TW200827960A - Statistical process control method and system for a multi-fabrication cluster - Google Patents

Statistical process control method and system for a multi-fabrication cluster Download PDF

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Publication number
TW200827960A
TW200827960A TW095148964A TW95148964A TW200827960A TW 200827960 A TW200827960 A TW 200827960A TW 095148964 A TW095148964 A TW 095148964A TW 95148964 A TW95148964 A TW 95148964A TW 200827960 A TW200827960 A TW 200827960A
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Taiwan
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process control
statistical process
fab
wafer
manufacturing execution
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TW095148964A
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Chinese (zh)
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Yu-Wen Ho
Wei-Chin Cheng
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Powerchip Semiconductor Corp
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Publication of TW200827960A publication Critical patent/TW200827960A/en

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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Abstract

A statistical process control method for a multi-fabrication cluster is disclosed. Process and measurement operations are implemented to a wafer lot using a first manufacture execution system (MES) of a first wafer fabrication and process and measurement data is stored in a first statistical process control (SPC) database of the first wafer fabrication. It is determined whether a span request is received using a first proxy server. If the span request is received, on-line SPC information and quality control (QC) policy are simultaneously transmitted to a second SPC database of a second wafer fabrication via the first proxy server. The wafer lot is moved to the second wafer fabrication to be processed based on the QC policy using a second MES.

Description

200827960 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種統計製程管制方法，且特別有關 於種半$體t落之尚效能統計製程管制（Statistical Process Control，SPC)系統與方法。 【先前技#f】 _ 現今的12吋半導體廠為了生產資源分享的考量，會將 多個半導體的生產動線予以機動調整混合，故一批晶圓在 A晶圓廠進入自動搬運系統（AMHS)以在各機台執行製 私時，可能需移動至β晶圓廠的機台執行製程，而實際上 Α晶圓與Β晶圓廠為兩個獨立不相關的實體工廠。若再加 上其它備援晶圓廠，則所有晶圓廠可組合而成一個半導體 薇生產聚落（Multi-Fab Cluster)，如第1圖所示。 在生產聚落中，生產管理與控制技術也因為架構上的 • 複雜性而衍生出不同問題。以統計製程管制（SPC)而言， 每-晶圓廠都有-套獨立的統計製程管制系統，其係應用 於製造埶扞条欲200827960 IX. INSTRUCTIONS: [Technical field to which the invention pertains] The present invention relates to a statistical process control method, and particularly to a statistical process control (SPC) system and method for a half-body . [Previous technology #f] _ Today's 12-inch semiconductor factory will adjust and mix multiple semiconductor production lines for the purpose of production resource sharing, so a batch of wafers will enter the automatic handling system (AMHS) at the A-wafer factory. In order to perform the manufacturing process on each machine, it may be necessary to move to the machine of the beta fab to execute the process. In fact, the wafer and the wafer fab are two independent and unrelated physical factories. If additional backup fabs are added, all fabs can be combined into a single Multi-Fab Cluster, as shown in Figure 1. In production settlements, production management and control technologies also derive different problems due to the complexity of the architecture. In terms of statistical process control (SPC), each fab has an independent statistical process control system that is applied to the manufacture of the shackles.

