TW200830665A - Electric device power supply circuit, light emitting diode illumination device, and battery having charge power supply circuit - Google Patents

Electric device power supply circuit, light emitting diode illumination device, and battery having charge power supply circuit Download PDF

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Publication number
TW200830665A
TW200830665A TW096136046A TW96136046A TW200830665A TW 200830665 A TW200830665 A TW 200830665A TW 096136046 A TW096136046 A TW 096136046A TW 96136046 A TW96136046 A TW 96136046A TW 200830665 A TW200830665 A TW 200830665A
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Taiwan
Prior art keywords
power supply
circuit
voltage
light
current
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TW096136046A
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Chinese (zh)
Inventor
Masaaki Kano
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Masaaki Kano
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Priority claimed from JP2006263510A external-priority patent/JP2009303280A/en
Priority claimed from JP2007008449A external-priority patent/JP2009302077A/en
Application filed by Masaaki Kano filed Critical Masaaki Kano
Publication of TW200830665A publication Critical patent/TW200830665A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/60—Light sources with three-dimensionally disposed light-generating elements on stacked substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/37—Converter circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Led Devices (AREA)

Abstract

A plurality of light emitting diodes are selected so that the intensity of the forward direction current of the peak light emission efficiency is within a predetermined irregularity range and arranged in parallel to one another. An electric device power supply circuit from an AC power source reduces and rectifies voltage Vf to the vicinity where the light emitting efficiency is at its peak and supplies current to a plurality of light emitting diodes so as to emit light.

Description

200830665 九、發明說明 【發明所屬之技術領域】 消耗電力少，且小 用電源電路，發光 之電池。 碳絲燈泡當時的美 爲直流電所承擔之 越遠，則有著送電 之後，在送電範圍 電力供給均成主流 燈絲，碳變換爲鎢 的光而照明的原理 之其他的照明，而 白色的構成，成爲 並且，亦揭示有有 言，有著發熱量過 肖耗多餘的電力。 本發明係爲有關可謀求發熱少，即 I» 型化或成本控制或壽命延長之電氣機器 ^ 二極體照明裝置及附有充電用電源電路 【先前技術】 Φ 針對在湯瑪斯.阿爾瓦.愛迪生發表 國，電器的主流係爲直流電（DC)，而作 重大課題，比較於交流電（AC)，當距離 損失率變高而成爲非效率性的事實。 作爲結果，，在美國係採用交流電， 廣大的歐洲或對於世界，經由交流電的 〇 另一方面，對於照明，首先燈泡的 • ’但將電氣變換爲熱，並作爲具有發熱 係爲相同，或者多採用螢光燈或水銀燈 - 在近年來係可進行各種發色，並亦提供 w 發光二極體（以下LED)呈使用於照明， 關LED之各種技術，但對於發光量而 大的問題點，而發熱量過大的情況係指 • 對此，在日本特開。平：3-24776,號公報（以下文獻1)中 ’係揭示有使用於LED之電源供給的開關調節器之消耗 電力或有關小型化的技術，或在日本特許公開2006- 200830665 20600 1號公報（以下文獻2)中，係揭示有有關將多數之 LED作爲串聯連接，並使用於此之開關調節器之技術。 在該文獻2之中，係從串聯連接之構成的1個電壓， 把握LED之發熱等之動作狀態，控制作爲供給之電源的 電壓，而當LED進行高亮度化或高輸出化時，LED本身 的發熱則變多，而有動作變爲不安定之虞。 在曰本特開平1 1 -94447號公報（以下文獻3)中，係由 ❿ 根據電抗而將電源電壓，進行分壓而降壓的情況，供給廉 價之電源電路。 另外，在日本特許公開2006-4936號公報（以下文獻 4)中，係揭示有在使用多數之LED時之有關此等LED之 高密度配置之技術，將印刷基板作爲2階層，安裝於下層 之印刷基板的LED之發光部係作爲呈從上層的印刷基板 之開口部露出。 但’在前述之文獻1或文獻2之發明中，開關調節器 • 的構件數爲多，小型化或成本降低則爲不易。 在文獻3之發明之中，係電路構成雖爲簡單，但當 ^ LED作爲高亮度化或高輸出化時，有著Led的動作變爲 不安定之虞，或，雖具備穩壓二極體，但經由LED的個 體差而動作狀態不均，並對於LED傳達應力之虞。 文獻4的發明係爲有關LED之高密度排列之構成， 並非謀求發熱或消耗電力之減少，或者小型化或成本控制 或壽命的延長構成。 200830665 【發明內容】 本發明係爲爲解決前述以往的問題點之構成，其課題 爲提供可謀求發熱少，即消耗電力少，且小型化或成本控 制或壽命延長之電氣機器用電源電路，發光二極體照明裝 P 置及附有充電用電源電路之電池。 首先，電氣機器用電源電路係屬於當所施加之直流電 壓上升時，消耗電流則增加，當相反地下降時，消耗電流 φ 則減少之情況，對於具有控制所施加之直流電壓的變動之 定電壓特性之負荷而言，將從交流電源所供給之電力，變 換爲直流電而供給之電氣機器用電源電路，其中，經由具. 有將交流進行整流而變換爲直流，供給直流電力於上述負 荷之整流電路，和將從直流電源所施加之電壓進行降壓而 供給至前述整流電路之降壓手段的情況，解決前述課題之 構成。 接著，LED照明裝置係由具有前述電氣機器用電源電 # 路，和對於此，作爲前述負荷而加以連接，相互並聯連接 之3個以上的發光二極體晶片（以下，LED晶片）而成，並 〜經由該並聯連接而控制順方向下降電壓VF之不均，根據 ，控制針對在作爲前述負荷之定電壓特性的電壓不均之情況 ，解決前述課題之構成。 又，具備相互並聯地連接之複數的LED晶片，和前 述電氣機器用電源電路之同時，前述電氣機器用電源電路 係將來自交流電流之電流進行降壓且整電，經由以發光效 率成爲峰値附近之順方向電流的大小，使前述LED晶片 200830665 發光之情況，解決前述課題之構成。 有前述電氣機 加以連接之電 解決前述課題 源電路之電源 ，作爲一例， 在2〜4V程度 的家庭用電源 將電壓進行降 壓器本身爲大 爲 50Hz乃至 節器而進行_ 件數則變多。 荷側而言，串 由以該電抗的 入之電源的電 電流’而該電 壓90°前進（容 附有充電用電源電路之電池裝置係由具 器用電源電路，和對於此，作爲前述負荷而 φ 池而成，並經由將該電池進行充電之情況， 之構成。 又，針對在本發明，前述電氣機器用電 供給的對象，並非限定於發光二極體之構成 Φ 發光二極體之情況，順方向下降電壓V F係 ’而有著個體差，無論如何，因較日本國內 (交流110V)爲高，故有需要經由任何手段而 壓，或限定流動的電流。 在使用變壓器而進行降壓之情況，因變 ’故有不易小型化之問題，因商用頻率數係 6 0Hz，故變壓器的鐵心變大，而使用開關調 壓之情況，變壓器本身係雖成爲小型，但構 ® 在前述電氣機器用電源電路中，對於負 聯地連接電抗，作爲電抗分壓電路，並且， w 大小，即負荷的阻抗大小的比率而分壓所輸 .壓情況，將電源電壓進行降壓，限定流動的 抗係不問容量性電抗，或誘導性電抗。 針對在電抗，流動的電流係相位則較電 量性電抗），或、流動的電流係相位則較電壓90°延遲（誘 導性電抗），因此，理論上，電力消耗係爲零，由此將可 實現小型，無發熱之電路。 200830665 在此，前述之電抗分壓電路係亦可說成爲提供電電流 特性之構成，隨之，即使LED以本身的發熱等而溫度上 升，流動的電流亦不易變動，而可防止LED之破損等， 特別是對於高亮度化或高輸出化之LED爲有效。 ^ 又，順方向下降電壓VF其他，對於LED係存在有個 體差，而在本專利發明之中，由相互地並聯連接複數之 LED，作爲本專利發明之負荷的情況，關於並聯連續之任 • 一 LED，均可作爲適合於各自LED之動作狀態者。 然而，針對在本專利發明係對於電氣機器用電源電路 之負荷，係在後述之實施形態或實施例中，作爲LED，但 並非爲被限定之構成，例如，亦可將電池作爲負荷，進行 該電池的充電。 LED照明裝置係較增加各LED晶片之發光照度，優 先作爲將其發光效率維持爲最大者，並決定發光時之順方· 向電流或順方向電壓之構成，或，LED照明裝置之全體的 ® 發光照度係作爲具備複數LED晶片而加以確保。 隨之’輸入於LED照明裝置之電力係效率佳而成爲 w 發光光量，因此不會有成爲不需要之焦耳熱之情況，隨之 • 可謀求發熱少，即消耗電力少，且小型化或成本控制或壽 命延長之情況。 在此，針對在本專利發明，LED晶片係指作爲形成有 作爲陽極及陰極之LED的構造之半導體晶片。 又’ LED單元係指作爲以塑料等密封該LED晶片之 構成’在此，LED單元係亦可爲具備複數LED晶片之構 200830665 成。 前述附有充電用電源電路之電池裝置係將前述電氣機 器用電源電路內藏於附有充電用電源電路之電池的構成， 或，其他之附有充電用電源電路之電池裝置係爲將前述 LED照明裝置之LED晶片，置換爲充電用電池之構成。 【實施方式】 • [爲了實施發明之最佳形態] 以下，使用圖示詳細說明本發明之實施形態。 圖1係爲表示適用本專利發明之實施形態的電氣機器 用電源電路的構成方塊圖。 該電氣機器用電源電路係爲使用於將從交流電源所供 給之電力變換爲直流而利用之電氣機器的構成。 如圖1所示，本實施形態之電氣機器用電源電路10 係具有突入電流控制電路1 2，和電抗分壓電路1 4，和整 ® 流電路1 6，和平滑電路1 7，並將直流電力供給制定電壓 特性負荷1 8之構成。 _ 從其電氣機器用電源電路10之利用變換後之直流電 y 力的定電壓特性負荷1 8係具有由當所施加的電壓上升時 ，消耗電流則增加，相反的，當下降時，消耗電流減少之 情況，控制施加於該負荷之電壓的變動之特性（稱作定電 壓特性），而該特性係針對在後述之實施例，係成爲有關 發光二極體之順方向下降電壓VF的特性。 前述整流電路1 6係具備將直流整流爲交流之整流電 -9- 200830665 ' 路機能，或’前述平滑電路1 7係具備爲了控制所整流之 直流的電壓之脈流的平滑電路機能。 又，電抗分壓電路1 4係具有串聯連接於整流電路1 6 k 之電抗元件，而在此之電抗係不問容量性電抗或誘導性電 、 抗，而該電抗分壓電路1 4係經由該串聯連接，以分壓從 交流電源所施加之電壓的情況而降壓，或限定流動的電流 〇 圖2係爲表示針對在本實施形態之電抗分壓電路1 4 的分壓之電路圖。 交流電源之電壓係針對在圖1，從左方藉由突入電流 控制電路1 2，供給至電抗分壓電路1 4，而針對在該電抗 分壓電路1 4係由以該電抗的大小（圖2之Z 1 )，以及負荷 之阻抗的大小（圖2之ZL)的比率，分壓交流電源之電壓情 況’將交流電源的電壓Viri進行降壓，限定動的電流，而 '經由該分壓，施加於整流電路1 6側之電壓VL係如下式。 • VL = ZL/ ( ZL + Z1 )…（1 ) - 又，較交流電源的電壓Vin，電壓VL如爲數十分之 一以下，也就是如爲ZL<<Z1，電抗分壓電路14係亦可 視爲流動下式之電流IL之定電流電路。 iL^Vin/ ( ZL + Z 1 ) =V i n / Z 1 (近似）…（2 ) -10- 200830665 圖3係表示針對在交流之相位的圖表。 針對其圖，對於波形A而言，波形B係相位則90。進 行，此等波形A或波形B係表示因應經過時間而產生變化 之交流的電壓或電流。 針對在容量性電抗，流動的電流係相位則較電壓90。 前進，隨之，針對在圖3，如將波形A作爲電壓，波形B 則成爲電流。 φ 或者，針對在誘導性電抗，流動的電流係相位則較電 壓9 0°延遲，隨之，針對在圖3，如將波形B作爲電壓， 波形A則成爲電流。 並且，針對在電抗，係因如此，電壓及電流的相位則 相互90°偏移，故理論上，消耗電力係爲零，而在本實施 形態之中，針對在電抗分壓電路1 4，採用如此之電抗，並 因使用於電源電壓之降壓或電流限制，故可實現小型，且 發熱非常少之電路。 • 接著，針對在圖1，突入電流控制電路1 2係爲控制針 對在電源投入時等所流動之突入電流之構成，例如，對於 - 使用於平滑電路1 7之電解電容器之充電電流則在電源投 ^ 入時，暫時性地變多，如此，將對於電抗分壓電路14等 帶來不良影響，以及對於外部而言，將電磁雜訊進行輻射 ，因此，經由突入電流控制電路1 2，控制交流電源之一時 性的突入電流，進而控制如上述之充電電流等。 然而，針對在如圖1所示之構成，由將從交流電源所 施加之電壓進行分壓之情況而降壓，或對於爲了限定流動 -11- 200830665 的電流，係必須要有電抗分壓電路14，又，定電壓特性負 荷1 8係因爲爲要求通常直流電源之供給的構成，故須具 備整流電路1 6，關於除此之外的突入電流控制電路1 2或 平滑電路1 7係如作爲因應需要而具備即可，即，如針對 > 在電源投入時等，無流動之突入電流的問題，亦可省略突 入電流控制電路1 2，而如無經由整流電路1 6所整流之直 流的電壓之脈流問題，亦可省略平滑電路1 7。 φ 圖4係爲適用本專利發明之LED照明裝置之第1實 施例的電路圖。 本實施例之LED照明裝置20係由電氣機器用電源電 路1 〇，和含有作爲負荷之複數LED之照明部1 9所構成， 而在本實施例中，係將合計3 0個之LED晶片1 1〜1 5， LED晶片21〜3 0，LED晶片31〜45，所有作爲並聯連接而 構成照明部1 9。 圖4之符號F0係表示配置於INPUT與二極體D4， • D3之間的耐熱性熔絲，而耐熱性熔絲F0係具備在LED照 明裝置20之製造時，可由焊錫之回流爐等之加熱程度的 ♦ 耐熱性，具體而言，使用陶瓷熔絲即可，又，耐熱性熔絲 F0係任一之LED晶片短路故障，在流動故大電流之情況 而破斷遮斷電源供給，由此，防止經由根據過大電流的發 熱而故障處擴大等之障害。200830665 IX. Description of the Invention [Technical Fields of the Invention] A battery that consumes less power and uses a small power supply circuit to emit light. The farther the carbon filament bulb is assumed by the DC power supply, the other illumination that is based on the principle that the power supply in the power transmission range becomes the mainstream filament after the power transmission, and the carbon is converted into tungsten light, and the white structure becomes Moreover, it also reveals that there is a saying that there is excessive power consumption. The present invention relates to an electric machine that can achieve less heat generation, that is, I» type or cost control or life extension, and a charging power supply circuit. [Prior Art] Φ For Thomas Alva In the country of Edison, the mainstream of electrical appliances is direct current (DC), and it is a major issue, compared with alternating current (AC), when the distance loss rate becomes high and becomes inefficient. As a result, in the United States, the use of alternating current, the vast majority of Europe or the world, through the alternating current, on the other hand, for lighting, first of the bulbs 'but the electricity is converted to heat, and as the heating system is the same, or more Fluorescent or mercury lamps - In recent years, various colors have been produced, and w-emitting diodes (hereinafter LEDs) have been used for lighting and LEDs, but for the problem of large amount of light, The case where the amount of heat is too large means that it is opened in Japan. Japanese Patent Publication No. 3-24776 (hereinafter referred to as "1") discloses a power consumption of a switching regulator for power supply of an LED or a related miniaturization technique, or a Japanese Patent Publication No. 2006-200830665 20600 No. 1 (Reference 2 below) discloses a technique in which a plurality of LEDs are connected in series and used as a switching regulator. In this document 2, the operation state of heat generation of the LED is controlled from one voltage connected in series, and the voltage as the power source to be supplied is controlled, and when the LED is increased in brightness or high in output, the LED itself is used. The fever is more, and the action becomes unstable. In Japanese Laid-Open Patent Publication No. Hei No. 1-94447 (hereinafter referred to as the following document), the power supply voltage is divided and reduced in accordance with the reactance, and supplied to an inexpensive power supply circuit. In Japanese Laid-Open Patent Publication No. 2006-4936 (hereinafter referred to as Document 4), a technique for high-density arrangement of such LEDs when a plurality of LEDs are used is disclosed, and the printed circuit board is installed in the lower layer. The light-emitting portion of the LED of the printed circuit board is exposed as an opening from the printed circuit board of the upper layer. However, in the invention of Document 1 or Document 2 described above, the number of components of the switching regulator is large, and it is difficult to reduce the size or cost. In the invention of Document 3, although the circuit configuration is simple, when the LED is increased in brightness or high in output, the operation of the LED is unstable, or a voltage-supplied diode is provided. However, the individual states of the LEDs are uneven, and the stress is transmitted to the LEDs. The invention of Document 4 is a configuration in which the high-density arrangement of LEDs is concerned, and does not require reduction in heat generation or power consumption, or miniaturization, cost control, or extension of life. In order to solve the above-mentioned conventional problems, the present invention provides a power supply circuit for an electric device that can reduce heat generation, that is, consumes less power, and is smaller in size, cost control, or longer in life. The diode lighting device P is provided with a battery with a charging power supply circuit. First, the power supply circuit for an electric device belongs to a case where the current consumption increases when the applied DC voltage rises, and decreases when the current decreases in the opposite direction, and a constant voltage having a variation of the applied DC voltage is controlled. In the load of the characteristic, the electric power supplied from the AC power source is converted into a power supply circuit for electric equipment supplied from the DC power, and the electric power is rectified by the alternating current to be converted into a direct current, and the direct current is supplied to the rectification of the load. The circuit and the step of reducing the voltage applied from the DC power supply and supplying the voltage to the step-down means of the rectifier circuit solve the above-described problems. Then, the LED lighting device is provided with three or more light-emitting diode chips (hereinafter, LED chips) which are connected to the above-described load and connected in parallel with each other as a power source for the electric device. The non-uniformity of the forward-down voltage VF is controlled by the parallel connection, and the above-described problem is solved by controlling the voltage unevenness as the constant voltage characteristic of the load. Further, the LED chip having a plurality of LED chips connected in parallel with each other and the power supply circuit for an electric device are configured to reduce the current from the alternating current and to reduce the current, thereby achieving a peak in luminous efficiency. The size of the current in the forward direction causes the LED chip 200830665 to emit light, and the above-mentioned problem is solved. In the electric power supply to which the electric machine is connected, the power supply of the source circuit of the above-mentioned problem is used as an example. In the household power supply of about 2 to 4 V, the voltage of the step-down device itself is greatly increased to 50 Hz or even the throttle unit. . On the charge side, the string is advanced by the electric current of the power source of the reactance and the voltage is advanced by 90° (the battery device to which the power supply circuit for charging is accommodated is the power supply circuit for the tool, and for this, as the load In the case of the present invention, the electric power supply to the electric device is not limited to the case where the illuminating diode of the illuminating diode is formed. In the forward direction, the voltage VF is lowered, and there is an individual difference. In any case, it is higher than that in Japan (AC 110V), so there is a need to press or limit the flow current by any means. In the case of the change, it is difficult to miniaturize. Since the commercial frequency is 60 Hz, the core of the transformer becomes large, and when the switch is used for voltage regulation, the transformer itself is small, but the structure is in the aforementioned electrical machine. In the power supply circuit, the reactance is negatively connected to the reactance voltage divider circuit, and the size of the w, that is, the ratio of the impedance of the load, is divided and transmitted. In this case, the power supply voltage is stepped down, and the flow resistance is limited to the capacity reactance, or the induced reactance. For the reactance, the current phase of the current is more than the electrical reactance), or the current phase of the flow is the voltage. 90° delay (inductive reactance), therefore, theoretically, the power consumption is zero, thereby enabling a small, non-heating circuit. 200830665 Here, the above-described reactance voltage dividing circuit can be said to provide a configuration of electric current characteristics. Accordingly, even if the temperature of the LED rises due to heat generation itself, the current flowing therein is not easily changed, and the LED can be prevented from being damaged. Etc., especially for LEDs with high brightness or high output. ^ Further, the voltage VF is decreased in the forward direction, and there is an individual difference in the LED system. In the present invention, a plurality of LEDs are connected in parallel to each other as a load of the present invention, and the parallel connection is continued. An LED can be used as the operating state suitable for the respective LED. However, the load of the power supply circuit for an electric device according to the present invention is an LED in the embodiment or the embodiment to be described later, but is not limited thereto. For example, the battery may be used as a load. Charging the battery. The LED lighting device increases the illuminance of each LED chip, and preferentially maintains the luminous efficiency to the maximum, and determines the composition of the smoothing current or the forward voltage at the time of light emission, or the entire LED lighting device. The illuminance is ensured as a plurality of LED chips. As a result, the electric power input to the LED lighting device is excellent in efficiency and becomes the amount of light emitted by w. Therefore, there is no need for unnecessary Joule heat, and accordingly, it is possible to reduce heat generation, that is, to reduce power consumption, and to reduce the size and cost. Control or extended life. Here, in the patented invention, the LED chip refers to a semiconductor wafer having a structure in which an LED as an anode and a cathode are formed. Further, the 'LED unit' is a structure in which the LED chip is sealed with plastic or the like. Here, the LED unit may be a structure having a plurality of LED chips. The battery device with the charging power supply circuit described above is configured such that the electric device power supply circuit is housed in a battery with a charging power supply circuit, or another battery device with a charging power supply circuit is provided with the LED The LED chip of the lighting device is replaced by a battery for charging. [Embodiment] [Best Mode for Carrying Out the Invention] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a block diagram showing the configuration of a power supply circuit for an electric device to which an embodiment of the present invention is applied. The power supply circuit for an electric device is configured to be used for converting an electric power supplied from an alternating current power source into a direct current. As shown in Fig. 1, the power supply circuit 10 for an electric device according to the present embodiment has an inrush current control circuit 12, a reactance voltage dividing circuit 14, and an integrated current circuit 16, and a smoothing circuit 107. The DC power supply is configured to form a voltage characteristic load 18. _ The constant voltage characteristic load of the DC power y force converted from the utilization of the power supply circuit 10 for the electric machine has a characteristic that the current consumption increases when the applied voltage rises, and conversely, when the voltage decreases, the current consumption decreases. In other cases, the characteristic of the fluctuation of the voltage applied to the load (referred to as a constant voltage characteristic) is controlled, and this characteristic is a characteristic of the forward-down voltage VF of the light-emitting diode for the embodiment to be described later. The rectifier circuit 16 includes a rectification circuit that rectifies a direct current to an alternating current, and the smoothing circuit 17 includes a smoothing circuit function for controlling a pulse current of a rectified direct current voltage. Further, the reactance voltage dividing circuit 14 has a reactance element connected in series to the rectifying circuit 16 k k, and the reactance does not require a capacitive reactance or an induced electrical reactance, and the reactance voltage dividing circuit 14 By the series connection, the voltage is applied from the voltage applied from the AC power source, or the current is limited. FIG. 2 is a circuit diagram showing the voltage division of the reactance voltage dividing circuit 14 in the present embodiment. . The voltage of the AC power source is supplied to the reactance voltage dividing circuit 14 from the left side by the inrush current control circuit 12 in Fig. 1, and the magnitude of the reactance is applied to the reactance voltage dividing circuit 14 (Z 1 in Fig. 2), and the ratio of the impedance of the load (ZL in Fig. 2), the voltage condition of the divided AC power source 'depresses the voltage Viri of the AC power source to limit the current flowing, and 'via the The voltage division VL applied to the side of the rectifier circuit 16 is divided into the following equation. • VL = ZL/ ( ZL + Z1 )...