲燒錄積體二，接受控 動。燒錄器用以對欲燒錄積體電路封 “晶片之移 行測試。其中，分類器與控制器、或入㈣或進 可簡單拆卸的方式進行連接設計。、、⑼燒錄益係以 依據本發明之積體電路封裝 Α刀類裝置以及積體 200831922 ，封裝晶片燒錄裝置，由於分類器係以可簡 式與控制器或燒錄器連接，所 、方 ::封，片’即可將分類器拆卸下來並更換為適合的分 '态。、、、。果，控制器及燒錄器便可重 購置設備的成本、並增加生產彈性之功效。 、低 【實施方式】 目關圖式’說明本發明實施例之積體 衣日日片（1C)燒錄裝置、以及積體 並中相Η认_ μ # 弘吩玎忒日日片分類裝置， "中相同的兀件將以相同的符號加以說明。 声釺人2圖’本發明-實施例之積體電路封裝晶片 Ϊ衣置2包含積體電路料晶片分類裝置2a以及—燒錄 為23。该積體電路封裝晶片分 、.〆、 人，相人+ 頦衣置2a疋與燒錄器23配 :、、且積體電路封裝晶片燒錄裝置2，而可對 電路封裝晶片進行自動化燒錄 、豆 片分類罗署9 一 疋’㈣耘。而積體電路封裝晶 m置2a包含一控制器21與一分類器22。該控制哭 制欲燒錄積體電路料晶片之輸人 ; 曰是接受控制器21之控制訊號以控制欲燒錄㈣ 晶片並移動至預定位晋” 粍錄的積體電路封裝 冑至預疋位置。之後’再由燒錄器23對欲 的積體電路封裝晶片寫入資料或進行測試。 -- =意者，分類器22與控制器21或燒錄器Μ是以 =拆卸的方式連接，例如設置公母螺絲、或卡槽卡荀 請參考第3圖’分類器22主要是由導軌⑵、至少一 200831922 阻擒構件222以及至少一開關如所組成 一凹槽加，且導執221呈傾斜的方式 /具有 積體電路封裝晶片可沿著凹槽2 2 U由導執2,2;:燒錄的 洛至另-端。阻擋構件222設置於 端滑 可移入/移出凹槽22]1。上# 日周邊，並且 蒋 σ弟3圖所示，當阻擋構件222 移入凹槽22U時，即可阻擋積體電路封 績滑落，使積體電路封I曰. 2繼 崎玎衣日日月3 1、3 2停留a猫—上人， 例如積體電路封裝晶片3 在預疋的位置’ 電路封裝晶片動作的位置。反之^為進行燒錄積體 Μ 99 11 之®阻擋構件222移出凹 才曰22U時’積體電路封裝晶片3卜32 冰 欲燒錄的積體電路封裝晶片31 、、’…洛，例如’ 鉻，品口咕 31滑洛至預定的位置進行燒 、〆、 已k錄完成的積體電路封f曰>ί 19 Η Ϊ 路封#曰Η榼拉壯 俗釘衣日日片32則滑出積體電 于衣日日片燒錄I置2〇開關223則 移入/移出凹槽2211，舉例而古，^^制阻W件222 口其可為一電磁閥。 及開二33:所示，當分類器22包含多組阻撞構件222 旬 時，則分類器22可更包含-控制介面224來 兵開關223電性連接。控制哭 、 木 面224來控制多組開關如的動作^可透過單一的控制介 電路==之Γ電路封裝晶片分類裝置以及積體 方弋盘衣:曰70錄衣置’其中之分類器是以可簡單拆卸的 路上::彳器或燒錄器連接。針對不同封裝型態的積體電 :即可將分類器拆卸下來並更換為適合的分類 :太因此’控制器及燒錄器可重複利用，降低購置設備的 成本’並增加生產彈性。此外，本發明之積體電路封裝晶 200831922 片分類裝置以及積體電路封裝晶片燒錄裝置並非利用真 空吸引的方式來固疋或移動積體電路封裝晶片，故不需使 用真空泵，直接接上電源即可使用。 σ 」便用因此，本發明之控制 器、分類器及燒錄器的設計、说細芬 Τ拆卸及組裝較為簡便，且機 體可有效的小型化。 ’但並不因此限定本發明 旨’該行業者可進行各種 f 以上雖以實施例說明本發明 之範圍，只要不脫離本發明之要 變形或變更。 【圖式簡單說明】 第 意圖。 1圖顯示一種習知積體電路封裝晶片 燒錄裝置之示 貝施例之積體電路封裝晶片燒錄 弟2圖顯不本發明^— 裝置之示意圖。 第3圖顯示第2圖之分類器之示意圖 【主要元件符號說明】200831922 IX. Description of the Invention: [Technical Field] The present invention relates to an integrated circuit package wafer sorting device and an integrated circuit (4) wafer firing, in particular, an integrated circuit package wafer The sorting device and the integrated circuit package I wafer burning device. [Prior Art] With reference to Figure 1, the integrated circuit packaged wafer (10) is mainly composed of the controller ll (contn) 1lei〇, > the dog handler is 12 (handler) and the burning port. 13 (Wnter ) composed of. Controller 士 曰Μ Μ λ λ 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王 王° * When the integrated circuit packaged wafer arrives at the predetermined position, the recording 13 performs the operation of writing the data or the test. ^ 1 The conventional integrated circuit is sealed and the 10th 曰 曰 曰 片 片 1 1 1 12 12 12 12 12 The vacuum 纟 (2) is composed of a real type to control the integrated circuit seal fa ', 'this, conventionally... moves up or stationary. Because of the words g #body琶 package wafer burning device 1 is mostly the output of the whole machine, that is, the controller JJ is the object circuit seal =: for different package types (package ty two of the product burning device = have it with Integral circuit package wafer production cost. Moreover, :::: 堇 reduce production flexibility, and greatly improve the desire to classify crying!:: 'Class 12 contains vacuum pump 12 2, because it is not easy, and machine control A 11 or burning ^ 13 separation or assembly is also not easy to miniaturize. Machines such as ...: class ... and burner 13 is integrated into 200831922 In summary, how to 'mix the belt maker' classifier and burn The integrated circuit package crystal of the control package type in the recorder of the arable wafer burning device; 2 and != for multi-standard. It is extremely difficult to work hard. [Inventive content] In response to the above problems, One of the circuit package wafer sorting devices of the present invention is to provide an integrated body which can be arbitrarily replaced with different types of integrated circuit package wafers. Can be applied to a variety of purposes for the above purposes, this hair _ per The device is used for automatic programming with a programmer package circuit package wafer. The integrated circuit is encapsulated and integrated with the circuit package wafer controller and the classifier. The control device is used to: "Class device includes - control曰 曰 K 终 λ / recognition ° Λ 工 — — — 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲: #制信号号 The controller is connected in a simple and detachable manner. 'Classifier and control, the integrated circuit of the embodiment of the present invention contains - controller, - classifier and _ burn cry Two-chip burning device system - to burn the integrated circuit package package: into: The controller is used to control the signal of the controller to control the burning of the integrated body two, to accept the control. The burner is used to burn The integrated circuit seals the "transfer test of the wafer. The classifier is connected to the controller, or into (4) or can be easily disassembled.), (9) burns the system to package the integrated circuit package according to the present invention. Class device and integrated body 200831922, packaged wafer burning Because the classifier is connected to the controller or the burner in a simple manner, the square:: seal, the piece 'can be disassembled and replaced with a suitable sub-state.,,,,, The controller and the burner can re-purchase the cost of the device and increase the elasticity of production. Low [Embodiment] The following is a description of the integrated clothing day (1C) burning device of the embodiment of the present invention. And the same as the Η Η μ _ _ _ _ 弘 弘 弘 弘 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 玎忒 2 2 2 2 2 2 2 The body circuit package wafer package 2 includes an integrated circuit chip sorting device 2a and a burn-in 23. The integrated circuit package wafer is divided into a chip, a 人, a person, a person + a clothes 2a and a burner 23 With::, and integrated circuit package wafer burning device 2, and can automatically burn the circuit package wafer, the classification of the beans is a 疋 ( ' (4) 耘. The integrated circuit package crystal 2a includes a controller 21 and a classifier 22. The control is intended to burn the input of the integrated circuit chip; 曰 is to receive the control signal of the controller 21 to control the chip to be burned (4) and move to the predetermined position. After that, the data is written or tested by the programmer 23 for the desired integrated circuit package wafer. --= It is intended that the classifier 22 is connected to the controller 21 or the burner = by means of disassembly. For example, set the male and female screws, or the card slot card. Please refer to FIG. 3 'The classifier 22 is mainly composed of a guide rail (2), at least one 200831922 blocking member 222, and at least one switch as a groove, and the guide 221 The slanted/integrated circuit package wafer