每-晶圓_之統計製程管制系麵根據其品管規則 Client’s Docket No· : ΡΤΛΡ-803 TT?s Docket No ： 0532-A41034-TW/Draft-Final/Alex Chen 6 200827960 制定欲執行的任務規則（j〇b Rule)，若A晶圓廠之晶圓 欲到B晶圓廠執行製程，則可能導致控制邏輯混淆。也就 是說’晶圓在執行製程時不知要依據A晶圓廠或B晶圓廠 的規格來檢測。此外，還需考慮到前站製程的因素。舉例 來說’曝光後的線寬（Critical Dimension，CD)值檢測會 因不同晶圓廠内之機台的種類與站別而有差異。在這種情 況下，晶圓執行製程後的檢測結果將更顯複雜。 絲上所述，可將製程執行區分為兩種屬性，即產品導 • 向與機台導向。 在產品導向方面，若A晶圓廠的晶圓需在B晶圓廠中 執行製程’則在檢測時理論上應依循A晶圓廠之統計製程 1制系統所訂定的規則。在機台導向方面，由於必須將機 $狀況考慮進去，故在檢_應參考B晶騎之統計製程 管制系統所訂定的規則。 因此’本發明提供了一種半導體聚落之統計製程管制 线與方法’以在製程檢測時㈣兼顧產品導向與機台導 零 向。 【發明内容】 基於上述目的，本發明實施例揭露了一種半導體聚落 的統計製程管制方法m晶圓廠之—第—製造執 仃糸統對-晶圓批量執行製程與量測操作，並且將製程與 ，測資料儲存在該第-晶κ廠之—第—統計製程管制資料 庫中。藉由—第—代_服器判斷是否自該第-製造執行 TT^sDocketNo : 〇532-A41034-TW/Draft.Final/Alex Chen 200827960 M代理伺服器將該晶圓批量之線上統計製程資訊與該第一統 計製程管制資料庫中的品管政策同時傳送到一第二晶圓廠 之一第二統計製程管制資料庫。將該晶圓批量傳送到該第 二晶圓廠，以根據該品管政策執行製程處理，以一第二製 造執行系統根據該品管政策對該晶圓批量執行製程處理。 本發明實施例更揭露了一種半導體聚落的統計製程管 制系統，包括一第一晶圓廠與一第二晶圓廠。該第一晶圓 廠更包括一第一統計製程管制資料庫、一第一統計製程管 • 制系統與一第一製造執行系統。該第二晶圓廠包括一第二 製造執行系統與一第二統計製程管制資料庫。該第一製造 執行系統對一晶圓批量執行製程與量測操作，並且將製程 與量測資料儲存在該第一統計製程管制資料庫中，以供該 第一統計製程管制系統進行分析統計。該第一代理伺服器 判斷是否自該第一製造執行系統收到一跨廠要求，以及若 收到該跨廠要求，則藉由該第一代理伺服器將該晶圓批量 之線上統計製程資訊與該第一統計製程管制資料庫中的品 • 管政策同時傳送到該第二統計製程管制資料庫。該晶圓批 量自該第一晶圓廠傳送到該第二晶圓廠，以一第二製造執 行系統根據該品管政策對該晶圓批量執行製程處理。 【實施方式】 為了讓本發明之目的、特徵、及優點能更明顯易懂， 下文特舉較佳實施例，並配合所附圖示第1圖至第3圖， 做詳細之說明。本發明說明書提供不同的實施例來說明本 發明不同實施方式的技術特徵。其中，實施例中的各元件The statistical process control system for each wafer is based on its quality control rules Client's Docket No. : ΡΤΛΡ-803 TT?s Docket No : 0532-A41034-TW/Draft-Final/Alex Chen 6 200827960 (j〇b Rule), if the wafers of the A fab are going to the B fab to execute the process, it may lead to confusion of the control logic. That is to say, the wafer is not known to be tested according to the specifications of the A fab or the B fab during the execution of the process. In addition, the factors of the previous station process must also be considered. For example, 'Critical Dimension (CD) value detection after exposure will vary depending on the type and location of the machines in different fabs. In this case, the inspection results after the wafer is executed will be more complicated. As described on the wire, process execution can be divided into two attributes, namely product guidance and machine guidance. In terms of product orientation, if the wafers of the A fab are to be processed in the B fab, then the rules set by the A fab's statistical process system should be theoretically followed. In terms of machine guidance, since the condition of the machine must be taken into account, the rules set by the statistical process control system of B. Therefore, the present invention provides a statistical process control line and method for semiconductor settlements to take into account product orientation and machine zero conduction during process inspection (4). SUMMARY OF THE INVENTION Based on the above objects, an embodiment of the present invention discloses a statistical process control method for a semiconductor settlement, a fab, a manufacturing process, a wafer batch execution process, and a measurement operation, and a process And the measured data is stored in the first-scale κ plant--the statistical process control database. Determine whether to execute TT^sDocketNo from the first-manufacturing by means of the -first generation server: 〇532-A41034-TW/Draft.Final/Alex Chen 200827960 M proxy server to batch the online statistical process information of the wafer The quality control policy in the first statistical process control database is simultaneously transmitted to a second statistical process control database of a second fab. The wafer is transferred in bulk to the second fab to perform process processing according to the quality control policy, and a second manufacturing execution system performs batch processing on the wafer according to the quality control policy. The embodiment of the invention further discloses a statistical process control system for semiconductor settlement, comprising a first fab and a second fab. The first fab further includes a first statistical process control database, a first statistical process management system, and a first manufacturing execution system. The second fab includes a second manufacturing execution system and a second statistical process control database. The first manufacturing execution system performs process and measurement operations on a wafer in batches, and stores the process and measurement data in the first statistical process control database for analysis and statistics by the first statistical process control system. The first proxy server determines whether a cross-plant request is received from the first manufacturing execution system, and if the cross-plant request is received, the first proxy server batches the online statistical process information of the wafer batch And transmitted to the second statistical process control database simultaneously with the product management policy in the first statistical process control database. The wafer batch is transferred from the first fab to the second fab, and a second manufacturing execution system performs batch processing on the wafer according to the quality control policy. DETAILED DESCRIPTION OF THE INVENTION In order to make the objects, features, and advantages of the present invention more comprehensible, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present specification provides various embodiments to illustrate the technical features of various embodiments of the present invention. Wherein, each component in the embodiment