(1 ) - Also, the voltage VL is less than a tenth of the voltage of the AC power supply, that is, as ZL<Z1, the reactance voltage dividing circuit The 14 series can also be regarded as a constant current circuit that flows the current IL of the following type. iL^Vin/ ( ZL + Z 1 ) =V i n / Z 1 (approximate) (2) -10- 200830665 Fig. 3 is a graph showing the phase at the alternating current. For the graph, for waveform A, waveform B has a phase of 90. In the meantime, the waveform A or the waveform B indicates the voltage or current of the alternating current that changes depending on the elapsed time. For the capacitive reactance, the current phase of the flow is 90. Moving forward, with respect to Fig. 3, if waveform A is used as a voltage, waveform B becomes a current. φ Or, for the induced reactance, the current phase of the current is delayed by 90 °, and accordingly, in Fig. 3, if waveform B is used as the voltage, waveform A becomes a current. Further, in terms of reactance, the phases of the voltage and the current are shifted by 90° from each other. Therefore, in theory, the power consumption is zero. In the present embodiment, the reactive voltage dividing circuit 14 is used. With such a reactance, and because of the step-down or current limitation of the power supply voltage, it is possible to realize a circuit that is small and has very little heat generation. In the following, the inrush current control circuit 12 is configured to control the inrush current flowing when the power is turned on, for example, for the charging current of the electrolytic capacitor used in the smoothing circuit 17 When it is injected, it is temporarily increased. As a result, the reactive voltage dividing circuit 14 and the like are adversely affected, and electromagnetic noise is radiated to the outside. Therefore, the current control circuit 12 is infiltrated. Controlling the inrush current of one of the AC power sources, thereby controlling the charging current as described above. However, for the configuration shown in FIG. 1, the voltage is applied from the voltage applied by the alternating current power source to reduce the voltage, or for the current to limit the flow of -11-200830665, it is necessary to have a reactance voltage dividing piezoelectric. In addition, the constant voltage characteristic load 18 is a configuration in which a normal DC power supply is required, and therefore, the rectifier circuit 16 is required to be provided, and the other inrush current control circuit 12 or smoothing circuit 17 is It may be provided as needed, that is, if there is no flow inrush current when the power is turned on, etc., the inrush current control circuit 12 may be omitted, and the DC current rectified by the rectifying circuit 16 may be omitted. The voltage flow problem of the voltage may also omit the smoothing circuit 17. φ Fig. 4 is a circuit diagram showing a first embodiment of the LED lighting device to which the present invention is applied. The LED lighting device 20 of the present embodiment is composed of an electric device power supply circuit 1 and an illumination unit 19 including a plurality of LEDs as a load, and in the present embodiment, a total of 30 LED chips 1 will be used. 1 to 1 5, LED chips 21 to 30, LED chips 31 to 45, all of which are connected in parallel to constitute an illumination unit 19. The symbol F0 in Fig. 4 indicates a heat-resistant fuse disposed between the INPUT and the diodes D4 and D3, and the heat-resistant fuse F0 includes a solder reflow furnace or the like when the LED lighting device 20 is manufactured. Heat resistance ♦ Heat resistance, specifically, a ceramic fuse can be used, and the heat-resistant fuse F0 is short-circuited by any of the LED chips, and the power supply is interrupted when a large current flows. This prevents obstacles such as expansion due to heat generation due to excessive current.

此等LED晶片係如圖5所示，各自則經由透明樹脂 部1，與陰極側及陽極側引導架2A，2B，接合線3同時加 以密封，作爲LED單元4所構成，在此，係對應於LED -12- 200830665 晶片1 1〜1 5，21~30，3 1〜45而作爲 LED單元4h~415、 4 21〜4 3 〇、4 3 1-44 5。 照明部1 9係因爲爲如上述，並聯地集合構成LED晶 片之構成，故具有來自於LED晶片之順方向下降電壓VF 之定電壓特性，又，可消解LED晶片之個體差的不均影 響，例如，順方向下降電壓VF係由並聯連接LED晶片之 情況所平均化，並可消解LED晶片之個體差的不均影響 〇 然而，LED晶片的數量係並無具體限定，但，某種程 度，例如如至少3個，可能的話，如1 0個以上，將可有 效地進行如此個體差之不均影響的降低。 在此，各LED晶片1 5，LED晶片21〜3 0，LED晶 片3 1〜45係爲日亞化學製之構成，又，順方向下降電壓 VF係爲3.6V，最大順電壓係爲4V，順電流If係爲30mA ，脈衝順電流Ifp係爲l〇〇mA，逆電壓VR係爲5V，而關 於LED晶片，順電流If等之選擇係後述之。 又，如圖4所示，平滑電路17係經由電解電容C51 及電阻R51所構成，經由該平滑電路17而控制發光二極 體之發光的閃爍，而電解電容C51係爲耐電壓6.3V，容 量爲47pF，而電阻R51係阻抗値爲21Ω，1/6W。 又，整流電路1 6係內藏於1個模製封裝，成爲經由4 個二極體D1〜D4所構成之橋式整流二極體D，並構成全波 整流電路，而該橋式整流二極體 D係爲 VISHAY(舊 General Semicon Ductor)製，順電流，最大爲 4.0A，逆電 -13- 200830665 流，最大爲200V峰値。 更加地，突入電流控制電路1 2係經由電阻R1 1所 成，並其電阻R 1 1係串聯地連接於交流電源之供給路徑 並串聯連接於電抗分壓電路1 4，呈控制發生在電源投入 之突入電流，該電阻R1 1係阻抗値爲1 ΚΩ，大小係成 1/4W，而當選擇太大的阻抗値時，與針對在該電阻ri】 損失增加的同時，將伴隨發熱者。 電抗分壓電路14係經由對於橋式整流二極體D而 ，作爲串聯連接之電容C2 1所構成，而其電容C2 1係經 LED晶片1 1〜15，LED晶片21〜30，LED晶片31〜4 5， 用不同特性之構成，例如，使用經由發光色而不同，耐 爲AC25 0V之聚酯電容（薄膜系無極性電容），例如，發 爲白色與藍色的情況係爲 0.68 // F，而綠色的情況係 0.47/zF(亦可爲 0.33//F，或 0.22//F)，紅色係爲 0· #F(亦可爲0.1//F)等，作爲並聯而使電壓安定，作 希望的容量。 圖6係爲從有關本實施例之LED照明裝置20之照 側而視的正面圖，並可穿越如後述之透明樹脂製罩體32 目視各自內包LED晶片之LED單元4，而合計30個 LED單兀4】1〜4i5、21〜3 0、31〜45係將中心軸C作爲共通 整列於半徑不同之3個圓周上，而圖6中的虛線係爲爲 表示該整列而作圖上記載之構成。 對於最內側之圓周係配置有5個LED單元 對於中間的圓周係配列有10個LED單元421〜43Q、對於 構 y 時 爲 之 言 由 使 壓 色 爲 15 爲 明 之 了 、 外 -14- 200830665 側之緣周上係配置有15個LED單元431〜44 5，均呈照面同 一方向地，於印刷基板3 0上，作爲配置配線，而該照面 的方向係針對在圖6係爲從紙面對於這邊側之方向，在接 著說明之圖7或圖8中，爲從右側對於左側之方向。 圖7係爲表示LED照明裝置20之外觀的側面圖，圖 8係爲從表示LED照明裝置20之內部的側面所視的一部 分剖面圖。 如圖8所示，離間於前述印刷基板（第1印刷基板）3 0 的背面側而設置有第2印刷基板3 1，並電氣機器用電源電 路1 0係安裝於第2印刷基板3 1的表面及內面，而L E D 單元4!】〜415、21〜3G、31〜45及印刷基板30，3 1係配設於外 殻34之內側，而對於其外殼34係於與照明方向相反側， 也就是針對在圖7或圖8，於右側，設置有一般照明用燈 泡的標準規格的燈座3 6，該燈座係爲稱作「E 2 6」之規格t 的一般構成。 ® 針對在該燈座3 6，電源的供給係作爲經由相互電性絕 緣之電極36a及36b之構成，又，在圖7中，從電極36a " ，經由配線42，有從電極36b，經由配線43，連接於電氣 • 機器用電源電路1 0，由此，從該燈座3 6，供給電源於該 內部電路，而該電氣機器用電源電路1 〇係針對在本實施 例，又針對在後述之實施例，如前述，亦安裝於第2印刷 基板31之表面及內面。 然而，外殼3 4係爲模製，經由鋁金屬蒸鍍等，內面 則呈反射光線地作爲表面加工之玻璃製，但，亦可將鋁板 -15- 200830665 作爲壓力成型之構成等金屬製其他，又，針對在外殼34， LED單元4i ^415、21〜3〇、31〜45之前面部分係經由爲透明 ，圓盤狀之平面的樹脂製罩體32所密封。 圖9係爲本實施例之印刷基板3 0的內面圖。 會 對於整列有LED卓兀4ιι〜4丨5、21〜3G、31〜45之3個圓 周各自之印刷基板3 0的內面，係供給此等發光二極體之 直流電源，正極的配線30-la，.3 0-2a，30-3a，負極的配 φ 線30-lb，30-2b，30-3b之配線則設置成圓周狀，而此等 之配線的圓周狀中心係成爲與發光二極體之圓周整列之中 心軸C相同。 又，印刷基板30的內面的此等正極的配線 30-la， 30-2a，3 0-3a，係經由印刷基板30的表面之印刷配線而作 爲相互連接，而關於負極的配線30-lb，30-2b，30-3 b， 亦經由印刷基板3 0的表面之印刷配線而作爲相互連接， 並且，經由配線 30-la，30-2a，30-3a，配線 30-lb，30-• 2b，30-3b，相互並聯連接LED晶片1 1〜15，LED晶片 2 1〜3 0，LED晶片31〜45，並作爲照明部19所編成。 & 在其實施例中，經由後述之理由，將順方向電壓Vf ，作爲在發光效率成爲峰値之附近，使用LED晶片於照明 ，而關於LED晶片，作爲調整電抗分壓電路14之容量等 ，而調整順方向電壓Vf或順方向電流If。 例如，將發光效率成爲峰値之順方向電流，作爲中心 ，並以上下1 0%的範圍內之順方向電流的大小，使LED晶 片發光。 -16- 200830665 又，針對在發光中的LED晶片之特定的順方向電壓 ，順方向電流的不均乃將特定之中央値，作爲中心，使用 呈上下10%的範圍內地所挑選之LED晶片。 說明上述之理由，圖1〇係爲表示一般的LED晶片之 at 順方向電壓Vf-順方向電流If的特性之圖表，又，圖1 1， 圖12，圖13係爲表示如此LED晶片之各自，順方向電流 If-發光亮度L之特性，在順方向電壓Vf-發光效率的特性 • ，上述順方向電壓Vf-順方向電流If之特性的不均之圖表 〇 針對在此等圖表，順方向電壓 Vf、順方向電流If、 發光亮度L、發光效率之單位係各自爲V、mA、cd = m2( =nt ) 、nt/W，在此，發光效率係爲對於傳達於LED晶片 之電力W的亮度L，即L/W。 又，針對在圖1 2，經由實線表示發光效率，經由一點 虛線表示發光亮度L，而針對在圖1 3，經由一點虛線，表 • 示1個LED晶片之順方向電壓Vf-順方向電流If之特性， 經由二點虛線，表示其他LED晶片之順方向電壓Vf_順方 ▲向電流If的特性。 k 如圖1 〇所示，LED晶片係當順方向電壓Vf較電壓 V 1爲小時，順方向電流if則不會流動而亦未發光，又， LED晶片係當順方向電壓Vf成爲較電壓v 1大時，則發光 ’當順方向電壓Vf增加時，伴隨此，順方向電流If則指 數函數性地增加。 接著，如圖1 1所示，LED晶片係伴隨著順方向電流 200830665 I f的增加’發光亮度L係對數函數性地增加，也就是， L E D晶片係當順方向電流！ f增加時’對於順方向電流j f ^ 之增加的發光亮度L之增加程度係變小，隨之，當順方向 電流If在某種程度以上增加時，了解到發光效率件次下降 M' 者。 其發光效率之漸次下降係從圖1 2而了解到，順方向 電壓Vf在從電壓vi至電壓V2爲止增加之範圍中，伴隨 ® 著順方向電壓Vf的增大，發光亮度L則增加，同時發光 效率亦增加，並且，順方向電壓Vf在電壓V2以上之範圍 中，伴隨著順方向電壓Vf之增加，雖發光亮度L係增加-，但發光效率係漸次下降。 隨之，如上述，將發光效率成爲峰値的値作爲中心， 將順方向電流的大小，作爲上下1 0%的範圍，且，當將 LED晶片，以特定的順方向電壓，順方向電流呈中央値的 上下1 〇%的範圍地挑選而使用時，將可高維持發光效率， ® 且減少發熱者。 然而，針對在圖1 3，一點虛線係爲表示LED晶片之 > 順方向電壓Vf-順方向電流If之特性的圖表，而即使爲相 i 同順方向電壓V a，針對在其圖表，在一點虛線之LED晶 片中，亦成爲順方向電流Ial，在二點虛線之LED晶片中 ，亦成爲順方向電流Ia2，又，此等順方向電流Ial，Ia2 之差別係爲有某種程度爲大之構成。 圖14〜圖17係爲表示各自適用本專利發明之有關第 2〜第5實施例之電氣機器用電源電路20A〜20D的電路圖 -18- 200830665 在第2實施例〜第5實施例之電氣機器用電源電路 20A〜20D中，與前述第1實施例作比較，電抗分壓電路 14之電容C21則作爲2個電容C22及C23，或者作爲6 i 個電容C24〜C29，或作爲4個電容C31〜C34，並此等係並 聯或串聯地加以連接，而電抗分壓電路1 4之電容係亦可 由如此適宜並聯地，或根據情況而串聯地連接之情況，作 Φ 爲時現任意的容量或耐壓之構成，或者，亦可因應需要而 作爲使用電解電容。 又，在第3實施例〜第5實施例之電氣機器用電源電 路2 0B〜2 0D中，省略突入電流控制電路12之電阻R1 1， 而如使用於平滑電路1 7之電解電容的容量爲小等而不要 ，如此，亦可省略突入電流控制電路1 2，又，如第5實施 例，亦可作爲省略平滑電路1 7。 然而，針對在此等電氣機器用電源電路20A〜20D，以 • 符號1 9所示之照明部係爲與在前述第1實施例之照明不 相同，省略一部分電路圖之作圖上圖示，然而，針對在此 -等電氣機器用電源電路20A〜20D，在發光二極體的數量係 .亦無具體限制。 圖1 8係爲表示前述之第1實施例〜第5實施例之變形 例的外觀正面圖，又，圖1 9係爲從表示該變形例之內部 側面而視之一部分剖面圖。 - 在該變形例之中，將照明部1 9，作爲分載於3個印刷 基板30A〜30C，fi卩，對於圓盤上之印刷基板30A，係將中 -19- 200830665 心軸C作爲中心，整列搭載5個LED晶片1 1〜15，而對於 將中心軸C作爲中心之環狀之印刷基板30B，係將該中心 軸C作爲中心，整列搭載10個LED晶片21〜30，而對於 將中心軸C作爲中心之環狀之印刷基板30C，係將該中心 軸C作爲中心，整列搭載15個LED晶片31〜45。 如圖1 8，當從經由本實施例所照明之正面側而視時， 圓盤上之印刷基板3 0 A係其中心呈中心軸C地，配置於全 體的中心，因此，該圓盤上之印刷基板3 0 A係稱作中心基 板。 又，對於印刷基板3 0 A之外側，係印刷基板3 0B，則 其中心呈中心軸C地較印刷基板3 0 A偏移配置於照明方向 (前方側），更加地，對於印刷基板30B之外側，係印刷基 板3 0C，則其中心呈中心軸C地較印刷基板3 0B偏移配置 於照明方向（前方側），而如此，因偏移於前方而配置，故. 亦從圖15 了解到，印刷基板30A〜30C係如圓形劇場的座 位，印刷基板3 0 A則成爲最靠近燈座3 6側，口徑則從小 至大依序配置於前面側（透明樹脂罩體32側）。 然而，針對在以上說明之第1實施例〜第5實施例， 從LED照明裝置20的正面而視之形狀，或整列LED單元 4h〜415、21〜30、3】〜45之形狀，又，印刷基板 30， 30A〜30B之平面形狀係均爲圓形，但，本專利發明並不侷 限於如此之構成，例如，亦可爲方形狀或矩形狀。 例如，針對在圖1 8及圖1 9之變形例，從LED照明 裝置20的正面而視之形狀，或印刷基板30A之平面形狀 -20- 200830665 ，或該印刷基板30A上之LED單元4η〜4 15、21〜3〇、3 ^45 之配置整列係均作爲圓形狀，並且，印刷基板30B及3 0C 的平面形狀，或此等印刷基板30B及30C上之LED單元 4ll〜4i5、2】〜3D、31〜45之配置整列係亦可作爲方形狀。 針對在上述實施例，一個LED單元係內包1個LED 晶片，但本發明並未侷限於此，而亦可於一個LED單元 ，作爲複數個，並聯地搭載。 φ 例如，如圖20，21所示之砲彈型之LED單元的情況 ，直徑如爲5mm，將可最多搭載4個（在圖 20係3個 )0.7 m m X 0 · 7 m m之正方形的L E D晶片。 如圖20，21所示，其LED單元50係由具備第1引 線52及第2引線54，和形成於第1引線52之端部（針對 在圖21，上端部21 A)的晶片搭載部56，和於其晶片搭載 部56上，爲其下側面之陰極電極則呈藉由接合線59人而 連接於上端部52A地所安裝之3個LED晶片58A，58B， ® 5 8C (以下，將此等總稱的情況係稱作LED晶片58)，和 第2引線54之針對在圖21，連接上端部54A與在3個 • LED晶片58A，58B，5 8C之上側的陽極電極之間的接合 線5 9B和密封第1引線52及第2引線54之上端部52 A， 54A，複數之LED晶片58及接合線59A，58B，例如由環 氧樹脂等之透光性樹脂而成之密封樹脂部60所構成。 3個LED晶片58A，5 8B，5 8C係針對在晶片搭載部 56上，如圖20所示，與連結第1引線52之上端部52A 與第2引線54之上端部54A的直線，針對在圖20，於垂 -21 · 200830665 直交叉的方向，配列呈直線狀。 晶片搭載部56係針對在圖2 1，如虛線所示，具有直 平面狀之搭載面56A，而接合線59A之LED晶片側端部 係固定於搭載面56，並於其上方，例如經由導電性黏合劑 * ，接著固定LED晶片58A，58B，58C之下側的電極（陰 極電極），又，LED晶片58A，58B，58C係針對在圖21 ，經由以二點虛線所示之螢光體分散樹脂54，一體地固定 Φ 於晶片搭載部56，而其螢光體分散樹脂24係由使爲了將 LED晶片50白色發光之螢光體分散之環氧樹脂或矽樹脂 所構成。 第1引線52及第2引線54係從引線架所構成，並其 引線架係由鍍銀之鐵，銅或銅合金所構成，且，第1引線 52則呈陰極側，第2引線54則呈陽極側地，連接於電源（ 省略圖示），又，構成晶片搭載部56之底面的搭載面56A. 係經由根據前述鍍銀之反射面所構成，隨之，從LED晶 @ 片58所射出之光線的一部分係在搭載面56A所反射，並 激勵，發光（白色光）螢光體分散樹脂54之螢光體。 -然而，在其LED單元之中係與以往之LED單元不同 ，，在LED晶片之圖2 1的下側之陰極電極則因並非藉由晶 片搭載面5 6之情況，而經由接合線5 9 A，直接連接於第1 引線52之上端部52A，故可對於3個LED晶片58A〜58C 而言，不會偏移而供給電力，而第1引線5 2或導電性黏 合劑之導電性，如充分爲大，則無須接合線59A。 針對在上述複數晶片型LED晶片50，係因搭載3個 -22- 200830665 LED晶片58A，58B，5 8C於1個晶片搭載部56，故增大 針對在作爲照明裝置之LED晶片50的LED晶片積體度， 並可經由此，大幅地增加發光量。 然而，在增加LED晶片積體度之情況，發熱則成爲 問題，但在其實施形態中，例如經由晶片挑選裝置，如組 合特性相等之晶片，可確認到發熱非常少之情況。 圖22係爲有關本專利發明之第6實施例之附有充電 用電源電路之電池裝置40的電路圖。 針對在本實施例，電池22係爲經由其實施例之電氣 機器用電源電路1 〇 A所充電之構成，充電後，本實施例之: 附有充電用電源電路之電池4 0係從圖2 2中右側之「DC OUTPUT」，輸出直流電力，可作爲直流電源而使用。 然而，此時的輸出之電壓係成爲電池22的電壓，又 ，本實施例之附有充電用電源電路之電池40，又，在後述 之第7實施例中，如述之第1實施例〜第5實施例的照明 部19，因無經由照明之閃爍之整流的直流脈流之問題，故 省略了平滑電路1 7。 在適用本專利發明之電氣機器用電源電路中，係如前 述，因有定電流特性，故可有效率地將電池22進行充電 ，即，電池22即使爲過放電狀態，流入於電池22之充電 電流亦不會成爲過電流地控制，而電抗分壓電路14之電 抗，例如，電容C2 1的容量係如因應可在該過放電狀態流 動情況之最大電流而決定即可，並且，在本實施例之中’ 當將電池22進行充電時，因充電電流減少，故可防止過 -23- 200830665 充電。 圖23係爲本專利發明之第7實施 部電路圖。 本實施例係亦可稱作將前述第6實 ~ 電源電路之電池40組裝於電氣機器之釋 爲該電氣機器之主體，並爲從附有充電 40供給直流電力之電氣機器主體的電路 φ 在此，圖24係爲表示使用於以上| 第7實施例之整流電路1 6的電路圖， 係各自爲表示該整流電路1 6之變形例的 使用於以上說明之第1實施例〜第 路1 6係並無特別限定爲何構成，例如 電路或半波整流電路，在此，將整流電 入端子IN1及IN2，又直流之輸出端子 圖示於圖24地定義，如此，該整流電腾 β 所示亦可作爲使用全波整流電路，或如 爲使用半波整流電路。 於 接著，圖27係爲表示前述第6實 .施例之充電用電池22的變形例之電路| 又針對在圖28及29，符號IN+ p，IN· 係均爲對應於圖22及圖23之構成，而 及圖29，亦作爲相同。 在其充電用電池22之變形例中， 給電源時之特性，亦具備合計η個相互As shown in FIG. 5, these LED chips are respectively sealed with the cathode side and the anode side lead frames 2A, 2B and the bonding wires 3 via the transparent resin portion 1, and are formed as the LED unit 4, and here, In the LED -12-200830665, the wafers 1 1 to 1 5, 21 to 30, and 3 1 to 45 are used as the LED units 4h to 415, 4 21 to 4 3 〇, and 4 3 1-44 5 . Since the illuminating unit 19 has a configuration in which the LED chips are collectively arranged in parallel as described above, it has a constant voltage characteristic from the forward voltage VF of the LED chip, and the unevenness of the individual difference of the LED chips can be eliminated. For example, the forward voltage VF is averaged by the parallel connection of the LED chips, and the unevenness of the individual differences of the LED chips can be eliminated. However, the number of LED chips is not specifically limited, but to some extent, For example, if at least 3, if possible, such as 10 or more, the reduction in the influence of the unevenness of such individual differences can be effectively performed. Here, each of the LED chips 15 and the LED chips 21 to 30, and the LED chips 3 1 to 45 are made of Nichia Chemical Co., Ltd., and the forward voltage VF is 3.6 V, and the maximum forward voltage is 4 V. The forward current If is 30 mA, the pulse forward current Ifp is 10 mA, and the reverse voltage VR is 5 V. Regarding the LED wafer, the selection of the forward current If or the like is described later. Further, as shown in FIG. 4, the smoothing circuit 17 is constituted by an electrolytic capacitor C51 and a resistor R51, and the smoothing circuit 17 controls the flicker of the light emission of the light-emitting diode, and the electrolytic capacitor C51 is a withstand voltage of 6.3 V. It is 47pF, and the resistance R51 is 2121Ω, 1/6W. Further, the rectifier circuit 16 is housed in one molded package, and is a bridge rectifier diode D composed of four diodes D1 to D4, and constitutes a full-wave rectifier circuit, and the bridge rectifier 2 The polar body D system is made of VISHAY (old General Semicon Ductor), with a forward current of up to 4.0A, a reverse current of -13 to 200830665, and a maximum of 200V peak. Further, the inrush current control circuit 12 is formed by the resistor R1 1 , and the resistor R 1 1 is connected in series to the supply path of the AC power source and connected in series to the reactance voltage dividing circuit 14 for control to occur at the power source. Injecting current into the resistor, the resistor R1 1 has an impedance 値 of 1 Κ Ω and a size of 1/4 W. When a too large impedance 选择 is selected, it is accompanied by an increase in the loss of the resistor ri. The reactance voltage dividing circuit 14 is formed by connecting the capacitor C2 1 connected in series to the bridge rectifier diode D, and the capacitor C2 1 is passed through the LED chips 1 1 to 15, the LED chips 21 to 30, and the LED chip. 31 to 4 5, with different characteristics, for example, a polyester capacitor (film-type non-polar capacitor) resistant to AC25 0V is used depending on the illuminating color. For example, the case of white and blue is 0.68 / / F, and the green case is 0.47/zF (may also be 0.33//F, or 0.22//F), and the red color is 0·#F (also 0.1//F), etc. Settling, making the desired capacity. Fig. 6 is a front view of the LED lighting device 20 according to the present embodiment, and the LED unit 4 in which each of the LED chips is packaged is visually traversed through a transparent resin cover 32 as will be described later, and a total of 30 LED single 兀 4] 1~4i5, 21~3 0, 31~45, the central axis C is collectively arranged on three circles having different radii, and the broken line in Fig. 6 is shown on the graph for indicating the whole column. The composition of the record. Five LED units are arranged for the innermost circumference, and ten LED units 421 to 43Q are arranged for the middle circumference. For the configuration y, the color is 15 for the light, and the outer 14-200830665 side. On the periphery of the edge, 15 LED units 431 to 44 5 are arranged in the same direction, and are arranged on the printed circuit board 30 as the arrangement wiring. The direction of the illumination surface is for the paper surface in Fig. 6 The direction of the side is the direction from the right side to the left side in Fig. 7 or Fig. 8 which will be described later. Fig. 7 is a side view showing the appearance of the LED lighting device 20, and Fig. 8 is a partial cross-sectional view as seen from the side showing the inside of the LED lighting device 20. As shown in FIG. 8, the second printed circuit board 3 is provided on the back side of the printed circuit board (first printed circuit board) 30, and the power supply circuit 10 for electric equipment is mounted on the second printed circuit board 31. The surface and the inner surface, and the LED units 4!]~415, 21~3G, 31~45 and the printed substrate 30, 31 are disposed on the inner side of the outer casing 34, and the outer casing 34 is attached to the opposite side of the illumination direction. That is, in the case of Fig. 7 or Fig. 8, on the right side, a lamp holder 3 of a standard specification of a general illumination bulb is provided, and the lamp holder is a general configuration of a specification t called "E 2 6". In the case of the lamp holder 36, the supply of the power source is constituted by the electrodes 36a and 36b which are electrically insulated from each other, and in FIG. 7, the electrode 36a " via the wire 42 has the slave electrode 36b. The wiring 43 is connected to the electrical/machine power supply circuit 10, whereby the power supply circuit 1 is supplied from the socket 36, and the electrical equipment power supply circuit 1 is directed to the present embodiment. The embodiment described later is also attached to the front surface and the inner surface of the second printed substrate 31 as described above. However, the outer casing 34 is molded, and the inner surface is made of glass which is surface-processed by reflecting light such as aluminum metal vapor deposition. However, the aluminum plate -15-200830665 may be used as a pressure forming structure or the like. Further, in the outer casing 34, the front surface portions of the LED units 4i^415, 21 to 3, and 31 to 45 are sealed by a resin cover 32 which is a transparent, disk-shaped flat surface. Fig. 9 is a plan view showing the printed circuit board 30 of the present embodiment. For the inner surface of each of the three printed circuits of the three rows of LEDs 4, 4, 5, 21, 3, and 31 to 45, a DC power supply for the light-emitting diodes is provided, and the wiring 30 of the positive electrode is provided. -la, .3 0-2a, 30-3a, the wiring of the negative φ line 30-lb, 30-2b, 30-3b is arranged in a circumferential shape, and the circumferential center of the wiring becomes and emits The central axis C of the entire circumference of the diode is the same. Moreover, the wirings 30-la, 30-2a, and 30-3a of the positive electrodes on the inner surface of the printed circuit board 30 are connected to each other via printed wiring on the surface of the printed circuit board 30, and the wiring 30-lb for the negative electrode is connected. 