CN100432879C - Integration of fault detection with run-to-run control - Google Patents

Integration of fault detection with run-to-run control Download PDF

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CN100432879C
CN100432879C CNB028142578A CN02814257A CN100432879C CN 100432879 C CN100432879 C CN 100432879C CN B028142578 A CNB028142578 A CN B028142578A CN 02814257 A CN02814257 A CN 02814257A CN 100432879 C CN100432879 C CN 100432879C
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fault
system
menu
wafer
run
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CN1564970A (en
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A·P·尚穆加松拉姆
A·T·施瓦姆
T·P·赖斯
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应用材料有限公司
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0286Modifications to the monitored process, e.g. stopping operation or adapting control
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/31From computer integrated manufacturing till monitoring
    • G05B2219/31357Observer based fault detection, use model
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/31From computer integrated manufacturing till monitoring
    • G05B2219/31443Keep track of nc program, recipe program
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45031Manufacturing semiconductor wafers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y02P90/12Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] characterised by programme execution
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y02P90/14Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] characterised by fault tolerance, reliability of production system
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y02P90/20Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS] characterised by job scheduling, process planning or material flow

Abstract

结合使用运行至运行控制器和故障检测系统制造执行系统加工半导体晶片。 Run to run in conjunction with the controller and performs fault detection system for a machining system for manufacturing a semiconductor wafer. 由运行至运行控制器从制造执行系统接收菜单用于控制工具。 The controller receives the menu operation from the manufacturing execution system to run a control tool. 该菜单包括用于获得一个或多个目标晶片特性的设定点。 The menu includes means for obtaining one or more target wafer properties setpoint. 通过使用故障检测系统和一个或多个传感器测量加工属性来监视晶片的加工,其中加工属性包括故障状况和晶片特性。 By using the fault detection system and the one or more sensors to monitor the measurement process attribute processing a wafer, wherein the process attribute and a fault condition comprises a wafer characteristics. 可以根据加工属性在运行至运行控制器修改菜单的设定点以保持目标晶片特性,除了由故障检测系统检测到故障状况的情况下之外。 The process attribute can run to run controller modifies the set point to maintain a target wafer menu characteristic, in addition to the case where the fault detection system is detected by the fault condition. 这样,在存在工具或晶片故障状况时获得的数据不能用于反馈目的。 Thus, data obtained in the presence of a fault condition the tool or wafer can not be used for feedback purposes. 此外,可使用故障检测模型确定表示故障状况的条件范围。 Further, fault detection model can be used to determine the range of conditions indicates a fault condition. 在这些情况下,可以修改故障检测模型,以便作为参数并入被运行至运行控制器修改的菜单的设定点。 In these cases, a fault detection model can be modified to incorporate the set point is to run controller modifies the operation menu as a parameter.

Description

运行至运行控制与故障检测的集成5 相关申请的交叉参考 5 to run integrated applications associated operation control and fault detection CROSS-REFERENCE

本申请要求在2002年5月1日的美国申请10/ 135405和在2001 年7月16日的美国申请60/305140的优先权,这些申请以参考的方式并入这里。 This application claims the United States in 2002, May 1 Application No. 10 / 135,405 and priority in 2001. July 16 in US application 60/305140, which applications are incorporated herein by reference.

io 发明领域 io Field of the Invention

本发明一般涉及半导体制造。 The present invention relates generally to semiconductor manufacturing. 特别是,本发明涉及一种通过集成运行至运行控制(run-to-run control)与故障检测概念(fault detection concepts)而制造半导体的技术。 In particular, the present invention relates to a technique for manufacturing a semiconductor integrated operation by operation control (run-to-run control) with the concept of fault detection (fault detection concepts) to which.

15 发明背景 15 BACKGROUND OF THE INVENTION

在通常的半导体制造工艺(processes)中,半导体晶片或简单的晶片,预先通过多个处理站,这被称为加工站(fab)。 In a typical semiconductor manufacturing processes (Processes), the wafer is a semiconductor wafer or simply advance through a plurality of processing stations, which is referred to the processing station (fab). 在这个组装线状处理中的每个位置上,加工(processing)设备或工具进行加工操作,以便修正晶片。 In this assembly line process in each position, processing (Processing) device or tool for machining operations, in order to modify the wafer. 例如, 一个工具可以向晶片上添加各种层(例如淀积工 For example, a tool may be added to the various layers (e.g., deposited on the wafer to the station

20具),同时另一个工具可以修正这些层(例如刻蚀工具),由此形成完整的半导体产品。 20), while the other tools can fix these layers (e.g., etch tool), thereby forming a complete semiconductor products.

当它们在组装线(assembly line)上移动通过时,在晶片上进行周期质量检测。 When they (assembly line) by moving the assembly line, periodic quality inspection on the wafer. 质量检测通常包括在晶片上测量微线(microscopic lines) 的宽度和膜厚,以确定偏差(aberrations)。 Measuring quality testing typically includes a micro-line (microscopic lines) width and the film thickness on the wafer, to determine the deviation (aberrations). 利用很多质量检测,只可 Using many quality testing, only

25以在晶片经过产生偏差的那些加工之后再经过处理后进行测量。 And then after treatment at 25 was measured after those variations in wafer processing yields. 此外, 引入偏差和它们的检测之间需要一定时间周期和大量工艺步骤。 Further, a certain period of time and a large number of process steps and the offset is introduced between their detection. 这样, 即使在已经产生偏差之后,也可以在晶片上进行大量工艺。 Thus, even after the deviation has been generated, a number of process may be performed on the wafer. 类似地, 即使在已经开始产生偏差,工具也可以连续加工晶片。 Similarly, even in the beginning to have a deviation, the tool may be continuously processing a wafer. 在任何情况下, 大量晶片必定会被弄碎。 In any case, the number of wafers are bound to crumble.

30 常规技术已被用于解决其中部分问题。 30 conventional techniques have been used to solve some of the problem. 两个例子包括运行至运行控制和故障检测。 Examples include two run to run control and fault detection. 一般来说,运行至运行控制通过利用建模技术(modding techniques) 送出(outgoing)和弓I入(incoming)晶片以调整工艺参数而解决了工艺结果(processoutput)偏移(即偏移工艺目标)。 In general, to run the control operation by using modeling techniques (modding techniques) sent (outgoing) and the bow I (incoming) wafer to adjust the process parameters and process results solved (processoutput) offset (i.e., offset process objective) . 这些偏移(drifts)涉及由于正常工具使用而产生的工具制造结果的方式上的轻微变化。 These offsets (DRIFTS) relates to a slight change in the tool due to normal tool use results generated manufactured. 例如, 5利用化学机械抛光(CMP)工艺,用于减小膜厚的抛光垫在一段时间后被磨损。 For example, 5 using chemical mechanical polishing (CMP) process for reducing the thickness of the polishing pad wear after a period of time. 结果是,被磨损的抛5t垫比新抛光垫势必需要更多时间来产生预定厚度。 As a result, worn polishing pad 5t than the new polishing pad is bound to need more time to produce a predetermined thickness. 通过调整工艺参数如抛光时间以解决如抛光垫上的磨损等问题,运行至运行控制可用于解决这些类型的问题。 By adjusting the process parameters such as polishing time to the polishing pad in order to solve problems such as wear, run to run control may be used to solve these types of problems.

运行至运行控制使用在一个或多个工艺步骤上提取的计量数据在io 运行至运行的基础上调整工艺菜单(recipes)(即,完成加工结果所需要的一组预定工艺参数)。 Run to run using a metering control data extracted in the step of adjusting one or more process recipe (Recipes) (i.e., a complete set of predefined machining parameters desired result) based on operation to run on io. 一次运行可构成晶片制造工艺的一个或多个步骤。 Run may constitute one or more steps of the wafer fabrication process. 可以包括一批(batch)晶片组(lot)、单组晶片或者甚至单个晶片,这取决于具体需要与工艺步骤和加工站的能力。 It may comprise a number of (BATCH) chipset (Lot), a single set of wafers or even a single wafer, depending on the specific needs and the ability to process steps and processing stations. 通常,运行至运行控制使用在每个工艺或工具上测量的数据,以便通过对每个工具菜15单上的设定点(setpoints)做轻微改变或调整而保持晶片特性(例如膜厚,均匀性等)接近于它们的标称值。 Typically, the control moves to operation using the data measured on each process or tool to be changed or adjusted by making minor set point (Setpoints) 15 on a single wafer each tool held food properties (e.g., film thickness, uniformity etc.) close to their nominal values. 在典型的情况下,将在特定工具上进行的工艺步骤期间或刚刚完成工艺步骤之后提取的数据反馈以调整用于下一次运行的菜单。 After extraction in a typical case, during the process steps to be performed on a particular tool or process step just completed feedback data to adjust for the next operation menu. 同样,数据可以发送给下一工具,以便调整下游菜单。 Likewise, data may be transmitted to the next tool to adjust the downstream menu. 通过这种方式,可使用运行至运行控制解决工艺结果20 的偏移问题。 In this manner, the control operation can be used to run the process results to solve the offset problem 20.

当使用运行至运行控制解决工艺偏移问题时,对于在工具不再能制造可接受的产品的情况是不合适的,不管菜单设定点所做的调整。 When a process run to run control solutions offset problem, in the case of the tool can no longer producing acceptable product is inappropriate, regardless of the adjustments made by the menu set point. 同样,运行至运行控制不能解决晶片包含缺陷的情形。 Similarly, the control operation moves to the wafer can not solve the situation including the defect. 这些情形被称为工具或晶片特性故障。 These situations are referred to as tools or wafer failure characteristics. 已经经受错误或故障状况的工具使得向晶片中 Tools have been subjected to an error or fault condition such that the wafer

25引入偏差或缺陷。 Deviation or defect 25 is introduced. 同样地,晶片特性缺陷表示不可修复的晶片状况。 Similarly, wafer defect characteristics of wafers represented uncorrectable situation.

大量方法可用于检测这些状况。 A number of methods can be used to detect these conditions. 例如,相对于进行给定工艺操作所需的温度的很大的温度下降可以表示为故障。 For example, with respect to a temperature for a given lot of desired process operating temperature drop it may be expressed as a fault. 故障状况的另一例子可能 Another example of possible fault conditions

是工艺材料的流速尖峰(spike)。 Is the peak flow rate of process material (spike). 在这些例子中,是运行至运行控制器(run-to-run controllers)把这些故障作为偏移,以便通过调整工具菜单来30修正这种情形,即使仅仅调整不能解决该问题。 In these examples, operation of the controller to run (run-to-run controllers) as an offset to these faults, to 30 to correct this situation by adjusting the Tools menu, even if only adjustment can not solve the problem. 这样,代替将工具返回到可接受的操作条件,工具继续在后来的晶片中引入偏差或继续加工有缺陷的晶片,由此导致额外的浪费。 Thus, instead of the tool will be returned to acceptable operating conditions, the tool offset is introduced in the subsequent continued wafer or a defective wafer is further processed, thereby resulting in additional waste.

与运行至运行控制相对照,故障检测监视工艺设备参数和晶片属性 In contrast to the running operation and control, fault detection and monitoring parameters of the wafer process equipment properties

(attributes),以便检测工具和晶片缺陷或故障状况。 (Attributes), and detection means for wafer defect or fault condition. 故障检测系统在工艺设备操作期间收集工艺数据并分析该数据以确定不正常或故障。 The fault detection system of process data collected during the operation of the process equipment and analyzes the data to determine abnormality or malfunction. 5如果检测到故障,故障检测系统可以具有各种反应方法。 5 If failures are detected, the fault detection system may have various reaction methods. 例如,该系统可以通知设备操作者或甚至终止工艺设备的执行。 For example, the system may notify the operator of the device or even to perform the termination process equipment.

故障检测适于应付工具或晶片特性有故障的情况,但是对解决工艺偏移不起任何作用。 Failure detection means is adapted to cope with the characteristics of faulty or wafer, the process solution but can not afford any offset effect. 这样,直到工具或工艺失败,故障检测系统保持沉默并允许工具偏移最佳操作条件。 Thus, until the process or the tool fails, the fault detection system remain silent and allow the tool shifted from the optimum operating conditions. io 这样,显然需要一种用于工艺晶片的显著有效的技术。 io Thus, a clear need in the art remarkably effective for a wafer process. 更具体地说, 需要一种能解决工艺偏移和故障状况的系统。 More specifically, a need for a system to solve a fault condition and offset processes.