Client’s Docket No. : PT.AP-803 TT^s Docket No ： 0532-A41034-TW/Draft-Final/Alex Chen 8 200827960 、之配置係為說明之用，並非用以限制本發明。且實施例中 圖式標號之部分重複，係為了簡化說明，並非意指不同實 施例之間的關聯性。 本發明實施例揭露了一種半導體聚落之統計製程管制 系統與方法。 統4製程管制（SPC )糸統包含有兩類的資料，即制 定品管政策（Job Setting )與紀錄管制圖（Chart Points )。 為了達成前述目的，該兩類資料必須要在多廠聚落中，以 φ 一個敢有效率的儲存方式被記錄下來，並互相同步比對， 以在即時環境中正確的做出統計製程管制品管判斷。 在制定統計製程管制系統的品管政策（J〇b Setting) 時，永遠將制定好的品管政策複製給其他各晶圓廠的統計 製程管制系統，以使得多廠聚落中之每個統計製程管制系 、、充白包含其它各晶圓廠的品管政策（Job Setting )。此外， 在備分晶圓批量產出時，將該晶圓批量之前的製程資料複 製到隶後執行之統計製程管制系統（即目的統計製程管制 ⑩ 系統），使得未來在目的地統計製程管制系統執行任何製 程操作時，可產生完整的管制圖來執行品管控制。以下即 說明本發明實施例之半導體聚落之統計製程管制系統與方 法的實施流程。 第2圖係顯示本發明實施例之半導體聚落的統計製程 管制系統的架構示意圖。 本發明實施例以兩個晶圓廠來做說明，但在實做上不 以此為限，其可應用於半導體聚落中之任兩個晶圓廠間之Client's Docket No. : PT.AP-803 TT^s Docket No : 0532-A41034-TW/Draft-Final/Alex Chen 8 200827960 The configuration is for illustrative purposes and is not intended to limit the invention. The repeated reference numerals in the embodiments are intended to simplify the description and do not imply the relationship between the different embodiments. Embodiments of the present invention disclose a statistical process control system and method for semiconductor settlement. The System 4 Process Control (SPC) system contains two types of information, namely, the Job Setting and the Chart Points. In order to achieve the above objectives, the two types of data must be recorded in a multi-factory settlement, φ a highly efficient storage method, and synchronized with each other to correctly make statistical process tube products in the immediate environment. Judge. When formulating the quality control policy of the statistical process control system (J〇b Setting), the quality control policy will always be copied to the statistical process control system of other fabs, so that each statistical process in the multi-factory settlement The control system and the whitening contain the Job Setting of the other fabs. In addition, when the batch wafer is produced in batches, the process data before the wafer batch is copied to the post-execution statistical process control system (ie, the target statistical process control system 10), so that the future statistical process control system at the destination When performing any process operations, a complete control chart can be generated to perform quality control. The following is a flow chart showing the implementation of the statistical process control system and method for the semiconductor cluster of the embodiment of the present invention. Fig. 2 is a block diagram showing the construction of a statistical process control system for semiconductor clusters according to an embodiment of the present invention. The embodiment of the present invention is described by two fabs, but it is not limited thereto, and it can be applied to any two fabs in a semiconductor settlement.

Client’s Docket No. : PT.AP-803 TT’s Docket No : 0532-A41034-TW / Draft-Final / Alex Chen 9 200827960 跨廠統計製程管制操作。 半導體聚落的統計製程管制系統的 2000包括晶圓廠 晶圓，21〇〇至少包括一製造執行系統（mes) 211J) /统片衣私官制資料庫⑽）川〇、一統計製 =織統213()與1理伺服器（Proxy Se而）2140。 晶圓廠2200至少包括—φ, — 衣造執行系統2210、一統計製程 貧料庫2220、—統計製程管制系統2230與-代理伺 服器屬。統計製程管制資料庫襲與謂分別儲存晶 圓廠2 i 00與2200之品管編 製程/量測資料。 S 列口 Μ及 言先’ "~晶圓批量右曰a — 測，且製造執行线2之❹猜製程與量 程管制資料庫212〇, 賴儲存在統計製 分析並產生管侧。當^^製程管制线213G存取與 則製造執行系、统⑽；；；；^量欲傳送至晶圓廠2細’ 求。細刪鳩^發出—跨薇要 之線上統計製程資訊與統;ϋ要求後，即將該晶圓批量 , 死冲I耘管制資料庫2120中的品 &朿^傳达到統計製程管制資料庫m 突’當該晶圓批量傳送到晶圓薇2200時’代理伺服 =〇:測該晶圓批量的來源晶圓薇編號，以判斷該來源 扁號與製造執行系統221〇之所屬晶圓廠的編號是 二若相同’則由製造執行系統221〇利用機台對該晶 :比=、仃製程’並且利用統計製程管制系統223()對該晶 圓批里進行監控與檢測。若不相同，則代理祠服器2剧Client’s Docket No. : PT.AP-803 TT’s Docket No : 0532-A41034-TW / Draft-Final / Alex Chen 9 200827960 Cross-factor statistical process control operation. The statistical process control system for semiconductor settlements 2000 includes fab wafers, 21〇〇 includes at least one manufacturing execution system (mes) 211J) / unified film private system database (10)) Chuanxiong, a statistical system = 织 213 () and 1 server (Proxy Se) 2140. The fab 2200 includes at least - φ, - a garment execution system 2210, a statistical process repository 2220, a statistical process control system 2230, and a proxy server. The statistical process control database is used to store the quality control data/measurement data of the crystal factory 2 i 00 and 2200 respectively. S 列 言 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 When the process control line 213G is accessed, the manufacturing execution system, system (10), and the system are transferred to the fab. Fine-deleted 发出^---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- When the wafer is transferred to Wafer 2200 in batches, 'Proxy Servo=〇: Measure the source Buoy number of the wafer batch to determine the source stencil and the manufacturing execution system 221 If the number is the same, then the manufacturing execution system 221 uses the machine to monitor and detect the wafer using the statistical process control system 223(). If it is not the same, then the agent server 2 drama

