CN101236418A - Statistical process control system and method for semiconductor cluster - Google Patents

Abstract

The invention relates to a statistical process control method for a semiconductor cluster. Process and metrology operations are performed on a wafer lot by a first MES of a first fab and process and metrology data are stored in a first SPC database of the first fab. A first proxy server determines whether a cross-factory request is received from the first MES. If the cross-factory request is received, the first proxy server transmits the on-line statistical process information of the wafer batch and the quality control policy in the first statistical process control database to a second statistical process control database of a second wafer factory. The wafer lot is transferred to the second foundry, and a second manufacturing execution system performs a process on the wafer lot according to the quality control policy.

Description

Statistical process control system and method for semiconductor clusters

technical field

The present invention relates to a statistical process control method, and in particular to a high-efficiency statistical process control (Statistical Process Control, SPC) system and method for semiconductor clusters.

Background technique

Today's 12-inch semiconductor factories will dynamically adjust and mix the production lines of multiple semiconductors in order to share production resources. Therefore, a batch of wafers enters the automatic handling system (AMHS) in the A wafer factory to perform the process on each machine. , it may be necessary to move to the machine of B wafer factory to perform the process, but in fact A wafer and B wafer factory are two independent and unrelated physical factories. If other backup fabs are added, all the fabs can be combined to form a semiconductor fab production cluster (Multi-FabCluster), as shown in FIG. 1 .

In production clusters, production management and control technologies also generate different problems due to the complexity of the architecture. In terms of statistical process control (SPC), each fab has an independent statistical process control system, which is applied to the manufacturing execution system (Manufacturing Execution System, MES) to collect machine execution process data (for example, WIP, QC, ED, etc.), converted into a control chart and then judge whether to issue a warning or perform operations such as batch suspension (Lot-Hold) according to the reservation rules. However, in a production cluster, if it is necessary to effectively control the quality of wafers performed by different fabs on the same batch of wafers, the following problems may occur.

The statistical process control system in each wafer factory formulates the task rules (Job Rules) to be executed according to its quality control rules. If the wafers from A wafer factory are going to B wafer factory to perform the process, it may cause confusion in the control logic. That is to say, the wafer does not need to be inspected according to the specifications of the A wafer factory or the B wafer factory when performing the process. In addition, the factors of the front station process also need to be considered. For example, the detection of the critical dimension (CD) value after exposure will be different due to the types and stations of the machines in different fabs. In this case, the detection results after the wafer is processed will be more complicated.

To sum up, process execution can be divided into two attributes, namely product-oriented and machine-oriented.

In terms of product orientation, if the wafers from fab A need to be processed in fab B, the inspection should theoretically follow the rules set by the statistical process control system of fab A. In terms of tool guidance, since the status of the tool must be taken into consideration, the rules stipulated by the statistical process control system of B wafer factory should be referred to during inspection.

Therefore, the present invention provides a statistical process control system and method for semiconductor clusters to take into account both product orientation and machine orientation during process inspection.

Contents of the invention

Based on the above purpose, an embodiment of the present invention discloses a statistical process control method for semiconductor clusters. Process and metrology operations are performed on a wafer batch by a first MES of a first fab, and process and metrology data are stored in a first statistical process control database of the first fab. A first proxy server is used to determine whether a cross-factory request is received from the first MES. If the cross-factory request is received, the online statistical process information of the wafer lot and the quality control policy in the first statistical process control database are simultaneously transmitted to a second wafer factory by the first proxy server. 2. Statistical process control database. The wafers are sent to the second wafer factory in batches to perform process processing according to the quality control policy, and a second manufacturing execution system is used to perform process processing on the wafer batches according to the quality control policy.

