200829799 九、發明說明： 【發明所屬之技術領域】 本發明係有關於-種固^裝置，更詳言之，係關於— 斧用X私放熱模組固定於發熱元件頂面之固定裝置。 【先前技術】 用以執行電腦之運算及主要控制功能的中央處理器 ，Central Pr〇cessor Unit)係爲電腦中樞部分， 地並= : = 同時隨著CPU集成度不斷提高’相應 =熱塊體（heats⑷以有效逸散咖運作時所產之熱置 =1圖所示，在如中央處理器（⑽（未圖示）的頂 面有—散熱模組10，兩側則分別設有一固定模细、 ^且、^㈣定模組1係供承载該散熱模幻G，該散妖 二Γ:二散熱塊體m、以及連接於該散熱塊趙⑻、 •該固定模組 ::-端則樞接有一彈性條12’該彈性條12之中 _扣環12。===:扣環12◦，籍 所具之彎折部份抵壓於該散熱模：;::==2 將该散熱模組10固定於該中央處理器上。 然’上述固定機構卻有如下缺失：令人 塊體11相扣合時，會致使今 《 /、口己 ^㈣條12所具f折部分之一 110042 5 200829799 角先接觸該底板103,而對散熱模組1〇產生—轉矩，散 熱杈組ίο在該力矩作用下發生瞬時傾斜 扣合塊體11相扣合後，麻技lnQ 门— ^ &板10 3與固疋模組1之纤人妝 態取決於彈性條12蠻;f/f都八a / …口 均勻合導致底板…盘 ，若彎折部分變形不 勺勺θ ^支底板103與固定模組i結合 與CPU間形成有空隙， ^ ^ 而〜音CPU所產生的熱量的傳導， 故會產生CPU因散埶不_而>、+，宏^ # 戚…、不良而热法運作甚至出現損壞之情 事。 口此士何提供-種能達成與如中央處理器之發熱元 件接觸良好，以將發埶亓杜 …、 熱兀件於運作時所產生之熱量傳導出 之散熱模組固定技術，實已成爲—亟待解決之問題。 【發明内容】 妓一鑒於上述習知技術之問題，本發明之主要目的在於提 h *種可i、具底板之散熱模組與發熱元件充分接觸之固 定裝置，以有效散逸發熱元件之熱能。 ，（★纟發明之另—目的在於提供—種固定裝置，以於散熱 杈組之固定過程中採用垂直向下壓緊之面接觸方式，藉以 避免务生散熱模組和發熱元件傾斜問題，並得使散熱模組 牙七熱元件之間的壓力更均勻，有利於固定和散熱。 ^ 务月之另目的在於提供一種固定裝置，得以提供 放熱模組之安裝與拆卸便捷性。 6壯為達上述主要目的及其他目的，本發明係提供一種固 2衣置，用以將具底板之散熱模組固定於設有發熱元件之 ^板上以使该散熱模組底板接觸該發熱元件之頂面， 110042 6 200829799 •該固疋裝置包括··組設於電路板上之套管·，接置於該套管 上之彈性構件，接置於該彈性構件上之壓板；接置於該壓 板上之轉動把手，該轉動把手可連動該壓板進行轉動，以 將該壓板轉動至該散熱模組之底板上方並向下壓迫該底 板而爿今"亥政熱模組固疋於發熱元件上；以及穿設通過該 轉動把手、壓板、彈性構件以將其相對樞接於該套管上之 插銷。 該套管外緣係設有第-扣件（如凸塊），同時對應該散 六、、极組之底板亦設有相對之第二扣件（如凹槽），以供該凸 塊嵌入該凹槽而限制該散熱模組之底板之水平位移及轉 動。 $ 該壓片之一端設有—開孔以供插銷穿設其中，且於兮 ?孔邊緣復凹設有第一凹槽(如扇形凹槽)及第 ； 日守於該壓片上對應其開孔周圍設有複㈣—卡件门 孔）。 卜 該轉動把手之-端亦設有一開孔以供插銷穿設並 中，且於該開孔邊緣復凹設有第三凹槽（ 後 四凹槽，該第三凹槽之長度較第一凹槽„ 轉動把手上於其開孔周圍復設有對應第一：件二同：亥 件（如斜滑塊），以供該轉動把手之第二 弟—卡 與墨片之第-卡件（如卡孔）相互卡合後（=滑塊） 之轉動同時帶動該壓片之轉動。 曰-轉動把手 該插銷上設有第一止擋塊及第二止浐 止擋塊之高度較該第二止擋 ：:二中該第- 厪為呵，垓第—止擋塊 110042 7 200829799 子C谷口又及私動於該壓 該轉動把手之第二 〈弟則“扇形凹槽)及 穿過該轉動把手之第四凹样而：）中亥弟-“塊係可供 於進行散熱模組之固定作 一凹乜 片所具有之第-卡件（卡^Γ 塊）係卡入㈣ 手一… 7件(卡孔)中，以帶動該壓片隨該轉動把 同方疋轉，而使該壓片相對μ 模组底柘卜古古石# 對6又有開孔之另一端置於散熱 片之第—月一，u插銷第一止擋塊於該轉動把手及壓 . U槽（扇形凹槽）内滑動絲住該壓片之 弟一凹槽（扇形凹槽）之一立山、真 轉動把手轉動而停止。…’而“亥壓片無法繼續隨 而，於該轉動把手之第三凹槽（扇形凹槽）長度係大 1片弟：凹槽(扇形凹槽)長度，因此可繼續轉動該轉動 巴，此時因該塵片已無法繼續轉動，因而可使該第二卡 件(斜滑塊)自該壓片之第一卡件(卡孔)中脫出，從而向下 推壓該壓片，而令壓片下方之彈性構件（如彈簀 > 壓縮，以 使設於該插銷表面較下方之第二止擋塊卡人該壓片之第 二凹槽中，如此即可使該壓片定位且下壓該散熱模組之底 板:同時配合該套管上所預設之第一扣件（凸塊）契合該散 熱杈組底板下表面之第二扣件（凹槽）以夾持該底板。因此 即可使散熱模組透過其底板固定於發熱元件（如cpu) 上，k而使该散熱模組固定於電路板上。 同樣地，當需拆卸散熱模組時，僅須反轉該轉動把 手，使該第二卡件（斜滑塊）卡入該壓片之第一卡件（卡孔） 8 110042 200829799 中’此時由於該彈性構件（ + AM、 〔弹尹、）先别受該轉動把手之第- 卡件（斜滑塊）之壓迫解除 于之弟一 片，使哕屄片夕筮 彳猎由口仅力向上頂該壓 本入1土片凹槽脫離與該插銷釘之第二浐止地之 卡&關係，該轉動把手即可帶 w " 之笫μ Mm 動该壓片轉動直至當該插銷 之弟一止私塊於該轉動把手及麗片之第一及第三 形凹槽）内滑動至抵住 S羽 一踹、真绦^ ^土片之弟一凹槽（扇形凹槽）之另 上移開以供拆卸散熱模2 MO自㈣熱模組底板 模組：= 過Λ發：前述之固定裝置即可便捷地將散熱 衣”卩於發熱兀件上，同時由於本發明係利用壓 以垂直向下壓緊之面接觸方式將散熱模組固定於發熱 7C件上’而得使散熱模組與發熱元件充分接觸，同時提供 散熱漁和發熱元件間更均勾之接觸壓力，強化散熱模組 之固疋和散熱效能’避免習知技術中利用彈性條彎折部分 固定散熱模組時’因彎折部分變形不均句所導致模熱模組 底板與固定模組結合不緊密，甚或傾斜問題，進而導致與 發熱兀件間形成有空隙，而影響發熱元件所產生之敎量的 傳導。 【實施方式】 以下係藉由特定的具體實施例說明本發明之實施方 式，請配合圖式說明本發明之具體實施例，以使所屬技術 中具有通常知識者可輕易地瞭解本發明之技術特徵與達 成功效。 請芬閱第2圖，係為顯示本發明之固定裝置3爆炸分 9 110042 200829799 解示意圖，該固定裝置3係用w於目产』u 了用以將具底板之散熱模組20 固定於設有發熱元件（未圖示）+ 丁）之包路板25上，以使該散 熱模組2 0底板2 0 3接觸該路為-μ 安蜩4兔熱兀件之頂面，其包括有： 組設於電路板25上之套管Ή •拉恶士人斗士 > * s W，接置於該套管31上之彈 性構件3 2，接置於該彈性構杜q 9 I Α π 、 坪I王稱件32上之壓板33;接置於該 壓板33上之轉動把手34，該轉動把手34可連動該壓板 33進行轉動’以將該壓板33轉動至該散熱模組2〇之底 板203上方並向下壓迫該底板2〇3，而將該散熱模組2〇 固定於發熱元件上；以及穿設通過該轉動把手％、壓板 33、彈性構件32以將其相㈣接於該套f 31上之 35 〇 該散熱模組20至少包括有一散熱塊體2〇1、及用以 接置該散熱塊體201且供接觸於發熱元件頂面之底板 2〇3。