30-2b, 30-3b are also connected to each other via printed wiring on the surface of the printed substrate 30, and via wirings 30-la, 30-2a, 30-3a, wiring 30-lb, 30-• 2b, 30-3b, LED chips 1 1 to 15 , LED chips 2 1 to 30 , LED chips 31 to 45 are connected in parallel to each other, and are incorporated as illumination unit 19 . In the embodiment, the forward voltage Vf is used as the peak in the vicinity of the luminous efficiency, and the LED wafer is used for illumination, and the LED wafer is used as the capacity of the adjustment reactance voltage dividing circuit 14 for the reason described later. Etc., and adjust the forward voltage Vf or the forward current If. For example, the LED efficiency is caused by the current in the forward direction of the peak 値, and the LED wafer is illuminated as the center and the magnitude of the forward current in the range of 10% above and below. In addition, for the specific forward voltage of the LED chip that emits light, the current in the forward direction is the center of the specific center, and the LED chip selected in the range of up to 10% is used as the center. For the reasons described above, FIG. 1 is a graph showing the characteristics of the at-direction voltage Vf-forward current If of a general LED chip. Further, FIGS. 1, 1, 12, and 13 show the respective LED chips. The characteristic of the forward current If-luminescence luminance L, the characteristic of the forward voltage Vf-luminous efficiency, and the non-uniformity of the characteristics of the forward voltage Vf-forward current If, for the graphs, The units of the voltage Vf, the forward current If, the light-emitting luminance L, and the luminous efficiency are each V, mA, cd = m2 (=nt), nt/W, where the luminous efficiency is the power W for the LED chip. The brightness L, which is L/W. Further, in Fig. 12, the luminous efficiency is indicated by a solid line, the luminous luminance L is indicated by a dotted line, and the forward voltage Vf-forward current of one LED wafer is shown by a dotted line in Fig. 13. The characteristic of If, via the two-dotted line, indicates the characteristics of the forward voltage Vf_shun ▲ to the current If of the other LED chips. k As shown in Fig. 1, the LED chip is when the forward voltage Vf is lower than the voltage V1, and the forward current if does not flow and does not emit light. Moreover, the LED chip becomes the voltage Vv in the forward direction voltage Vf. When it is 1 hour, the light emission 'when the forward voltage Vf increases, along with this, the forward current If increases exponentially. Next, as shown in Fig. 11, the LED chip is accompanied by an increase in the forward current 200830665 I f. The luminance L is functionally increased logarithmically, that is, the L E D chip is a forward current! When f is increased, the degree of increase in the luminance L of the increase in the forward current j f ^ is small, and accordingly, when the forward current If is increased to some extent or more, it is known that the luminous efficiency is decreased by M'. The gradual decrease in luminous efficiency is known from FIG. 12, and in the range where the forward voltage Vf increases from the voltage vi to the voltage V2, the luminance L increases with the increase of the forward voltage Vf. The luminous efficiency is also increased, and the forward voltage Vf is in the range of the voltage V2 or more. As the forward voltage Vf increases, the luminous luminance L increases, but the luminous efficiency gradually decreases. As a result, as described above, the illuminating efficiency is the peak of the peak, and the magnitude of the forward current is in the range of 10% above and below, and when the LED wafer is subjected to a specific forward voltage, the forward current is present. When the range of the upper and lower sides of the center 挑选 is selected and used, it is possible to maintain the luminous efficiency, and reduce the number of people who are hot. However, for FIG. 13, a dotted line is a graph indicating the characteristic of the forward voltage Vf-forward current If of the LED wafer, and even if the phase is the same as the forward voltage Va, for the graph thereof, In the dotted-line LED chip, the forward current Ial also becomes the forward current Ia2 in the two-dotted LED chip, and the difference between the forward currents Ial and Ia2 is somewhat large. The composition. FIG. 14 to FIG. 17 are circuit diagrams showing the electric power supply circuits 20A to 20D of the second to fifth embodiments to which the present invention is applied. FIG. 18 to 200830665 Electrical apparatus according to the second to fifth embodiments In the power supply circuits 20A to 20D, in comparison with the first embodiment, the capacitance C21 of the reactance voltage dividing circuit 14 is used as two capacitors C22 and C23, or as 6 i capacitors C24 to C29, or as four capacitors. C31~C34, and these are connected in parallel or in series, and the capacitance of the reactance voltage dividing circuit 14 can also be connected in series as appropriate, or connected in series according to the situation, and Φ is arbitrary. The capacity or the composition of the withstand voltage, or the electrolytic capacitor can be used as needed. Further, in the electrical equipment power supply circuits 20B to 2D of the third embodiment to the fifth embodiment, the resistance R1 1 of the inrush current control circuit 12 is omitted, and the capacity of the electrolytic capacitor used in the smoothing circuit 17 is It is not necessary to do so, and the inrush current control circuit 12 may be omitted. Further, as in the fifth embodiment, the smoothing circuit 17 may be omitted. However, in the electric power supply circuits 20A to 20D for electric equipment, the illumination unit indicated by the symbol (1) is different from the illumination of the first embodiment, and a part of the circuit diagram is omitted. There is no specific limitation on the number of the light-emitting diodes for the power supply circuits 20A to 20D for electric devices. Fig. 18 is an external front view showing a modification of the first to fifth embodiments, and Fig. 19 is a partial cross-sectional view showing the inner side of the modification. - In this modification, the illumination unit 19 is distributed on the three printed boards 30A to 30C, and the printed board 30A on the disc is centered on the center axis -19-200830665. The five LED chips 11 to 15 are mounted in the entire row, and the printed circuit board 30B having the central axis C as a center is mounted on the central axis C as a center, and ten LED chips 21 to 30 are mounted in a row. The printed circuit board 30C having the center axis C as a center has 15 LED chips 31 to 45 mounted in a row along the center axis C. As shown in Fig. 1, when viewed from the front side illuminated by the present embodiment, the printed substrate 30A on the disk has its center centered on the center C, and is disposed at the center of the whole. The printed substrate 30 A is referred to as a center substrate. Further, in the case of the printed circuit board 30B on the outer side of the printed circuit board 30A, the center of the printed circuit board 30B is offset from the printed circuit board 30A in the illumination direction (front side), and more specifically, the printed circuit board 30B. On the outer side, when the printed circuit board 30C is centered on the center axis C, it is arranged offset from the printed circuit board 30B in the illumination direction (front side), and thus is shifted from the front side. Therefore, it is also understood from FIG. The printed boards 30A to 30C are, for example, seats of an amphitheatre, and the printed boards 30 A are closest to the holder 36, and the apertures are arranged on the front side (the side of the transparent resin cover 32) from small to large. However, in the first to fifth embodiments described above, the shape of the LED illumination device 20 is viewed from the front, or the shapes of the LED units 4h to 415, 21 to 30, and 3 to 45 are arranged. The planar shapes of the printed boards 30, 30A to 30B are all circular, but the present invention is not limited to such a configuration, and may be, for example, a square shape or a rectangular shape. For example, for the modification of FIGS. 18 and 19, the shape from the front of the LED illumination device 20, or the planar shape of the printed substrate 30A -20-200830665, or the LED unit 4n on the printed substrate 30A~ 4, 21~3〇, 3^45 are arranged in a circular shape, and the planar shapes of the printed boards 30B and 30C, or the LED units 411 to 4i5, 2 on the printed boards 30B and 30C] The arrangement of ~3D and 31~45 can also be a square shape. In the above embodiment, one LED unit is packaged with one LED chip. However, the present invention is not limited thereto, and one LED unit may be mounted in parallel as a plurality of LED units. φ For example, in the case of the bullet-type LED unit shown in Figs. 20 and 21, if the diameter is 5 mm, it is possible to carry up to four (three in Fig. 20) LED chips of 0.7 mm X 0 · 7 mm square. . As shown in FIGS. 20 and 21, the LED unit 50 includes a first lead 52 and a second lead 54, and a wafer mounting portion formed at an end portion of the first lead 52 (for the upper end portion 21 A in FIG. 21). 