The embodiment of the present invention further discloses a semiconductor cluster statistical process control system, including a first wafer factory and a second wafer factory. The first fab further includes a first statistical process control database, a first statistical process control system and a first manufacturing execution system. The second fab includes a second manufacturing execution system and a second statistical process control database. The first manufacturing execution system performs process and measurement operations on a batch of wafers, and stores the process and measurement data in the first statistical process control database for analysis and statistics by the first statistical process control system. The first proxy server determines whether a cross-factory request is received from the first manufacturing execution system, and if the cross-factory request is received, the online statistical process information of the wafer batch is compared with the online statistical process information of the wafer batch by the first proxy server The quality control policies in the first statistical process control database are simultaneously transmitted to the second statistical process control database. The wafer batch is transferred from the first wafer factory to the second wafer factory, and a second manufacturing execution system is used to process the wafer batch according to the quality control (quality management) policy.

Description of drawings

FIG. 1 is a schematic diagram showing a semiconductor cluster of an embodiment of the present invention.

FIG. 2 is a schematic diagram showing the architecture of a statistical process control system for a semiconductor cluster according to an embodiment of the present invention.

FIG. 3 is a flow chart showing the steps of a statistical process control method for semiconductor clusters according to an embodiment of the present invention.

[Description of main component symbols]

2100, 2200～wafer factory

2110, 2210～Manufacturing Execution System

2120, 2220～statistical process control database

2130, 2230～statistical process control system

2140, 2240～proxy server

Detailed ways

In order to make the purpose, features, and advantages of the present invention more comprehensible, preferred embodiments are specifically cited below, together with accompanying drawings 1 to 3 , for a detailed description. The description of the present invention provides different examples to illustrate the technical features of different implementations of the present invention. Wherein, the configuration of each element in the embodiment is for illustration, not for limiting the present invention. Moreover, part of the reference numerals in the embodiments are repeated for the purpose of simplifying the description, and do not imply the correlation between different embodiments.

The embodiment of the invention discloses a semiconductor cluster statistical process control system and method.

The Statistical Process Control (SPC) system contains two types of data, namely the formulation of quality control policies (JobSetting) and the recording of control charts (Chart Points). In order to achieve the aforementioned goals, the two types of data must be recorded in the most efficient storage method in the multi-factory cluster, and compared with each other synchronously, so as to correctly make statistical process control quality control judgments in a real-time environment .

When formulating the quality control policy (Job Setting) of the statistical process control system, the established quality control policy will always be copied to the statistical process control systems of other fabs, so that each statistical process control system in the multi-factory cluster can be Contains the quality control policy (Job Setting) of other fabs. In addition, when the backup wafer batch is produced, the process data before the wafer batch is copied to the last statistical process control system (that is, the destination statistical process control system), so that any process operation will be performed in the destination statistical process control system in the future When, a complete control chart can be generated to perform quality control. The implementation flow of the semiconductor cluster statistical process control system and method according to the embodiment of the present invention is described below.

FIG. 2 is a schematic diagram showing the architecture of a statistical process control system for a semiconductor cluster according to an embodiment of the present invention.

The embodiment of the present invention is described with two wafer fabs, but the implementation is not limited thereto, and it can be applied to the cross-fab statistical process control operation between any two wafer fabs in the semiconductor cluster.

The semiconductor cluster statistical process control system 2000 includes fabs 2100 and 2200 . The wafer factory 2100 includes at least a manufacturing execution system (MES) 2110 , a statistical process control database (SPCDB) 2120 , a statistical process control system 2130 and a proxy server (Proxy Server) 2140 . The wafer factory 2200 includes at least a manufacturing execution system 2210 , a statistical process control database 2220 , a statistical process control system 2230 and a proxy server 2240 . The statistical process control databases 2120 and 2220 respectively store the quality control policies (Job Setting), control charts and process/measurement data of the wafer factories 2100 and 2200.