該發熱元件可例如為cpu，可設於—例如為主機板 之電路板25上，該底板203可例如為一具有高導熱性之 金屬板，以迅速地將發熱元件之熱能傳導至該散熱塊體 2〇1 ’再散逸到空氣中。 復請配合參閱第3圖，該固定裝置之套管31外緣係 設有如凸塊之第一扣件311，同時對應該散熱模組別之1" 底板203下表面亦設有相對之如凹槽的第二扣件，以供該 凸塊嵌入該凹槽而限制該散熱模組之底板之水平位移及 轉動。 該壓片33之一端設有一開孔330以供插銷35穿設其 中’且於該開孔330邊緣復凹設有如扇形凹槽之第一凹槽 110042 10 200829799 .331及如矩形凹槽之第二凹槽332，同時衿該壓片μ 應其開孔330周圍設有複數如卡孔之第一卡件3犯。、 該轉動把手34之一端亦設有—開孔％ 穿設其中，且於該開孔34〇邊緣復凹設有如扇形二 ，凹槽343及如矩形凹槽之第四凹#3“，該第三 启 形凹槽）343之長度較第一凹槽（扇形凹槽）331長度為羽 :’= 轉動把手34上於其開孔34〇周圍復 二一卡件（卡孔）333之如斜滑塊的第二卡件345，以“ ' :動把手34之第二卡件(斜滑塊)345與壓片之第一卡： (卡孔）如相互卡合後，藉自該轉動 帶動該壓片33之轉動。 之〜動叫 塊35ΓΪΓ5表面係凸設有第—止擔塊如及第二止撞 之n 351之高度較該第二正擋塊352 ^ ―止擒塊351係可對應容設及移動㈣ / 二』弟一凹槽(扇形凹槽)331及該轉動把手34之第 轉動把手34之擒塊352係可供穿過該 槽332。 四凹枱344而嵌設於該壓片33之第二凹 動該41 ’㈣行散_組之固定作業時’係轉 件（斜1挣^4 34，此時，該轉動把手34所具有之第二卡 孔)3二1係!*入該壓片33所具有之第—卡件（卡 而僅 U $動该壓片33隨該轉動把手34 一同旋轉， 33相對設有開孔33〇之另一端置 = 底板203上方，直至該插銷％第―止擔塊動 110042 11 200829799 把手34及壓片33之第一及第三凹枰 w〜I扇形凹槽）q q】q200829799 IX. Description of the Invention: [Technical Field] The present invention relates to a type of fixing device, and more particularly to a fixing device for fixing an X-axis private heat releasing module to a top surface of a heating element. [Prior Art] The central processor for performing computer calculation and main control functions, the Central Pr〇cessor Unit) is the central part of the computer, and the ground = = = at the same time, as the CPU integration continues to increase 'corresponding = hot block (heats(4) is shown in the heat setting diagram of the effective escape coffee operation. On the top surface of the central processing unit ((10) (not shown), there is a heat dissipation module 10, and a fixed mold is respectively arranged on both sides. Thin, ^ and ^ (4) fixed module 1 is used to carry the heat dissipation phantom G, the fascinating two: two heat sink block m, and connected to the heat sink block Zhao (8), • the fixed module:: - end Then, an elastic strip 12' is attached to the elastic strip 12, and the buckle 12 is replaced by a buckle 12, and the bent portion is pressed against the heat dissipation mold: :::==2 The heat dissipating module 10 is fixed on the central processing unit. However, the above-mentioned fixing mechanism has the following defects: when the block body 11 is engaged, it will cause the f-part of the "12" One of the 110042 5 200829799 angles first contact the bottom plate 103, and generates a torque to the heat dissipation module 1 转矩, the heat dissipation group ίο an instant under the action of the moment After the slanting and splicing block body 11 is engaged, the AIQ door of the numb- ing _Q-- and the stencil of the solid-state module 1 depends on the elastic strip 12; the f/f is eight a / ... If the bending part is deformed without scooping, the bottom plate 103 and the fixed module i are combined with the CPU to form a gap between the CPU and the ^ ^ and the heat generated by the CPU is generated, so that the CPU is generated.