Client’s Docket No· : ΡΤΛΡ-803 TT5s Docket No : 〇532-A41〇34-TW/Draft.Final/Alex Chen 200827960 A將與該晶圓批量相關的製程相關資料（例如，執行製程資 料、量測資料、統計製程管制資料...等等）傳送回其來源 晶圓廠（晶圓廠2100)的統計製程管制系統（統計製程管 制系統2130)，以同時藉由晶圓廠2100與2200的統計製 程管制系統2130與2230對該晶圓批量進行監控與檢測。 然後，在一預設之門檻時間（Timeout)内，統計製程管制 系統2130與2230分別將檢測結果回傳給製造執行系統 2110 與 2210。 • 需注意到，當同時藉由晶圓廠2100與2200的統計製 程管制系統2130與2230對該晶圓批量進行監控與檢测 時，該晶圓批量必須同時滿足統計製程管制系統2130與 2230的品管政策，亦即對統計製程管制系統2130與2230 的品管政策執行一 AND邏輯運算，若無法滿足其中一品管 政策即發出警示。 第3圖係顯示本發明實施例之半導體聚落的統計製程 管制方法的步驟流程圖。 • 首先，藉由一第一晶圓廠之一第一製造執行系統對一 晶圓批量執行製程與量測操作（步驟S301)，並且將製程 與量測資料儲存在該第一晶圓廠之一第一統計製程管制資 料庫中（步驟S302)。藉由一第一代理伺服器判斷是否自 該第一製造執行系統收到一跨廠要求（步驟S303)。若收 到一跨廠要求，則該第一晶圓廠之該第一代理伺服器將該 晶圓批量之線上統計製程資訊與該第一統計製程管制資料 庫中的品管政策同時傳送到一第二晶圓廠之一第二統計製Client's Docket No· : ΡΤΛΡ-803 TT5s Docket No : 〇532-A41〇34-TW/Draft.Final/Alex Chen 200827960 A Process-related data related to the wafer batch (for example, execution of process data, measurement data) , statistical process control data, etc.) transmitted back to its source fab (fab 2100) statistical process control system (statistical process control system 2130) to simultaneously use the fab 2100 and 2200 statistical process The control systems 2130 and 2230 monitor and detect the wafer batch. Then, within a predetermined timeout, the statistical process control systems 2130 and 2230 respectively transmit the test results back to the manufacturing execution systems 2110 and 2210. • It should be noted that when the wafer batch is monitored and inspected simultaneously by the fab 2100 and 2200 statistical process control systems 2130 and 2230, the wafer lot must simultaneously satisfy the statistical process control systems 2130 and 2230. The quality control policy, that is, the implementation of an AND logic operation on the quality control policies of the statistical process control systems 2130 and 2230, provides a warning if one of the quality control policies cannot be met. Fig. 3 is a flow chart showing the steps of the statistical process control method for the semiconductor cluster of the embodiment of the present invention. • First, the process and measurement operations are performed on a wafer in batches by a first manufacturing execution system of a first fab (step S301), and the process and measurement data are stored in the first fab. A first statistical process control database (step S302). A first proxy server determines whether a cross-plant request has been received from the first manufacturing execution system (step S303). If a cross-plant request is received, the first proxy server of the first fab transmits the online statistical process information of the wafer batch to the quality control policy in the first statistical process control database to the same The second statistical system of the second fab

Client’s Docket No· : PT.AP-803 TT^DocketNo ： 0532-A41034-TW/Draft-Final/AlexChen 11 200827960 ζ程管制資料庫（步驟3304)，並且將該晶圓批量傳送到該 第二晶圓廠（步驟S305)。 接著，藉由該第二晶圓廠之一第二代理伺服器檢測該 晶圓批量的來源晶圓廠編號（步驟S306)，以判斷該來源 晶圓廠編號與該第二晶圓廠之一第二製造執行系統之所屬 晶圓廠的編號是否相同（步驟S307)。若相同，則藉由該 第二製造執行系統對該晶圓批量執行製程（步驟S308)， 並且藉由該第二統計製程管制系統對該晶圓批量進行監控 _ 與檢測（步驟S309)。若不相同，則藉由該第二代理伺服 器將與該晶圓批量相關的製程相關資料（例如，執行製程 資料、量測資料、統計製程管制資料...等等）傳送回該第 一晶圓廠之該第一統計製程管制系統，以同時藉由該第一 與第二統計製程管制系統對該晶圓批量進行監控與檢測 (步驟S310)。然後在一預設之門檻時間（Timeout)内， 藉由該第一與第二統計製程管制系統分別將檢測結果回傳 給該第一與第二製造執行系統（步驟S311)。根據檢測結 • 果執行一 AND邏輯運算，以判斷該晶圓批量是否同時滿足 統計製程管制系統2130與2230的品管政策，若無法滿足 其中一品管政策即發出警示。 如上所述，本發明實施例之半導體聚落之統計製程管 制系統與方法在每一晶圓廠皆提供有一代理程式 (Proxy )’用以將跨晶圓廠之晶圓的製程結果傳回給該晶 圓之來源晶圓廠的統計製程管制系統以進行檢測，同時亦 藉由該晶圓目前所在晶圓廠的統計製程管制系統進行檢Client's Docket No. : PT.AP-803 TT^DocketNo : 0532-A41034-TW/Draft-Final/AlexChen 11 200827960 Process Control Library (Step 3304), and transfer the wafer to the second wafer in batches Factory (step S305). Then, the source fab number of the wafer lot is detected by the second proxy server of the second fab (step S306) to determine the source fab number and one of the second fabs. Whether the number of the fab to which the second manufacturing execution system belongs is the same (step S307). If they are the same, the process is batch-executed by the second manufacturing execution system (step S308), and the wafer batch is monitored and detected by the second statistical process control system (step S309). If not, transmitting, by the second proxy server, process related data related to the batch of the wafer (eg, executing process data, measurement data, statistical process control data, etc.) back to the first The first statistical process control system of the fab is to simultaneously monitor and detect the wafer batch by the first and second statistical process control systems (step S310). Then, within a predetermined timeout, the first and second statistical process control systems respectively transmit the detection results back to the first and second manufacturing execution systems (step S311). An AND logic operation is performed according to the detection result to determine whether the wafer batch meets the quality control policies of the statistical process control systems 2130 and 2230 at the same time, and if one of the quality control policies cannot be satisfied, a warning is issued. As described above, the statistical process control system and method for semiconductor settlement of the embodiment of the present invention provides a proxy (Proxy) at each fab to transmit the process results of the wafer across the fab to the The wafer's source fab's statistical process control system is used for inspection and is also inspected by the wafer's current process control system at the wafer fab.