发明内容 SUMMARY

本发明通过集成运行至运行控制和故障检测技术而解决了上述问 With the integrated operation of the present invention to run control and fault detection techniques to solve the above Q

15 题。 15 questions. 具体而言,可以使用运行至运行控制器和故障检测系统和制造执 Specifically, the execution controller may be used to run and fault detection system and manufacturing execution

行系统相结合以处理工艺半导体晶片和其它对象。 In-line systems combined treatment process semiconductor wafers and other objects. 首先,根据本发明的一个以上的实施例,运行至运行控制器从制造执行系统接收一个菜单以控制一个工具。 First, according to one or more embodiments of the present invention, a run to run controller receives a tool from the menu to control the manufacturing execution system. 这个菜单包括用于获得一个或多个目标晶片特性的设定点。 This menu includes means for obtaining one or more target wafer properties setpoint. 这样,通过使用故障检测系统和/或传感器测量包括故障 Thus, by using fault detection systems and / or sensor measurements comprise failure

20状况的加工属性,监视晶片加工。 20 process attribute condition monitoring wafer processing. 这些加工属性从故障检测系统传送到运行至运行控制器。 The fault detection process attribute transmitted from the system controller to run to run. 结果是,可以根据加工属性由运行至运行控制器修改菜单的设定点,以便保持目标晶片特性,除了被故障检测系统检测到故障状况的情况之外。 As a result, the properties can be modified according to the processing by the run to run controller setpoint menu, so as to maintain the target wafer properties, in addition to detecting a fault condition is detected the system fault condition.

在另一(或平行的)实施例中,也可以«&^取加工晶片*这:个菜 In another (or parallel) embodiment, may also be «^ & * This wafer processing taken: a dish

25单包括用于获得一个或多个目标晶片特性的至少一个设定点。 25 includes means for obtaining a single or more target wafer properties of the at least one setpoint. 该技术还包括测量晶片特性和检测表示故障状况(例如晶片或设备故障)的状况。 The technical characteristics and further comprises measuring a wafer condition detecting a fault condition (e.g., a wafer or device failure) of. 如果没检测到故障状况,则根据被测晶片特性修改菜单的设定点,以便保持目标晶片特性。 If no fault condition is detected, the set point is modified according to the measured wafer properties menu, so as to maintain the target wafer properties. 在某些实施例中,如果检测到故障状况, In certain embodiments, if a fault condition is detected,

则终止工艺。 The process is terminated.

30 在其它(或平行)实施例中,可以在进行加工之前测量晶片特性。 In other 30 (or parallel) to the embodiments, the measurement may be performed before the processing characteristics of the wafer.

在又一(或平行)实施例中,修改菜单的两个或两个以上的设定点,这些设定点可包括温度、压力、功率、加工时间、和升高位置和材料的流速。 In a further (or parallel) embodiments, two menus modified set point or more, these setpoints may include temperature, pressure, power, processing time, and a raised position and a flow rate of the material.

在另一(或平行)实施例中,可以使用故障检测模型确定表示故障状况的条件范围。 In another (or parallel) embodiment embodiment, the range condition can be used to determine fault detection model indicates a fault condition. 在这些实施例中,可以修改故障检测模型以便作为5参数,由运行至运行控制器修改的菜单的设定点并入。 In these embodiments, the fault detection model may be modified to 5 as a parameter, the set point to modify operation of the controller by the operation menu is incorporated.

附图简述 BRIEF DESCRIPTION

当与附图结合考虑时,参照下面本发明的详细说明能更好地理解本发明的各个目的、特征和优点,其中: When considered in conjunction with the accompanying drawings, reference to the following detailed description of the present invention is able to better understand the objects, features and advantages of the present invention, wherein:

图1是表示可用于执行本发明的至少一部分概念的一部分半导体制10造系统的至少一个例子的硬件方框图; FIG 1 is a diagram showing an example of at least a portion of at least a portion of the semiconductor may be used for implementation of the concept of the present invention produced a hardware block diagram of the system 10 made;

图2表示通过用于制造半导体晶片的图1的半导体制造系统可执行的控制系统的至少一个例子; Figure 2 shows at least one example of a control system by a semiconductor manufacturing system executable of FIG manufacturing a semiconductor wafer;

图3表示可用于控制根据本发明一个或多个实施例的制造工艺的至少一个工艺例子; Figure 3 shows an example of a process at least one or more embodiments of the manufacturing process of the present invention may be used to control;

15 图4是可用于执行本发明的一个或多个实施例的运行至运行控制过 FIG 4 is 15 for performing one or more of the present invention, operation of the embodiment to run over control

程的至少一个工艺例子; At least one process example of the process;

图5表示可用于执行本发明的一个或多个实施例的故障检测控制过程的至少一个工艺例子; Figure 5 represents the present invention for performing one or more of the at least one process example of the failure detection control procedure of the embodiment;

图6是表示作为本发明的一个或多个实施例的一部分并与其一起使20用的计算装置的高级方框图;和 FIG 6 is a diagram of the present invention as a part or a plurality of embodiments and embodiments of the high level block diagram of a computing device 20 makes use therewith; and

图7表示可用于储存本发明的一个或多个实施例的计算机执行程序 7 shows a computer to execute a program can be used to store one or more embodiments of the present invention embodiment

的存储介质的一个例子。 Examples of a storage medium.

具体实施例 Specific Example

根据本发明的一个或多个实施例,提供一,术,其使用运行至运25行控制器和故障检测系统并结合制造执行系统用于工艺半导体晶片。 According to one or more embodiments of the present invention, there is provided a, surgery, using a row controller 25 run to run and fault detection system for a manufacturing execution system in combination with a semiconductor wafer process. 更具体地说,该制造执行系统将菜单传送给运行至运行控制器,用于控制工具。 More specifically, the MES transmits the menu to run to run controller, controlling tool. 这个菜单包括用于获得一个或多个目标晶片特性的设定点。 This menu includes means for obtaining one or more target wafer properties setpoint. 此外,故障检测系统通过测量加工属性来监视晶片加工,其中加工属性包括故障状况和晶片特性。 Further, the fault detection system is monitored by measuring the wafer processing process attribute, wherein the fault condition comprises the process attribute and wafer characteristics. 运行至运行控制器根据加工属性(从故30障检测系统以及例如其它信息收集源接收到的)修改菜单的设定点, 以便保持目标晶片特性,除了由故障检测系统检测到故障状况的情况之外。 Moves to operation of the controller (it receives from the fault detection system 30, and other information such as the source to collect) modifies the set point in accordance with the process attribute menu, so as to maintain the target wafer properties, in addition to fault detection system is detected by the fault condition of outer.

图1示出了表示可用于执行本发明的至少一个或多个发明的半导体 Figure 1 shows a representation of the semiconductor of the present invention may be used to perform at least one or more of the invention

制造系统100的一部分的硬件方框图的至少一个例子。 At least a portion of the example of a hardware block diagram of a manufacturing system 100. 如图1所示, As shown in Figure 1,

除了其它组件之外,半导体制造系统ioo包括故障检测系统iio、运行 In addition to other components, including semiconductor manufacturing system fault detection system ioo the IIO, running

5至运行控制器120和一件或多件工艺设备或工具150、这些组件的都通过网络130互连。 5 to an operating controller 120 and one or more pieces of process equipment or tool 150, these components are interconnected via a network 130. 如上所述,故P豪检测系统IIO用于监视一个或多个工具150和晶片,目的是为了检测故障状况。 As described above, the P ho IIO detection system for monitoring one or more tool and the wafer 150, the purpose is to detect a fault condition. 运行至运行控制器120 用于修改工具菜单,目的是为了提高制造效率。 Run to run the controller 120 to modify the Tools menu, the purpose is to improve the manufacturing efficiency. 尽管图1示出了作为分离的或独立的组件的故障检测系统110和运行至运行控制器120,但 Although FIG. 1 shows a fault detection system separate or independent components 110 and 120 run to run controller, but

io 是本发明的一个或多个实施例企图在单个计算节点(computingnode) 执行故障检测系统110和运行至运行控制器120。 io one or more embodiments of the present invention, attempted execution of the fault detection system 110 and the controller 120 moves to run on a single computing node (computingnode).

除了运行至运行控制器120和故障检测系统110之外,本发明的一个或多个实施例期望在由一个或多个工具150刚刚加工之前或之后, 任何数量的计量工具或传感器190可设置在用于测量晶片特性的一个 In addition to running operation controller 120 and to fault detection system 110 outside the one or more desired embodiment of the present invention is carried out before the tool 150 by one or more immediately or after processing, any number of metrology tools or sensor 190 may be disposed measuring a characteristic for wafer

15或多个工具150的每个的上游或下游。 Upstream or downstream of each of the plurality of tools 15 or 150. 如果使用的话,计量工具190 可经过网络130连接到系统100的其余部件上。 If used, the metrology tool 190 may be connected to the remaining components of system 100 via network 130. 同样,还可从上游或馈送工具(例如设置在另一工具上游的工具)接收输入晶片特性。 Likewise, also from the upstream or feeding means (e.g., another tool is disposed upstream of the tool) receiving an input characteristic of the wafer. 这样,可以在先前制造步骤结束时或期间通过在其它工具上的传感器测量这些特性并传送,以便在当前工具中使用。 In this way, measured at the end of the previous step or during manufacture by a sensor on the other tools and transmits these characteristics, for use in the current tool. 这种计量工具190的例 This embodiment of the metrology tool 190

20 子包括由加利福尼亚的San Jose的KLA-Tencor提供的RS-75TM。 20 promoters include RS-75TM provided by San Jose, California KLA-Tencor.

一个或多个工具150可以是可用于加工晶片以便产生预定输出的任何数量的不同类型的工具。 One or more tools 150 may be used to process a wafer to produce any number of predetermined output of the different types of tools. 例子包括CMP、光刻、淀积、或刻蚀工具, 等等。 Examples include the CMP, photolithography, deposition, or etch tool, and the like. 在本发明的一个或多个实施例中, 一个或多个工具可包括控制器152、任何数量的工艺腔室154、和晶片测量子系统156。 In one or more embodiments of the present invention, one or more tools may include a controller 152, any number of process chambers 154, 156 and wafer measurement subsystem. 如下面的 Such as the following

25更详细的说明,控制器152利用来自故障检测系统110和运行至运行控制器120的信息加工晶片。 25 described in more detail, to the information processing controller 152 of the wafer 110 by operation of the controller 120 and the operation from the fault detection system. 在操作中,输入晶片160首先移动到工艺腔室154中。 In operation, the wafer 160 is first moved to enter the process chamber 154. 在那里,加工晶片,然后移出该工具。 There, wafer processing, and then out of the tool. 这些加工腔室的例子包括双等离子体刻蚀腔室和CMP抛光腔室。 Examples of such processing chambers include bis plasma etch chamber and a CMP polishing chamber.

在晶片加工之前、期间和/或之后,使用晶片测量子系统156测量 Prior wafer processing, during and / or after, using a wafer measurement subsystem 156 measures

30晶片特性。 30 wafer characteristics. 这些特性取决于待讨论的工具(一个或多个)的类型,并且可包括膜厚、均匀性等。 These characteristics depend on the type of tool (s) to be discussed, and may include film thickness, uniformity and the like. 晶片测量子系统156可包括能够在加工期间实时测量晶片参数的原位传感器。 Wafer measurement subsystem 156 may include a sensor capable of in-situ real-time measurement of parameters of a wafer during processing. 同样,晶片测量子系统156可包括位于加工腔室154内或附近的集成的在线的(inline)传感器,用于近似实时测量。 Similarly, measurement subsystem 156 may include a wafer positioned within the process chamber 154 or in the vicinity of the integrated online (inline) sensors, used to approximate the real-time measurement. 原位传感器的例子包括由加利福尼亚的Santa Chra的应用材料股份有限公司提供的原位可移去监视器(In Situ Removal 5 Monitor)。 Examples include a position sensor provided in situ by the application of California Santa Chra removable monitor Materials Co., Ltd. (In Situ Removal 5 Monitor). 集成或在线式传感器的例子包括与计量技术集成一体的工具(例如,由Rehovot的Nova测量仪器有限公司提供的Nova 2020™, 由加利福尼亚的Santa Clara的Nanomertric提供的Israel或Nano 9000™)。 Examples of integrated or on-line sensors including integration with integral measurement technology tools (e.g., provided by Nova Measuring Instruments Ltd. of Rehovot Nova 2020 ™, supplied by Nanomertric Santa Clara, California or Israel Nano 9000 ™).