散埶不_和>,+,宏^# 戚..., bad and thermal operation and even damage. The mouth can provide a good contact with the heating element such as the central processor.散热杜... The heat-dissipation module fixing technology that is generated by the heat generated during the operation of the heat-sinking component has become a problem to be solved. [Invention] In view of the above-mentioned problems of the prior art, the present invention The main purpose is to provide a fixture that can fully contact the heat-dissipating component of the heat-dissipating module with the bottom plate to effectively dissipate the heat energy of the heat-generating component. (★ Another aspect of the invention is to provide a fixing device to Vertical down during the fixing process of the heat sink Close contact with the surface to avoid the problem of tilting the heat dissipation module and the heating element, and to make the pressure between the seven heat elements of the heat dissipation module more uniform, which is conducive to fixing and heat dissipation. The utility model relates to a fixing device, which can provide the convenience of installation and disassembly of the heat releasing module. 6 The main purpose and other objects of the present invention are to provide a solid clothing device for fixing the heat dissipation module with the bottom plate. The heat generating component is mounted on the board such that the heat sink module bottom plate contacts the top surface of the heat generating component, 110042 6 200829799 • the fixing device includes a sleeve disposed on the circuit board, and is placed on the sleeve An elastic member, a pressing plate attached to the elastic member; a rotating handle attached to the pressing plate, the rotating handle being rotatable to rotate the pressing plate to rotate the pressing plate above the bottom plate of the heat dissipation module and downward The bottom plate is pressed and the current thermal module is fixed to the heating element; and the pin through which the rotating handle, the pressing plate and the elastic member are pivotally connected to the sleeve is disposed. The outer edge of the sleeve is provided with a first fastening member (such as a bump), and at the same time, the bottom plate of the pole group is also provided with an opposite second fastening member (such as a groove) for the convex portion to be embedded. The recess limits the horizontal displacement and rotation of the bottom plate of the heat dissipation module. One end of the pressing piece is provided with an opening for the insertion of the pin, and a first groove (such as a fan-shaped groove) is formed on the edge of the hole, and the first surface is fixed on the pressing piece. There are complex (four)-card door holes around the hole. The end of the rotating handle is also provided with an opening for the pin to pass through, and a third groove is formed on the edge of the opening (the rear four groove, the third groove is longer than the first Groove „ The rotating handle is provided with a corresponding first part around its opening: a piece of the same piece: a piece of the piece (such as a diagonal block) for the second brother of the rotating handle—the first piece of the card and the ink piece (such as the card hole) after the mutual engagement (= slider) rotation simultaneously drives the rotation of the tablet. 