Firstly, a batch of wafers is processed and measured on the machine of the wafer factory 2100, and the manufacturing execution system 2110 stores the process and measured data in the statistical process control database 2120 for the statistical process control system 2130 to access, analyze and generate Control Charts. When the wafer batch is to be sent to the wafer factory 2200 , the MES 2110 sends a cross-fab request to the proxy server 2140 . After the proxy server 2140 receives the request from the manufacturer, it transmits the online statistical process information of the wafer lot and the quality control policy in the statistical process control database 2120 to the statistical process control database 2220 at the same time.

Next, when the wafer lot is sent to the fab 2200 , the proxy server 2240 detects the source fab number of the wafer lot to determine whether the source fab number is the same as the fab number of the MES 2210 . If they are the same, the manufacturing execution system 2210 uses the machine tool to execute the process on the wafer batch, and uses the statistical process control system 2230 to monitor and detect the wafer batch. If not, the proxy server 2240 transmits process-related data (e.g., execution process data, metrology data, statistical process control data, etc.) associated with the wafer lot back to its source fab (fab 2100) The statistical process control system (statistical process control system 2130) of the wafer factory 2100 and 2200 is used to simultaneously monitor and detect the wafer lot through the statistical process control systems 2130 and 2230 of the wafer factories 2100 and 2200. Then, within a preset threshold time (Timeout), the statistical process control systems 2130 and 2230 send back the detection results to the MES 2110 and 2210 respectively.

It should be noted that when the wafer batches are monitored and tested by the statistical process control systems 2130 and 2230 of the wafer factories 2100 and 2200 at the same time, the wafer batches must meet the quality control policies of the statistical process control systems 2130 and 2230 at the same time. That is, an AND logic operation is performed on the quality control policies of the statistical process control system 2130 and 2230 , and a warning is issued if one of the quality control policies cannot be satisfied.

FIG. 3 is a flow chart showing the steps of a statistical process control method for semiconductor clusters according to an embodiment of the present invention.

First, process and measurement operations are performed on a wafer batch by a first manufacturing execution system of a first fab (step S301), and the process and measurement data are stored in a first statistics of the first fab In the process control database (step S302). A first proxy server is used to determine whether a cross-factory request is received from the first MES (step S303 ). If a cross-factory request is received, the first proxy server of the first wafer factory transmits the online statistical process information of the wafer lot and the quality control policy in the first statistical process control database to a second wafer at the same time A second statistical process control database of the fab (step S304), and batch transfer the wafers to the second fab (step S305).

Next, a second proxy server of the second fab detects the source fab serial number of the wafer lot (step S306), to determine the source fab serial number and a second manufacturing execution system of the second fab Whether the numbers of the wafer factories they belong to are the same (step S307). If they are the same, the process is executed on the wafer lot by the second manufacturing execution system (step S308 ), and the wafer lot is monitored and detected by the second statistical process control system (step S309 ). If not, the process-related data (eg, execution process data, measurement data, statistical process control data, etc.) related to the wafer lot is sent back to the first fab by the second proxy server The first statistical process control system is used to simultaneously monitor and detect the wafer lot by the first and second statistical process control systems (step S310). Then, within a preset threshold time (Timeout), the first and second statistical process control systems respectively send back the detection results to the first and second MES (step S311 ). An AND logic operation is performed according to the test results to determine whether the wafer lot satisfies the quality control policies of the statistical process control system 2130 and 2230 at the same time. If one of the quality control policies cannot be satisfied, a warning is issued.

As mentioned above, the statistical process control system and method of the semiconductor cluster according to the embodiment of the present invention provides a proxy program (Proxy) in each fab to transmit the process results of the wafers across fabs back to the source of the wafer The statistical process control system of the wafer fab is used for detection, and the detection is also performed by the statistical process control system of the wafer fab where the wafer is currently located. For front-end process control, the location of each process station can be clearly listed in the statistical process control task definition (Job Definition) of each wafer factory, and different front-end stations can be clearly divided according to the wafer process data sent back from across factories combination status.

