200829851 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種供烤一基板之裝置；尤其，關於一種去除光阻 ###夂基板烘烤裝置。 【先前技術】 於薄膜電晶體液晶顯示器(thin film transistor liquid ciystal disphy， TFT LCD)及彩色濾光片(c〇i〇r filter)之前段製程中，產品在黃光製程 φ &hotoprocess)所使用的光阻(photo-resist)，經過塗佈(；〇)ating；)|， 表面光阻的溶劑(solvent)含量頗高，需置入烘箱中，進行曝光前預烤 (pre-bake)的動作。預烤加熱過程中，玻璃表面會產生大量的溶劑及光 阻的有機氣體揮發物，故需對烘箱設計氣體流向系統，降低 成對製程後續影響。 —^ 目蓟的設計是由烘箱兩侧的排氣(exhaust)孔抽出，如第1圖所示。 此基板烘烤裝置1包含一容置本體η與一蓋板13。容置本體u與蓋 板13定義出一腔室(Chamber)15。容置本體11與蓋板13間有缝隙n， 用以吸入冷空氣。容置本體η之側壁有複數個排氣孔19 以 # 與冷空氣混合之揮發氣體。 排出 因腔至15上之蓋板13並無密封絕熱的設計，故蓋板η與g 15間$隙縫17將使外界的冷空氣受排氣力量所產生的負壓影^ ^ 對較高溫的光阻揮發氣體造成熱衝擊(thermal加决)，產生不理^之殘 留物，凝結於基板之特定位置，使後續製程中，基板玻璃表面g 該不理想之光阻殘留物，影響後續生產機台之運作；亦導致曝光機= 產生共同缺陷(common defect)，需停機清洗光罩，並導致機^需停& 疋期保養以預維修(pre-maintenance，PM)的比例偏高，嚴重景彡變產二 同時對晶圓製造(簡稱fab，fabrication)環境有一定程度影響。 匕 因此，為避免冷空氣因負壓吸入腔室中而造成之熱衝擊，進而使 5 200829851 響製造品質，故此業界賴一種能 室内部有機揮發氣體之技術。 光阻揮發物低落玻璃表面殘留，影 有效隔絕外界冷空氣，並能排除腔 【發明内容】 板丄係在於提供一種裝置。此裝置適用於烘烤一基 板此衣置0 3 了-谷器、一加熱裝置以及一預熱裝置哭二 本體、一蓋板以及一密封裝置。本古 … 〜、有一 至少-氣體出Π ;蓋板實質上覆蓋於“上$本體二200829851 IX. Description of the Invention: [Technical Field] The present invention relates to a device for baking a substrate; in particular, to a device for removing a photoresist ###夂 substrate baking device. [Prior Art] In the previous process of thin film transistor liquid ciystal disphy (TFT LCD) and color filter (c〇i〇r filter), the product is in the yellow light process φ &hotoprocess The photo-resist used is coated (;〇) ating;)|, the solvent of the surface resist is quite high, and it needs to be placed in an oven for pre-bake before exposure. action. During the pre-bake heating process, a large amount of solvent and resistive organic gas volatiles are generated on the surface of the glass. Therefore, it is necessary to design a gas flow to the system for the oven to reduce the subsequent influence of the paired process. —^ The design of the eyepiece is extracted from the exhaust holes on both sides of the oven, as shown in Figure 1. The substrate baking apparatus 1 includes a receiving body η and a cover plate 13. The housing body u and the cover plate 13 define a chamber 15. There is a gap n between the receiving body 11 and the cover plate 13 for sucking in cold air. The side wall of the accommodating body η has a plurality of vent holes 19 and a volatile gas mixed with cold air. The cover plate 13 from the cavity to the 15 is not sealed and insulated, so the gap 17 between the cover η and g 15 will cause the outside cold air to be negatively affected by the exhaust force. The photoresist volatile gas causes thermal shock (thermal addition), which causes the residue to be ignited and condenses at a specific position on the substrate, so that the substrate glass surface g is undesired in the subsequent process, which affects the subsequent production machine. The operation of the station; also caused the exposure machine = common defect, the need to stop cleaning the reticle, and cause the machine to stop & the maintenance period with pre-maintenance (PM) is high, serious The change of production in Jingjing has a certain degree of influence on the fab (fabrication) environment.