曰-rotating the handle, the height of the first stop block and the second stop stop block is The second stop: the second middle of the first - 厪 呵 垓 垓 垓 止 止 止 止 止 止 止 止 止 止 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 The fourth concave sample of the rotating handle is:) Zhong Haidi - "The block is suitable for fixing the heat dissipation module, and the first card member (card) of the concave plate is engaged (4) One hand (7 holes), in order to drive the tablet to rotate with the same side, so that the tablet is opposite to the μ module bottom 柘古古石# to 6 has a hole One end is placed on the first part of the heat sink, and the first stop block of the u-pin slides in the rotating handle and the pressing groove. The U-groove (fan-shaped groove) slides the groove of the pressing piece (the fan-shaped groove). A vertical mountain, really turning the handle to stop and stop .... 'And the "sea piece can not continue, the length of the third groove (sector groove) of the rotating handle is a large brother: groove (fan groove) The length, so that the rotation bar can continue to be rotated, and the second card member (oblique slider) can be released from the first card member (the card hole) of the tablet because the dust sheet can no longer rotate. Therefore, the pressing piece is pushed downward, and the elastic member (such as the magazine) under the pressing piece is compressed, so that the second stopper disposed below the surface of the pin is inserted into the second concave portion of the pressing piece. In the slot, the pressing piece is positioned and the bottom plate of the heat dissipation module is pressed down: at the same time, the first fastening member (bump) preset on the sleeve is matched with the second surface of the lower surface of the heat dissipation group a fastener (groove) for holding the bottom plate, so that the heat dissipation module can be fixed to the heat generating component (such as cpu) through the bottom plate thereof And k, the heat dissipation module is fixed on the circuit board. Similarly, when the heat dissipation module needs to be disassembled, the rotation handle only needs to be reversed, so that the second card member (oblique slider) is stuck into the tablet. The first card (card hole) 8 110042 200829799 "At this time, because the elastic member (+ AM, [Yin Yin,) is not subject to the pressure of the first handle of the rotating handle (the oblique slider) One piece, so that the 哕屄 筮彳 筮彳 筮彳 由 由 由 由 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅 仅; Mμ Mm, the tablet is rotated until the latch of the latch is in the first and third recesses of the rotating handle and the slab, and is