can be guided along the groove 2 2 U by the guide 2, 2;: burned to the other end. The blocking member 222 is disposed in the end slide movable in/out groove 22 ]1. Around #日日, and as shown in Figure 3, when the blocking member 222 is moved into the groove 22U, the integrated circuit can be blocked from slipping, so that the integrated circuit is sealed. Days and nights 3 1 , 3 2 stay a cat - the master, such as the integrated circuit package wafer 3 in the pre-position The position at which the circuit package wafer is moved. Conversely, when the barrier member 222 of the burn-in assembly 11 99 11 is removed from the recess 22U, the integrated circuit package wafer 3 is immersed in the integrated circuit package wafer 31. , '...Lo, for example, 'Chromium, 品 咕 31 slide to the predetermined position to burn, 〆, has completed the integrated circuit seal f曰> ί 19 Η Ϊ Road seal #曰Η榼拉俗俗Nailer day 32 is slipped out of the integrated body in the clothing day, the film is burned, I set 2, the switch 223 is moved into/out of the groove 2211, for example, the ancient, ^^ resistance W piece 222 mouth can be an electromagnetic Valves and opening 33: As shown, when the classifier 22 includes a plurality of sets of blocking members 222, the classifier 22 may further include a control interface 224 to electrically connect the switch 223. Control the crying, the wooden surface 224 Control the operation of multiple sets of switches, such as through a single control dielectric circuit == Γ circuit package wafer sorting device and integrated body 弋 曰 曰 曰 录 录 录 录 录 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中:: 彳 or burner connection. For different package types of integrated power: the classifier can be removed and replaced with Classification: too, therefore, 'controller and burner can be reused, reducing the cost of purchasing equipment' and increasing production flexibility. In addition, the integrated circuit package crystal of the present invention 200831922 piece sorting device and integrated circuit package wafer burning The device does not use vacuum suction to solidify or move the integrated circuit package wafer, so it can be used without a vacuum pump, and directly connected to the power supply. σ", therefore, the controller, classifier and burner of the present invention The design and the finer disassembly and assembly are simple and the body can be effectively miniaturized. The present invention is not limited thereto, and various modifications may be made without departing from the scope of the invention. [Simple description of the diagram] The first intention. 1 is a schematic diagram showing a conventional integrated circuit package wafer burning device. The integrated circuit package wafer burning of the embodiment of the present invention is not shown in the present invention. Figure 3 shows the schematic diagram of the classifier in Figure 2. [Key component symbol description]
I、 2 積體電路封裝晶片燒錄袭置 2a積體電路封裝晶片分類裝置 II、 2 1 控制器 12、 22 分類器 121、221 導軌 122 真空泵 13、 23 燒錄器 2211 凹槽 222 阻擋構件 10 200831922 223 開關 224 控制介面 31、32積體電路封裝晶I, 2 Integrated Circuit Package Wafer Recording 2a Integrated Circuit Package Wafer Sorting Device II, 2 1 Controller 12, 22 Classifier 121, 221 Guide 122 Vacuum Pump 13, 23 Burner 2211 Groove 222 Blocking Member 10 200831922 223 Switch 224 control interface 31, 32 integrated circuit package crystal