CN101236418A - Semiconductor clustering statistical process control system and method - Google Patents
Semiconductor clustering statistical process control system and method Download PDFInfo
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- CN101236418A CN101236418A CNA2007100047544A CN200710004754A CN101236418A CN 101236418 A CN101236418 A CN 101236418A CN A2007100047544 A CNA2007100047544 A CN A2007100047544A CN 200710004754 A CN200710004754 A CN 200710004754A CN 101236418 A CN101236418 A CN 101236418A
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Abstract
The invention relates to a statistical process control method for a semiconductor cluster. A first manufacturing execution system of a first wafer plant is used to execute processing and measuring operations to a wafer batch, and processing and measuring data are stored in a first statistical process control database of the first wafer plant. A first proxy server is used to determine whether the first manufacturing execution system receives a multi-plant requirement or not; if so, the first proxy server is used to transmit online statistical process information of the wafer batch and a quality control policy in a first statistical process control database to a second statistical process control database of a second wafer plant. The wafer batch is transmitted to the second wafer plant so as to use a second manufacturing execution system to execute a process treatment to the wafer batch according to the quality control policy.
Description
Technical field
The invention relates to a kind of statistics process control method, and be particularly to a kind of high-effect statistics technology controlling and process (Statistical Process Control, SPC) System and method for of semiconductor clustering.
Background technology
12 inch semiconductor factories now are for considering that the resources of production are shared, a plurality of semi-conductive production moving-wires can be given motor-driven adjustment mixes, so a collection of wafer enters automatic handing system (AMHS) with when each board is carried out technology in A wafer factory, the board that may move to B wafer factory is carried out technology, and in fact A wafer and B wafer factory are two the incoherent entity of independence factories.If add other redundant wafer factory, then all wafers factory is capable of being combined forms a semiconductor factory production and troops (Multi-FabCluster), as shown in Figure 1.
Concentrate at productive group, production management also derives different problems because of the complicacy on the framework with control technology.With statistics technology controlling and process (SPC), each wafer factory all has overlaps independently statistical process control system, it is to be applied to manufacturing execution system (Manufacturing Execution System, MES) data of collection board execution technology (for example, WIP, QC, ED... or the like), be converted to behind the control chart again according to subscribing rule judgment and whether should send caution or carry out and suspend operations such as (Lot-Hold) in batches.And concentrate at productive group, if want effective keyholed back plate different chips factory to carry out the wafer quality of technology with a collection of wafer, then following problem may take place.
Statistical process control system in each wafer factory is the Mission Rules Guidelines of carrying out according to its QC Rulemaking desire (Job Rule), if the wafer desire of A wafer factory is carried out technology to B wafer factory, then may cause steering logic to be obscured.That is to say that wafer is not known and will be detected according to the specification of A wafer factory or B wafer factory when carrying out technology.In addition, also need consider the next stop process factors.For instance, (Critical Dimension, CD) the value detection can be other and variant with the station because of the kind of the board in the different chips factory for the live width after the exposure.In this case, the testing result after the wafer execution technology will more apparent complexity.
In sum, technology can be carried out and divide into two kinds of attributes, be i.e. product orientation and board guiding.
Aspect product orientation,, then when detecting, should follow the ordered rule of statistical process control system of A wafer factory in theory if the wafer of A wafer factory needs to carry out technology in B wafer factory.Aspect the board guiding, owing to the board situation must be taken into account, so should be when detecting with reference to the ordered rule of statistical process control system of B wafer factory.
Therefore, the invention provides a kind of statistical process control system and method for semiconductor clustering, when technology detects, to take into account product orientation and board guiding simultaneously.
Summary of the invention
Based on above-mentioned purpose, the embodiment of the invention has disclosed a kind of statistics process control method of semiconductor clustering.One first manufacturing execution system by one first wafer factory is carried out technology and metrology operation in batches to a wafer, and technology and metric data are stored in the one first statistics technology controlling and process database of this first wafer factory.Judge whether to receive that from this first manufacturing execution system one strides factory's requirement by one first acting server.Stride factory's requirement if receive this, then the QC policy in statistics technique information on this wafer line in batches and this first statistics technology controlling and process database is sent to simultaneously one second statistics technology controlling and process database of one second wafer factory by this first acting server.This wafer is sent to this second wafer factory in batches,, according to this QC policy this wafer is carried out PROCESS FOR TREATMENT in batches with one second manufacturing execution system with according to this QC policy implementation PROCESS FOR TREATMENT.