slid to the S feather, true 绦^ ^The brother of the soil piece is removed from the groove (fan-shaped groove) for disassembly of the heat-dissipating mold 2 MO from the (four) thermal module bottom plate module: = over-burst: the aforementioned fixing device can conveniently heat the heat sink "On the heat-generating element, and at the same time, because the invention uses the surface contact method of pressing down vertically to fix the heat-dissipating module to On the hot 7C piece, the heat-dissipating module and the heating element are fully contacted, and the contact pressure between the heat-dissipating fishing and heating elements is provided, and the fixing and heat-dissipating efficiency of the heat-dissipating module are enhanced to avoid the use of elasticity in the conventional technology. When the bending part is fixed to the heat dissipation module, the bottom plate of the mold module and the fixed module are not tightly combined or even tilted due to the uneven deformation of the bending portion, thereby causing a gap between the heat generating element and the influence. The conduction of the amount of heat generated by the heating element. The embodiments of the present invention are described in the following by way of specific embodiments. The specific embodiments of the present invention are described in conjunction with the drawings, so that those skilled in the art can easily understand the technical features of the present invention. And achieve the effect. Please refer to FIG. 2 for a schematic diagram showing the explosion of the fixing device 3 of the present invention, which is 9 110042 200829799. The fixing device 3 is used to fix the heat dissipation module 20 with the bottom plate. There is a heating element (not shown) + D) on the road board 25, so that the heat sink module 20 bottom plate 203 contacts the road to be the top surface of the -μ ampere 4 rabbit enthalpy, which includes : a casing set on the circuit board 25 • Pulling a warrior's fighter> * s W, an elastic member 3 2 attached to the sleeve 31, and being placed in the elastic structure du q 9 I Α π a pressing plate 33 on the slab I; the rotating handle 34 attached to the pressing plate 33, the rotating handle 34 can be coupled to the pressing plate 33 for rotation to rotate the pressing plate 33 to the heat dissipation module 2 The bottom plate 203 presses the bottom plate 2〇3 downwardly and fixes the heat dissipation module 2〇 to the heat generating component; and passes through the rotating handle%, the pressing plate 33, and the elastic member 32 to connect the phase (4) thereof The heat dissipation module 20 includes at least one heat dissipation block body 〇1, and is connected to the heat dissipation block body 201 for contact with heat generation. A top surface of the bottom plate member 2〇3. The heat generating component can be, for example, a cpu, and can be disposed on, for example, a circuit board 25 of a motherboard. The bottom plate 203 can be, for example, a metal plate