一般来说, 一个或多个工具160根据工艺菜单或者换言之,根据执io行加工结果所需要的一组预定工艺参数在输入晶片.160上进行操作。 Generally, one or more tools 160 according to the recipe or in other words, in accordance with a predetermined set of process parameters io perform row processing results required to operate on the input wafer .160. 例如,典型的菜单可表示用于实现预定输出所需的任何数量的一个或多个设定点。 For example, a typical menu for realizing the desired number of any one or more predetermined output setpoint. 这样,菜单可识别所需的温度、压力、功率、加工时间、 升高位置和产生特殊晶片结果所需要的材料的流速。 Thus, the menu may identify a desired temperature, pressure, power, processing time, flow rate raised position and generating special results desired wafer material. 此外,其它特性也可包含在内。 In addition, other properties may be included. 根据本发明的一个或多个实施例,当需要时,控制器15 152利用从例如上游计量工具接收的信息和一个或多个工具150的先前操作或运行修改这些菜单。 According to one or more embodiments of the present invention, when necessary, for example, the controller 15152 from an upstream metrology tool using the received information and the previous run or operate one or more tools 150 modify these menus. 这样,可以沿着在加工之前的先前运行的结果将输入晶片的测量膜厚提供给控制器152。 Thus, the input thickness of the wafer is measured along a result of a previous run before the processing to the controller 152. 然后,可由控制器152使用这个信息修改工艺菜单的一个或多个设定点,以便提高制造效率。 Then, the controller 152 may use one or more set points of the menu information modification process, in order to improve the manufacturing efficiency.

20 在加工期间,晶片测量子系统156可用于测量任何数量的晶片特性。 20 During processing, the wafer measurement subsystem 156 can be used to measure any number of characteristics of the wafer. 此外,还可以在刚刚加工之前或之后测量晶片特性。 In addition, the wafer may also be measured after or just before processing characteristics. 在本发明的一个或多个实施例中,可以使用子系统156检测加工的完成(例如经过结束点检测等)。 In one or more embodiments of the present invention may be used to complete the detection processing subsystem 156 (e.g. through end point detection). 一旦加工完成,将晶片从工艺室154移出到例如下游工具。 Once processing is completed, the wafer is removed from the process chamber 154, for example, to a downstream tool. 由晶片测量子系统156或其它计量工具通过完成工艺收集的任何 A measurement subsystem 156, or other wafer metrology tools to complete the process of collecting any

25晶片特性可以输送给下游工具。 Characteristics of the wafer 25 can be fed to a downstream tool. 同样,测量的特性可以输送给控制器152、故障检测系统li0和/或运行至运行控制器120,用于修改将来的运行。 Similarly, the measured characteristics may be supplied to the controller 152, li0 fault detection system and / or run to run controller 120, it is used to modify future operation. 如下面所讨论的,可以分析输送给故障检测系统110和运行至运行控制器120的数据,用于检测任何故障状况和用于修改后来的工艺菜单。 As it can be analyzed as discussed below the data supplied to the fault detection system 110 and run to run controller 120, for detecting any fault condition and for modifying the recipe later.

30 参照图2,其中示出了可由半导体制造系统100执行的控制系统200 的一个例子。 30 Referring to FIG. 2, there is shown an example of a semiconductor manufacturing system may be performed by the control system 100 200. 如图2所示,控制系统200包括控制工艺210、故障检测工艺220、运行至运行工艺230和晶片测量工艺240。 As shown, the control system 200 includes a control process 210, a fault detection process 220, process 230 moves to operation 240 and wafer measuring process. 控制工艺210使用例如控制算法等控制一个或多个工具150的操作。 For example, the control process 210 controls the operation of a control algorithm 150 of one or more tools. 例如,控制工艺210可用于选择用于加工晶片的工具或工艺菜单。 For example, controlling process 210 may be used to select menu tools or processes for processing a wafer. 这个工艺菜单可以由工艺工程师输入或下载到系统200中。 This recipe can be input by the process engineer or downloaded into the system 200. 该菜单部分地识别所需输出或5要制造的最终产品,如由任何数量的目标特性所规定的。 The output of the desired menu or partially identify the final products 5 to be manufactured, as defined by any number of target characteristics. 这些目标特性可包括例如将要由CMP工具制造的最终所需膜厚。 These may include, for example, the target characteristic to the final desired thickness of the CMP tool manufactured. 此外,控制工艺210还从例如上游计量工具接收任何数量的晶片预测量值(pre wafer measurements) 214。 Further, the control process 210 also receives predicted magnitude of any number of wafers (pre wafer measurements) 214, for example, upstream from the metering tool. 对于控制工艺210这些测量值描述输入晶片的特性,并用于确定菜单设定点,如下所述。 For the control process 210 described properties of these input measurement values ​​of the wafer, and used to determine the set point the menu, as described below.

io 使用这些输入(即菜单212和测量值214),控制'工艺210产生用于实现所需产量的特殊设定点。 io uses these inputs (i.e., menus 212 and 214 measured values), the control process of the '210 generates a set point for achieving the desired special production. 如本领^^普通技术人员公知的,控制工艺210在某些输入基础上使用例如用于预报所需输出的模型分析目标特性和测量值214。 ^^ ordinary skill in the art such as known, for example, the control process 210 uses the model used to predict the desired output characteristic of the analysis target 214 and the measured values ​​on the basis of certain inputs. 在这种情况下,输入目标特性(例如膜厚)和晶片预测量值(例如实际厚度)。 In this case, the target input characteristic (e.g., film thickness) and the wafer predicted values ​​(e.g., actual thickness). 然后,在模型基础上,可以预报获得所需 Then, based on the model, you can obtain the required forecast

15目标特性所需的设定点。 15 objective characteristics desired set point. 在本发明的一个或多个实施例中,可以通过例如工艺工程师等在系统初始化阶段输入或执行模型。 In one or more embodiments of the present invention, for example, may enter execution model or the like by the process engineer in the system initialization phase. 一般来说,可以使用任何合适的半导体晶片制造模型。 In general, any suitable semiconductor wafer manufacturing model.

在使用时,在工艺之前、期间和/或之后由晶片测量系统240收集任何数量晶片特性的测量值。 In use, before the process, and / or after the measurement value of the wafer 240 to collect any amount of the characteristic of the measuring system during wafer. 然后将这些特性输送给运行至运行工艺 These characteristics are then delivered to the process run to run

20 2 30。 20230. 运行至运行工艺230分析由晶片测量系统240测量的晶片特性并确定对工具的工艺菜单是否做任何修改(例如经过控制工艺210),以便提高效率。 Analysis process 230 moves to operating characteristics of the wafer 240 from the wafer measurement system and a measurement tool for determining whether any modification to the recipe (e.g. via control of the process 210), to improve efficiency. 为了说明,如上所述,在CMP抛光操作中,使用时抛光垫很容易磨损。 To illustrate, as mentioned above, the CMP polishing operation, the polishing pad is easy to wear during use. 结果是,磨损的抛光垫比新抛光垫需要更多的抛光时间来获得特定膜厚。 As a result, worn polishing pad polishing pad requires more time than the new polished to obtain specific film thickness. 当需要时(例如当抛光垫已经磨损),运行至运行 When required (for example, when the polishing pad has worn), run to run

25程序230可以用于识别需要更多时间和指示抛光工具,由此增加其抛光时间。 25 may be used to identify the program 230 requires more time and indication polishing tool, thereby increasing the polishing time. 这样,运行至运行工艺分析的结果可以输送给控制工艺210, 用于访问后来操作中的工艺偏移。 Thus, the process moves to the results of analysis can be fed to the control operation of the process 210, then the process for accessing the offset operation.

根据本发明的一个或多个实施例,故障检测工艺220被系统200使用以便检测故障状况。 Embodiment, the fault detection process 220 is using the system 200 according to one or more embodiments of the present invention to detect a fault condition. 如下面更详细的说明,在工艺期间故障检测工 As described in more detail below, during the process of fault detection station

30艺220使用被例如原位或集成传感器收集的数据。 30 Arts 220 using the data collected by the sensors or integrated in-situ for example. 一个或多个实施例预见到为了这些目的而产生故障检测标记。 One or more embodiments foreseen for these purposes failure detection flag. 具体而言,这个标记可以由控制工艺210利用以便确定是否对工艺菜单进行调整。 Specifically, the tag 210 may be controlled by using the process to determine whether to adjust the recipe. 例如,故障检测标记和由运行至运行工艺230所产生的分析结果输送给控制工艺210并分析以确定是否改变工艺菜单,其中故障检测标记和由运行至运行程序230所产生的分析结果一起构成由本发明使用的至少一些加工5属性。 For example, fault detection mark and the analysis result by the runtime to run the process 230 generated is supplied to the control process 210 and analyzed to determine whether to change the recipe, wherein the fault detection mark and the analysis result by the runtime to run the program 230 generated together constitute the present at least some of the processing 5 properties for use herein. 例如,.运行至运行控制工艺230产生对菜单的修改和故障检测工艺220识别是否应该或不应该执行修改的情况。 For example, Run to Run 220 where the control process 230 generates a menu for identification and modification process whether fault detection should or should not perform modification. 相应地,只有在适当的时候(即,当工具菜单以修复可解决的问题或无效性的方式调整时),控制程序210可以修改菜单。 Accordingly, only when appropriate (i.e., when the tool is to fix the problem solvable menu or invalidity adjusted), the control program 210 can modify the menu. 这样,系统200能够在"故障"条件下制止执行根据运行至运行技术产生的修改。 Thus, the system 200 can be modified to stop operation performed in accordance with techniques to run at "fault" condition.

10 图3表示可用于控制本发明的制造工艺的工艺的.至少一个例子。 10 Figure 3 shows at least one example of a manufacturing process may be used to control the process of the present invention. 参见图3 (结合图1),至少在本例中,加工开始于测量晶片特性的步骤(步骤304)。 Referring to Figure 3 (in conjunction with FIG. 1), at least in the present embodiment, the processing starts at a step of measuring wafer properties (step 304). 具体而言,可以在它们到达工具(例如一个或多个工具150)之前测量预加工晶片特性。 Specifically, the tool can be reached (e.g., one or more tools 150) in their pre-processed prior to measuring wafer properties. 如上所述,可使用位于上游工具中的任何后测量传感器,原位传感器、集成或在线式传感器、或者其它类 As described above, may be used after any measurement sensor positioned upstream of the tool in situ sensors integrated or on-line sensors, or other types

15似装置。 Like means 15. 此时可以测量任何数量的晶片特性,包括例如膜厚、均匀性、 临界尺寸、颗粒数量等。 At this time, the wafer may be measured in any number of characteristics, including for example the film thickness, uniformity, critical dimension, the number of particles and the like. 测量这些晶片特性之后,将数据输送给运行至运行控制器120 (步骤308)。 After measuring the properties of these wafer, the operation moves to the data supplied to the controller 120 (step 308).

结合测量数据向运行至运行控制器120的传输,相应晶片被输送给具有任何相关工艺信息的一个或多个工具150 (步骤312)。 Binding to transmit measurement data to the runtime operation of the controller 120, the wafer is conveyed to a respective one or more tools have any information related to the process 150 (step 312). 此外,制 In addition, the system

20造执行系统(MES)输送涉及和识别特定菜单的信息,用于加工晶片, 其中这些特定菜单将被一个或多个工具150使用。 20 manufacturing execution system (MES) and relates to the identification information conveying a specific menu, for processing a wafer, wherein the specific menu is 150 uses one or more tools. 如本领域普通技术人员公知的,MES可识别将要使用的特定室、任何工艺序列、该工具中的传送信息、设置等。 As those of ordinary skill in the art known, MES may identify a particular room to be used, any process sequence information is transferred in the tool, and the like is provided. 同样,MES通常用于自动化、集成和谐调执行或产生输出产品所需要的每个工艺和资源。 Similarly, MES typically used for automation, integration, and harmonized execution resource and each process or to produce the desired output product.