Clienfs Docket No. ： PT.AP-803 TT’s Docket No : 0532-A41034-TW/Draft-Final/Alex Chen 12 200827960 測。對於前站製程控制，可在每一晶圓廠之 任務定義(Job Definition )中清楚列出每一製程站：：g ’: 則可根據跨廠回傳的晶圓製程資料明確分 、 的組合狀況。 4不同前後站 此外，本發明實施例之半導體聚落之統計费 在統計製程管制系統與製造執行系統間加二代 理輊式（Proxy)，以兼顧機台（晶圓目前所 計製程管制系統的設定）與產品（晶圓所屬來二二：統 統計製程管制系統的設定）的設計規格與限制廠= 跨廠傳遞時，只需傳遞目前的檢測資料 匕：，在 站製程與先前量測資料傳遞回來源晶圓廠，如^ ^則 遞資料量而降低網路傳輸負擔與加速檢測效率。β ’夕傳 本發明更提供一種記錄媒體（例如弁 抽取式硬磾等等），幻㈣年心先碟片、磁碟片與 44) ’其係雜-電腦可讀取之 式’以便執行上述之半導體聚落的統計製 ς ^ 二=記錄媒體上之權限簽核程式，基本== 二二段所組成的（例如建立組織圖程式碼片段、簽 =早程式碼諸、設絲式碼m 部署程式 &)’並且這些程式碼片段的功能係 驟與上述系統的功能方塊圖。 J上丈方法的步 H本發明已以較佳實施例揭露如上，然其並非用以 限林發明，任何熟習此㈣者，在錢離本發明 ^範圍内’當可作各種之更動與潤飾，因此本發明之保= 靶圍當視後附之申請專利範圍所界定者為準。 …Clienfs Docket No. : PT.AP-803 TT’s Docket No : 0532-A41034-TW/Draft-Final/Alex Chen 12 200827960 Test. For the former station process control, each process station can be clearly listed in the Job Definition of each fab::g ': The combination of the wafer process data can be clearly defined according to the cross-plant backhaul. situation. 4 different front and rear stations In addition, the statistical fee for the semiconductor settlement of the embodiment of the present invention adds a proxy Proxy between the statistical process control system and the manufacturing execution system to take into account the machine (the current process control system setting of the wafer) ) Design and specification of the product (wafer belongs to the 22nd: the setting of the statistical process control system) = When passing the factory, only the current inspection data is transmitted: 在: the process in the station and the previous measurement data transmission Back to the source fab, such as ^ ^ to transfer the amount of data to reduce the network transmission burden and accelerate the detection efficiency. The invention of the present invention further provides a recording medium (for example, a removable hard disk, etc.), a magical (four) year first disc, a magnetic disk and 44) 'its omni-computer readable type' for execution The above-mentioned statistical system of semiconductor settlements ^ 2 = permission signing program on the recording medium, basic == two or two segments (for example, to create an organization chart code segment, sign = early code, set wire code m The deployment program &)' and the function of these code segments are linked to the functional block diagram of the above system. Step J of the method of the above-mentioned method The present invention has been disclosed in the preferred embodiment as above, but it is not intended to limit the invention of the forest. Anyone who is familiar with this (four) is able to make various changes and refinements within the scope of the invention. Therefore, the scope of the invention is defined by the scope of the patent application. ...

Client’s Docket No. : PT.AP-803 ΤΓ^ Docket No ： 〇532-A41034-TW/Draft.Final/Alex Chen 200827960 【圖式簡單說明】 第1圖係顯示本發明實施例之半導體聚落的示意圖。 第2圖係顯示本發明實施例之半導體聚落的統計製程 管制系統的架構示意圖。 第3圖係顯示本發明實施例之半導體聚落的統計製程 管制方法的步驟流程圖。 【主要元件符號說明】 2100、2200〜晶圓廠 2110、2210〜製造執行系統 2120、2220〜統計製程管制資料庫 2130、2230〜統計製程管制系統 2140、2240〜代理伺服器Client's Docket No. : PT.AP-803 ΤΓ^ Docket No : 〇532-A41034-TW/Draft.Final/Alex Chen 200827960 [Simplified Schematic] FIG. 1 is a schematic view showing a semiconductor cluster of an embodiment of the present invention. Fig. 2 is a block diagram showing the construction of a statistical process control system for semiconductor clusters according to an embodiment of the present invention. Fig. 3 is a flow chart showing the steps of the statistical process control method for the semiconductor cluster of the embodiment of the present invention. [Main component symbol description] 2100, 2200~ fab 2110, 2210~ manufacturing execution system 2120, 2220~ statistical process control database 2130, 2230~ statistical process control system 2140, 2240~ proxy server