匕 Therefore, in order to avoid the thermal shock caused by the cold air being sucked into the chamber due to the negative pressure, and thus the manufacturing quality of 5 200829851, the industry relies on a technology capable of indoor organic volatile gases. The photoresist volatiles are low on the surface of the glass, and the film effectively isolates the outside cold air and can eliminate the cavity. [Summary] The slab system is to provide a device. The device is suitable for baking a substrate. The garment is provided with a bowl, a heating device and a preheating device for crying the body, a cover and a sealing device. Bengu ... ~, there is at least - gas out of the sputum; the cover is essentially covered by "on $ body two
體魅韻。加絲置係用以Ϊ 封ί置可隔料界冷缝，並賴適當缝路徑，以 ‘:、ΐ乱:ΐϊ=ϊϊ想揮發氣體’不但能避免熱衝擊而影響 衣以口口貝，更旎有效去除有機殘留物。 心ίΐΐΐ式及隨後描述之實施方式後，本發明所屬技術領域具有 #可輕棘解本發曰月之基本精神及其他發明目的，以及本 叙明所採用之技術手段與較佳實施態樣。 【實施方式】 本發明之一較佳實施例如第2圖所示，其係揭露一種適用於烘烤 反之裝置，第2圖係為此實施例之示意圖。絲具有一表面，且 基板^含（但不限於）一彩色濾光片㈣〇r他㈤或至少一晶圓。基板 上通常塗佈有光_，絲_可含具有溶纖权#釋劑。 、、此裝置2包含了一容器21、一加熱裝置23、一預熱裝置25以及 一過濾、裝置27。其巾，勒反20設置於容器21中。 友士容器21具有一本體2n、一蓋板213、一密封裝置215、一第一 氣流導引裝置22S以及-第二氣流導引裝置227，於此實施例中，容 6 200829851 二21之形狀係為一矩形容置空間。本體211具有—開口 π、$個氣 體入口 219、5個氣體出口 221以及二侧壁223 ;開口 217之位置、數 目及形狀均不設限。本實施例中，開口 217係為矩形，恰盘矩晉 配，且斯217錄矩形容置郎之上方'。容器21 係^^二侧壁223 ’鱗氣體入口 219與該等氣體出口 221 d 壁223上’此二側壁223可為相對或相鄰，於此 貝_中’此二侧壁223係為二相對側壁；又，氣體入口和氣 相^數及形狀不限，且氣體入口 219與氣體出口 221之個數亦 223 引裝置225及一第二氣流導引裝置227分設於兩側壁 I門弟一氣流導引裝置225具有一進氣口（圖未示）盘多個 =Γ/ )，第二氣流導引裝置227具有—廢氣排出口 228盘多 個小開口。弟一氣流導引裝置225之進氣口與預埶裝置 一孔々丨引衣置227之多個小開口與氣體出口 221相 屮 ==第rr之纖氣，二 出疋故，弟一氣kV引衣置225之小開口個數同於氣許 氣流導引裝置227之小開口個數同於氣體出口功之個 數，係為％^土之選擇。第-氣流導引裝置22s與第二氣流 之形狀不限，於此實施例中，兩者皆輕心矩形體。、衣置 署_tt213實質上覆蓋於開口217上，與本體211共同界定出-容 ^ ^«211 么山封衣置215可為一封膠，使本體211與蓋 ^口 2Π出現實質之縫隙。可予理解的是:口與: 式不而限制，僅f能覆蓋住開口，且二 ^二個’各刻、練縣置郎域Body charm. The wire is used to seal the cold seam of the material barrier, and the appropriate seam path is used to ':, chaos: ΐϊ = 挥发 挥发 挥发 挥发 ' ' ' 不 不 不 不 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' , , , , , , , , , More effective in removing organic residues. The present invention has the basic spirit and other objects of the present invention, as well as the technical means and preferred embodiments of the present invention. [Embodiment] A preferred embodiment of the present invention is shown in Fig. 2, which discloses a device suitable for baking and vice versa, and Fig. 2 is a schematic view of this embodiment. The wire has a surface, and the substrate includes, but is not limited to, a color filter (four) 他r (f) or at least one wafer. The substrate is usually coated with light _, and the silk _ may contain a solvent release agent. The device 2 comprises a container 21, a heating device 23, a preheating device 25, and a filter, device 27. The towel, the reverse 20 is disposed in the container 21. The friend container 21 has a body 2n, a cover plate 213, a sealing device 215, a first airflow guiding device 22S and a second airflow guiding device 227. In this embodiment, the shape of the volume 6 200829851 It is a rectangular housing space. The body 211 has an opening π, a gas inlet 219, five gas outlets 221, and two side walls 223; the position, number and shape of the opening 217 are not limited. In this embodiment, the opening 217 is rectangular, just the right moment, and the 217 is rectangular. The container 21 is provided with two side walls 223 'scale gas inlets 219 and the gas outlets 221 d of the wall 223 'the two side walls 223 may be opposite or adjacent, and the two side walls 223 are two The opposite side wall; in addition, the gas inlet and the gas phase and the shape are not limited, and the number of the gas inlet 219 and the gas outlet 221 is also 223, and the second airflow guiding device 227 is disposed on the two side walls. The guiding device 225 has an air inlet (not shown) disk plurality = Γ / ), and the second air flow guiding device 227 has a plurality of small openings for the exhaust gas discharge port 228. The air inlet of the airflow guiding device 225 and the small opening of the hole guiding device 227 of the airflow guiding device 225 are opposite to the gas outlet 221 == the rr of the rr, the second out, the younger one kV The number of small openings of the clothes-holding device 225 is the same as the number of small openings of the air-flowing air guiding device 227, which is the same as the number of gas outlets. The shape of the first air flow guiding device 22s and the second air flow are not limited, and in this embodiment, both are light-hearted rectangular bodies. The clothing department _tt213 substantially covers the opening 217, and defines a body- 211 with the body 211. The 215 can be a glue, so that the body 211 and the cover 2 have a substantial gap. . It can be understood that: mouth and: the formula is not limited, only f can cover the opening, and two ^ two 'each moment, Lianxian Langlang
盍上並以㈣裝_懷，即絲上_〇「日應盍板 加熱裝置23設於容置空間229外，更詳細而言，係位^容哭I 7 200829851 之本體211之下方，透過本體211之受埶部价 體211為受熱部分），對該容置空間229 ^之基板20淮貝一^係以本 光阻劑中的稀釋劑揮發，進而使光阻劑硬化於基=此 23可為習知之熱軋板或為其他可產生熱之装置土扳20上此加熱裝置 开杜iff所稱之預熱裝置％ ’可為一獨立元件，抑或是一與本案現有 、、、σ δ之7G件’其主要目的是接收加熱裝置 之孰源、 將容置空間中的氣流提升溫度之用。依圖 流導官255。預熱裝置25之循環氣體人口25 n 循$軋體出口 253分別位於氣流導管255之二 ^ 與第-氣流導引裝置225連通，外界氣體自循产Ί 253 流導管255，透過加熱裝置23之^體流入氣 氣由循環碰如253，轉—氣流ΐΐ ί It 該 而排出容ίί過;;置227之廢氣排出口⑽ 俜用以辦，隹二置 預熱裝置25之循環氣體入口 251處， =以過濾進入谷置空間229之循環熱 事 質進入容置空間229而污染製造之環境。郷乱體之财’避免雜 確立與本體211之相接處密封時，便能 中將有負壓形成，因此^發置空間229 ，,i,^£23 置27，即可使排置/間229 ;若再配合猶裝 環熱氣，無需另外耗能吸^經加熱裝置23加溫之循 衝擊，有效降低容p門尹，亦不會使容置空間229内產生熱 產生共同缺陷、減少理想揮發物之濃度、避免曝光機台 外機檢修鮮’麵提升基板生產品質及速度。 8 200829851 、第一氣流導引裝置與第二氣流導引裝置之形狀並不以上述實例 為限，相同地，雜裝置之氣流導管形狀亦不應受限。舉例而古，、 氣流導引裝置3卜第二氣流導引裝置％與氣流導管紳，可 設計成如第3圖所示之形態。更甚者，第一氣流導 法 要，若直接將預熱裝置之循環氣:二 氣流導引裝置之導引’亦為可以選擇之設計方式。 ‘由弟- ^發:肚述實施例之元件及其態樣僅為例示說明之用， 内imf狀實施村，w可使財發明之裝置，喊少容置办門 ^同之戦設胁本體^卜_， 其中造成之熱衝擊，並增加排出揮發物 ’卜j冷玉乳進入 例舉本發明之實施態樣，以及闡釋本=明2 =之$施例翻來 本發明之範>#。任何熟悉此技術特徵^ ^二二，來限制 安排均屬树賴錄m ^ 錢均等性之 為準。 &月之榷利犯圍應以申請專利範圍 【圖式簡單說明】On the 盍 并 以 ( ( 即 即 即 即 即 即 即 即 即 即 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 229 229 229 The receiving portion 211 of the body 211 is a heated portion), and the substrate 20 of the receiving space 229 ^ is volatilized by a diluent in the photoresist, thereby hardening the photoresist to the base = 23 can be a conventional hot-rolled plate or for other devices that can generate heat. The heating device can be used as a separate component, or one with the present case, σ The main purpose of the 7G piece of δ is to receive the source of the heating device and raise the temperature of the airflow in the accommodating space. According to the flow guide 255. The circulating gas population of the preheating device 25 is 25 n. 253 is located in the air flow conduit 255 and communicates with the first air flow guiding device 225, the external gas self-circulates the 253 flow conduit 255, and the air flowing through the heating device 23 is circulated as 253, and