25 接下来,一个或多个工具150执行其制造工艺(步骤316)。 25 Next, the tool 150 performs one or more of its manufacturing process (step 316). 更具体地说, 一个或多个工具150根据从MES接收的信息并结合由运行至运行控制器120和/或故障检测系统110提供的信息加工晶片。 More specifically, one or more tools 150 based on information received from the MES and the combined information provided from the operation processing to wafer 120 and / or the fault detection system controller 110 runs. 如下所述,在没有故障时可使用从运行至运行控制器120接收的信息修改或调整由MES提供的菜单。 As described below, when no faults may use information received from the operation controller 120 to modify or adjust operation menu provided by the MES.

30 在进行工艺期间,如下面将要描述的,故障检测系统110监视工具的工具故障或工具缺陷和晶片的晶片特性故障(步骤320)。 30 is performed during the process, as will be described below, tool malfunction or failure characteristic wafer defects and wafer tool failure detection system monitoring tools 110 (step 320). 由故障检测系统进行的分析,或者换言之,是否检测到故障,输送给运行至运 Analysis performed by the fault detection system, or in other words, whether a fault is detected, supplied to the run to run

行控制器120 (步骤324)。 Row controller 120 (step 324). 例如,故障检测标记可传输到控制器120 (从故障检测系统110),用于识别是否存在故障。 For example, the fault detection flag may be transmitted to the controller 120 (from the fault detection system 110) for identifying whether a fault. 根据本发明的一个或多个实施例,然后使用这个信息确定根据运行至运行技术应修改(和5不修改)菜单的那些情况。 According to one or more embodiments of the present invention, and then use this information to determine where those technologies should be modified to run (and do not modify 5) operating according to the menu.

在已经完成执行工具工艺之后,.在后工艺测量步骤中测量晶片(步骤328)。 After the process has completed execution tool, measurement of the wafer (step 328) after the measuring step in the process. 在本发明的一个或多个实施例中,使用工具上的集成传感器进行测量。 In one or more embodiments of the present invention, a sensor on the integrated measurement tool. 同样,其它类型的传感器也可以使用。 Similarly, other types of sensors may also be used. 然后用这个信息修改随后的菜单,如这里所述的。 This information is then used to modify the subsequent menu, as described herein. io 根据本发明的一个或多个实施例,并如上所述,运行至运行控制器120使用后工艺测量值并结合故障检测信息修改工具菜单。 io According to one embodiment of the present invention, one or more embodiments, and as described above, to run the measurement process 120 using the controller to run in conjunction with failure detection information editing tools menu. 具体而言, 首先确定工艺是否已经经历工具或晶片特性故障(步骤332)。 Specifically, the process first determines whether the tool has experienced failure or characteristics of the wafer (step 332). 例如, 如下面更详细说明的,将由故障检测系统如110产生的故障检测标记(例如表示存在于晶片和/或工具上的一个或多个状况的一个或多个15数字标识)与由例如运行至运行控制器120可接受的值范围相比较。 For example, as described in more detail below, by the fault detection system 110 generates a fault detection marker (e.g. indicates the presence of a wafer and / or a plurality of conditions on the tool 15 or one or more digital ID), for example, by the operation range compared to operation of the controller 120 is acceptable.

如果该标记是不可接受的,则发生故障。 If the flag is not acceptable, a fault occurs. 如果故障已经发生,则从发生工具故障的运行收集到的运行后工艺测量值不能用于修改随后的菜 If a failure has occurred, from the running tool failure occurs to the operation of the process of collecting the measured values ​​can not be used to modify subsequent dish

单(步骤336)。 Mono (step 336). 此外,工艺可以完全终止。 In addition, the process can be completely terminated. 另一方面,如果程序确定没有发生故障,则在本发明的运行至运行技术下修改菜单(步骤340)。 On the other hand, if the program determines that no failure occurs, the operation of the invention in an operating technology Edit menu (step 340) to.

20通过这种方式,在没有发生工具故障的情况下修改菜单。 20 In this way, the Edit menu in the case where the tool failure does not occur.

图4表示可用于根据本发明的一个或多个概念用于进行运行至运行控制过程的工艺的至少一个例子。 FIG 4 represents at least one example of a process run to run control procedure for carrying out the invention in accordance with one or more concepts. 首先,测量来自先前工艺或工具的后工艺晶片特性并将其输送给将要在其中进行本发明的运行至运行和故障检测技术的工具(步骤404)。 First, measure the characteristics of the wafer from a previous process or a process tool and to be supplied to the present invention in which the operation is to run the tool and fault detection techniques (step 404). 这些测量值可从上游工具或从位于 These measurements may be located upstream from the tool or from

25上游工艺之后但在当前工具之前的计量工具提取。 After the extraction process, but before the tool 25 upstream of the current measurement tools. 同样,可以在当前工具本身或在任何其它模拟装置或加工前的位置上提取测量值。 Similarly, the measured value can be extracted, or any other position before machining simulation apparatus or on the current tool itself.

在某些情况下,上游测量是无效的。 In some cases, the upstream measurement is invalid. 例如,在一些工具或工艺中测量每个晶片需要太多时间。 For example, some tools or measuring process takes too much time for each wafer. 在这些情况下,不可测量每个晶片或运行操作。 In these cases, the wafer can not be measured for each run or operation. 例如,可以在每个第二或第三运行上进行测量。 For example, measurements may be performed on each of the second or third operating. 因此来自这些 So from these

30晶片的后加工测量在该工艺中是无效的或不考虑的。 Measured wafer 30 after processing is invalid or not considered in the process. 这样,检测上游测量值以确定它们是否是有效的测量(步骤408)。 Thus, measured upstream of the detection value to determine if they are valid measurement (step 408). 如果不是,运行至运行控制器120忽略被测量的上游测量值并使用先前运行的设定点继续加工(步骤432)。 If not, the run to run controller 120 ignores measured values ​​are measured upstream and use set points previously run further processing (step 432). 如果有效,可以在修改工具的加工菜单上使用这些测量值。 If so, these measurements may be used to modify the tool on the processing menu.

根据本发明的至少一些实施例,和如下面更详细说明的,对菜单的5修改可以作为各种变型分为故障检测模型的因子。 According to at least some embodiments of the present invention, and as described in more detail below, modifications of the 5 menu as various modifications may factor into the fault detection model. 在这些实施例中, 由运行至运行控制器120进行的任何菜单设定点变化被输送给故障检测系统110,该故障检测系统IIO利用这菜单修改识别新的故障状况范围。 In these embodiments, any menu operation performed by the operation of the controller 120 to change the set-point is supplied to fault detection system 110, the fault detection system using this menu IIO modify the new condition ranges fault identification. 通过这种方式,即使由运行至运行控制器120改变了菜单,故障检测系统110也可用灵敏的方式操作(即调整故障状况的范围,以便io 适应任何修改的菜单设定点)。 In this manner, even if the operation of the menu to change the operation of the controller 120, the fault detection system 110 may also be sensitive manner (i.e., the range of adjustment of the fault condition, in order to accommodate any changes in the menu io setpoint).

应该理解,前面已经借助例子介绍了实施例的具体步骤及其顺序, 本发明还考虑了其它的附加、省略和配置。 It should be appreciated that the foregoing examples have been described by means of specific steps and sequence of the embodiments, the present invention also contemplates other Additions, omissions and configuration. 例如,可以想象由运行至运行控制器接收到的所有加工属性首先通过(或开始于)故障检测系统。 For example, it is conceivable to operation received by the operation controller first of all by the process attribute (or starts) a fault detection system. 在这些实施例中,如果检测到故障,则不是接收任何加工属性, 15而是运行至运行控制器只接收例如故障警报。 In these embodiments, if a fault is detected, it is not receiving any process attribute, the controller 15 but only receives run to run, for example, a failure alarm.

根据本发明的一个或多个方面,并如上所述,在用于后来运行的运行至运行工艺中不考虑被已经经历工具故障或已经经历晶片特性故障的工具加工的晶片或运行。 According to one or more aspects of the present invention, and as described above, the operation for subsequent operation to run the process is not considered to be the tool has experienced failure or failure characteristic has undergone wafer processing tool or a wafer run. 这样,在继续执行之前考虑关于加工工具的故障检测信息(步骤416)。 In this way, consider the failure detection information about the machining tool (step 416) before proceeding. 具体而言,如果在先前运行中检测到缺20陷或故障状况,则不修改工具的菜单(步骤412)。 Specifically, if it is detected in the previous run to 20 missing defect or fault condition, the tool is not modified menu (step 412). 此外,可以显示错误信息,并完全暂停加工。 In addition, it can display an error message, and fully suspend processing.

如果在先前运行中没有检测到故障,执行对数据的任何所需转换(步骤420)。 If no fault is detected in the previous operation, performing any required conversion of the data (step 420). 例如,由传感器所读取的原始数据可以转换成更有意义的形式。 For example, the original data read by the sensors can be converted into more meaningful form. 作为一个例子,不均匀参数可要求大量测量值之间的比。 As an example, non-uniform ratio between the parameters measured value of a large number of requirements. 这25样,在本例中,计算每个测量值的比。 25 like this, in the present embodiment, the ratio of each measured value is calculated. 同样,膜厚的平均值将要求转换以平均所有的测量厚度。 Similarly, the average thickness would require conversion to an average thickness of all the measurements. 而且,对某些测量值完全可以不必进行转换。 Moreover, for some measurements may not necessarily be completely converted.

进行任何转换(如果需要的话)之后,执行控制工艺算法,用于估计下一个预报输出(步骤424)。 After any conversion (if necessary), the process control algorithm execution, estimating a prediction for the next output (step 424). 通常来说,该算法利用各种模拟技术、 30工具菜单和涉及输入晶片和先前工艺运行的信息,用于建立将要由该工具预定产生的输出。 Generally speaking, the algorithm using a variety of modeling techniques, and the Tools menu information 30 relates to an input operation of the wafer and the previous process for establishing the output to be generated by the tool is predetermined. 例如,通过利用模型,可以在对应参数如压力、功率、气流等的设定点基础上预报特定输出膜厚。 For example, by using a model, a thickness of a particular output can be predicted based on the set point corresponding to parameters such as pressure, power, etc. of the airflow.

—旦已经由控制算法预报了下一输出,则该输出与规格限 - Dan has been forecast for the next output by the control algorithm, the output specification limits

(specification limits)相比较(步骤428)。 (Specification limits) are compared (step 428). 规格限指示出晶片特性的可接受极限。 Specification limits indicating an acceptable limit of characteristics of the wafer. 如果输出在规格限内(即如果预报的输出处于可接受范5围内),不必修改,并在先前运行中使用的相同设定点可再次使用(步骤432)。 If the output is within specification limits (i.e., if the output is acceptable forecasts range around 5), without having to modify the same set points used in the previous operation, and can be used again (step 432). 另一方面,如果预报的输出超过了规格限,则预报输出与工具的可接受范围相比较(步骤436)。 On the other hand, if the output exceeds the specification limits of the forecast, the forecast output acceptable range of the tool is compared (step 436). 工具的范围描述了工具可实现的能力。 The ability to describe the range of instruments tool that can be achieved. 如果由于工具范围不够而使预报的输出不能处于规格限内,则将不能获得所需结果。 If the output range is not enough because the tool can not be in the forecasts within specification limits, will not achieve the desired result. 在这神情况下,工艺忽略该结果,显示错误信io 息,并例如终止加工(步骤440)。 In this spirit, the process ignores the result, the error message io letters, such as terminating and processing (step 440).

如果预报的输出处于规格限之外但处于工具范围内,则可对工具菜单进行修改(步骤444)。 If the output is outside the specification limits forecasts but within the range of tools, can be modified on the Tools menu (step 444). 尤其是,根据标准模拟技术修改菜单的一个或多个设定点。 In particular, according to a standard analog technology Edit menu or more set points. 在很多情况下,如本领域普通技术人员公知的,这些模型是通过工艺工程师设计的并在设备的初始阶段下载到系统100上。 In many cases, as is well known to those of ordinary skill in the art, and these models are designed by the process engineer the system and downloaded to the device 100 at an initial stage.

15 —旦己经估计了为获得所需产品所需要的调整,执行该工艺(步骤 15-- Once adjusted to have the estimated required to obtain the desired product, the process is performed (step

448)。 448). 通过这种方式,在本发明的一个或多个实施例中,控制算法利 In this manner, in one or more embodiments of the present invention, the control algorithm Lee

用一个或多个目标晶片特性(即所需输出)、测量的输入晶片特性和对工具菜单的修改,如由运行至运行和故障检测技术确定的,以便有效 With one or more target wafer properties (i.e. the desired output), the measured input characteristics of the wafer and modifications of the Tools menu, as indicated by the run to run and determines the fault detection techniques to effectively

地制造半导体晶片。 The semiconductor wafer manufactured. . .

20 图5表示了可用于执行根据本发明的各一个或多个实施例的故障检测控制工艺的工艺的至少一个例子。 20 FIG 5 shows at least one example of each operable to perform in accordance with the present invention, a plurality of fault detecting process or the control process of the embodiment. 首先,故障检测系统110识别出在工具或工艺上执行的菜单(步骤504)。 First, recognize that fault detection system 110 in the menu execution tools or processes (step 504). 根据正在使用的菜单,建立或选择一个故障检测模型(步骤508)。 The menu is used to create or choose a fault detection model (step 508). 如本领域普通技术人员所公知的,故障检测模型可用于确定表示故障状况的条件范围。 As one of ordinary skill in the known fault detection model can be used to determine fault conditions represent the range of conditions. 这样,使用 In this way, the use of

25 了具体涉及该菜单的模型。 25 involving a specific model of the menu.

选择故障检测模型之后,制造工艺开始执行,在这个期间内,传感器实时收集晶片特性如膜厚、均匀性等。 After selecting a fault detection model, the manufacturing process is started within this period, the sensor wafer collected in real time characteristic such as the film thickness, uniformity and the like. 作为选择,可以在程序之前或之后收集晶片特性。 Alternatively, the wafer may be collected after or before the program characteristics. 这些特性与故障检测模型相比较,产生故障检测标记或故障事件(即触发器)。 These properties compared with the model fault detection, a fault or failure event detectable label (i.e., flip-flop). 如本领域普通技术人员公知的,任何 As it is known to those of ordinary skill in the art, and any

30 数量的方法都可用于产生故障检测标记。 30 number of methods may be used to generate a fault detection flag. 例如,可以利用任何统计学工艺控制、神经网络、或以分析技术为基础的模型等。 For example, using any statistical process control, neural network, or the like to the model-based analysis techniques. 该标记表示由该工具产生的晶片的最优化。 This flag indicates to optimize generated by the tool wafer. 这样,该标记可以与预定值相比较以便表示工具故障或工具缺陷。 Thus, the marker may be compared to a predetermined value in order to represent the tool or tool failure defect. 如上所述,在最优化晶片制造中这个标记构成由本发明使用的晶片工艺属性的至少一部分。 As described above, the optimization of the manufacturing process wafer constituting the wafer mark by using the attributes of the present invention at least a portion. 例如,也如上所述, For example, as described above,

运行至运行控制器120可忽略来自于运行中,由已经经历故障状况的5工具制造的被测晶片的特性。 Run to run the controller 120 can be ignored from the operation, the measured characteristics of the wafer has been subjected to a fault condition produced by the tool 5.

如上所述,本发明的至少一些实施例考虑对由运行至运行控制器120所做的菜单的修改分解成故障检测模型因子,作为独立参数。 As described above, according to the present invention, at least some embodiments contemplate modification of the operation of the controller 120 moves to a menu made fault detection model is decomposed into factors, as independent parameters. 通过这种方式,故障检测系统110可重新确定故障状况的范围,以便容纳菜单改变,由此提高系统灵敏度。 In this manner, fault detection system 110 may re-determine the scope of a fault condition, in order to accommodate the change menu, thereby increasing system sensitivity. io 更具体地说,可以根据并考虑菜单设定点的改变或修改重新确定故:障状况边界。 io More specifically, according to the menu and consider the set point change or modify the redetermined so: - impaired boundary. 特别是,通过根据菜单设定点的修改调整故障状况范围, 可以在故障检测模型中实施更窄的故障状况范围。 In particular, the range of fault conditions by adjusting the set point in accordance with the edit menu, can be implemented more narrow range of fault conditions in the fault detection model. 在本发明的至少一些实施例中,故障状况范围可根据到菜单设定点的固定距离来设置。 In at least some embodiments of the present invention, the fault condition may be set according to a fixed range of distance from the set point the menu. 这样,在这些实施例中,对设定点的修改导致对故障状况范围的相应 Thus, in these embodiments, the modification of the set point results in a corresponding range of fault conditions

15 修改。 15 modifications.

作为例子,在单维情况下,用于获得特定目标特性的固定菜单设定点设置在初始值(例如五十个单位)。 By way of example, in the one-dimensional case, the target characteristic for obtaining a specific fixed set point the menu at an initial value (e.g. fifty units). 根据涉及这个菜单的故障检测模型,故障状况边界可以初始地设置在给定范围(例如四十八和五十二个单位)。 According to this menu relates to fault detection model, a fault condition may be initially provided in a boundary of a given range (e.g. forty-eight and fifty-two units). 这样,在给定范围(例如五十二以上和四十八个单位以下) 20以外的实际晶片特性测量值导致故障状况。 Thus, in a given range (e.g. fifty-two forty eight units above and below) the actual characteristic measured value other than the wafer 20 causes a fault condition. 在这些故障状况下,如上所述,加工例如可以终止。 Under these fault conditions, as described above, for example, the processing may be terminated.

在加工期间,对菜单设定点的修改可以由运行至运行控制器120来实施,以便解决工艺输出偏移。 During processing, the modification of the operation of the menu set point may be implemented by the controller 120 to run, in order to solve the output offset process. 这样,在上述例子中,运行至运行控制器120可增加菜单设定点(例如从五十增加到五十三个单位),由此 Thus, in the above example, the menu may be increased to 120 run operation of the controller set point (e.g. increased from fifty fifty three units), whereby

25必然导致故障状况。 25 will inevitably lead to a fault condition. 为解释正常运行至运行修改,一种解决方案是增 Run revised to explain to normal operation, one solution is to increase

加故障状况的范围(例如增加到四十三和五十七个单位)。 Plus a range of fault conditions (eg increased forty-three and fifty-seven units). 但是,这种解决方案使故障检测能力不敏感。 However, this solution is not sensitive to the fault detection capability. 为了解决这个问题,本发明的实施例考虑将修改的设定点合并到故障检测模型中,以便在到设定点的距离的基础上产生故障状况边界。 To solve this problem, embodiments of the present invention contemplate the combined modified setpoint fault detection model in order to produce a fault condition on the basis of the boundary of the set-point distance. 通过各种方式,通过集成运行至运行 A variety of ways, through integrated operation to run

30技术与故障检测概念不会危及系统灵敏度。 30 failure detection technique and system is not compromised sensitivity concept. 这样,在本例中,故障状况的范围将再设置在五十一到五十五。 Thus, in the present embodiment, the range of fault conditions is provided Jiangzai fifty-one to fifty-five. 集成的多维情况是相同的。 The integrated multi-dimensional situation is the same. 在这些情况下,非故障状况区域可以视为到多维设定点的坐标的距离。 In these cases, non-fault conditions can be regarded as area from the point to multi-dimensional set of coordinates. 当由运行至运行控制器120修改确定菜单中的设定点的一个或多个坐标时,故障状况边界的范围可以重新定义为操作菜单参数的函数。 When determining a set point 120 to modify one or more of the menu by the runtime to coordinate operation of the controller, the range of fault conditions may be redefined boundary as a function of operating parameters menu. 5 此外,在多个输入、多输出情况的至少一些实施例中,预报的输出 Example 5 In addition to at least some embodiments, a plurality of input, multi-output case, the output prediction

值和实际测量的输出值之间的距离可用作故障检测的度量标准 The distance between the output and the actual measured values ​​can be used as a metric for fault detection

(metric)。 (Metric). 这样,预报值和实际值之间的差别可用于确定故障状况边界。 Thus, the difference between the forecast and actual values ​​may be used to determine the boundaries of a fault condition.

图6,总称为640,表示图2的系统100的潜在任何组件的内部硬 6, always referred to 640, the internal hard any potential components of system 100 of FIG. 2

|0 件的一个例子的方框图,其例子包括任何数量的不同类型的计算机, 如由加利福尼亚的Santa Clara的Intel公司制造的具有奔腾,基的处理器的计算机。 | A block diagram showing an example of a 0, a computer having a Pentium-based processor and examples thereof include any number of different types of computers, such as made by Intel of Santa Clara, California company. 总线656用作互连系统100的其它部件的主信息链路。 Bus 656 serves as the other components of the interconnect system 100 main information link. CPU658是该系统的中央处理单元,进行执行本发明的工艺以及其它程序所需的计算和逻辑操作。 A central processing unit CPU658 the system performs calculations and logic operations required to execute the process of the present invention and other programs. 只读存储器(ROM) 660和随机存取存储 A read only memory (ROM) 660 and random access memory

!5 器(RAM) 662构成该系统的主存储器。 ! 5 device (RAM) 662 constitute the main memory of the system. 磁盘控制器664将一个或多个磁片驱动器连接到该系统总线656。 Disk controller 664, one or more diskette drives connected to the system bus 656. 这些磁盘驱动器例如是软盘驱动器670、或CD ROM或DVD (数字视频盘)驱动器666,或者内部或外部硬盘驱动器668。 The magnetic disk drive 670, for example, a floppy disk drive, or CD ROM or DVD (Digital Video Disc) drive 666, or internal or external hard drive 668. CPU658可以是任何数量的不同类型处理器,包括由Intel公司或Illinois的Schaumberg的摩托罗拉公司制造的处理器。 CPU658 can be any number of different types of processors, including processors made by Intel Corporation or Illinois company Motorola of Schaumberg.

20 存储器/存储装置可以是任何数量的不同类型存储装置,如DRAM和SRAM以及各种类型的存储装置,包括磁性和光学介质。 20 memory / storage devices may be any number of different types of storage devices, such as DRAM and SRAM as well as various types of storage devices, including magnetic and optical media. 此外,存储器/存储装置还可采用传输的形式。 In addition, memory / storage devices may also take the form of transmission.

显示接口672连接显示器648和允许来自总线656的信息显示在显示器648上。 The display interface 648 and a display 672 connected to the bus 656 from the permission information is displayed on the display 648. 显示器648也可以是任选的附件。 Display 648 may be an optional accessory. 与外部装置如上述该 And the external device as described above

25系统的其它部件的通信是例如利用通信端口674实现的。 Other components of the communication system 25, for example, using a communication port 674 achieved. 例如,端口674可以与连接到计量工具190的总线/网络连接。 For example, port 674 may be connected to the metrology tool 190 of a bus / network connection. 光纤和/或电缆和/或导体和/或光学通信(例如红外等)和/或无线通信(例如射频(RF)等)可以用作外部装置和通信端口674之间的传输介质。 Fibers and / or cables and / or conductors and / or optical communication (e.g., infrared, etc.) and / or wireless communication (eg, radio frequency (RF), etc.) may be used as a transmission medium between the external devices and communication port 674. 外围接口654连接键盘650和鼠标652,允许输入数据传输到总线656。 The peripheral interface 654 connected to a keyboard 650 and mouse 652, allows the input data to the bus 656. except

30 了这些部件之外,控制系统还可以任选地包括红外发射器678和/或红外接收器676。 Addition to these components 30, the control system may also optionally include an infrared transmitter 678 and / or the infrared receiver 676. 在计算机系统结合通过红外信号传输发送/接收数据的一个或多个加工组件/站使用时,可选用红外发射器。 When incorporated in a computer system transmitting / receiving data to one or more processing components / stations using infrared signals transmitted through the infrared emitter can be selected. 代替利用红外发射器或红外接收器,控制系统也可选用低功率无线电通信发射机 Instead of utilizing an infrared transmitter or infrared receiver, the control system can also be used a low-power radio transmitter

680和/或低功率无线电通信接收机682。 680 and / or low-power radio communication receiver 682. 低功率无线电通信发射机传输由制造工艺的组件接收到的信号,并经过低功率无线电通信接收机5接收来自这些部件的信号。 Low-power radio transmitters from the received transmission signal component manufacturing process, and receives signals from the components via the low power radio communications receiver 5.

图7是表示可用于存储计算机可读编码或指令的示意计算机可读存储介质784,其中计算机可读编码或指令包括模型、菜单等。 FIG 7 is a schematic showing a computer for storing computer readable code or instructions readable storage medium 784, wherein the computer readable instructions comprising code or model, menus and the like. 作为一个例子,介质784可由图6中所示的磁盘驱动器使用。 As an example, a magnetic disk drive shown in FIG. 6 medium 784 may be used. 通常,存储介质如软盘,或CDROM,或者数字视频盘将包含例如用于单字节语言的io多字节场所(locale)和用于控制上述系统的程序信息以使计算机执行这里所述的功能。 Typically, a storage medium such as a floppy disk or CDROM, or digital video disk will contain, for example, multi-byte io place (the locale) for single byte language and the program information for controlling the system to cause a computer to perform the functions described herein . 或者,ROM 660和/或RAM662还可用于存储程序信息,这些程序信息用于命令中央处理单元658执行与当前工艺相关的操作。 Alternatively, ROM 660 and / or the RAM662 information may also be used to store programs, program information for instructing the central processing unit 658 performs operations associated with the current process. 用于存储信息的合适的计算机可读介质的其它例子包括磁性、 电子、或光学(包括全息照相)存储器、它们的一些组合等。 Other examples of suitable computer readable media for storing information include magnetic, electronic, or optical (including holographic) storage, some combination thereof and the like. 此外, 15本发明的至少一些实施例考虑计算机可读介质可以是传输型的。 In addition, 15 of the invention into account at least some embodiments of the computer readable medium may be a transmission type.

本发明的实施例考虑用于执行如前面所说明的本发明的不同方面的软件的不同部分,可以位于存储器/存储装置中。 Embodiment of the present invention as contemplated for carrying out various aspects of the different parts of the software of the present invention described above, may be located in the memory / storage device.

通常,应该强调的是本发明实施例的各个组件可以在硬件、软件、 或其组合中实施。 Typically, it should be emphasized that the various components of an embodiment of the present invention may be implemented in hardware, software, or a combination thereof. 在这种实施例中,不同组件和步骤将在硬件和/后20软件中执行,以便实施本发明的功能。 Embodiment, the various components and steps to be performed in hardware, software 20 and / or rear in order to implement the functions of the present invention in this embodiment. 任何目前可得到或将来开发的计算机软件语言和/或硬件部件都可以用在本发明的这些实施例中。 Any computer software language and / or hardware components currently available or later developed can be used in these embodiments of the present invention. 例如,上述功能的至少一些功能可以使用BASIC、 C、 O+或其它编程或脚本(scripting)语言(例如TCL、 Pearl、 Java或SQL)。 For example, at least some of the above functions can be used BASIC, C, O +, or other programming or scripting (Scripting) language (e.g. TCL, Pearl, Java or SQL).

还显然和能够理解这里所述的本发明的具体实施例只是用于表示25本发明的一般原理。 It is also obvious and can be understood specific embodiments of the invention described herein is merely used to indicate the general principles of the invention 25. 本领域普通技术人员可以做各种符合前述原理的修改。 Those skilled in the art may make various modifications in line with the aforementioned principles.

Claims (81)

1、一种使用带有故障检测系统的运行至运行控制器在制造执行系统中加工晶片的方法,所述方法包括以下步骤: 1)将用于控制工具的菜单接收到所述运行至运行控制器中,其中所述菜单包括至少一个设定点,用于获得一个或多个目标晶片特性; 2)通过测量加工属性监视所述晶片的加工,其中所述加工属性包括由所述故障检测系统识别的晶片特性和故障状况; 3)将所述加工属性输送给所述运行至运行控制器;和4)除了所述故障检测系统检测到故障状况时之外,根据所述测量的加工属性修改在所述运行至运行控制器上的所述菜单的所述至少一个设定点,以便除了由所述故障检测系统检测到故障状况之外保持所述目标晶片特性,而在所述故障检测系统检测到故障状况的情况下,并不根据所述测量的加工属性来修改所述菜单的所述至少一个设定点;和5)将 1, for use with the operating system to run the fault detection in a manufacturing execution system controller, the method of processing a wafer comprising the steps of: 1) menu for controlling the operation of the tool to the received operation control reactor, wherein the menu includes at least one setpoint for obtaining one or more target wafer properties; 2) measuring the process attribute monitoring by processing the wafer, wherein the process attribute by the fault detection system comprises identifying characteristics of the wafer and a fault condition; 3) the operation of the process attribute is supplied to the controller to run; and 4) in addition to said fault detection system detects a fault condition is outside, measured according to the modified process attribute run to run on the controller in the menu at least one set point, so as to maintain said target wafer properties in addition to the fault detection system is detected by a fault condition in the fault detection system when detecting a fault condition, and not modifying the menu based on the measured at least one process attribute set point; and 5) 述菜单的所述至少一个设定点作为参数并入到所述故障检测系统中。 The menu of said at least one set point to the fault detection system is incorporated as a parameter.
2、 根据权利要求1的方法,还包括在进行加工之前测量晶片特性。 2. The method according to claim 1, further comprising measuring the characteristics of the wafer prior to processing. 20 20
3、根据权利要求1的方法,还包括由所述测量的加工属性生成故障检测标记,并将所述标记传输到所述运行至运行控制器,目的是为了修改所述至少一个设定点。 3. The method of claim 1, further comprising generating a fault detection mark measured by the process attribute, and the marker is transferred to the run to run controller, the purpose of modifying the at least one setpoint.
4、 根据权利要求1的方法,其中所述修改包括比较预报输出与可25 接受的工具规格限。 4. The method of claim 1, wherein said modifying comprises comparing the prediction output 25 can be an acceptable tool specification limit.
5、 根据权利要求1的方法,其中所述修改包括比较预报输出与可接受的工具范围。 5. The method of claim 1, wherein said modifying means includes comparing the prediction range of acceptable outputs. 30 30
6、根据权利要求1的方法,还包括在检测到故障状况时终止所述加工。 6. The method of claim 1, further comprising terminating said processing upon detection of a fault condition.
7、根据权利要求1的方法,其中所述至少一个设定点包括两个或多个设定点。 7. The method of claim 1, wherein said at least one setpoint comprises two or more setpoints.
8、根据权利要求1的方法,其中所述至少一个设定点包括温度、压力、功率、加工时间、升高位置和材料的流速中的至少一个。 8. The method of claim 1, wherein said at least one set point comprises a temperature, pressure, power, processing time, flow rate raised position and at least one material.
9、根据权利要求1的方法,其中所述故障状况包括工具故障。 9. The method of claim 1, wherein said fault condition comprises a tool fault.
10、根据权利要求1的方法,其中所述故障状况包括晶片特性故障。 10. The method of claim 1, wherein said fault condition comprises a wafer fault characteristics.
11、 根据权利要求l的方法,其中步骤5)包括将所述菜单的所述至少一个设定点合并到一个或多个用于确定表示故障状况的条件范围的故障检测模型中。 11. The method of claim l, wherein step 5) comprises at least one of the menu set point into one or more means for determining a fault condition indicates a fault condition detection model range.
12、 根据权利要求l的方法,其中当检测到晶片故障时,所述测量的晶片特性不能用于修改所述菜单。 12. A method according to claim l, wherein upon detection of the fault wafer, the wafer characteristics can not be measured for modifying the menu.
13、 一种用于加工晶片的方法,所述方法包括以下步骤:1)根据菜单加工所述晶片,其中所述菜单包括用于获得一个或多个目标晶片特性的至少一个设定点;2) 测量晶片特性;3) 利用一个故障检测系统检测表示故障状况的条件;和4) 在没有故障状况的情况下,根据所述测量的晶片特性修改所述菜单的所述至少一个设定点,以保持所述目标晶片特性,在有故障状况的情况下,并不根据所述测量的晶片特性来修改所述菜单的所述至少一个设定点;5) 将所述菜单的所述至少一个设定点作为参数并入到所述故障检测系统中。 13. A method for processing a wafer, said method comprising the steps of: 1) processing the wafer according to the menu, wherein said menu comprises means for obtaining one or more target wafer properties of the at least one setpoint; 2 ) measuring wafer properties; 3) using a fault detection system detecting a fault condition of the condition; and 4) in the absence of a fault condition, the measured characteristic of the wafer according to the modification of the menu at least one set point, to maintain said target wafer properties in the case of a fault condition, not modifying the characteristics of the menu wafer according to the measured at least one set point; 5) to said at least one of the menu setpoint incorporated into the system as a fault detection parameter.
14、 根据权利要求13的方法,其中如果检测到故障状况则终止加工。 14. The method of claim 13, wherein the fault condition is detected if the processing is terminated.
15、根据权利要求13的方法,所述测量步骤在加工期间进行。 15. The method of claim 13, wherein said measuring step is carried out during processing.
16、根据权利要求13的方法,其中所述测量步骤在加工之后进行。 16. The method of claim 13, wherein said measuring step is performed after processing.
17、 根据权利要求13的方法,其中将所述菜单的所述至少一个设定点作为参数并入到用于确定表示故障状况的条件范围的故障检测模型中。 17. The method of claim 13, wherein said at least one of the menu as a parameter to the setpoint incorporated fault detection models used to determine the fault condition indicates a condition range.
18、 一种在制造执行系统中加工晶片的系统,所述系统包括: 运行至运行控制器,用于根据从所述制造执行系统接收来的菜单控制工具,其中所述菜单包括用于获得一个或多个目标晶片特性的至少一个设定点-,用于测量包括晶片特性的加工属性的传感器;故障检测器,用于监视所述晶片特性以检测表示故障状况的条件和将所述条件输送给所述运行至运行控制器;其中除了所述故障检测器检测到故障状况时之外,根据所述加工属性修改所述菜单的所述至少一个设定点,以保持所述目标晶片特性, 20 而在所述故障检测器检测到故障状况的情况下,并不根据所述加工属性来修改所述至少一个设定点;且其中将所述菜单的所述至少一个设定点作为参数并入到所述故障检测器中。 18. A system for manufacturing execution system processing a wafer, said system comprising: a run to run controller for receiving from the control means according to the manufacturing execution system menu, wherein said menu comprises means for obtaining a or more target wafer properties in at least one set point - for measuring the characteristics of the process attribute sensor comprises a wafer; the fault condition detector, for monitoring the characteristic represented wafer to detect a fault condition and the delivery condition run to run to the controller; wherein in addition to said fault detector detects a fault condition, the modification according to the process attribute of the menu at least one setpoint to maintain said target wafer properties, and in the case of the failure detector 20 detects a fault condition, not in accordance with the process attribute modifying the at least one set point; and wherein the at least one of the menu as a parameter set point and into said fault detector.
19、根据权利要求18的系统,还包括用于在进行加工之前测量晶片特性的传感器。 19. The system of claim 18, further comprising a sensor for measuring the characteristics of the wafer prior to processing.
20、根据权利要求18的系统,其中所述故障检测器从所述测量的加工属性生成故障检测标记,并将所述标记传送给所述运行至运行控30 制器,以便修改所述至少一个设定点。 20. The system of claim 18, wherein said fault detector generates a fault detection flag from said measured process attribute, and the marking operation to transfer to the operating system device controller 30, so as to modify at least one set point.
21、 根据权利要求18的系统,其中所述运行至运行控制器通过比较预报的输出与可接受的工具规格限而修改所述至少一个设定点。 21. The system of claim 18, wherein the run to run controller output with pharmaceutically tool specification limit comparator forecasts modifying the at least one set point.
22、 根据权利要求18的系统,其中所述运行至运行控制器通过比5 较预报的输出与可接受的工具范围而修改所述至少一个设定点。 22. The system of claim 18, wherein the run to run controller 5 outputs more than acceptable range forecast and modifying the at least one tool set point.
23、 根据权利要求18的系统,其中在检测到故障状况时所述运行至运行控制器终止加工。 23. The system of claim 18, wherein upon detection of a fault condition of the processing operation to terminate the operation of the controller. io io
24、根据权利要求18的系统,其中所述至少一个设定点包括两个或两个以上的设定点。 24. The system of claim 18, wherein said at least one setpoint comprises two or more setpoints.
25、 根据权利要求18的系统,其中所述至少一个设定点包括温度、 压力、功率、处理时间、升高位置和材料的流速中的至少一个。 25. The system of claim 18, wherein said at least one set point comprises a temperature, pressure, power, processing time, flow rate raised position and at least one material. 15 15
26、 根据权利要求18的系统,其中所述故障状况包括工具故障。 26. The system of claim 18, wherein said fault condition comprises a tool fault.
27、 根据权利要求18的系统,其中所述故障状况包括晶片特性故障。 27. The system of claim 18, wherein said fault condition comprises a wafer fault characteristics. 20 20
28、 根据权利要求18的系统,其中故障检测模型用于确定表示故障状况的条件范围,其中所述故障检测模型被修改以便在所述运行至运行控制器中将所述菜单的所述至少一个设定点作为参数并入。 28 The system according to claim 18, wherein fault detection models used to represent the range of conditions to determine a fault condition, wherein the fault detection model to be modified to run in the running said controller in said at least one menu incorporated as a parameter set point. 25 25
29、 一种用于加工晶片的系统,所述系统包括:运行至运行控制器,用于根据菜单加工所述晶片,其中所述菜单包括用于获得一个或多个目标晶片特性的至少一个设定点; 用于测量包括晶片特性的传感器;故障检测器,用于检测表示故障状况的条件,而且所述菜单的所述30 至少一个设定点被作为参数并入到所述故障检测器中;和其中在所述故障检测器没有检测到故障状况的情况下,所述运行至运行控制器根据所述晶片特性修改所述菜单的所述至少一个设定点, 以保持所述目标晶片特性,而当所述故障检测器检测到故障状况时, 所述运行至运行控制器并不根据所述晶片特性修改所述菜单的所述至少一个设定点。 29. A system for processing a wafer, the system comprising: a run to run controller for processing the wafer according to the menu, wherein said menu comprises means for obtaining one or more target wafer properties disposed at least one of point; means for measuring characteristics of a wafer comprising a sensor; fault detector for detecting a fault condition of the condition, and said at least one of the menu 30 of the fault detector is incorporated into a set-point as a parameter ; and in the case where no fault condition is detected in the failure detector, the operation of the controller to modify operation of said menu according to at least one characteristic of said wafer setpoint to maintain said target wafer properties , when the fault detector detects a fault condition, the run to run controller does not modify said menu based on said characteristic of at least one wafer setpoint.
30、 根据权利要求29的系统,其中如果检测到故障状况,则所述运行至运行控制器不修改所述菜单的所述至少一个设定点。 30. The system of claim 29, wherein if a fault condition is detected, then the run to run controller does not modify said at least one of the menu set point.
31、 根据权利要求29的系统,其中在加工期间所述传感器测量晶io 片特性。 31. The system of claim 29, wherein the sensor measures sheet io crystalline characteristics during processing.
32、 根据权利要求29的系统,其中在加工之后所述传感器测量晶片特性。 32. The system of claim 29, wherein said sensor measuring wafer properties after machining.
33、根据权利要求29的系统,其中修改用于确定表示故障状况的条件范围的故障检测模型,以便在所述运行至运行控制器中并入作为参数的所述菜单的所述至少一个设定点。 33. The system of claim 29, wherein fault detection models used to modify the range of conditions to determine a fault condition represented in order to run in the execution controller incorporated in the menu as a parameter of said at least one set point.
34、 一种使用带有故障检测系统的运行至运行控制器在制造执行系统中加工晶片的系统,所述系统包括-用于将控制工具的菜单接收到所述运行至运行控制器中的装置,其中所述菜单包括用于获得一个或多个目标晶片特性的至少一个设定点;用于通过测量加工属性监视所述晶片加工的装置,其中所述加工属25 性包括由所述故障检测系统识别的晶片特性和故障状况;用于将所述加工属性输送给所述运行至运行控制器的装置;和用于修改的装置,其在除了所述故障检测系统检测到故障状况吋之夕卜,根据所述加工属性修改在所述运行至运行控制器上的所述菜单的所述至少-一个设定点,以保持所述目标晶片特性,而在所述故障检测系30 统检测到故障状况的情况下,并不根据所述加工属性来修改所述菜单的所述至少一个设定点,所述菜单的所述至少一个设 Control means for receiving the operation to the menu operation controller means to - 34 An operation of the controller processing a wafer, the system comprising MES running with the failure detection system used to wherein said menu comprises means for obtaining one or more target wafer properties of at least one set point; processing means by monitoring the measuring process attributes for wafer, wherein the processing of the case 25 by the failure detection comprising the system identifies fault conditions and characteristics of the wafer; attribute for delivering to said processing means operating to control the operation; and a means for modifying, which in addition to said fault detection system evening detects a fault condition of inch Bu, modified according to the process attribute on the running operation of the controller in the menu at least - a set point to maintain said target wafer properties, and detecting the fault detection system 30 to the system in the case of a fault condition, not modifying the menu based on the processing properties of the at least one set point, said at least one set of the menu 点被作为参数并入到所述故障检测系统中。 Points are incorporated into the system as a fault detection parameter.
35、 根据权利要求34的系统,还包括用于在进行加工之前测量晶片特性的装置。 35. The system of claim 34, further comprising means for measuring characteristics of the wafer prior to processing.
36、 根据权利要求34的系统,还包括用于从所述测量的加工属性生成故障检测标记的装置,和用于将所述标记传送给所述运行至运行控制器以便修改所述设定点的装置。 36. The system of claim 34, further comprising means for generating a failure detection flag from said measured process attributes, and means for operating said marking to transmit to the controller in order to modify the operating set point s installation.
37、根据权利要求34的系统,其中所述用于修改的装置包括用于比较预报输出与可接受的工具规格限的装置。 37. The system of claim 34, wherein said means for modifying comprises means for comparing the output with a pharmaceutically prediction tools for specification limits.
38、 根据权利要求34的系统,其中所述用于修改的装置包括用于比较预报输出与可接受的工具范围的装置。 38. The system of claim 34, wherein said means for modifying comprises comparing the output prediction device for an acceptable tool range.
39、 根据权利要求34的系统,还包括用于在检测到故障状况时终止所述加工的装置。 39. The system of claim 34, further comprising means terminating said processing upon detection of a fault condition.
40、 根据权利要求34的系统,其中所述故障状况包括工具故障。 40. The system of claim 34, wherein said fault condition comprises a tool fault.
41、 根据权利要求34的系统,其中所述故障状况包括晶片特性故障。 41. The system of claim 34, wherein said fault condition comprises a wafer fault characteristics.
42、 根据权利要求34的系统,其中修改用于确定表示故障状况的25 条件范围的故障检测模型,以便在所述运行至运行控制器中并入作为参数的所述菜单的所述至少一个设定点。 42. The system of claim 34 wherein the fault detection model 25 for modifying the condition of the range represents a fault condition is determined so as to run in the execution controller incorporated in the menu as a parameter of said at least one set point.
43、 一种用于加工晶片的系统,所述系统包括: 用于根据菜单加工所述晶片的装置,其中所述菜单包括用于获得一个或多个目标晶片特性的至少一个设定点;用于测量晶片特性的装置;用于检测表示故障状况的条件的装置;和用于修改的装置,其在没有故障状况的情况下根据所述测量的晶片特性修改所述菜单的所述至少一个设定点,以保持所述目标晶片特性, 而在有故障状况的情况下并不根据所述测量的晶片特性来修改所述菜5 单的所述至少一个设定点,其中所述菜单的所述至少一个设定点被作为参数并入到所述用于检测表示故障状况的条件的装置中。 43. A system for processing a wafer, said system comprising: means for processing the wafer according to a menu, wherein said menu comprises means for obtaining one or more target wafer properties of at least one set point; with means to measure wafer properties; means for detecting a fault condition for condition; and said modification means for modifying the menu which according to said measured wafer properties in the absence of a fault condition at least one condition is provided point, to maintain said target wafer properties, and in the case of a fault condition is not modifying the at least one set point of the menu 5 single wafer according to the measured characteristic, wherein said menu said at least one set point is incorporated as a parameter to the means for detecting a fault condition in the condition.