56. On the wafer mounting portion 56, the cathode electrode on the lower side thereof is connected to the three LED chips 58A, 58B, and 5 8C which are connected to the upper end portion 52A by the bonding wires 59 (hereinafter, These general terms are referred to as LED wafers 58), and the second leads 54 are directed between FIG. 21, the upper end portion 54A and the anode electrodes on the upper side of the three LED chips 58A, 58B, and 5 8C. The bonding wire 5 9B and the sealing end portions 52 A and 54A of the first lead 52 and the second lead 54 , and the plurality of LED chips 58 and bonding wires 59A and 58B are sealed by a translucent resin such as epoxy resin. The resin portion 60 is configured. As shown in FIG. 20, the three LED chips 58A, 5 8B, and 5 8C are connected to the upper end portion 52A of the first lead 52 and the upper end 54A of the second lead 54 on the wafer mounting portion 56. Fig. 20, in the direction of the straight intersection of the vertical 21 · 200830665, the arrangement is linear. The wafer mounting portion 56 has a straight planar mounting surface 56A as shown by a broken line in FIG. 2, and the LED wafer side end portion of the bonding wire 59A is fixed to the mounting surface 56, and is electrically connected thereto, for example, via a conductive surface. The adhesive*, then the electrodes (cathode electrodes) on the lower side of the LED chips 58A, 58B, 58C are fixed, and the LED chips 58A, 58B, 58C are directed to the phosphors shown by the two-dot chain in Fig. 21 The dispersion resin 54 is integrally fixed to the wafer mounting portion 56, and the phosphor dispersion resin 24 is composed of an epoxy resin or a resin which disperses the phosphor for emitting the white color of the LED wafer 50. The first lead 52 and the second lead 54 are formed of a lead frame, and the lead frame is made of silver-plated iron, copper or a copper alloy, and the first lead 52 is on the cathode side, and the second lead 54 is on the cathode side. It is connected to a power source (not shown) on the anode side, and the mounting surface 56A constituting the bottom surface of the wafer mounting portion 56 is formed by a silver-plated reflecting surface, and is then connected from the LED crystal piece 58. A part of the emitted light is reflected by the mounting surface 56A, and is excited to emit light (white light) of the phosphor of the phosphor dispersion resin 54. However, in the LED unit, unlike the conventional LED unit, the cathode electrode on the lower side of the LED chip in FIG. 21 is not via the wafer mounting surface 56, but via the bonding wire 59. A is directly connected to the upper end portion 52A of the first lead 52. Therefore, the electric power can be supplied to the three LED chips 58A to 58C without shifting, and the conductivity of the first lead 52 or the conductive adhesive can be If it is sufficiently large, the bonding wire 59A is not required. In the above-described plurality of wafer-type LED chips 50, three -22-200830665 LED chips 58A, 58B, and 58C are mounted on one wafer mounting portion 56, so that the LED chip for the LED wafer 50 as the illumination device is increased. With the degree of integration, and by this, the amount of luminescence can be greatly increased. However, in the case of increasing the total amount of the LED wafer, heat generation is a problem. However, in the embodiment, for example, via a wafer sorting apparatus, it is possible to confirm that the heat generation is extremely small, such as a wafer having the same combination characteristics. Fig. 22 is a circuit diagram showing a battery device 40 with a power supply circuit for charging according to a sixth embodiment of the present invention. In the present embodiment, the battery 22 is configured to be charged by the power supply circuit 1A of the electric device according to the embodiment. After charging, the battery of the present embodiment is provided with the battery of the charging power supply circuit. The "DC OUTPUT" on the right side of 2 outputs DC power and can be used as a DC power supply. However, the output voltage at this time is the voltage of the battery 22, and the battery 40 with the charging power supply circuit of the present embodiment is also the first embodiment as described in the seventh embodiment to be described later. In the illuminating unit 19 of the fifth embodiment, since there is no problem of the rectified DC pulsation passing through the flicker of the illumination, the smoothing circuit 17 is omitted. In the power supply circuit for an electric device to which the present invention is applied, as described above, since the constant current characteristic is applied, the battery 22 can be efficiently charged, that is, the battery 22 is charged in the battery 22 even if it is in an overdischarged state. The current is not controlled by the overcurrent, and the reactance of the reactance voltage dividing circuit 14, for example, the capacity of the capacitor C2 1 is determined according to the maximum current that can be flowed in the overdischarge state, and In the embodiment, when the battery 22 is charged, since the charging current is reduced, over--23-200830665 charging can be prevented. Figure 23 is a circuit diagram of a seventh embodiment of the present invention. This embodiment can also be called a circuit φ in which the battery 40 of the sixth real-power circuit is assembled to an electric machine and is the main body of the electric machine, and is an electric machine main body that supplies DC power from the charging 40. Here, FIG. 24 is a circuit diagram showing the rectifier circuit 16 used in the above-described seventh embodiment, and each of the first embodiment to the first embodiment shown in the above description of the modification of the rectifier circuit 16 is used. There is no particular limitation on the configuration, such as a circuit or a half-wave rectification circuit. Here, the rectifiers are electrically connected to the terminals IN1 and IN2, and the DC output terminal diagram is defined in FIG. 24, and thus, the rectification ething β is shown. It can also be used as a full-wave rectification circuit or as a half-wave rectification circuit. 27 is a circuit showing a modification of the charging battery 22 of the sixth embodiment. Further, in FIGS. 28 and 29, the symbols IN+p, IN· are all corresponding to FIGS. 22 and 23. The composition is the same as that of Fig. 29. In the modification of the charging battery 22, the characteristics at the time of power supply also have a total of n mutual

例之電氣機器的要 施例之附有充電用 奪成，而符號24係 用電源電路之電池 部。 %明之第1實施例〜 又，圖25及圖26 J電路圖。 7實施例之整流電 ，亦可爲全波整流 路1 6之交流的輸 OUT +及 OUT-，呈 & 1 6係例如如圖2 5 圖26所示亦可作 施例，又，第7實 圖，針對在圖27， P，OUT + s，OUT-s 針對在後述之圖2 8 充電特性，又，供 相同之電池單元B -24- 200830665 ，此等係各自作爲電池單元B1，B2，Β3·..Βη而區別。 此等各電池單元Β係對於正極端子，係具備切換開關 S + s及切換開關S + p，對於負極端子，係具備切換開關S-s 及切換開關S-p，此等切換開關S + s，切換開關S + p，切換 ^ 開關S-s，切換開關S-p係亦可爲半導體開關，或金屬接 點之繼電器接點。 並且，由切換此等切換開關S + s，切換開關S + p，切 Φ 換開關S-s，切換開關S-p之情況，此等電池單元Β係亦 可以串聯連接而編成所有，或可以並聯連接而編成所有者 〇 首先，對於作爲特定之電源電壓時，將此等電池單元 Β之所有的切換開關S + s，以及所有的切換開關S-s，作爲 開啓，又，將所有的切換開關S + p，以及所有的切換開關 S-p，作爲關閉，如此，此等電池單元Β係如圖28所示， 所有則以串聯連接所編成，如此，對於作爲電源時，當將 ® 1個電池單元Β之電壓作爲Ε時，可從端子OUT + s， OUT-s，供給（Εχη)之電源電壓的電源。 _ 或者，對於作爲充電時，將此等電池單元Β之所有的 切換開關S + p，以及所有的切換開關S-p，作爲開啓，又 ，將所有的切換開關S + s，以及所有的切換開關S-s，作 爲關閉，如此，此等電池單元Β係如圖29所示，所有則 以並聯連接所編成，而其充電時，可從端子ΙΝ + ρ及端子 ΙΝ·ρ，進行此等電池單元Β之充電者。 然而，對於從串聯連接的編成切換爲並聯連接之編成 -25- 200830665 時，或者與此相反，對於從並聯連接的編成切換爲串聯連 接之編成時，亦一端暫時性地，將所有的電池單元B之此 等切換開關S + s，切換開關S + p，切換開關S-s，及切換開 關S-p所有作爲關閉，而如無一端暫時性地，所有作爲關 ’ 閉時，有著在電池單元B，正極及負極產生短路之虞。 然而，在圖28中，此等切換開關S + s，及切換開關 S-s係均在作圖的情況上，成爲關閉（OFF :關），但以串聯 • 連接編成而作爲電源時，作爲實際的電路動作係所有成爲 開啓（ON :開），又，在圖26中，切換開關S + p，及切換 開關S-p係均在作圖的情況上，成爲關閉（OFF :關），但 作爲充電時，作爲實際的電路動作係所有成爲開啓（ON : 開）。 如此，在圖27之變形例之中，將充電用電池22，作 爲電氣機器24等之電源而使用之情況，作爲圖2 8所示之i 串聯編成，可得到必要之電源電壓，另一方面，對於將充 ® 電用電池22，經由電氣機器用電源電路l〇A進行充電時 ’由作爲圖29所示之並聯編成之情況，對於任一之電池 -單元B，仍進行最佳之電壓控制的同時，可進行有效率的 .充電，並控制不需要之電力消耗，又，亦控制不需要的發 熱。 然而，圖31係爲表示使用於前述第〗〜第5實施例之 照明部1 9的變形例之電路圖。 針對在圖31，如LED晶片1 1〜15之方塊，LED晶片 21〜30之方塊’ LED晶片31〜45之方塊，於各方塊，設置 •26— 200830665 有耐熱性熔絲F1〜F3，隨之，因只遮斷含有短路故障之 LED晶片的方塊之耐熱性熔絲F1〜F3，故有著其他的方塊 之LED晶片係可持續進行照明之特徵。 另外，圖32係爲表示各前述之第1〜第7實施例之電 氣機器用電源電路10或10A之變形例的電路圖，又，圖 33係爲可使用於此等變形例之降壓用變壓器之一例的 電路圖。 Θ 前述之第1〜第7實施例係因具備電抗分壓電路14， 故當從商用交流電力AC 100 V之交流電力輸入側而視時， 作爲全體’成爲電抗性（電容性）之負荷，但如此等變形例 ’由具備降壓用變壓器1 1之情況，可控制電容性之表觀 電力。 然而’針對在圖3 3之變形例係亦可作爲省略突入電 流控制電路1 2。 β [產業上之利用的可能性] 如根據本專利發明，可提供可謀求發熱少，即消耗電 -力少’且小型化或成本控制或壽命延長之電氣機器用電源 ν 電路，發光二極體照明裝置及附有充電用電源電路之電池 【圖式簡單說明】 [圖1 ]係爲表示適用本專利發明之實施形態的電氣機 器用電源電路的構成方塊圖。 -27- 200830665 [圖2]係爲表示針對在本實施形態之電抗分壓電路的 分壓之電路圖。 [圖3]係表示針對在交流之相位的圖表。 [圖4]係爲本發明之第1實施例之Led照明裝置之電 路圖。 [圖5]係爲擴大表示針對在第1實施例之LED照明裝 置之LED單元的剖面圖。 Φ [圖6]係爲表示第1實施例之LED之外觀的正面圖。 [圖7]係爲表示第1實施例之LED之外觀的側面圖。 [圖8]係爲從表示第1實施例之LED之內部而視之一 部分剖面圖。 [圖9]係爲第1實施例之LED之印刷基板的內面圖。 [圖1〇]係爲表示一般的LED晶片之順方向電壓Vf-順 方向電流If的特性之圖表。 [圖Π]係爲表示一般的LED晶片之順方向電流If-發 ® 光亮度L的特性之圖表。 [圖12]係爲表示一般的LED晶片之順方向電壓Vf-發 ‘光效率的特性之圖表。 [圖13]係爲表示一般的LED晶片之順方向電壓Vf-順 方向電流I f特性之不均的圖表。 [圖14]係爲適用本專利發明之第2實施例之LED照 明裝置之電路圖。 [圖15]係爲適用本專利發明之第3實施例之LED照 明裝置之電路圖 -28- 200830665 [圖16]係爲適用本專利發明之第4實施例之LED照 明裝置之電路圖。 [圖17]係爲適用本專利發明之第5實施例之LED照 明裝置之電路圖。 [圖18]係爲表示有關第1實施例~第5實施例之變形 例的LED照明裝置之外觀正面圖。 [圖19]係爲從表示同LED照明裝置之內部側面而視 • 之一部分剖面圖。 [圖20]係爲擴大表示LED單元之變形例的平面剖面 圖。 [圖2 1 ]係爲同變形例之縱剖面圖。 [圖22]係爲適用本專利發明之第6實施例之附有充電 用電源電路之電池的電路圖。 [圖23]係爲適用本專利發明之第7實施例之電氣機器 的要部電路圖。 ® [圖24]係爲表示使用於前述第1實施例〜第7實施例 之整流電路的電路圖。 •[圖25]係爲表示該整流電路之第1變形例之電路圖。 [圖26]係爲表示該整流電路之第2變形例之電路圖。 [圖27]係爲表示前述第6實施例，或第7實施例之充 電用電池之變形例的電路圖。 [圖28]係爲表示上述變形例之串聯連接編成之電路圖 〇 [圖29]係爲表示該變形例之並聯連接編成之電路圖。 - 29- 200830665 [圖30]係爲表示使用於前述第1〜第5實施例之照明 部的第1變形例之電路圖。 [圖3 1]係爲表示使用於前述第1〜第5實施例之照明 部的第2變形例之電路圖。 [圖32]係爲表示前述第1〜第7實施例之電氣機器用 電源電路之第1變形例的電路圖。 [圖3 3]係爲可使用於此等變形例之降壓用變壓器之一 例的電路圖。 