having high thermal conductivity to rapidly transfer thermal energy of the heat generating component to the heat sink block. Body 2〇1 'dissipates into the air. Referring to FIG. 3, the outer edge of the sleeve 31 of the fixing device is provided with a first fastening member 311 such as a bump, and the corresponding heat dissipation module is also 1" the lower surface of the bottom plate 203 is also provided with a concave surface. a second fastener of the slot for the bump to be embedded in the recess to limit horizontal displacement and rotation of the bottom plate of the heat dissipation module. One end of the pressing piece 33 is provided with an opening 330 for the insertion of the pin 35 therein, and a first groove 110042 10 200829799 .331 such as a sector groove is recessed at the edge of the opening 330 and the The two recesses 332, at the same time, the pressing piece μ is provided with a plurality of first card members 3 such as card holes around the opening 330. One end of the rotating handle 34 is also provided with an opening % penetrating therein, and a concave shape such as a fan shape, a groove 343 and a fourth recess #3" such as a rectangular groove are formed in the edge of the opening 34. The length of the third opening groove 343 is longer than the length of the first groove (sector groove) 331: '= the rotating handle 34 is affixed to the opening 34 〇 around the opening 34 〇 The second card member 345 of the slanting slider is rotated by " ': the second card member (oblique slider) 345 of the moving handle 34 and the first card of the tablet: (the card hole) are engaged with each other The rotation of the pressing piece 33 is driven. The height of the surface of the moving block 35ΓΪΓ5 is convexly provided with the first stop block and the second stop n 351 is higher than the second positive stop 352 ^ - the stop block 351 can accommodate and move (4) / A groove (sector groove) 331 and a block 352 of the first turning handle 34 of the turning handle 34 are allowed to pass through the groove 332. a four-recessed table 344 is embedded in the second concave portion of the pressing piece 33. The fixed movement of the 41' (four) line _ group is a rotating member (the oblique 1 earns ^4 34, at this time, the rotating handle 34 has The second card hole) 3 2 1 system! * into the first card member of the pressing piece 33 (the card only U U moves the pressing piece 33 together with the rotating handle 34, 33 is oppositely provided with the opening 33 The other end of the crucible is above the bottom plate 203 until the latch % first stop block moves 110042 11 200829799 handle 34 and the first and third recesses of the pressing piece 33 to the I sector groove qq]q