Client’s Docket No. : PT.AP-803 TT’s Docket No : 0532-A41034-TW / Draft-Final / Alex Chen 14Client’s Docket No. : PT.AP-803 TT’s Docket No : 0532-A41034-TW / Draft-Final / Alex Chen 14

Claims (1)

200827960 十、申請專利範圍： 1·一種半導體聚落的統計製程管制方法，包括下列步 驟： 藉由一第一晶圓廠之一第一製造執行系統對一晶圓批 量執行製程與量測操作； 將製程與量測資料儲存在該第一晶圓廠之一第一統計 製程管制資料庫中； 藉由一第一代理伺服器判斷是否自該第一製造執行系 統收到一跨廠要求； 若收到該跨廠要求，則藉由該第一代理伺服器將該晶 圓批量之線上統計製程資訊與該第一統計製程管制資料庫 中的品管政策同時傳送到一第二晶圓廠之一第二統計製程 管制資料庫；以及 將該晶圓批量傳送到該第二晶圓廠，以一第二製造執 行系統根據該品管政策對該晶圓批量執行製程處理。 2.如申請專利範圍第1項所述的半導體聚落的統計製 程管制方法，其更包括下列步驟： 藉由該第二晶圓廠之一第二代理伺服器檢測該晶圓批 量之一來源晶圓廠編號； 判斷該來源晶圓廠編號與該第二晶圓廠之該第二製造 執行系統之所屬晶圓廠的編號是否相同； 若該來源晶圓廠編號與該第二製造執行系統之所屬晶 圓廠編號不相同，則藉由該第二代理伺服器將與該晶圓批 量相關的製程相關資料傳送回該第一晶圓廠之該第一統計 Client’s Docket No. : PT.AP-803 TT，s Docket No : 0532-A41034-TW/Draft-Final/Alex Chen 15 200827960 *製程管制系統；以及 同時藉由該第一與第二統計製程管制系統對該晶圓批 量進行監控與檢測。 3.如申請專利範圍第2項所述的半導體聚落的統計製 程管制方法，其更包括根據該監控與檢測結果執行一 AND 邏輯運算，以判斷該晶圓批量是否同時滿足第一與第二統 計製程管制系統的品管政策，若無法滿足其中一品管政策 即發出警示。 • 1如申請專利範圍第2項所述的半導體聚落的統計製 程管制方法，其更包括在一預設之門檻時間内，藉由該第 一與第二統計製程管制系統分別將檢測結果回傳給該第一 與第二製造執行系統。 5. 如申請專利範圍第2項所述的半導體聚落的統計製 程管制方法，其更包括下列步驟： 若該來源晶圓廠編號與該第二製造執行系統之所屬晶 圓廠編號相同，則由該第二製造執行系統對該晶圓批量執 • 行製程；以及 藉由該第二統計製程管制系統對該晶圓批量進行監控 與檢測。 6. —種半導體聚落的統計製程管制系統，包括： 一第二晶圓廠，包括一第二製造執行系統與一第二統 計製程管制資料庫；以及 一第一晶圓薇，包括： 一第一統計製程管制資料庫； Client’s Docket No. : PT.AP-803 TT^ Docket No ： 0532-A41034-TW/Draft-Final/Alex Chen 16 200827960 i 一第一統計製程管制系統； 一第一製造執行系統，其用以對一晶圓批量執行 製程與量測操作，並且將製程與量測資料儲存在該第 一統計製程管制資料庫中，以供該第一統計製程管制 系統進行分析統計；以及 一第一代理伺服器，其用以判斷是否自該第一製 造執行系統收到一跨廠要求，以及若收到該跨廠要 求，則藉由該第一代理伺服器將該晶圓批量之線上統 • 計製程資訊與該第一統計製程管制資料庫中的品管政 策同時傳送到該第二統計製程管制資料庫； 其中，該晶圓批量自該第一晶圓廠傳送到該第二晶圓 廠’以該弟二製造執行糸統根據該品管政東對該晶圓批ϊ 執行製程處理。 7.如申請專利範圍第6項所述的半導體聚落的統計製 程管制系統，其中，該第二晶圓廠更包括： 一第二統計製程管制系統；以及 ⑩ 一第二代理伺服器，其用以檢測該晶圓批量之一來源 晶圓廠編號，判斷該來源晶圓廠編號與該第第二製造執行 系統之所屬晶圓廠的編號是否相同，若該來源晶圓廠編號 與該第二製造執行系統之所屬晶圓廠編號不相同，則將與 該晶圓批量相關的製程相關資料傳送回該第一晶圓廠之該 第一統計製程管制系統； 其中，同時藉由該第一與第二統計製程管制系統對該 晶圓批量進行監控與檢测。 Client’s Docket No. : PT.AP-803 TT's Docket No ： 0532-A41034-TW/Draft-Final/Alex Chen 17 200827960 ^ 8·如申請專利範圍第7項所述的半導體聚落的統計製 程管制系統，其中，該第一與第二代理伺服器根據該監控 與檢測結果執行一 AND邏輯運算，以判斷該晶圓批量是否 同時滿足第一與第二統計製程管制系統的品管政策，若無 法滿足其中一品管政策即發出警示。 9. 如申請專利範圍第7項所述的半導體聚落的統計製 程管制系統，其中，該第一與第二統計製程管制系統在一 預設之門檻時間内，分別將檢測結果回傳給該第一與第二 參 製造執行系統。 10. 如申請專利範圍第7項所述的半導體聚落的統計製 程管制系統，其中，若該來源晶圓廠編號與該第二製造執 行系統之所屬晶圓廠編號相同，則該第二製造執行系統對 該晶圓批量執行製程，且該第二統計製程管制系統對該晶 圓批量進行監控與檢測。 1L一種儲存媒體，用以儲存一電腦程式，上述電腦程 式包括複數程式碼，其用以載入至一電腦系統中並且使得 • 上述電腦系統執行一種半導體聚落的統計製程管制方法， 包括下列步驟： 藉由一第一晶圓廠之一第一製造執行系統對一晶圓批 量執行製程與量測操作； 將製程與量測資料儲存在該第一晶圓廠之一第一統計 製程管制資料庫中； 藉由一第一代理伺服器判斷是否自該第一製造執行系 統收到一跨廠要求； Client’s Docket No. : PT.AP-803 TT’s Docket No : 0532-A41034-TW/Draft-Final/ Alex Chen 18 200827960 若收到該跨廠要求，則藉由該第一代理伺服器將該晶 圓批量之線上統計製程資訊與該第一統計製程管制資料庫 中的品管政策同時傳送到一第二晶圓廠之一第二統計製程 管制資料庫；以及 將該晶圓批量傳送到該第二晶圓廠，以一第二製造執 行系統根據該品管政策對該晶圓批量執行製程處理 12. 如申請專利範圍第11項所述的儲存媒體，其更包 括下列步驟： • 藉由該第二晶圓廠之一第二代理伺服器檢測該晶圓批 置之一來源晶圓廠編號， 判斷該來源晶圓廠編號與該第二晶圓廠之該第二製造 執行系統之所屬晶圓廠的編號是否相同； 若該來源晶圓廠編號與該第二製造執行系統之所屬晶 圓廠編號不相同，則藉由該第二代理伺服器將與該晶圓批 量相關的製程相關資料傳送回該第一晶圓廠之該第一統計 製程管制系統；以及 ® 同時藉由該第一與第二統計製程管制系統對該晶圓批 量進行監控與檢測。 13. 如申請專利範圍第12項所述的儲存媒體，其更包 括根據該監控與檢測結果執行一 AND邏輯運算，以判斷該 晶圓批量是否同時滿足第一與第二統計製程管制系統的品 管政策，若無法滿足其中一品管政策即發出警示。 14. 如申請專利範圍第12項所述的儲存媒體，其更包 括在一預設之門檻時間内，藉由該第一與第二統計製程管 Client’s Docket No. : PT.AP-803 TT^DocketNo ： 0532-A41034-TW/Draft-Final/AlexChen 19 200827960 ^制系統分別將檢測結果回傳給該第一與第二製造執行系 統0 15.如申請專利範圍第12項所述的儲存媒體，其更包 括下列步驟： 若該來源晶圓廠編號與該第二製造執行系統之所屬晶 圓廠編號相同，則由該第二製造執行系統對該晶圓批量執 行製程；以及 藉由該第二統計製程管制系統對該晶圓批量進行監控 φ 與檢測。200827960 X. Patent application scope: 1. A statistical process control method for semiconductor settlements, comprising the following steps: performing process and measurement operations on a wafer in batches by using a first manufacturing execution system of a first fab; The process and measurement data are stored in a first statistical process control database of the first fab; and a first proxy server determines whether a cross-plant request is received from the first manufacturing execution system; To the cross-plant requirement, the first proxy server transmits the on-line statistical process information of the wafer batch to the quality control policy in the first statistical process control database to one of the second fabs simultaneously. a second statistical process control database; and batch transferring the wafer to the second fab, and performing a process processing on the wafer in batches according to the quality control policy by a second manufacturing execution system. 