【主要元件符號說明】 3 ·接合線 10，10八，20八〜200:電氣機器用電源電路 1 2 :突入電流控制電路 1 4 :電抗分壓電路 1 6 :整流電路 1 7 :平滑電路 1 8 :定電壓特性負荷 1 9 :照明部 1 1〜15 : LED晶片 2 1〜3 0 ·· LED晶片 3 1〜45 : LED晶片 20 : LED照明裝置 2 2 :電池 F 0 :耐熱性熔絲 -30- 200830665 D1〜D4 :二極體 2A，2B :引線架 C21〜C2 9，C31 〜C34:電容 C 5 1 :電解電容 R3 1 :電阻 C :中心軸 4ll 〜15，42 卜 30，431 〜45 : LED 單兀For example, the electrical device is provided with a charge for charging, and the symbol 24 is for the battery portion of the power supply circuit. The first embodiment of the present invention is shown in FIG. 25 and FIG. The rectification power of the seventh embodiment can also be the output of the full-wave rectification circuit 16 of the AC output OUT + and OUT-, and the & 16 system can also be used as an example, as shown in Fig. 25, Fig. 26, and 7 real map, for Figure 27, P, OUT + s, OUT-s for the charging characteristics of Figure 28, which will be described later, and, for the same battery unit B -24-200830665, these are each as battery unit B1, B2, Β3·..Βη and the difference. Each of the battery units includes a changeover switch S + s and a changeover switch S + p for the positive terminal, and a changeover switch Ss and a changeover switch Sp for the negative terminal, the changeover switch S + s, and the changeover switch S + p, switch ^ switch Ss, the switch switch Sp can also be a semiconductor switch, or a metal contact relay contact. Moreover, by switching the switch S + s, switching the switch S + p, switching the switch Ss, and switching the switch Sp, the battery units can be connected in series or all of them, or can be connected in parallel. Owner 〇 First, for the specific supply voltage, all the switches S + s of these battery units, and all the switches Ss, as open, and all the switches S + p, and All of the switchers Sp are turned off. Thus, the battery cells are as shown in Fig. 28, and all of them are serially connected. Thus, when used as a power source, when the voltage of the battery cells is Ε1 When the power supply voltage of (Εχη) is supplied from the terminals OUT + s, OUT-s. _ Or, for charging, all the switches S + p of these battery units, and all the switches Sp, as open, again, all the switches S + s, and all the switches Ss As a shutdown, the battery cells are as shown in Fig. 29, and all of them are formed by parallel connection, and when charging, the battery cells can be made from the terminals ΙΝ + ρ and the terminals ΙΝ·ρ. Charger. However, when the programming from the series connection is switched to the parallel connection -25-200830665, or vice versa, when the programming from the parallel connection is switched to the series connection, one end temporarily, all the battery cells are The switch S + s of the B, the switch S + p, the switch Ss, and the switch S are all turned off, and if there is no end temporarily, all of them are turned off, there is a battery B, the positive And the negative pole produces a short circuit. However, in Fig. 28, these switches S + s and the switch Ss are both turned off (OFF: off) in the case of drawing, but when they are serially connected and connected as a power source, as an actual All the circuit actions are turned ON (ON: ON), and in Fig. 26, the switch S + p and the switch S are all turned off (OFF: OFF), but when charging As the actual circuit action system, all become ON (ON: ON). In the modification of FIG. 27, when the charging battery 22 is used as a power source of the electric device 24 or the like, it is serially formed as i shown in FIG. 28, and the necessary power supply voltage can be obtained. When the battery 22 for charging the battery is charged via the power supply circuit 10A for the electric device, the optimum voltage is applied to any of the battery cells B as shown in FIG. At the same time of control, efficient charging can be performed, and unnecessary power consumption can be controlled, and unnecessary heat generation can be controlled. However, Fig. 31 is a circuit diagram showing a modification of the illumination unit 19 used in the above-described fifth to fifth embodiments. For the block of Figure 31, such as LED chips 1 1 to 15, the blocks of LED chips 21 to 30 'LED chips 31 to 45, in each block, set • 26 — 200830665 have heat-resistant fuses F1 ~ F3, with Since the heat-resistant fuses F1 to F3 of the square of the LED chip containing the short-circuit fault are only blocked, the LED chip having the other squares is characterized in that illumination is continuously performed. In addition, FIG. 32 is a circuit diagram showing a modification of the power supply circuit 10 or 10A for electrical equipment according to the first to seventh embodiments, and FIG. 33 is a step-down transformer in which the above-described modifications can be used. A circuit diagram of one example.第 The first to seventh embodiments described above are provided with the reactance voltage dividing circuit 14, and therefore, when viewed from the AC power input side of the commercial AC power AC 100 V, the load becomes a reactive (capacitive) load. However, in such a modified example, when the transformer 11 for step-down is provided, the apparent power of the capacitance can be controlled. However, the modification of Fig. 3 can also be omitted as the omitting current control circuit 12. [ [Industrial Applicability] According to the present invention, it is possible to provide a power supply ν circuit for an electric machine that can reduce heat generation, that is, consume less electric power, and that is smaller in size, cost control, or longer in life. (Brief Description of the Drawings) [Fig. 1] is a block diagram showing a configuration of a power supply circuit for an electric device to which an embodiment of the present invention is applied. -27- 200830665 Fig. 2 is a circuit diagram showing the voltage division of the reactance voltage dividing circuit of the present embodiment. [Fig. 3] is a graph showing the phase in the alternating current. Fig. 4 is a circuit diagram of a LED lighting device according to a first embodiment of the present invention. Fig. 5 is a cross-sectional view showing an enlarged LED unit for the LED lighting device of the first embodiment. Φ [Fig. 6] is a front view showing the appearance of the LED of the first embodiment. Fig. 7 is a side view showing the appearance of the LED of the first embodiment. Fig. 8 is a partial cross-sectional view showing the inside of the LED of the first embodiment. Fig. 9 is a plan view showing a printed circuit board of the LED of the first embodiment. [Fig. 1A] is a graph showing the characteristics of the forward voltage Vf-direction current If of a general LED chip. [Fig. 2] is a graph showing the characteristics of the forward current If-transmitting ® lightness L of a general LED chip. Fig. 12 is a graph showing the characteristics of the forward voltage Vf- ray efficiency of a general LED chip. Fig. 13 is a graph showing the variation in the forward voltage Vf-forward current I f characteristics of a general LED chip. Fig. 14 is a circuit diagram of a LED lighting device to which a second embodiment of the present invention is applied. [Fig. 15] A circuit diagram of a LED lighting device to which a third embodiment of the present invention is applied. Fig. 28 is a circuit diagram of a LED lighting device to which a fourth embodiment of the present invention is applied. Fig. 17 is a circuit diagram of a LED lighting device to which a fifth embodiment of the present invention is applied. Fig. 18 is a front elevational view showing an LED lighting device according to a modification of the first to fifth embodiments. Fig. 19 is a partial cross-sectional view showing the same from the inner side surface of the LED lighting device. Fig. 20 is a plan sectional view showing an enlarged example of a modification of the LED unit. [Fig. 2 1] is a longitudinal sectional view of the same modification. Fig. 22 is a circuit diagram of a battery to which a power supply circuit for charging is applied in accordance with a sixth embodiment of the present invention. Fig. 23 is a circuit diagram of an essential part of an electric machine to which a seventh embodiment of the present invention is applied. Fig. 24 is a circuit diagram showing the rectifier circuit used in the first to seventh embodiments. [Fig. 25] is a circuit diagram showing a first modification of the rectifier circuit. Fig. 26 is a circuit diagram showing a second modification of the rectifier circuit. Fig. 27 is a circuit diagram showing a modification of the sixth embodiment or the battery for charging according to the seventh embodiment. [Fig. 28] is a circuit diagram showing a series connection of the above-described modification. Fig. 29 is a circuit diagram showing the parallel connection of the modification. [Fig. 30] Fig. 30 is a circuit diagram showing a first modification of the illumination unit used in the first to fifth embodiments. [Fig. 3] is a circuit diagram showing a second modification of the illumination unit used in the first to fifth embodiments. [Fig. 32] Fig. 32 is a circuit diagram showing a first modification of the power supply circuit for an electric device according to the first to seventh embodiments. [Fig. 3] Fig. 3 is a circuit diagram showing an example of a step-down transformer which can be used in the modifications. [Description of main component symbols] 3 · Bonding wires 10, 10, 8, 20 to 200: Power supply circuit for electrical equipment 1 2: Inrush current control circuit 1 4 : Reactance voltage dividing circuit 1 6 : Rectifier circuit 1 7 : Smoothing circuit 1 8 : Constant voltage characteristic load 1 9 : Illumination part 1 1 to 15 : LED chip 2 1 to 3 0 · · LED chip 3 1 to 45 : LED chip 20 : LED illumination device 2 2 : Battery F 0 : heat-resistant melting丝-30- 200830665 D1~D4: diode 2A, 2B: lead frame C21~C2 9, C31 ~ C34: capacitor C 5 1 : electrolytic capacitor R3 1 : resistance C: central axis 4ll ~ 15, 42 431 ~ 45 : LED single 兀

3 0，3 1 :印刷基板 3 0A〜3 0C:印刷基板 32:樹脂製罩體 34 :外殼 3 6 :燈座 36a，3 6b:電極 42 :配線 52 :第1引線 54 :第2引線 56 :晶片搭載部 58，58 A 〜58C : LED 晶片 59A，5 9B :接合線 52A，54A :上端部 -31 -3 0, 3 1 : printed circuit board 3 0A to 3 0C: printed circuit board 32: resin case 34: case 3 6 : lamp holder 36a, 3 6b: electrode 42: wiring 52: first lead 54: second lead 56 : wafer mounting portion 58, 58 A to 58C : LED chip 59A, 5 9B : bonding wire 52A, 54A: upper end portion - 31 -

Claims (1)

200830665 十、申請專利範圍 I· 一種電氣機器用電源電路，屬於由當所施加之直流 電壓上升時，消耗電流則增加，當相反地下降時，消耗電 流則減少之情況，對於具有控制所施加之直流電壓的變動 ^ 之定電壓特性之負荷而言，將從交流電源所供給之電力， 變換爲直流電而供給之電氣機器用電源電路，其特徵乃， 具有將交流進行整流而變換爲直流，供給直流電力於 上述負荷之整流電路， 和將從交流電源所施加之電壓進行降壓而供給至前述 整流電路之降壓手段者。 2. 如申請專利範圍第1項之電氣機器用電源電路，其 中，前述降壓手段乃含有串聯連接於前述整流電路之電抗 元件，由將從交流電源所施加之電壓進行分壓之事而降壓 ，又限定流動之電流的電抗分壓電路。 3. 如申請專利範圍第2項之電氣機器用電源電路，其 ® 中，具備設置於前述整流電路與前述負荷之間，爲了控制 從前述整流電路所得到之直流的電壓之脈流的平滑電路， -和設置於較前述電抗分壓電路爲上流側之交流電源側 ，，爲了控制在電源投入時產生之突入電流之突入電流控制 電路。 4. 如申請專利範圍第1項之電氣機器用電源電路，其 中，前述降壓手段乃爲變壓器。 5 .如申請專利範圍第1項至第4項之任一項之電氣機 器用電源電路’其中，前述整流電路乃爲全波整流電路。 -32 200830665 6. 如申請專利範圍第1項至第4項之任一項之電氣機 器用電源電路，其中，前述整流電路乃爲半波整流電路。 7. —種發光二極體照明裝置，其特徵乃由具有申請專 利範圍第1項至第6項之任一項之電氣機器用電源電路， ' 和作爲前述負荷而連接於此，相互作爲並聯連接之3 個以上的發光二極體晶片而成； 經由該並聯連接而控制順方向下降電壓V F之不均， • 控制在作爲前述負荷之定電壓特性之電壓不均者。 8·—種發光二極體照明裝置，其特徵乃具備作爲相互 並聯連接之複數發光二極體晶片，和前述申請專利範圍第 1項至第6項之任一項之電氣機器用電源電路之同時，前 述電氣機器用電源電路乃將來自交流電流之電流，進行降 壓且整電，以發光效率成爲峰値附近之順方向電流的大小 ，使前述發光二極體晶片發光。 9.如申請專利範圍第8項之發光二極體照明裝置，其 ® 中，前述電氣機器用電源電路乃將前述發光效率成爲峰値 之順方向電流的大小，作爲中心，以寬度爲1 〇 %之範圍內 •的順方向電流的大小，供給電力者。 ρ 1 〇 ·如申請專利範圍第8項或第9項之發光二極體照 明裝置，其中’至少具備一個由複數發光二極體晶片和並 聯連接此等發光二極體晶片之一對陰極側引線架及陽極側 引線架，和一體地密封前述發光二極體晶片及在其附近之 前述陰極側引線架及陽極側引線架之密封樹脂部而成之發 光二極體單元者。 -33- 200830665 1 1 ·如申請專利範圍第1 0項之發光二極體照明 其中，前述複數之二極體晶片係經由接合線，各自 極側電極於前述陰極側引線架、連接陽極側電極於 極側引線架者。 1 2 ·如申請專利範圍第8項乃至第1 1項之任一 光二極體照明裝置，其中，前述複數之發光二極體 爲順方向電壓-順方向電流特性呈特定範圍內地所 • 構成者。 1 3 ·如申請專利範圍第8項乃至第1 2項之任一 光二極體照明裝置，其中，將前述發光二極體晶片 1或複數個相同之密封樹脂加以密封，構成發光二 元，將其發光二極體單元，於第1基板上，呈照明 方向地加以配置，且於離開此基板之背面側的位置 前述電氣機器用電源電路。 1 4 .如申請專利範圍第1 3項之發光二極體照明 ® 其中，將前述發光二極體單元分爲共有陰極側引線 側引線之複數組群，於各組群，設置由過電流熔斷 〇 . 1 5.如申請專利範圍第8項乃至第1 4項之任一 光二極體照明裝置，其中，於前述電氣機器用電源 電源側，設置由過電流熔斷之熔絲，將作爲相互並 之複數之前述發光二極體晶片分爲複數之組群’於 ，設置由過電流熔斷之熔絲。 16.—種附有充電用電源電路之電池’其特徵 裝置， 連接陰 前述陽 項之發 晶片乃 挑選之 項之發 ，經由 極體單 在同一 ，配置 裝置， 及陽極 之熔絲 項之發 電路之 聯連接 各組群 乃由具 -34- 200830665 有申請專利範圍第1項至第6項之任一項之電氣機器用電 源電路， 和作爲前述負荷而連接於其之電池而成； 將其電池進行充電者。 ^ 17.如申請專利範圍第16項之附有充電用電源電路之 電池，其中，具備對於在供給電源時，由以相互串聯連接 而編成之情況，以必要之電源電壓進行電源供給的同時， • 對於在進行充電時，以相互並聯連接而編成，供給電源時 之特性，以及充電特性相互相同之複數電池單元和 設置於此等各電池單元，又連接於電池單元之正極端 子，在前述串聯連接編成時，對於鄰接之其他電池單元的 負極端子而言，成爲開啓之切換開關S + s，以及在前述並 聯連接編成時，對於鄰接之其他電池單元的正極端子而言 ，成爲開啓之切換開關S + P， 和設置於此等各電池單元，又連接於電池單元之負極 • 端子，在前述串聯連接編成時，對於鄰接之其他電池單元 的正極端子而言，成爲開啓之切換開關S-S，以及在前述 •並聯連接編成時，對於鄰接之其他電池單元的負極端子而 ， 言，成爲開啓之切換開關S-ρ者。 -35-200830665 X. Patent Application Area I. A power supply circuit for electrical equipment, which is caused by an increase in the current consumption when the applied DC voltage rises and a decrease in the current consumption when it is reversed, and is applied to the control. In the load of the constant voltage characteristic of the DC voltage, the electric power supplied from the AC power source is converted into a DC power supply circuit, and the electric power supply circuit is rectified and converted into DC power. The rectifier circuit in which the DC power is applied to the load and the step-down means that is supplied to the rectifier circuit by stepping down the voltage applied from the AC power source. 2. The power supply circuit for an electrical device according to claim 1, wherein the step-down means includes a reactance element connected in series to the rectifier circuit, and is divided by a voltage applied from an alternating current power source. A voltage divider circuit that compresses and limits the current flowing. 3. In the power supply circuit for an electric device according to the second aspect of the patent application, the method includes: a smoothing circuit provided between the rectifying circuit and the load, and for controlling a pulse current of a direct current voltage obtained from the rectifying circuit - and an inrush current control circuit provided for controlling the inrush current generated when the power is turned on, on the side of the alternating current power source on the upstream side of the reactance voltage dividing circuit. 4. The power supply circuit for an electrical machine according to the first aspect of the patent application, wherein the step-down means is a transformer. 5. The power supply circuit for an electric machine according to any one of claims 1 to 4 wherein the rectifying circuit is a full-wave rectifying circuit. The electric power supply circuit for an electric machine according to any one of claims 1 to 4, wherein the rectifying circuit is a half-wave rectifying circuit. 7. A light-emitting diode lighting device characterized by being provided with a power supply circuit for an electric machine according to any one of claims 1 to 6, and connected to the load as the aforementioned load, in parallel with each other It is formed by connecting three or more light-emitting diode wafers; the unevenness of the forward-down voltage VF is controlled by the parallel connection, and the voltage unevenness which is a constant voltage characteristic of the load is controlled. 8. A light-emitting diode lighting device characterized by comprising a plurality of light-emitting diode chips connected in parallel with each other, and a power supply circuit for an electric machine according to any one of the above-mentioned claims 1 to 6. At the same time, the power supply circuit for an electric device performs a step-down and power-down of a current from an alternating current, and causes the light-emitting diode to emit light in such a manner that the luminous efficiency becomes a forward current near the peak. 9. The light-emitting diode lighting device according to the eighth aspect of the invention, wherein the power supply circuit for the electric device has a width of 1 〇 as a center of the current in which the luminous efficiency is a peak direction. The current in the forward direction of the range of % is supplied to the electric power. ρ 1 〇 · The light-emitting diode lighting device of claim 8 or 9, wherein at least one of the plurality of light-emitting diode chips and one of the light-emitting diode chips are connected in parallel to the cathode side A lead frame and an anode-side lead frame, and a light-emitting diode unit in which the light-emitting diode chip and the sealing resin portion of the cathode-side lead frame and the anode-side lead frame are integrally sealed in the vicinity thereof. -33- 200830665 1 1 ·Light-emitting diode illumination according to claim 10, wherein the plurality of diode chips are connected via a bonding wire, and the respective electrode-side electrodes are connected to the cathode-side lead frame and the anode-side electrode On the pole side lead frame. The photodiode illumination device of any one of the above-mentioned items, wherein the plurality of light-emitting diodes are in a specific range in the forward voltage-forward current characteristic. . The photodiode illumination device of any one of the eighth or the second aspect of the invention, wherein the light-emitting diode wafer 1 or a plurality of the same sealing resin is sealed to form a light-emitting binary The light-emitting diode unit is disposed on the first substrate in the illumination direction, and is disposed at a position away from the back side of the substrate. 1 4 . The light-emitting diode illumination of claim 13 of the patent application, wherein the light-emitting diode unit is divided into a complex array group of common cathode-side lead-side leads, and an overcurrent is blown in each group </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; The plurality of light-emitting diode chips are divided into a plurality of groups, and a fuse that is blown by an overcurrent is provided. 16. A battery equipped with a power supply circuit for charging, characterized by a device for connecting the hair of the above-mentioned positive item to the selected item, and generating electricity through the same body, the arrangement device, and the fuse of the anode. The connection between the groups of the roads is made up of a power supply circuit for an electric machine having any one of the applications of the first to sixth items of the application of the above-mentioned patent, and a battery connected thereto as the load; Its battery is charged. [17] The battery of the charging power supply circuit of the sixteenth aspect of the invention, wherein the battery is supplied in series with each other when the power is supplied, and the power supply is performed with the necessary power supply voltage. • For charging, when connected in parallel with each other, the characteristics of the power supply and the charging characteristics are the same, and the battery cells are connected to the positive terminals of the battery cells. When the connection is made, the switch S + s that is turned on for the negative terminal of the adjacent battery cell, and the switch that is turned on for the positive terminal of the adjacent battery cell when the parallel connection is programmed S + P, and the battery cells provided therein are connected to the negative terminal of the battery unit, and when the series connection is programmed, the switching switch SS is turned on for the positive terminal of the adjacent battery unit, and In the above-mentioned • parallel connection, the negative for other adjacent battery cells Terminals, say, the switch is turned ON S-ρ person. -35-
TW096136046A 2006-09-27 2007-09-27 Electric device power supply circuit, light emitting diode illumination device, and battery having charge power supply circuit TW200830665A (en)

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