The embodiment of the invention has more disclosed a kind of statistical process control system of semiconductor clustering, comprises one first wafer factory and one second wafer factory.This first wafer factory more comprises one first statistics technology controlling and process database, one first statistical process control system and one first manufacturing execution system.This second wafer factory comprises one second manufacturing execution system and one second statistics technology controlling and process database.This first manufacturing execution system is carried out technology and metrology operation in batches to a wafer, and technology and metric data are stored in this first statistics technology controlling and process database, carries out analytic statistics for this first statistical process control system.This first acting server judges whether to receive that from this first manufacturing execution system one strides factory's requirement, and, then statistics technique information on this wafer line in batches and QC policy in this first statistics technology controlling and process database are sent to this simultaneously and second add up the technology controlling and process database by this first acting server if receive that this strides factory's requirement.This wafer is sent to this second wafer factory from this first wafer factory in batches, according to this QC (qualitative control) policy this wafer is carried out PROCESS FOR TREATMENT in batches with one second manufacturing execution system.
Description of drawings
Fig. 1 is the synoptic diagram that shows the semiconductor clustering of the embodiment of the invention.
Fig. 2 is the configuration diagram of statistical process control system that shows the semiconductor clustering of the embodiment of the invention.
Fig. 3 is the flow chart of steps of statistics process control method that shows the semiconductor clustering of the embodiment of the invention.
[main element symbol description]
2100,2200～wafer factory
2110,2210～manufacturing execution system
2120,2220～statistics technology controlling and process database
2130,2230～statistical process control system
2140,2240～acting server
Embodiment
For allow purpose of the present invention, feature, and advantage can become apparent, preferred embodiment cited below particularly, and cooperate appended Fig. 1 to Fig. 3 is described in detail.Instructions of the present invention provides different embodiment that the technical characterictic of the different embodiments of the present invention is described.Wherein, the configuration of each element among the embodiment is the usefulness for explanation, is not in order to restriction the present invention.And the part of Reference numeral repeats among the embodiment, is for the purpose of simplifying the description, is not the relevance that means between the different embodiment.
The embodiment of the invention has disclosed a kind of statistical process control system and method for semiconductor clustering.
Statistics technology controlling and process (SPC) system includes the data of two classes, promptly formulates QC policy (JobSetting) and record control chart (Chart Points).In order to reach aforementioned purpose, these two classes data must be in Duo Chang troops, go on record with the storing mode of a full blast, and comparison synchronously mutually, judge with the statistics technology controlling and process QC of making correct in instant environment.
When formulating the QC policy (Job Setting) of statistical process control system, to formulate good QC policy forever and duplicate statistical process control system, so that many factories each statistical process control system in trooping all comprises the QC policy (Job Setting) of other each wafer factory to other each wafer factories.In addition, when back-up wafer batch volume production goes out, process data before this wafer batch is copied to the statistical process control system (being the purpose statistical process control system) of last execution, make future when the destination statistical process control system is carried out any technological operation, can produce complete control chart and carry out QC control.The statistical process control system of semiconductor clustering of the embodiment of the invention and the implementing procedure of method below promptly are described.
Fig. 2 is the configuration diagram of statistical process control system that shows the semiconductor clustering of the embodiment of the invention.
The embodiment of the invention is done explanation with two wafer factories, but does not as limit real, and its factory's statistics technology controlling and process of striding that can be applicable to any two wafer inter-plants in the semiconductor clustering is operated.
2000 of the statistical process control system of semiconductor clustering comprises wafer factory 2100 and 2200.Wafer factory 2100 comprises that at least a manufacturing execution system (MES) 2110, is added up technology controlling and process database (SPCDB) 2120, a statistics process control system 2130 and is acted on behalf of server (Proxy Server) 2140.Wafer factory 2200 comprises that at least a manufacturing execution system 2210, is added up technology controlling and process database 2220, a statistics process control system 2230 and is acted on behalf of server 2240.Statistics technology controlling and process database 2120 and 2220 stores QC policy (Job Setting), control chart and the technology/metric data of wafer factory 2100 and 2200 respectively.