In addition, the statistical process control system and method of the semiconductor cluster according to the embodiment of the present invention adds a proxy program (Proxy) between the statistical process control system and the manufacturing execution system, so as to take into account the statistical process control system of the machine (the chip currently belongs to the wafer factory) settings) and design specifications and constraints for products (the settings of the statistical process control system of the source wafer fab to which the wafer belongs). In addition, when transferring across fabs, only the current inspection data needs to be transferred, and there is no need to repeatedly transfer the front-end process and previous measurement data back to the source wafer factory, which can reduce the amount of transferred data, reduce the burden of network transmission and speed up inspection efficiency.

The present invention further provides a recording medium (such as an optical disk, a magnetic disk, and a removable hard disk, etc.), which records a computer-readable authority sign-off program, so as to execute the above-mentioned statistical process control method for semiconductor clusters . Here, the authorization verification program stored on the recording medium is basically composed of a plurality of program code segments (such as creating an organization chart program code segment, approving form program code segments, setting program code segments, and deploying program code segments), and the functions of these program code segments correspond to the steps of the above-mentioned method and the functional block diagram of the above-mentioned system.

Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of protection of the invention shall be defined by the scope of the appended patent application.

Claims (15)

1. the statistics process control method of a semiconductor clustering comprises the following steps:

One first manufacturing execution system by one first wafer factory is carried out technology and metrology operation in batches to a wafer;

Technology and metric data are stored in the one first statistics technology controlling and process database of this first wafer factory;

Judge whether to receive that from this first manufacturing execution system one strides factory's requirement by one first acting server;

Stride factory's requirement if receive this, then the QC policy in statistics technique information on this wafer line in batches and this first statistics technology controlling and process database is sent to simultaneously one second statistics technology controlling and process database of one second wafer factory by this first acting server; And

This wafer is sent to this second wafer factory in batches, according to this QC policy this wafer is carried out PROCESS FOR TREATMENT in batches with one second manufacturing execution system.

2. the statistics process control method of semiconductor clustering as claimed in claim 1, it more comprises the following steps:

One second acting server by this second wafer factory detects this wafer source wafer factory numbering in batches;

Whether the numbering of affiliated wafer factory of this second manufacturing execution system of judging this source wafer factory numbering and this second wafer factory is identical;

If the affiliated wafer factory numbering of this source wafer factory numbering and this second manufacturing execution system is inequality, then will the technology related data relevant in batches send back this first statistical process control system of this first wafer factory with this wafer by this second acting server; And

Simultaneously this wafer is monitored in batches and detected by this first and second statistical process control system.

3. the statistics process control method of semiconductor clustering as claimed in claim 2, it more comprises according to this monitoring and testing result carries out an AND logical operation, judging whether this wafer satisfies the QC policy of first and second statistical process control system in batches simultaneously, promptly send caution if can't satisfy wherein a QC policy.

4. the statistics process control method of semiconductor clustering as claimed in claim 2, it more is included in the preset threshold time, testing result is returned to this first and second manufacturing execution system respectively by this first and second statistical process control system.

5. the statistics process control method of semiconductor clustering as claimed in claim 2, it more comprises the following steps:

If it is identical that the affiliated wafer factory of this source wafer factory numbering and this second manufacturing execution system numbers, then this wafer is carried out technology in batches by this second manufacturing execution system; And

By this second statistical process control system this wafer is monitored in batches and detected.

6. the statistical process control system of a semiconductor clustering comprises:

One second wafer factory comprises one second manufacturing execution system and one second statistics technology controlling and process database; And

One first wafer factory comprises:

One first statistics technology controlling and process database;

One first statistical process control system;

One first manufacturing execution system, it is in order to carrying out technology and metrology operation in batches to a wafer, and technology and metric data are stored in this first statistics technology controlling and process database, carries out analytic statistics for this first statistical process control system; And

One first acting server, it is in order to judge whether receiving that from this first manufacturing execution system one strides factory's requirement, and, then statistics technique information on this wafer line in batches and QC policy in this first statistics technology controlling and process database are sent to this simultaneously and second add up the technology controlling and process database by this first acting server if receive that this strides factory's requirement;

Wherein, this wafer is sent to this second wafer factory from this first wafer factory in batches, according to this QC policy this wafer is carried out PROCESS FOR TREATMENT in batches with this second manufacturing execution system.