the air flow ΐΐ ί It should be discharged ίί;; 227 exhaust gas discharge (10) 俜 for office, 隹 two At the circulating gas inlet 251 of the preheating device 25, the circulating thermal matter entering the arranging space 229 is filtered into the accommodating space 229 to pollute the manufacturing environment. The turbulent body is saved to avoid the connection with the body 211. When it is sealed, a negative pressure will be formed in the middle. Therefore, the space 229, i, ^23 can be set to 27, so that the arrangement/interval 229 can be made. If the heat is still installed, no additional energy is needed. The heating device 23 heats up the impact, effectively reduces the capacitance of the door, and does not cause the heat generated in the accommodating space 229 to produce common defects, reduce the concentration of the ideal volatiles, and avoid the inspection of the external machine of the exposure machine. The surface quality and speed of the substrate are improved. 8 200829851 The shape of the first airflow guiding device and the second airflow guiding device are not limited to the above examples, and the shape of the airflow conduit of the hybrid device should not be limited. However, the airflow guiding device 3, the second airflow guiding device%, and the airflow conduit 绅 can be designed in the form shown in Fig. 3. Moreover, the first airflow guiding method is required, if the preheating device is directly Circulating gas: two airflow guiding devices The quoted 'is also a design method that can be chosen. 'By the brother - ^ hair: the components of the embodiment and its aspects are for illustrative purposes only, the imf-like implementation of the village, w can make the invention of the invention, shout less容 办 办 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The example turns to the van of the present invention. Anyone familiar with this technical feature ^^22, to limit the arrangement is subject to the m ^ money equality of the tree. & Patent scope [schematic description]
第1圖係為習知絲烘烤裝置之示· 第2圖係為本發明之一會条 ^回， 箆3 FI孫盔士政 、例之立體示意圖；及 係為本發明之其他實施態樣之立體示意圖 【主要元件符號說明】 I :基板烘烤裝置 II :容置本體 13 :蓋板 15 ··腔室 17 :縫隙 19 ··複數個排氣孔 2:裝置 20 ··基板 21 ··容器 211 :本體 9 200829851 212 :受熱部份 213 :蓋板 215 :密封裝置 217 :開口 219 :氣體入口 221 :氣體出口 223 :側壁 225 :第一氣流導引裝置 227 :第二氣流導引裝置 228 :廢氣排出口 229 :容置空間 23 :加熱裝置 25 :預熱裝置 251 :循環氣體入口 253 :循環氣體出口 255 :氣流導管 27 :過濾裝置 31 :第一氣流導引裝置 33 :第二氣流導引裝置 35 :氣流導管1 is a schematic view of a conventional wire baking device. FIG. 2 is a schematic view of one of the present inventions, 箆3 FI Sun Helmets, and a schematic view of another embodiment of the present invention. Stereoscopic diagram [Description of main components] I: Substrate baking device II: accommodating body 13: cover plate 15 · chamber 17: slit 19 · Multiple vents 2: device 20 · · substrate 21 · · Container 211 : Body 9 200829851 212 : Heated portion 213 : Cover plate 215 : Sealing device 217 : Opening 219 : Gas inlet 221 : Gas outlet 223 : Side wall 225 : First air flow guiding device 227 : Second air flow guiding device 228: exhaust gas discharge port 229: accommodation space 23: heating device 25: preheating device 251: circulating gas inlet 253: circulating gas outlet 255: air flow conduit 27: filtering device 31: first airflow guiding device 33: second airflow Guide device 35: air flow conduit