内滑動至抵住該壓片33之第一凹样厂戶… J4J w h i扇形凹槽）331 一 端邊緣，而使該壓片33無法繼續隨轉 止 和動把手34轉動而停 同時配合參閱第5圖，由於該轉動把手34之第三凹 槽（扇形凹槽）343長度係大於麼片33第一凹槽（扇形凹 槽）331長度’因此可繼續轉動該轉動把手34，此 壓片33已無法繼續轉動，因而可使該轉動把手^之: 卡件（斜滑塊）345自該墨片33之第—卡件（卡孔）333中^ 出’其中因該第二卡件345係可設計為具有傾斜面之斜滑 塊，因此可較便於自該第一卡件（卡孔）333中脫出，藉以 凸出該壓片33，從而向下推壓該壓片33，而令壓片& 下方之弹性構件（彈簧）32壓縮，以使設於該插銷Μ表面 位置較下方之第二止擋塊352卡入該壓片33之第二凹槽 332中，如此即可使該壓片33定位且下壓該散熱模組 之底板203 ’同時配合該套管3丨上所預設之第一扣件（凸 塊）311契合該散熱模組底板2〇3下表面之第二扣件（凹 槽）2031以夾持該底板2〇3。因此即可使散熱模組透過其 底板固定於發熱元件（如CPU)上，從而使該散熱模組固定 於電路板上。 同樣地’當需拆卸散熱模組時，僅須反轉該轉動把手 34’使該第二卡件（斜滑塊）345卡入該壓片33之第一卡 件（卡孔）333中’同時解除該彈性構件（彈簧）32所受之壓 迫’俾可藉由回復力向上頂該壓片33,使該壓片33之第 12 110042 200829799 二 凹槽332脫離與該插銷釘％之第 關係，該轉動把丰w e 兄们Z之卡合 銷35之第二 動該壓片33轉動直至當該插 、拘5之弟一止擋塊351於該轉動把手％及壓片 -及第—三凹槽（扇形凹槽）331，343内滑動至抵住該壓片弟 "二凹槽(扇形凹槽)331之另-端邊緣為止，在此過 透過本發明前述之固定裝置即可便捷地將散熱 果、、且女裝與拆卸於發熱元件上，同時由於本發明係利用壓 垂直向下壓緊之面接觸方式將散熱模組固定於發熱 7L件上，而传使散熱模組與發熱元件充分接觸，同時提供 議組和發熱元件間更均勾之接觸麗力，強化散熱模組 〜固疋和散熱效能，避免習知技術中利用彈性條彎折部分 固定散熱模組時’因彎折部分變形不均勾所導致模熱模： 底板與固定模組結合不緊密，甚或傾斜問題，進而導致盥 發熱元件間形成有空隙，而影響發熱元件所產生之埶量白； 傳導。 …、里的 上述實施例僅例示性說明本發明之原理及其功效，而 非用於限制本發明。任何熟習此項技藝之人士均可在不違 T本發明之精神及範疇下，對上述實施例進行修飾與改1^ 變。因此，本發明之權利保護範圍，應如後述之申請 範圍所列。 W 1 【圖式簡單說明】 第1圖係顯示習知用以固定散熱模組至一中央處理 110042 13 200829799 器之固定機構示意圖； 第2圖係為本發明之用於固定散熱模組至發熱元件 之固定裝置爆炸示意圖； 第3圖係為本發明之固定裝置中部分構成元件之放 大示意圖；以及 第4圖及第5圖係顯示本發明之固定裝置之作動示意 【主要 元件符號說明】 1 固定模組 10 散熱模組 101 散熱塊體 103 底板 11 扣合凸塊 12 彈性條 120 扣環 20 散熱模組 201 散熱塊體 203 底板 2031 第二扣件 25 電路板 3 固定裝置 31 套管 311 第一扣件 32 彈性構件 110042 14 200829799 33 壓板 330 開孔 331 第一凹槽 332 第二凹槽 333 第—Μ牛 34 轉動把手 340 開孔 343 第三凹槽 344 第四凹槽 345 第二卡件 35 插鎖 351 第一止擋塊 352 第二止擋塊Sliding to the first concave factory of the pressing piece 33 (J4J whi-slot groove) 331 one end edge, so that the pressing piece 33 can not continue to rotate with the rotation and the moving handle 34 to stop and cooperate with the fifth In the figure, since the third groove (segment groove) 343 of the rotating handle 34 is longer than the first groove (sector groove) 331 of the piece 33, the rotating handle 34 can be continuously rotated, and the pressing piece 33 has been The rotation can not be continued, so that the rotating handle can be: the card member (oblique slider) 345 is pulled out from the first card member (the card hole) 333 of the ink sheet 33, wherein the second card member 345 can be used. The utility model is designed as an inclined slider with an inclined surface, so that it can be easily taken out from the first card member (the card hole) 333, thereby protruding the pressing piece 33, thereby pushing the pressing piece 33 downward, and pressing The lower elastic member (spring) 32 is compressed so that the second stopper 352 disposed at a lower position of the surface of the latch is engaged in the second recess 332 of the pressing piece 33, so that the sheet The pressing piece 33 is positioned and pressed down the bottom plate 203 ′ of the heat dissipation module while matching the first fastening component preset on the sleeve 3 Bump) 311 of the heat dissipation module fit a second fastener plate (2〇3 surface of the lower groove) to clamp the base plate 2031 2〇3. Therefore, the heat dissipation module can be fixed to the heat generating component (such as the CPU) through the bottom plate, so that the heat dissipation module is fixed on the circuit board. Similarly, when the heat dissipation module needs to be disassembled, it is only necessary to reverse the rotation handle 34' to cause the second card member (oblique slider) 345 to be snapped into the first card member (slot hole) 333 of the pressure piece 33. At the same time, the pressing force of the elastic member (spring) 32 is released, and the pressing piece 33 can be lifted upward by the restoring force, so that the 12th 110042 200829799 two groove 332 of the pressing piece 33 is disengaged from the first relationship of the pin. The rotation rotates the pressing piece 33 of the second movement of the card of the brothers of the Z. The rotation of the tablet 33 is reversed until the rotation of the handle 351 and the tablet--and the third The groove (fan-shaped groove) 331, 343 slides to abut against the other end edge of the tablet (the scallop) 331, and is convenient to pass through the aforementioned fixing device of the present invention. The heat dissipating fruit, and the women's wear and disassembly are disassembled on the heating element, and at the same time, since the present invention fixes the heat dissipating module to the heat generating 7L by the surface contact method of pressing down vertically, the heat dissipating module is transmitted and The heating element is in full contact, and at the same time, it provides a more uniform contact between the group and the heating element, and enhances heat dissipation. Group ~ solid and heat dissipation performance, to avoid the use of the elastic strip bending part to fix the heat dissipation module in the prior art. 'The mold is not deformed due to the uneven deformation of the bent part: the bottom plate and the fixed module are not tightly combined, or even inclined The problem, in turn, causes voids to form between the heating elements, and affects the amount of whiteness produced by the heating elements; conduction. The above-described embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the invention. Any person skilled in the art can modify and modify the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the application described below. W 1 [Simple description of the drawing] Figure 1 shows a schematic diagram of a fixing mechanism for fixing a heat dissipation module to a central processing 110042 13 200829799; Figure 2 is a fixed heat dissipation module for heating according to the present invention. FIG. 3 is an enlarged schematic view showing a part of components of the fixing device of the present invention; and FIG. 4 and FIG. 5 are diagrams showing the operation of the fixing device of the present invention. Fixed module 10 Heat dissipation module 101 Heat sink block 103 Base plate 11 Buckle 12 Elastic strip 120 Buckle 20 Heat sink module 201 Heat sink block 203 Base plate 2031 Second fastener 25 Circuit board 3 Fixing device 31 Bushing 311 A fastener 32 elastic member 110042 14 200829799 33 pressure plate 330 opening 331 first groove 332 second groove 333 first - yak 34 rotating handle 340 opening 343 third groove 344 fourth groove 345 second card 35 mortise lock 351 first stop block 352 second stop block