2. The statistical process control method for semiconductor settlement according to claim 1, further comprising the steps of: detecting one of the wafer batches by a second proxy server of the second fab; a round factory number; determining whether the source fab number is the same as the number of the fab of the second manufacturing execution system of the second fab; if the source fab number and the second manufacturing execution system If the fab number is different, the process related data related to the wafer batch is transmitted back to the first facsimile of the first fab by the second proxy server: PT.AP- 803 TT,s Docket No : 0532-A41034-TW/Draft-Final/Alex Chen 15 200827960 *Process control system; and simultaneously monitor and detect the wafer batch by the first and second statistical process control systems. 3. The statistical process control method for semiconductor settlement according to claim 2, further comprising performing an AND logic operation according to the monitoring and detection result to determine whether the wafer batch satisfies the first and second statistics at the same time. The quality control policy of the process control system will issue a warning if it fails to meet one of the quality control policies. • The statistical process control method for semiconductor settlements as described in claim 2, further comprising returning the detection results by the first and second statistical process control systems within a predetermined threshold time The first and second manufacturing execution systems are provided. 5. The statistical process control method for semiconductor settlement according to claim 2, further comprising the steps of: if the source fab number is the same as the fab number of the second manufacturing execution system, The second manufacturing execution system performs the batch processing of the wafer; and monitors and detects the wafer batch by the second statistical process control system. 6. A statistical process control system for a semiconductor settlement, comprising: a second fab comprising a second manufacturing execution system and a second statistical process control database; and a first wafer, including: A statistical process control database; Client's Docket No. : PT.AP-803 TT^ Docket No : 0532-A41034-TW/Draft-Final/Alex Chen 16 200827960 i A first statistical process control system; a system for performing a process and measurement operation on a wafer in batches, and storing the process and measurement data in the first statistical process control database for analysis and statistics by the first statistical process control system; a first proxy server for determining whether a cross-plant request is received from the first manufacturing execution system, and if the cross-plant request is received, the wafer is batched by the first proxy server The online system and the process information are transmitted to the second statistical process control database simultaneously with the quality control policy in the first statistical process control database; wherein the wafer is batched from the first Plant transferred to the second round wafer plant 'to the two brother manufacturing execution system which is based on the quality control of the host government process performs the lot ϊ process. 7. The statistical process control system for semiconductor settlement according to claim 6, wherein the second fab further comprises: a second statistical process control system; and 10 a second proxy server, wherein Determining whether the source fab number is the same as the number of the fab belonging to the second manufacturing execution system by detecting the source fab number of the wafer lot, if the source fab number and the second The manufacturing execution system has a different fab number, and the process related data related to the wafer batch is transmitted back to the first statistical process control system of the first fab; wherein, by the first The second statistical process control system monitors and detects the wafer batch. Client's Docket No. : PT.AP-803 TT's Docket No : 0532-A41034-TW/Draft-Final/Alex Chen 17 200827960 ^ 8. The statistical process control system for semiconductor settlements as described in claim 7 of the patent application, wherein The first and second proxy servers perform an AND logic operation according to the monitoring and detection result to determine whether the wafer batch meets the quality control policies of the first and second statistical process control systems simultaneously, and if one of the products cannot be satisfied The policy is to issue a warning. 