TW200828529A - Package structure of photosensitive chip and the making method thereof - Google Patents
Package structure of photosensitive chip and the making method thereof Download PDFInfo
- Publication number
- TW200828529A TW200828529A TW095150099A TW95150099A TW200828529A TW 200828529 A TW200828529 A TW 200828529A TW 095150099 A TW095150099 A TW 095150099A TW 95150099 A TW95150099 A TW 95150099A TW 200828529 A TW200828529 A TW 200828529A
- Authority
- TW
- Taiwan
- Prior art keywords
- photosensitive
- substrate
- wafer
- color filter
- layer
- Prior art date
Links
- 238000000034 method Methods 0.000 title description 5
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000011521 glass Substances 0.000 claims abstract description 25
- 235000012431 wafers Nutrition 0.000 claims description 43
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 2
- 229910052707 ruthenium Inorganic materials 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 230000035515 penetration Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 42
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 3
- 239000000306 component Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- KZNMRPQBBZBTSW-UHFFFAOYSA-N [Au]=O Chemical compound [Au]=O KZNMRPQBBZBTSW-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910001922 gold oxide Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095150099A TW200828529A (en) | 2006-12-29 | 2006-12-29 | Package structure of photosensitive chip and the making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095150099A TW200828529A (en) | 2006-12-29 | 2006-12-29 | Package structure of photosensitive chip and the making method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200828529A true TW200828529A (en) | 2008-07-01 |
| TWI329352B TWI329352B (cg-RX-API-DMAC7.html) | 2010-08-21 |
Family
ID=44817679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095150099A TW200828529A (en) | 2006-12-29 | 2006-12-29 | Package structure of photosensitive chip and the making method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200828529A (cg-RX-API-DMAC7.html) |
-
2006
- 2006-12-29 TW TW095150099A patent/TW200828529A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI329352B (cg-RX-API-DMAC7.html) | 2010-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |