200827226 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種佈線板及一種安置有該佈線板之跨坐 型機車，且特定言之係關於一種經組態成可選鮮性地安裝 不同類型開關元件之佈線板及一種安置有該佈線板之跨坐 型機車。 【先前技術】 習知地，各種開關元件已用於用在電子控制設備及其類 似物中之佈線板中。在此等佈線板中，有時需要視規格變 化（例如，輸出信號所提供到的目標或電力所提供到的目 標的變化）及其類似物而安裝不同類型開關元件。然而， 當開關元件類型不同時，開關元件周圍之電路組態亦不 同。由於該原因，當待安裝之開關元件改變時，佈線板中 之佈線及電阻器之安裝位置亦必須改變。因此，當制定了 多個電子控制設備規格及其類似物時，必需獨立地製造包 括對於每一規格各不相同之電路組態的佈線板。然而，製 造對於每一規格各不相同之佈線板具有不良的大規模生產 率’且製造成本增加。由於該原因，習知地，已使用安置 有複數個佈線圖案並經組態成可選擇性地安裝不同類型開 關元件的佈線板。 舉例而言，就跨坐型機車之前燈而言，有時在一種類型 機車中使用LED且在另一類型機車中使用燈。在此等狀況 下有日可在種類型機車之電子控制設備中使用適於電流 控制之雙極電晶體（下文簡稱為，，電晶體，，），而在另一類型 121928.doc 200827226 機車之電子控制設備中使用一適於電壓控制之場效應電晶 體（下文稱為"FET”）。因此，作為一可以此方式適應於不 同類型機車之佈線板，使用一經組態成可選擇性地安裝電 晶體及FET之佈線板。 圖9展示一安置於經組態成可選擇性地安褒一電晶體及 一 FE 丁之板200之一部分上的電路210。將跨越一預定距離 彼此相鄰之複數對焊盤安置於板200上。亦即，焊盤211及 212、焊盤213及214、焊盤215及216、焊盤217及218、焊 盤2 19及220，以及焊盤221及222安置於板2〇〇上。此外， 將用於安裝電晶體20 la(參看圖10)之焊盤223至225、用於 女I電晶體201b(餐看圖1〇)之焊盤226至228，以及用於安 裝FET 202(參看圖11)之焊盤229至234安置於板2〇〇上。 如圖10中所示，當電晶體2〇la及201b安裝於板200上 時，電阻器R1安裝於焊盤211及212上，電阻器R2安裝於焊 盤213及214上，下拉電阻器R3安裝於焊盤215及216上，且 下拉電阻器R4安裝於焊盤2 17及2 18上。另一方面，如圖u 中所示，當FET 202安裝於板200上時，電阻器R1安裝於焊 盤211及212上，電阻器R2安裝於焊盤213及214上，電阻器 R5安裝於焊盤219及220上，且電阻器R6安裝於焊盤221及 222上。以此方式，板200經組態成可選擇性地安裝電晶體 201a及201b或FET 202。因此，例如，就前燈而言，即使 當在一種類型機車中使用led或在另一種類型機車中使用 燈時，板200也可用於任一類型機車。 【發明内容】 121928.doc 200827226200827226 IX. Description of the Invention: [Technical Field] The present invention relates to a wiring board and a straddle-type locomotive in which the wiring board is placed, and in particular to an optional installation A wiring board of different types of switching elements and a straddle locomotive in which the wiring board is placed. [Prior Art] Conventionally, various switching elements have been used in wiring boards used in electronic control devices and the like. In such a wiring board, it is sometimes necessary to install different types of switching elements depending on a specification change (for example, a target to which an output signal is supplied or a change in a target to which power is supplied) and the like. However, when the types of switching elements are different, the circuit configuration around the switching elements is also different. For this reason, when the switching element to be mounted is changed, the wiring and the mounting position of the resistor in the wiring board must also be changed. Therefore, when a plurality of electronic control device specifications and the like are formulated, it is necessary to independently manufacture a wiring board including circuit configurations different for each specification. However, the manufacturing has a bad mass production rate for each of the wiring boards of different specifications and the manufacturing cost increases. For this reason, it is conventionally known to use a wiring board in which a plurality of wiring patterns are disposed and configured to selectively mount different types of switching elements. For example, in the case of a straddle locomotive front light, LEDs are sometimes used in one type of locomotive and used in another type of locomotive. Under these conditions, it is possible to use a bipolar transistor suitable for current control (hereinafter referred to as "transistor") in an electronic control device of a type of locomotive, and in another type 121928.doc 200827226 locomotive A field effect transistor suitable for voltage control (hereinafter referred to as "FET") is used in the electronic control device. Therefore, as a wiring board that can be adapted to different types of locomotives in this manner, the use is configured to be selectively Mounting the wiring board of the transistor and FET. Figure 9 shows a circuit 210 disposed on a portion of a board 200 that is configured to selectively mount a transistor and a FE board. It will be adjacent to each other across a predetermined distance. The plurality of pads are disposed on the board 200. That is, the pads 211 and 212, the pads 213 and 214, the pads 215 and 216, the pads 217 and 218, the pads 2 19 and 220, and the pads 221 and 222 is disposed on the board 2 。. In addition, the pads 223 to 225 for mounting the transistor 20 la (see FIG. 10) and the pads 226 for the female I transistor 201b (see FIG. 228, and pads 229 to 234 for mounting FET 202 (see FIG. 11) On the board 2, as shown in FIG. 10, when the transistors 2〇1a and 201b are mounted on the board 200, the resistor R1 is mounted on the pads 211 and 212, and the resistor R2 is mounted on the pad 213 and At 214, pull-down resistor R3 is mounted on pads 215 and 216, and pull-down resistor R4 is mounted on pads 2 17 and 2 18. On the other hand, as shown in Figure u, when FET 202 is mounted on board 200 In the upper case, the resistor R1 is mounted on the pads 211 and 212, the resistor R2 is mounted on the pads 213 and 214, the resistor R5 is mounted on the pads 219 and 220, and the resistor R6 is mounted on the pads 221 and 222. In this manner, the board 200 is configured to selectively mount the transistors 201a and 201b or the FET 202. Thus, for example, in the case of a headlight, even when using a led or type in another type of locomotive When the lamp is used in the locomotive, the plate 200 can also be used for any type of locomotive. [Summary of the Invention] 121928.doc 200827226
G 然而’在板200中，取決於是將電晶體2〇la及201b安裝 為開關元件或是將FET 202安裝為開關元件，與此等元件 一起安裝的下拉電阻器（R3&R4，或R5&R6)之安置位置 不同。由於該原因，電晶體2〇la及2〇lb之電路組態與FET 202之電路組態部分地不同，且不可使用相同電路。視根 據電路組態的情況而定，在板2〇〇中，必須個別地確保用 於安裝六個電阻器R丨至R6之電阻器使用空間在彼此離開 之位置中由於5亥原因’存在以下問題：必須一次一個地 個別安裝電阻器R1至R6，其在安裝期間花費時間及金 錢0 此外，必須將每一電阻器使用空間設定為稍微大於實際 電阻器之尺寸，以防止當電阻器安裝於佈線板上時干擾其 他導線及其他電子元件。由於該原因，在其中六個電阻器 使用空間經個別地安置於彼此離開的位置中的板中， 亦存在以下問題：電阻器使用空間之區域變得較大，且難 以減少佈線板之面積。 已根據此等方面而製作本發明，且其目標為在可選擇性 地安裝不同類型開關元件之佈線板中，減少安裝電阻器 的時間及成本，並減少板面積。 。、 [解決問題之方法] —二-尸/Τ不，興不赞明相關之佈 (80)為-其上選擇性地安裝一與一第一電阻器㈨ 一第二電阻器(18、19)-起使用之第-開關元件(81a、 )及人第二電阻器（18、19)及一第四電阻器、 121928.doc -10- 200827226 21)—起使用之第二開關元件（82)的佈線板（8〇)，該佈線板 包含：一第一焊盤（25、27)及一在一預定方向（以至以）上 離開第一悍盤（25、27)—預定距離而安置的第二焊盤（26、 28); —第三焊盤（29、31)及一在預定方向至上離開 第二焊盤（29、31)預定距離而安置的第四焊盤（3〇、32); 及一第五焊盤（33、35)及一在預定方向（L3至L8)上離開第 五焊盤（33、3 5)預定距離而安置的第六焊盤（34、36)，其 中第一焊盤（25、27)、第三焊盤（29、31)及第五焊盤（33、 35)在一大致垂直於預定方向（1^至[8)之方向（L1)上按次序 女置，第二焊盤（26、2δ)、第四焊盤（3〇、3；Z)及第六焊盤 (34、36)在一大致垂直於預定方向（L3sl8)之方向（L2)上 知7 _人序女置’當安裝第一開關元件（81a、81b)時，第一電 阻器（16、17)安裝於第一焊盤（25、27)及第二焊盤（26、28) 上且第二電阻器（18、19)安裝於第三焊盤（29、31)及第四 焊盤（30、32)上，且當安裝第二開關元件（82)時，第三電 阻器（18、19)安裝於第三焊盤（29、31)及第四焊盤（3〇、32) 上且第四電阻器（2〇、21)安裝於第五焊盤（33、35)及第六 焊盤（34、36)上。 在與本發明相關之佈線板（80)中，第一至第六焊盤（25至 3 6)配置於一網格中。由於該原因，可將用於安裝第一至 第四電阻器（16至21)之空間一起聚集於一處。因此，與其 中將電阻器使用空間個別地安置於彼此離開之位置中的佈 線板相比，可易於安裝電阻器。此外，在佈線板（8〇)中， 當安裝第二電阻器（18、19)時或當安裝第三電阻器（18、 121928.doc 11 200827226 1 9)日守’可共同使用相同的第三焊盤（29、31)及第四焊盤 (30 3 2)。因此’根據佈線板（g 〇 )，可減少電阻器使用空 間之區域。 較佳地，第一電阻器（16、17)及第二電阻器（丨8、19)由 苐夕連接晶片電阻器（X)形成，或第三電阻器（18、19)及 第四電阻器（2〇、21)由第二多連接晶片電阻器（γ)形成，且 第一多連接晶片電阻器（X)或第二多連接晶片電阻器（γ)安 裝於佈線板（8 0)上。 根據此佈線板（8 0 )，可藉由安裝第一多連接晶片電阻器 (X)或弟一多連接晶片電阻器（Υ)而同時安裝第一電阻器 (16、17)及第二電阻器（18、19)或第三電阻器（18、19)及第 四電阻器（20、21)。因此，可減少安裝電阻器時之時間及 成本。此外，在此佈線板（80)中，其中安裝第一多連接晶 片電阻器（X)的空間及其中安裝第二多連接晶片電阻器（γ) 的二間部分地重豐（第二焊盤（2 9、31)及第四焊盤（3〇、32) 部分）。由於該原因，根據與本發明相關之佈線板（8〇)，可 減少板面積。 較佳地，佈線板（80)進一步包含電路（Α〇、Β〇)，該電路 (AO、Β0)包括：第一至第六焊盤（25至36); 一安置於輸入 側之第七焊盤（2、5)及一安置於輸出側之第八焊盤（3、 6)，以安裝第一開關元件（81a、81b); 一安置於輸入側之 第九焊盤（8、9)及一安置於輸出側之第十焊盤（12、13)， 以安裝第二開關元件（82); —第一導線（41、42)，其輸出 側端連接至第三焊盤（29、31); 一第二導線（43、44)，其 121928.doc -12- 200827226 輸入側端連接至第四焊盤（3〇、32); 一第三導線（45、 46)，其輸入側端連接至第二導線（43、44)之輸出側端且其 輸出側端連接至第七焊盤（2、5); 一第四導線（51、52)， 其輸入側端連接至第二導線（43、44)之輸出側端且其輸出 側端連接至第九焊盤（8、9); 一第五導線（47、48)，其輸 入側端連接至第二導線（43、44)之中間部分或第三導線 (45、46)之中間部分且其輸出側端連接至第二焊盤（26、 28)，一第六導線（49、50)，其輸入側端連接至第一焊盤 (25、27)且其輸出側端連接至接地端（G); 一第七導線 (53、54)，其輸入側端連接至第一導線（41、42)之中間部 分且其輸出側端連接至第五焊盤（33、35); —第八導線 (55、56)，其輸入側端連接至第六焊盤（34、36)且其輸出 側端連接至接地端（G); —第九導線（57、58)，其輸入側端 連接至第八焊盤（3、6);及一第十導線（59、60)，其輸入 側端連接至第十焊盤（12、13)。 較佳地，佈線板（80)包括複數個電路（A0、B〇)，複數個 電路（AO、B0)之第一焊盤（2 5、27)在一大致垂直於預定方 向（L3至L8)之方向（L1)上彼此鄰近地安置，複數個電路 (AO、B0)之第三焊盤（29、3 1)在一大致垂直於預定方向（L3 至L8)之方向（L1)上彼此鄰近地安置’且複數個電路（Ao、 B0)之第五焊盤（33、35)在一大致垂直於預定方向（乙3至]^8) 之方向（L1)上彼此鄰近地安置。 舉例而言，如圖6至圖8中所示，與本發明相關的佈線板 (180)為一其上選擇性地安裝一與一第一電阻器（I?]、174) 121928.doc -13- 200827226 及一第二電阻器（173、175) —起使用之第一開關元件 (81a、8 lb)及一與一第三電阻器（176、178)及一第四電阻 器（177、179) —起使用之第二開關元件（82)的佈線板 (180)，該佈線板包含：一第一焊盤（111、113)及一在預定 方向（L11至L13)上離開該第一焊盤（111、113)—預定距離 而安置的第二焊盤（112、114); 一第三焊盤（115、117)及 一在預定方向（L11至L13)上離開該第三焊盤（115、117)預 定距離而安置的第四焊盤（116、118);及一第五焊盤 (119、121)及一在預定方向（L11至L13)上離開該第五焊盤 (119、121)預定距離而安置的第六焊盤（120、122)，其中 該第一焊盤（111、113)、該第三焊盤（115、117)及該第五 焊盤（119、121)在一大致垂直於預定方向（L11至L13)之方 向（L14、L16)上按次序安置，該第二焊盤（112、114)、該 第四焊盤（116、118)及該第六焊盤（120、122)在一大致垂 直於預定方向（L11至L13)之方向（L15、L17)上按次序安 置’當安裝第一開關元件（81 a、81 b)時，第一電阻器 (172、174)安裝於第一焊盤（ill、113)及第三焊盤（115、 117)上且第二電阻器（173、175)安裝於第二焊盤（112、114) 及第四焊盤（116、118)上，且當安裝第二開關元件（82) 時’第三電阻器（176、178)安裝於第三焊盤（115、117)及 第五焊盤（119、121)上且第四電阻器（177、179)安裝於第 四焊盤（U6、118)及第六焊盤（120、122)上。 根據此佈線板（1 80)，與其中電阻器使用空間個別地安 置於彼此離開的位置中的佈線板相比，可易於安裝電阻 121928.doc -14- 200827226 裔。此外’在佈線板（180)中，當安裝第一電阻器（172、 174)及第二電阻器（173、175)時或當安裝第三電阻器 (176、178)及第四電阻器（177、179)時，可共同使用相同 之第三焊盤（115、Π7)及第四焊盤（116、118)。因此，根 據佈線板（180)，可減少焊盤之數目。 較佳地，第一電阻器（172、及第二電阻器（173、 175)由第一多連接晶片電阻器（χ，）形成，或第三電阻器 (176、178)及第四電阻器（177、179)由第二多連接晶片電 阻裔（Υ )形成，且第一多連接晶片電阻器（X，）或第二多連 接晶片電阻器（Υ’）安裝於佈線板（18〇)上。 車乂佳地’佈線板（18〇)進一步包含電路（Α1〇、Β1〇)，該 電路（Α1〇、Β1〇)包括··第一至第六焊盤（111至122); —安 置於輸入側之第七知盤（2、5)及一安置於輸出側之第八焊 盤（3、6)，以安裝第一開關元件（81a、81b); —安置於輸 入側之第九焊盤（8、9)及一安置於輸出側之第十焊盤（12、 13) ’以安1第二開關元件（82); 一第一導線（Μ〗、Μ〕）， 其輸出側端連接至第一焊盤（111、113); 一第二導線 (143、144)，其輸入側端連接至第三焊盤（ιΐ5、丨17); 一 第三導線（45、46)，其輸入側端連接至第二導線（143、 144)之輸出側端且其輸出側端連接至第七焊盤（2、5”一 第四V線（51、52)，其輸入側端連接至第二導線（143、 ^44)之輸出側端且其輸出側端連接至第九焊盤（8、9); 一 第五‘線（147、148)，其輸入側端連接至第三焊盤（115、 U7)且其輸出側端連接至第二焊盤（112、114); 一第六導 121928.doc 200827226 線（149、150)，其輸入側端連接至第四焊盤（116、118)且 其輸出側端連接至接地端（G); 一第七導線（17〇、171)，其 輸入側端連接至第一導線（141、142)之中間部分且其輸出 側端連接至第五焊盤（1〗9、; 一第八導線（153、 154)，其輸入側端連接至第七導線（17〇、171)之中間部分 且其輸出側端連接至第六焊盤（12〇、122); 一第九導線 (57、58)，其輸入側端連接至第八焊盤（3、6);及一第十 導線（59、60)，其輸入側端連接至第十焊盤（12、13)。 較佳地，佈線板包括複數個電路（Α1〇、Β1〇)，且複數個 電路（A10、B10)之第一焊盤（111、113)及第二焊盤（112、 114)女置於沿預定方向延伸之相同直線（L1丨）上。 較佳地，第一開關元件（8 i a、8 i b)為雙極電晶體且第二 開關元件（82)為場效應電晶體。 與本發明相關之跨坐型機車（90)安置有佈線板（8〇、 180)。 [本發明之效應] 如上文所描述，根據本發明，在可選擇性地安裝不同類 型開關元件之佈線板中，可減少安裝電阻器時之時間及成 本’且可減少板面積。 【實施方式】 (第一實施例） 下文將基於圖式來詳細描述本發明之實施例。 如圖1中所示，與本實施例相關之跨坐型機車9〇為一適 於越野賽之摩托車（摩托越野車（mot〇cr〇sser))。然而，與 121928.doc -16 - 200827226 本發明相關之跨坐型機車90不限於摩托越野車且亦可為另 一類型摩托車（包括機器腳踏車、小型摩托車等）。此外， 與本發明相關之跨坐型機車不限於摩托車且亦可（例如）為 諸如四輪越野車（four-wheel buggy)之ATV。 跨坐型機車90安置有一機車本體91及一覆蓋機車本體9ι 之一部分的盍92。一引擎控制單元93(下文稱為，，ECU 93，，) 安裝於機車本體91之後部的由蓋92覆蓋之部分中。猶後描 述之佈線板80(參看圖2)安置於ECU 93中。儘管稍後將描 述其，但是電路1(參看圖2)安置於佈線板8〇上，且電路1輸 出電信號至圖1中所示之零件（part)aS n。此處，字母a表 不起動繼電器’ b表示電池，c表示空檔開關（neutral switch)，d表示AC馬達，e表示起動馬達，f表示噴射器，g 表示火星塞’ h表示點火線圈，i表示燃油泵，j表示前燈， k表示各種儀錶，1表示離合器開關，m表示主繼電器，且〇 表示調整器。 圖2為一展示佈線板8〇之一部分的圖。電路丨（其經組態 成可選擇性地安裝一電晶體81a及一電晶體81b(參看圖3)及 一 FET 82(參看圖4))安置於佈線板80上。下文，為便於描 述起見，圖2之頂側將被稱為前側，底側將被稱為後側， 左側將被稱為左側，且右側將被稱為右側。 將用於安裝電晶體81a及81 b(參看圖3)之焊盤2至4及5至 7,以及用於安裝FET(參看圖4)之焊盤8至13安置於電路1 上。安置焊盤2至4及5至7，使得電晶體81a及81b之基極連 接至焊盤2及5，集電極連接至焊盤3及6，且發射極連接至 121928.doc -17- 200827226 焊盤4及7。安置焊盤8至13，使得焊盤8及9連接至FET 82 之兩個閘極端子，焊盤12及13連接至兩個源極端子，且焊 盤10及11連接至兩個汲極端子。請注意，，，焊盤"指的是安 置於板上並藉由（例如）焊料將各零件之導線及端子連接至 的導電部分。焊盤之每一者的形狀不限於本實施例之形狀 且可為任何形狀。G However, 'in the board 200, depending on whether the transistors 2〇la and 201b are mounted as switching elements or the FET 202 is mounted as a switching element, pull-down resistors (R3&R4, or R5& R6) is placed in different locations. For this reason, the circuit configurations of the transistors 2〇1a and 2〇1b are partially different from the circuit configuration of the FET 202, and the same circuit cannot be used. Depending on the configuration of the circuit, in the board 2, it is necessary to individually ensure that the resistors used to mount the six resistors R丨 to R6 use space in the position away from each other due to the following reasons. Problem: Resistors R1 to R6 must be installed individually one at a time, which takes time and money during installation. In addition, each resistor usage space must be set slightly larger than the actual resistor size to prevent when the resistor is mounted on Interference with other wires and other electronic components on the wiring board. For this reason, in the board in which the six resistor use spaces are individually disposed in positions apart from each other, there is also a problem that the area in which the resistor is used becomes larger, and it is difficult to reduce the area of the wiring board. The present invention has been made in view of such aspects, and its object is to reduce the time and cost of mounting a resistor and reduce the board area in a wiring board in which different types of switching elements can be selectively mounted. . [Method of Solving the Problem] - Second - corpse / Τ , 兴 兴 兴 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关 相关- using the first switching element (81a, ) and the human second resistor (18, 19) and a fourth resistor, 121928.doc -10- 200827226 21) - the second switching element used (82 a wiring board (8〇), the wiring board comprising: a first pad (25, 27) and a predetermined distance (towards) leaving the first disk (25, 27) - a predetermined distance a second pad (26, 28); a third pad (29, 31) and a fourth pad (3〇, disposed at a predetermined distance from the second pad (29, 31) in a predetermined direction And a fifth pad (33, 35) and a sixth pad (34, 36) disposed at a predetermined distance from the fifth pad (33, 35) in a predetermined direction (L3 to L8) , wherein the first pad (25, 27), the third pad (29, 31), and the fifth pad (33, 35) are substantially perpendicular to a predetermined direction (1^ to [8) (L1) On the order of the female, the second pad (26, 2δ), the fourth pad (3〇, 3; Z) and the sixth pad (34, 36) are in a direction (L2) substantially perpendicular to the predetermined direction (L3s18), and the first switching element (81a) is mounted. , 81b), the first resistor (16, 17) is mounted on the first pad (25, 27) and the second pad (26, 28) and the second resistor (18, 19) is mounted on the third On the pads (29, 31) and the fourth pads (30, 32), and when the second switching element (82) is mounted, the third resistors (18, 19) are mounted on the third pads (29, 31) And the fourth pads (3, 32) and the fourth resistors (2, 21) are mounted on the fifth pads (33, 35) and the sixth pads (34, 36). In the wiring board (80) related to the present invention, the first to sixth pads (25 to 36) are disposed in a grid. For this reason, the spaces for mounting the first to fourth resistors (16 to 21) can be gathered together in one place. Therefore, the resistor can be easily mounted as compared with the wiring board in which the resistors are used in a space where they are individually disposed in positions apart from each other. In addition, in the wiring board (8〇), when the second resistor (18, 19) is mounted or when the third resistor (18, 121928.doc 11 200827226 119) is installed, the same number can be used together. Three pads (29, 31) and a fourth pad (30 3 2). Therefore, according to the wiring board (g 〇 ), the area where the resistor is used can be reduced. Preferably, the first resistor (16, 17) and the second resistor (丨8, 19) are formed by a chip resistor (X), or a third resistor (18, 19) and a fourth resistor. The device (2〇, 21) is formed by a second multi-connection wafer resistor (γ), and the first multi-connection wafer resistor (X) or the second multi-connection wafer resistor (γ) is mounted on the wiring board (80) on. According to the wiring board (80), the first resistor (16, 17) and the second resistor can be simultaneously mounted by mounting the first multi-connection wafer resistor (X) or the multi-connected wafer resistor (?) (18, 19) or third resistor (18, 19) and fourth resistor (20, 21). Therefore, the time and cost of installing the resistor can be reduced. Further, in the wiring board (80), the space in which the first multi-connection wafer resistor (X) is mounted and the two portions in which the second multi-connection wafer resistor (?) are mounted are partially heavy (second pad) (2 9, 31) and the fourth pad (3〇, 32) part). For this reason, according to the wiring board (8 〇) related to the present invention, the board area can be reduced. Preferably, the wiring board (80) further includes a circuit (Α〇, Β〇0) including: first to sixth pads (25 to 36); a seventh portion disposed on the input side Pads (2, 5) and an eighth pad (3, 6) disposed on the output side to mount the first switching element (81a, 81b); a ninth pad (8, 9) disposed on the input side And a tenth pad (12, 13) disposed on the output side to mount the second switching element (82); - a first wire (41, 42) whose output side is connected to the third pad (29) , 31); a second wire (43, 44), whose 121928.doc -12-200827226 input side is connected to the fourth pad (3〇, 32); a third wire (45, 46), its input The side end is connected to the output side end of the second wire (43, 44) and the output side end thereof is connected to the seventh pad (2, 5); a fourth wire (51, 52) whose input side end is connected to the An output side end of the two wires (43, 44) and an output side end thereof is connected to the ninth pad (8, 9); a fifth wire (47, 48) whose input side end is connected to the second wire (43, 44) the middle part or the third wire (45, 46) The intermediate portion and its output side end are connected to the second pad (26, 28), a sixth wire (49, 50) whose input side end is connected to the first pad (25, 27) and whose output side end is connected To the ground terminal (G); a seventh wire (53, 54) whose input side end is connected to the middle portion of the first wire (41, 42) and whose output side end is connected to the fifth pad (33, 35) - an eighth wire (55, 56) having an input side end connected to the sixth pad (34, 36) and an output side end connected to the ground end (G); - a ninth wire (57, 58), The input side end is connected to the eighth pad (3, 6); and a tenth wire (59, 60) whose input side end is connected to the tenth pad (12, 13). Preferably, the wiring board (80) includes a plurality of circuits (A0, B), and the first pads (25, 27) of the plurality of circuits (AO, B0) are substantially perpendicular to a predetermined direction (L3 to L8) The directions (L1) are disposed adjacent to each other, and the third pads (29, 31) of the plurality of circuits (AO, B0) are in a direction substantially perpendicular to the predetermined direction (L3 to L8) (L1) The fifth pads (33, 35) of the plurality of circuits (Ao, B0) are disposed adjacent to each other in a direction (L1) substantially perpendicular to a predetermined direction (B3 to ]8). For example, as shown in FIG. 6 to FIG. 8, a wiring board (180) related to the present invention is selectively mounted with a first resistor (I?), 174) 121928.doc - 13-200827226 and a second resistor (173, 175) together with the first switching element (81a, 8 lb) and one and a third resistor (176, 178) and a fourth resistor (177, 179) a wiring board (180) of the second switching element (82) used, the wiring board comprising: a first pad (111, 113) and a first one in a predetermined direction (L11 to L13) Pads (111, 113) - second pads (112, 114) disposed at a predetermined distance; a third pad (115, 117) and a third pad in a predetermined direction (L11 to L13) (115, 117) a fourth pad (116, 118) disposed at a predetermined distance; and a fifth pad (119, 121) and a leaving the fifth pad in a predetermined direction (L11 to L13) And 121) a sixth pad (120, 122) disposed at a predetermined distance, wherein the first pad (111, 113), the third pad (115, 117), and the fifth pad (119, 121) ) in a direction substantially perpendicular to the predetermined direction The directions (L14, L16) of L11 to L13 are arranged in order, and the second pads (112, 114), the fourth pads (116, 118), and the sixth pads (120, 122) are in a The first resistors (172, 174) are mounted first in the direction (L15, L17) substantially perpendicular to the predetermined direction (L11 to L13). The pads (ill, 113) and the third pads (115, 117) and the second resistors (173, 175) are mounted on the second pads (112, 114) and the fourth pads (116, 118) And when the second switching element (82) is mounted, the 'third resistor (176, 178) is mounted on the third pad (115, 117) and the fifth pad (119, 121) and the fourth resistor ( 177, 179) are mounted on the fourth pad (U6, 118) and the sixth pad (120, 122). According to this wiring board (180), it is easy to mount a resistor as compared with a wiring board in which the resistor use spaces are individually placed in positions apart from each other. Further, in the wiring board (180), when the first resistors (172, 174) and the second resistors (173, 175) are mounted or when the third resistors (176, 178) and the fourth resistors are mounted ( In the case of 177, 179), the same third pad (115, Π 7) and fourth pad (116, 118) can be used in common. Therefore, the number of pads can be reduced according to the wiring board (180). Preferably, the first resistor (172, and the second resistor (173, 175) are formed by a first multi-connection chip resistor (χ,), or a third resistor (176, 178) and a fourth resistor (177, 179) formed of a second multi-connection wafer resistor (Υ), and the first multi-connection wafer resistor (X,) or the second multi-connection wafer resistor (Υ') is mounted on the wiring board (18〇) The car's wiring board (18〇) further includes circuits (Α1〇, Β1〇), which include (·1st to 6th pads (111 to 122); a seventh (2, 5) disposed on the input side and an eighth pad (3, 6) disposed on the output side to mount the first switching element (81a, 81b); - placed on the input side Nine pads (8, 9) and a tenth pad (12, 13) disposed on the output side 'A second switching element (82); a first wire (Μ, Μ)), the output thereof The side end is connected to the first pad (111, 113); the second wire (143, 144) has an input side end connected to the third pad (ιΐ5, 丨17); a third wire (45, 46) , its input side Connected to the output side of the second wire (143, 144) and its output side is connected to the seventh pad (2, 5" - a fourth V line (51, 52), the input side of which is connected to the second wire An output side end of (143, ^44) and an output side end thereof connected to the ninth pad (8, 9); a fifth 'line (147, 148) whose input side end is connected to the third pad (115) , U7) and its output side is connected to the second pad (112, 114); a sixth guide 121928.doc 200827226 line (149, 150), the input side end of which is connected to the fourth pad (116, 118) And its output side end is connected to the ground end (G); a seventh wire (17〇, 171) whose input side end is connected to the middle portion of the first wire (141, 142) and its output side end is connected to the fifth wire Pad (1) 9, an eighth wire (153, 154) whose input side is connected to the middle portion of the seventh wire (17A, 171) and whose output side is connected to the sixth pad (12〇) And a ninth wire (57, 58) having an input side end connected to the eighth pad (3, 6); and a tenth wire (59, 60) having an input side end connected to the tenth wire Disk (12, 13). Preferably, The wire board includes a plurality of circuits (Α1〇, Β1〇), and the first pads (111, 113) and the second pads (112, 114) of the plurality of circuits (A10, B10) are placed in a predetermined direction Preferably, the first switching element (8 ia, 8 ib) is a bipolar transistor and the second switching element (82) is a field effect transistor. The locomotive (90) is provided with wiring boards (8〇, 180). [Effects of the Invention] As described above, according to the present invention, in a wiring board in which different types of switching elements can be selectively mounted, the time and cost of mounting the resistor can be reduced and the board area can be reduced. [Embodiment] (First Embodiment) Hereinafter, an embodiment of the present invention will be described in detail based on the drawings. As shown in Fig. 1, the straddle locomotive 9 associated with the present embodiment is a motorcycle (mot 〇 〇 〇 。 。 。 。). However, the straddle locomotive 90 associated with the present invention is not limited to a motorcycle off-road vehicle and may be another type of motorcycle (including a motorcycle, a scooter, etc.). Further, the straddle locomotive associated with the present invention is not limited to a motorcycle and may, for example, be an ATV such as a four-wheel buggy. The straddle locomotive 90 houses a locomotive body 91 and a cymbal 92 that covers a portion of the locomotive body 9i. An engine control unit 93 (hereinafter, ECU 93, ???) is installed in a portion of the rear portion of the locomotive body 91 covered by the cover 92. The wiring board 80 (see Fig. 2) described later is disposed in the ECU 93. Although it will be described later, the circuit 1 (see Fig. 2) is disposed on the wiring board 8A, and the circuit 1 outputs an electric signal to the part aSn shown in Fig. 1. Here, the letter a indicates that the relay is not activated, b indicates a battery, c indicates a neutral switch, d indicates an AC motor, e indicates a starter motor, f indicates an injector, and g indicates a spark plug 'h indicates an