7. the statistical process control system of semiconductor clustering as claimed in claim 6, wherein, this second wafer factory more comprises:

One second statistical process control system; And

One second acting server, it is in order to detect this wafer source wafer factory numbering in batches, whether the numbering of affiliated wafer factory of judging this source wafer factory numbering and this second manufacturing execution system is identical, if the affiliated wafer factory numbering of this source wafer factory numbering and this second manufacturing execution system is inequality, then will the technology related data relevant in batches send back this first statistical process control system of this first wafer factory with this wafer;

Wherein, by this first and second statistical process control system this wafer is monitored in batches and detected simultaneously.

8. the statistical process control system of semiconductor clustering as claimed in claim 7, wherein, this first and second acting server is carried out an AND logical operation according to this monitoring and testing result, judging whether this wafer satisfies the QC policy of first and second statistical process control system in batches simultaneously, promptly send caution if can't satisfy wherein a QC policy.

9. the statistical process control system of semiconductor clustering as claimed in claim 7, wherein, this first and second statistical process control system returns testing result to this first and second manufacturing execution system respectively in a preset threshold time.

10. the statistical process control system of semiconductor clustering as claimed in claim 7, wherein, if the affiliated wafer factory of this source wafer factory numbering and this second manufacturing execution system numbers identical, then this second manufacturing execution system is carried out technology in batches to this wafer, and this second statistical process control system is monitored in batches and detected this wafer.

11. a Storage Media, in order to store a computer program, above-mentioned computer program comprises a plurality of procedure codes, and it comprises the following steps: in order to be loaded in the computer system and to make above-mentioned computer system carry out a kind of statistics process control method of semiconductor clustering

One first manufacturing execution system by one first wafer factory is carried out technology and metrology operation in batches to a wafer;

Technology and metric data are stored in the one first statistics technology controlling and process database of this first wafer factory;

Judge whether to receive that from this first manufacturing execution system one strides factory's requirement by one first acting server;

Stride factory's requirement if receive this, then the QC policy in statistics technique information on this wafer line in batches and this first statistics technology controlling and process database is sent to simultaneously one second statistics technology controlling and process database of one second wafer factory by this first acting server; And

This wafer is sent to this second wafer factory in batches, according to this QC policy this wafer is carried out PROCESS FOR TREATMENT in batches with one second manufacturing execution system.

12. as the Storage Media of claim 11, it more comprises the following steps:

One second acting server by this second wafer factory detects this wafer source wafer factory numbering in batches;

Whether the numbering of affiliated wafer factory of this second manufacturing execution system of judging this source wafer factory numbering and this second wafer factory is identical;

If the affiliated wafer factory numbering of this source wafer factory numbering and this second manufacturing execution system is inequality, then will the technology related data relevant in batches send back this first statistical process control system of this first wafer factory with this wafer by this second acting server; And

Simultaneously this wafer is monitored in batches and detected by this first and second statistical process control system.

13. Storage Media as claim 12, it more comprises according to this monitoring and testing result carries out an AND logical operation, judging whether this wafer satisfies the QC policy of first and second statistical process control system in batches simultaneously, promptly send caution if can't satisfy wherein a QC policy.

14. as the Storage Media of claim 12, it more is included in the preset threshold time, testing result is returned to this first and second manufacturing execution system respectively by this first and second statistical process control system.

15. as the Storage Media of claim 12, it more comprises the following steps:

If it is identical that the affiliated wafer factory of this source wafer factory numbering and this second manufacturing execution system numbers, then this wafer is carried out technology in batches by this second manufacturing execution system; And

By this second statistical process control system this wafer is monitored in batches and detected.

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