At first, a wafer is in batches carried out technology and measurement at the board of wafer factory 2100, and manufacturing execution system 2110 is stored in statistics technology controlling and process database 2120 with technology and metric data, for statistical process control system 2130 accesses and analysis and generation control chart.Deliver to wafer factory 2200 when this wafer batch tendency to develop, then manufacturing execution system 2110 sends one to acting server 2140 and strides factory's requirement.After acting server 2140 receives that this overstates that factory requires, be about to statistics technique information on this wafer line in batches and be sent to statistics technology controlling and process database 2220 simultaneously with QC policy in the statistics technology controlling and process database 2120.
Whether then, when this wafer was sent to wafer factory 2200 in batches, acting server 2240 detected these wafers source wafer factories numbering in batches, identical with the numbering of the affiliated wafer factory of manufacturing execution system 2210 to judge that this source wafer factory numbers.If identical, then utilize board that this wafer is carried out technology in batches, and utilize 2230 pairs of these wafers of statistical process control system to monitor in batches and detect by manufacturing execution system 2210.If it is inequality, then the technology related data that acting server 2240 will be relevant in batches with this wafer (for example, carry out process data, metric data, statistics technology controlling and process data ... or the like) send back the statistical process control system (statistical process control system 2130) of its source wafer factory (wafer factory 2100), to monitor in batches and to detect by statistical process control system 2130 and 2230 pairs of these wafers of wafer factory 2100 and 2200 simultaneously.Then, in a preset threshold time (Timeout), statistical process control system 2130 and 2230 returns testing result to manufacturing execution system 2110 and 2210 respectively.
Note, when simultaneously monitoring in batches and detecting by the statistical process control system 2130 of wafer factory 2100 and 2200 and 2230 pairs of these wafers, this wafer must satisfy the QC policy of statistical process control system 2130 and 2230 in batches simultaneously, that is, promptly send caution if can't satisfy wherein a QC policy to the QC policy implementation one AND logical operation of statistical process control system 2130 and 2230.
Fig. 3 is the flow chart of steps of statistics process control method that shows the semiconductor clustering of the embodiment of the invention.
At first, one first manufacturing execution system by one first wafer factory is carried out technology and metrology operation (step S301) in batches to a wafer, and technology and metric data is stored in the one first statistics technology controlling and process database of this first wafer factory (step S302).Judge whether to receive that from this first manufacturing execution system one strides factory's requirement (step S303) by one first acting server.If receive that one strides factory's requirement, then this first acting server of this first wafer factory is sent to one second of one second wafer factory simultaneously with the QC policy in statistics technique information on this wafer line in batches and this first statistics technology controlling and process database and adds up technology controlling and process database (step S304), and this wafer is sent to this second wafer factory (step S305) in batches.
Then, detect this wafer source wafer factory numbering (step S306) in batches by one second acting server of this second wafer factory, number and the numbering of the affiliated wafer factory of one second manufacturing execution system of this second wafer factory whether identical (step S307) to judge this source wafer factory.If identical, then this wafer carried out technology (step S308) in batches, and (step S309) monitored and detected to this wafer in batches by this second statistical process control system by this second manufacturing execution system.If it is inequality, then by this second acting server will be relevant in batches with this wafer the technology related data (for example, carry out process data, metric data, statistics technology controlling and process data ... or the like) send back this first statistical process control system of this first wafer factory, by this first and second statistical process control system (step S310) monitored and detected to this wafer in batches simultaneously.In a preset threshold time (Timeout), respectively testing result is returned to this first and second manufacturing execution system (step S311) then by this first and second statistical process control system.Carry out an AND logical operation according to testing result, whether satisfy the QC policy of statistical process control system 2130 and 2230 in batches simultaneously, promptly send caution as if satisfying wherein a QC policy to judge this wafer.
As mentioned above, the statistical process control system of the semiconductor clustering of the embodiment of the invention and method all provide one in each wafer factory and act on behalf of program (Proxy), the statistical process control system of source wafer factory that is returned to this wafer in order to the process results of the wafer that will stride wafer factory to be to detect, and also detects by the statistical process control system of the present place of this wafer wafer factory simultaneously.For the next stop technology controlling and process, can in the statistics technology controlling and process task definition (Job Definition) of each wafer factory, know the position of listing each technology station, then can clearly be partitioned into the combined state at station, different front and back according to the wafer technique data of striding factory's passback.
In addition, the statistical process control system of the semiconductor clustering of the embodiment of the invention and method add one and act on behalf of program (Proxy) between statistical process control system and manufacturing execution system, to take into account the design specification and the restriction of board (setting of the statistical process control system of the at present affiliated wafer factory of wafer) and product (setting of the statistical process control system of source wafer factory under the wafer).In addition,, only need to transmit present detection data, and need not repeat, so can reduce the Data transmission amount and reduce networking transmission burden and acceleration detection efficient next stop technology and the previous metric data transmission source wafer factory of returning striding factory when transmitting.