9. The statistical process control system for a semiconductor settlement according to claim 7, wherein the first and second statistical process control systems respectively transmit the detection result to the first time within a predetermined threshold time. One and the second reference manufacture the execution system. 10. The statistical process control system for a semiconductor settlement according to claim 7, wherein the second manufacturing execution is performed if the source fab number is the same as the fab number of the second manufacturing execution system The system performs a batch process on the wafer, and the second statistical process control system monitors and detects the wafer batch. 1L is a storage medium for storing a computer program, the computer program comprising a plurality of code codes for loading into a computer system and causing the computer system to perform a statistical process control method for semiconductor settlement, comprising the following steps: Performing process and measurement operations on a wafer in batches by a first manufacturing execution system of a first fab; storing process and measurement data in one of the first fabs of the first statistical process control database Retrieving whether a cross-plant request is received from the first manufacturing execution system by a first proxy server; Client's Docket No. : PT.AP-803 TT's Docket No : 0532-A41034-TW/Draft-Final/ Alex Chen 18 200827960 If the cross-plant requirement is received, the first proxy server transmits the online statistical process information of the wafer batch to the quality control policy in the first statistical process control database to the first a second statistical process control database of one of the two fabs; and batch transfer of the wafer to the second fab, with a second manufacturing execution system based on the product Policy for performing batch processing on the wafer 12. The storage medium described in claim 11 further includes the following steps: • detecting the wafer by a second proxy server of the second fab Determining a source fab number to determine whether the source fab number is the same as the number of the fab belonging to the second fab of the second fab; if the source fab number and the The second manufacturing execution system has a different fab number, and the second proxy server transmits the process related data related to the wafer batch to the first statistical process control system of the first fab. And the wafer is monitored and detected simultaneously by the first and second statistical process control systems. 13. The storage medium of claim 12, further comprising performing an AND logic operation based on the monitoring and detection result to determine whether the wafer batch meets the contents of the first and second statistical process control systems simultaneously. If the policy fails to meet one of the quality control policies, it will issue a warning. 14. The storage medium of claim 12, further comprising a predetermined threshold time by the first and second statistical process tubes Client's Docket No.: PT.AP-803 TT^ DocketNo: 0532-A41034-TW/Draft-Final/AlexChen 19 200827960 ^The system returns the test results to the first and second manufacturing execution systems respectively. 15. The storage medium according to claim 12, The method further includes the following steps: if the source fab number is the same as the fab number of the second manufacturing execution system, the second manufacturing execution system performs the process in batches on the wafer; and by the second The statistical process control system monitors φ and detects the wafer batch. Client’s Docket No. : PT.AP-803 TT^ Docket No ： 0532-A41034-TW/Draft-Final/Alex Chen 20Client’s Docket No. : PT.AP-803 TT^ Docket No : 0532-A41034-TW/Draft-Final/Alex Chen 20
TW095148964A 2006-12-26 2006-12-26 Statistical process control method and system for a multi-fabrication cluster TW200827960A (en)

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