44、 根据权利要求43的系统,其中如果检测到故障状况则终止加工。 44. The system of claim 43 wherein the fault condition is detected if the processing is terminated.
45、 根据权利要求43的系统,其中修改用于确定表示故障状况的条件范围的故障检测模型,以便在所述运行至运行控制器中并入作为参数的所述菜单的所述至少一个设定点。 45. The system of claim 43, wherein fault detection models used to modify the range of conditions to determine a fault condition represented in order to run in the execution controller incorporated in the menu as a parameter of said at least one set point.
46、"种使用带有故障检测系统的运行至运行控制器在制造执行系统中用于加工物品的方法,所述方法包括以下步骤:1) 将用于控制工具的菜单接收到所述运行至运行控制器中,其中所述菜单包括用于获得一个或多个目标物品特性的至少一个设定点;2) 通过测量加工属性监视所述物品的加工,其中所述加工属性包20 括由所述故障检测系统识别的物品特性和故障状况;3) 将所述加工属性输送给所述运行至运行控制器;和4) 除了所述故障检测系统检测到故障状况时之外,根据所述测量的加工属性修改在所述运行至运行控制器上的所述菜单的至少一个设定点,以保持所述目标物品特性,而在所述故障检测系统检测到故障状况的情况下,并不根据所述测量的加工属性来修改所述菜单的所述至少一个设定点,其中所述至少一个设定点被作为参数并入到所述故障检 46, "operation method kinds with the operation of the failure detection system to a controller for processing an article in a manufacturing execution system, said method comprising the steps of: 1) menu for controlling the operation of the tool to the receiving operation controller, wherein said menu comprises means for obtaining one or more target item properties in at least one set point; 2) by processing said article monitoring process attribute measurement, wherein the package 20 includes a process attribute is said detection system to identify the fault condition and a fault article characteristics; 3) the operation of the process attribute is supplied to the controller to run; and 4) in addition to said fault detection system detects a fault condition when the outside, according to the measurement the process attribute modifications to the operation of the menu on the operation of the controller of the at least one setpoint to maintain said target item properties, and the fault condition is detected in said failure detection system, not according to the processing the measured properties to modify the menu of the at least one set point, wherein said at least one set point to the fault detection to be incorporated as a parameter 测系统中。 Measurement system.
47、根据权利要求46的方法,还包括在进行加工之前测量物品特性。 47. The method of claim 46, further comprising measuring item properties prior to processing.
48、根据权利要求46的方法,还包括从所述测量的加工属性生成故障检测标记,并将所述标记传输到所述运行至运行控制器,目的是为了修改所述至少一个设定点。 48. The method of claim 46, further comprising generating a fault detection flag from said measured process attribute, and the marking operation to the operation is transmitted to the controller, the purpose of modifying the at least one setpoint.
49、根据权利要求46的方法,还包括在检测到故障状况时终止所述加工。 49. The method of claim 46, further comprising terminating said processing upon detection of a fault condition.
50、 根据权利要求46的方法,其中所述至少一个设定点包括两个或两个以上设定点。 50. The method of claim 46, wherein said at least one setpoint comprises two or more setpoints.
51、 一种用于加工物品的方法,所述方法包括以下步骤-1) 根据菜单处理所述物品,其中所述菜单包括用于获得一个或多个目标物品特性的至少一个设定点;2) 测量物品特性; 3)利用一个故障检测系统来检测表示故障状况的条件;和4)在没有故障状况的情况下,根据所述测量的物品特性修改所述菜单的所述至少一个设定点,以保持所述目标物品特性,而在有故障状况的情况下,并不根据所述测量的物品特性来修改所述菜单的所述至少一个设定点,其中所述至少一个设定点被作为参数并入到所述故20 障检测系统中。 51, a method for processing an article, said method comprising the steps of -1), the article processing according to the menu, wherein said menu comprises means for obtaining one or more target item properties in at least one set point; 2 ) measured article characteristic; 3) using a fault detection system for detecting a fault condition in the conditions; and said 4) in the absence of a fault condition, the modification of the properties of a menu item in accordance with said measured at least one set point , to maintain the characteristics of the target item, and in the case of a fault condition, not modifying the menu item according to the measured characteristics of at least one set point, wherein the at least one setpoint is it is incorporated as a parameter to the fault detection system 20.
52、 根据权利要求51的方法,其中如果检测到故障状况则终止加工。 52. The method of claim 51, wherein the fault condition is detected if the processing is terminated.
53、 一种在制造执行系统中加工物品的系统,所述系统包括:运行至运行控制器,用于根据从所述制造执行系统接收来的菜单控制工具,其中所述菜单包括用于获得一个或多个目标物品特性的至少一个设定点;用于测量包括物品特性的加工属性的传感器; 30 故障检测器,用于监视所述物品特性以检测表示故障状况的条件和将所述条件输送给所述运行至运行控制器,所述至少一个设定点被作为参数并入到所述故障检测器中;和其中除了所述故障检测器检测到故障状况时之外,根据所述加工属性修改所述菜单的所述至少一个设定点,以保持所述目标物品特性, 而在所述故障检测器检测到故障状况的情况下,并不根据所述加工属5 性来修改所述菜单的所述至少一个设定点。 53, A MES system processing items, said system comprising: a run to run controller for receiving from the control means according to the manufacturing execution system menu, wherein said menu comprises means for obtaining a setting at least one or more target article characteristic points; attributes for measuring an article comprising a processing characteristic of the sensor; a fault detector 30 for monitoring the article characteristic to detect a fault condition indicates the condition and the delivery condition run to run controller, said at least one set point is incorporated into said fault detector as to the parameters; and wherein when said fault detector in addition detects a fault condition outside, according to the process attribute a case where the modification of the menu at least one setpoint to maintain said target item properties, and the fault condition is detected in said fault detector, not modifying the menu based on the processing of the case 5 the at least one set point.
54、根据权利要求53的系统,还包括用于在进行加工之前测量物品特性的传感器。 54. The system of claim 53, further comprising a sensor for measuring the characteristics of an article prior to processing.
55、根据权利要求53的系统,其中所述故障检测器从所述测量的加工属性生成故障检测标记,并将所述标记传送给所述运行至运行控制器,目的是为了修改所述至少一个设定点。 55. The system of claim 53, wherein said fault detector generates a fault detection flag from said measured process attribute, and the marking operation to the operation is transmitted to the controller, the purpose of modifying the at least one set point.
56、 根据权利要求53的系统,其中在检测到故障状况时所述运行15 至运行控制器终止加工。 56. The system of claim 53, wherein upon detection of the fault condition 15 run to run controller terminates processing. - -
57、 根据权利要求53的系统,其中所述至少一个设定点包括两个或两个以上的设定点。 57. The system of claim 53, wherein said at least one setpoint comprises two or more setpoints.
58、 一种用于加工物品的系统,所述系统包括:运行至运行控制器,用于根据菜单处理所述物品,其中所述菜单包括用于获得一个或多个目标物品特性的至少一个设定点; 用于测量物品特性的传感器;故障检测器,用于检测表示故障状况的条件,其中所述菜单的所述25 至少一个设定点被作为参数并入到所述故障检测器中;和其中在所述故障检测器没有检测到故障状况的情况下,所述运行至运行控制器根据所述物品特性修改所述菜单的所述至少一个设定点, 以保持所述目标物品特性,且其中在所述故障检测器检测到故障状况的情况下,所述运行至运行控制器并不根据所述物品特性来修改所述30 菜单的所述至少一个设定点。 58, a system for processing items, said system comprising: a run to run controller for processing said items according to the menu, wherein said menu comprises means for obtaining one or more target item properties in at least one set point; a sensor for measuring item properties; fault detector for detecting a fault condition of the condition, the menu 25 wherein said at least one set point to be incorporated into the fault detector as a parameter; and the case where no fault condition is detected in said failure detector, said controller modifies the operation of the operation to the menu item in accordance with the characteristic of the at least one setpoint to maintain said target item properties, and the case where the fault detector detects a fault condition, the run to run controller does not modify the menu 30 of the article characteristics according to at least one set point.
59、 一种使用带有故障检测系统的运行至运行控制器在制造执行系统中加工晶片的方法,所述方法包括以下步骤:1)将用于控制工具的菜单接收到所述运行至运行控制器中,其中所述菜单包括至少一个设定点,用于获得一个或多个目标晶片特性; 5 2)通过测量加工属性监视所述晶片的加工,其中所述加工属性包括由所述故障检测系统识别的晶片特性和故障状况;3) 将所述加工属性输送给所述运行至运行控制器;4) 当所述故障检测系统未检测到故障状况时,根据所述测量的加工属性修改在所述运行至运行控制器上的所述菜单的所述至少一个设定10 点,以保持所述目标晶片特性;和5) 当所述故障检测系统检测到一个不需要终止所述加工的故障状况时,并不根据所述测量的加工属性来修改在所述运行至运行控制器上的所述菜单的所述至少一个设定点。 59, for use with the operating system to run the fault detection in a manufacturing execution system controller, the method of processing a wafer comprising the steps of: 1) menu for controlling the operation of the tool to the received operation control reactor, wherein the menu includes at least one setpoint for obtaining one or more target wafer properties; 52) by monitoring the process measurement wafer process attribute, wherein said attribute comprises machining failure is detected by the wafer characteristics and errors identified by the system; 3) the operation of the process attribute is supplied to the controller to run; 4) when said fault detection system does not detect a fault condition, modifying said measured process attribute in run to run on the controller of the at least one of the menu set 10-point, to maintain said target wafer properties; and 5) when said fault detection system detects a fault not need to terminate the processing when the condition is not measured according to the properties to modify at least one processing set to the operating point in the operation of the controller on the menu.
60、根据权利要求59的方法,还包括在进行加工之前测量晶片特 60. The method of claim 59, further comprising prior to measuring the wafer processing Laid
61、根据权利要求59的方法,还包括根据所述测量的加工属性生成故障检测标记,并将所述标记传输到所述运行至运行控制器,以便20 修改所述至少一个设定点。 61. The method of claim 59, further comprising generating a fault detection markers measured according to the process attribute, and the marker is transferred to the run to run controller 20 to modify the at least one set point.
62、根据权利要求59的方法, 可接受的工具规格限。 62. The method of claim 59, acceptable tool specification limit.
63、根据权利要求59的方法, 可接受的工具范围。 63. The method of claim 59, the acceptable range of tools.
64、 根据权利要求59的方法,述加工。 64. The method of claim 59, said processing. 30 30
65、 根据权利要求59的方法,其中所述修改包括比较预报输出与其中所述修改包括比较预报输出与还包括在检测到故障状况时终止所其中所述至少一个设定点包括两个或多个设定点。 65. The method of claim 59, wherein said modifying comprises comparing the prediction output wherein modifying comprises comparing the output prediction termination further comprising wherein said fault condition upon detection of the at least one setpoint comprises two or more set points.
66、 根据权利要求59的方法,其中所述至少一个设定点包括温度、 压力、功率、加工时间、升高位置和材料流速中的至少一个。 66. The method of claim 59, wherein said at least one set point comprises a temperature, pressure, power, processing time, flow rate in the raised position and at least one material.
67、 根据权利要求59的方法,其中所述故障状况包括工具故障。 67. The method of claim 59, wherein said fault condition comprises a tool fault.
68、 根据权利要求59的方法,其中所述故障状况包括晶片特性故障。 68. The method of claim 59, wherein said fault condition comprises a wafer fault characteristics.
69、 根据权利要求59的方法,其中修改用于确定表示故障状况的条件范围的故障检测模型,以便在所述运行至运行控制器中将所述菜单的所述至少一个设定点作为参数并入。 69. The method of claim 59, wherein fault detection models used to modify the range of conditions to determine the fault condition indicates to the controller in the operation to the operation of the menu at least one set point as a parameter and into.
70、根据权利要求59的方法,其中当检测到晶片故障时,所述测量的晶片特性不能用于修改所述菜单。 70. The method of claim 59, wherein upon detection of the fault wafer, the wafer characteristics can not be measured for modifying the menu.
71、 一种在制造执行系统中加工晶片的系统,所述系统包括: 运行至运行控制器,用于根据从所述制造执行系统接收的菜单来控20制工具,其中所述菜单包括用于获得一个或多个目标晶片特性的至少一个设定点;用于测量包括晶片特性的加工属性的传感器;故障检测器,用于监视所述晶片特性以检测表示故障状况的条件和将所述条件输送给所述运行至运行控制器;且25 其中当所述故障检测器未检测到故障状况时,根据所述加工属性修改所述菜单的所述至少一个设定点,以保持所述目标晶片特性,且其中在所述故障检测器检测到一个不需要终止所述加工的故障状况的情况下,并不根据所述加工属性来修改所述至少一个设定点。 71, A system for manufacturing execution system processing a wafer, said system comprising: a run to run controller for receiving from said manufacturing execution system menu to control molding tool 20, wherein said menu comprises a obtaining one or more target wafer properties of at least one set point; means for measuring comprises a wafer processing properties characteristic of the sensor; a fault detector, for monitoring the wafer to detecting a fault condition characteristic of conditions and the conditions supplied to the run to run controller; and 25 wherein when said fault detector does not detect a fault condition, the modification according to the process attribute of the menu at least one set point, to maintain said target wafer the characteristics, and wherein the fault detector detects a fault not need to terminate the processing conditions, the processing is not based on the properties to modify the at least one set point.
72、根据权利要求71的系统,还包括用于在进行加工之前测量晶片特性的传感器。 72. The system of claim 71, further comprising a sensor for measuring the characteristics of the wafer prior to processing.
73、 根据权利要求71的系统,其中所述故障检测器根据所述测量的加工属性生成故障检测标记,并将所述标记传送给所述运行至运行控制器,以便修改所述至少一个设定点。 73. The system of claim 71, wherein said fault detector generates a fault detection markers measured according to the process attribute, and the marking operation to the operation is transmitted to the controller, so as to modify said at least one set point. 5 5
74、 根据权利要求71的系统,其中所述运行至运行控制器通过比较预报的输出与可接受的工具规格限来修改所述至少一个设定点。 74. The system of claim 71, wherein the run to run controller modifies said at least one set point by outputting acceptable tool specification limit comparator forecasts.
75、 根据权利要求71的系统,其中所述运行至运行控制器通过比io 较预报的输出与可接受的工具范围来修改所述至少一个设定点。 75. The system of claim 71, wherein the run to run controller output ratio io compared with acceptable ranges prediction tools to modify the at least one set point.
76、 根据权利要求71的系统,其中在检测到故障状况时所述运行至运行控制器终止加工。 76. The system of claim 71, wherein the run to run controller terminates processing upon detection of a fault condition.
77、根据权利要求71的系统,其中所述至少一个设定点包括两个或两个以上的设定点。 77. The system of claim 71, wherein said at least one setpoint comprises two or more setpoints.
78、 根据权利要求71的系统,其中所述至少一个设定点包括温度、 压力、功率、处理时间、升高位置和材料的流速中的至少一个。 78. The system of claim 71, wherein said at least one set point comprises a temperature, pressure, power, processing time, flow rate raised position and at least one material. 20 20
79、 根据权利要求71的系统,其中所述故障状况包括工具故障。 79. The system of claim 71, wherein said fault condition comprises a tool fault.
80、 根据权利要求71的系统,其中所述故障状况包括晶片特性故障。 80. The system of claim 71, wherein said fault condition comprises a wafer fault characteristics. 25 25
81、 根据权利要求71的系统,其中用于确定表示故障状况的条件范围的故障检测模型被修改,以便在所述运行至运行控制器中将所述菜单的所述至少一个设定点作为参数并入。 81. The system of claim 71, wherein fault detection models used to determine the range of conditions represents a fault condition is modified so as to the operation of the controller in the operating menu of said at least one set point as a parameter incorporated.
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