The present invention more provides a kind of recording medium (for example CD-RW discsCD-RW, disk and removable hard disk or the like), and it is the authority sign-off program that record one computer-readable is got, so that carry out the statistics process control method of above-mentioned semiconductor clustering.At this, be stored in the authority sign-off program on the recording medium, basically (for example the setting up organization chart procedure code fragment, sign-off list procedure code fragment, setting program chip segment and deployment program chip segment) formed by a plurality of procedure code fragments, and the function of these procedure code fragments corresponds to the step of said method and the functional block diagram of said system.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; when can being used for a variety of modifications and variations, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
Claims (15)
1. the statistics process control method of a semiconductor clustering comprises the following steps:
One first manufacturing execution system by one first wafer factory is carried out technology and metrology operation in batches to a wafer;
Technology and metric data are stored in the one first statistics technology controlling and process database of this first wafer factory;
Judge whether to receive that from this first manufacturing execution system one strides factory's requirement by one first acting server;
Stride factory's requirement if receive this, then the QC policy in statistics technique information on this wafer line in batches and this first statistics technology controlling and process database is sent to simultaneously one second statistics technology controlling and process database of one second wafer factory by this first acting server; And
This wafer is sent to this second wafer factory in batches, according to this QC policy this wafer is carried out PROCESS FOR TREATMENT in batches with one second manufacturing execution system.
2. the statistics process control method of semiconductor clustering as claimed in claim 1, it more comprises the following steps:
One second acting server by this second wafer factory detects this wafer source wafer factory numbering in batches;
Whether the numbering of affiliated wafer factory of this second manufacturing execution system of judging this source wafer factory numbering and this second wafer factory is identical;
If the affiliated wafer factory numbering of this source wafer factory numbering and this second manufacturing execution system is inequality, then will the technology related data relevant in batches send back this first statistical process control system of this first wafer factory with this wafer by this second acting server; And
Simultaneously this wafer is monitored in batches and detected by this first and second statistical process control system.
3. the statistics process control method of semiconductor clustering as claimed in claim 2, it more comprises according to this monitoring and testing result carries out an AND logical operation, judging whether this wafer satisfies the QC policy of first and second statistical process control system in batches simultaneously, promptly send caution if can't satisfy wherein a QC policy.
4. the statistics process control method of semiconductor clustering as claimed in claim 2, it more is included in the preset threshold time, testing result is returned to this first and second manufacturing execution system respectively by this first and second statistical process control system.
5. the statistics process control method of semiconductor clustering as claimed in claim 2, it more comprises the following steps:
If it is identical that the affiliated wafer factory of this source wafer factory numbering and this second manufacturing execution system numbers, then this wafer is carried out technology in batches by this second manufacturing execution system; And
By this second statistical process control system this wafer is monitored in batches and detected.
6. the statistical process control system of a semiconductor clustering comprises:
One second wafer factory comprises one second manufacturing execution system and one second statistics technology controlling and process database; And
One first wafer factory comprises:
One first statistics technology controlling and process database;
One first statistical process control system;
One first manufacturing execution system, it is in order to carrying out technology and metrology operation in batches to a wafer, and technology and metric data are stored in this first statistics technology controlling and process database, carries out analytic statistics for this first statistical process control system; And
One first acting server, it is in order to judge whether receiving that from this first manufacturing execution system one strides factory's requirement, and, then statistics technique information on this wafer line in batches and QC policy in this first statistics technology controlling and process database are sent to this simultaneously and second add up the technology controlling and process database by this first acting server if receive that this strides factory's requirement;
Wherein, this wafer is sent to this second wafer factory from this first wafer factory in batches, according to this QC policy this wafer is carried out PROCESS FOR TREATMENT in batches with this second manufacturing execution system.
7. the statistical process control system of semiconductor clustering as claimed in claim 6, wherein, this second wafer factory more comprises:
One second statistical process control system; And
One second acting server, it is in order to detect this wafer source wafer factory numbering in batches, whether the numbering of affiliated wafer factory of judging this source wafer factory numbering and this second manufacturing execution system is identical, if the affiliated wafer factory numbering of this source wafer factory numbering and this second manufacturing execution system is inequality, then will the technology related data relevant in batches send back this first statistical process control system of this first wafer factory with this wafer;
Wherein, by this first and second statistical process control system this wafer is monitored in batches and detected simultaneously.
8. the statistical process control system of semiconductor clustering as claimed in claim 7, wherein, this first and second acting server is carried out an AND logical operation according to this monitoring and testing result, judging whether this wafer satisfies the QC policy of first and second statistical process control system in batches simultaneously, promptly send caution if can't satisfy wherein a QC policy.
9. the statistical process control system of semiconductor clustering as claimed in claim 7, wherein, this first and second statistical process control system returns testing result to this first and second manufacturing execution system respectively in a preset threshold time.
10. the statistical process control system of semiconductor clustering as claimed in claim 7, wherein, if the affiliated wafer factory of this source wafer factory numbering and this second manufacturing execution system numbers identical, then this second manufacturing execution system is carried out technology in batches to this wafer, and this second statistical process control system is monitored in batches and detected this wafer.
11. a Storage Media, in order to store a computer program, above-mentioned computer program comprises a plurality of procedure codes, and it comprises the following steps: in order to be loaded in the computer system and to make above-mentioned computer system carry out a kind of statistics process control method of semiconductor clustering
One first manufacturing execution system by one first wafer factory is carried out technology and metrology operation in batches to a wafer;
Technology and metric data are stored in the one first statistics technology controlling and process database of this first wafer factory;
Judge whether to receive that from this first manufacturing execution system one strides factory's requirement by one first acting server;
Stride factory's requirement if receive this, then the QC policy in statistics technique information on this wafer line in batches and this first statistics technology controlling and process database is sent to simultaneously one second statistics technology controlling and process database of one second wafer factory by this first acting server; And
This wafer is sent to this second wafer factory in batches, according to this QC policy this wafer is carried out PROCESS FOR TREATMENT in batches with one second manufacturing execution system.
12. as the Storage Media of claim 11, it more comprises the following steps:
One second acting server by this second wafer factory detects this wafer source wafer factory numbering in batches;
Whether the numbering of affiliated wafer factory of this second manufacturing execution system of judging this source wafer factory numbering and this second wafer factory is identical;
If the affiliated wafer factory numbering of this source wafer factory numbering and this second manufacturing execution system is inequality, then will the technology related data relevant in batches send back this first statistical process control system of this first wafer factory with this wafer by this second acting server; And
Simultaneously this wafer is monitored in batches and detected by this first and second statistical process control system.
13. Storage Media as claim 12, it more comprises according to this monitoring and testing result carries out an AND logical operation, judging whether this wafer satisfies the QC policy of first and second statistical process control system in batches simultaneously, promptly send caution if can't satisfy wherein a QC policy.
14. as the Storage Media of claim 12, it more is included in the preset threshold time, testing result is returned to this first and second manufacturing execution system respectively by this first and second statistical process control system.
15. as the Storage Media of claim 12, it more comprises the following steps:
If it is identical that the affiliated wafer factory of this source wafer factory numbering and this second manufacturing execution system numbers, then this wafer is carried out technology in batches by this second manufacturing execution system; And
By this second statistical process control system this wafer is monitored in batches and detected.
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2007100047544A CN101236418A (en) | 2007-01-30 | 2007-01-30 | Semiconductor clustering statistical process control system and method |
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| CNA2007100047544A CN101236418A (en) | 2007-01-30 | 2007-01-30 | Semiconductor clustering statistical process control system and method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514113A (en) * | 2015-11-25 | 2016-04-20 | 上海新储集成电路有限公司 | 3D nonvolatile memory, and manufacturing method and power consumption reduction method thereof |
| WO2021213433A1 (en) * | 2020-04-21 | 2021-10-28 | 长鑫存储技术有限公司 | Transaction request processing method and semiconductor production system |
-
2007
- 2007-01-30 CN CNA2007100047544A patent/CN101236418A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514113A (en) * | 2015-11-25 | 2016-04-20 | 上海新储集成电路有限公司 | 3D nonvolatile memory, and manufacturing method and power consumption reduction method thereof |
| WO2021213433A1 (en) * | 2020-04-21 | 2021-10-28 | 长鑫存储技术有限公司 | Transaction request processing method and semiconductor production system |
| US12045042B2 (en) | 2020-04-21 | 2024-07-23 | Changxin Memory Technologies, Inc. | Method of handling transaction request, and semiconductor production system |
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