ignition coil, i Indicates a fuel pump, j denotes a headlight, k denotes various meters, 1 denotes a clutch switch, m denotes a main relay, and 〇 denotes a regulator. Fig. 2 is a view showing a part of the wiring board 8'. A circuit port (which is configured to selectively mount a transistor 81a and a transistor 81b (see Fig. 3) and a FET 82 (see Fig. 4) is disposed on the wiring board 80. Hereinafter, for convenience of description, the top side of Fig. 2 will be referred to as the front side, the bottom side will be referred to as the rear side, the left side will be referred to as the left side, and the right side will be referred to as the right side. Pads 2 to 4 and 5 to 7, which are used to mount the transistors 81a and 81b (see Fig. 3), and pads 8 to 13 for mounting the FET (see Fig. 4) are disposed on the circuit 1. Place pads 2 to 4 and 5 to 7 so that the bases of transistors 81a and 81b are connected to pads 2 and 5, the collectors are connected to pads 3 and 6, and the emitters are connected to 121928.doc -17- 200827226 Pads 4 and 7. The pads 8 to 13 are placed such that the pads 8 and 9 are connected to the two gate terminals of the FET 82, the pads 12 and 13 are connected to the two source terminals, and the pads 10 and 11 are connected to the two terminal terminals . Note that the pad " refers to the conductive portion that is placed on the board and that connects the wires and terminals of each part to, for example, solder. The shape of each of the pads is not limited to the shape of the embodiment and may be any shape.
此外，將用於安裝—電阻器16(參看圖3)之輝盤加 26’用於安裝-電阻器17(參看圖3)之焊盤27及28,用於安 裝一電阻器18(參看圖3及圖4)之焊盤29及3〇，用於安裝一 電阻器19(參看圖3及圖4)之焊盤31及32，用於安裝―電阻 器2〇(參看圖4)之焊盤33及34，及用於安裝—電阻器η(參 看圖4)之焊盤35及36安置於電路丨上。將焊盤乃、w、 29、31、33及35在沿前後方向延伸之直線u上自前至後 地按次序安置。將焊盤26、28、3〇、32、34及36在沿前_ 後方向延伸且不同於直㈣之另-㈣L2上自前至後地按 次序安置。此外，焊盤25及焊盤26、烊盤27及焊盤Μ、焊 盤29及焊盤3〇、焊盤31及焊盤32、焊盤^及焊盤34，以及 知1 35及;^盤36在左.右方向上跨越—預定距離彼此鄰近 地安置。 導線41及42(其每-者之—末端部分連接至微電腦輸出 端子或其類似物（未圖示））安置於電路丨中。導線41之另一 末端部分連接至焊盤29,且導線42之另一末端部分連接至 焊盤31。導線41及42分別將自微電腦輸出端子或其類似物 所輸入的電信號傳輪至焊盤29及3 1。 121928.doc 200827226 導線43之一末端部分連接至焊盤30。導線44之一末端部 分連接至焊盤32。導線43及44將自在焊盤3〇及32側的該等 一末端部分輸入的電信號傳輸至另一末端部分。 導線45之一末端部分連接至導線43之另一末端部分。導 線45之另一末端部分連接至焊盤2。此外，導線46之一末 端部分連接至導線44之另一末端部分。導線46之另一末端 部分連接至焊盤5。導線45及46將自在導線43及44側的該In addition, the pads 26 and 28 for mounting-resistor 16 (see FIG. 3) are used for mounting resistors 17 (see FIG. 3) for mounting a resistor 18 (see FIG. 3 and FIG. 4) pads 29 and 3, for mounting pads 31 and 32 of a resistor 19 (see FIGS. 3 and 4) for soldering of "resistor 2" (see FIG. 4) The pads 33 and 34, and the pads 35 and 36 for mounting the resistor η (see FIG. 4) are disposed on the circuit board. The pads, w, 29, 31, 33, and 35 are placed in order from front to back on a straight line u extending in the front-rear direction. The pads 26, 28, 3, 32, 34, and 36 are placed in order from front to back in the front-rear direction and on the other - (four) L2 different from the straight (four). In addition, the pad 25 and the pad 26, the pad 27 and the pad pad, the pad 29 and the pad 3, the pad 31 and the pad 32, the pad ^ and the pad 34, and the known 1 35 and; The discs 36 are spanned in the left and right directions - predetermined distances are placed adjacent to each other. Wires 41 and 42 (each of which is connected to a microcomputer output terminal or the like (not shown) are disposed in the circuit case. The other end portion of the wire 41 is connected to the pad 29, and the other end portion of the wire 42 is connected to the pad 31. The wires 41 and 42 respectively transmit electrical signals input from the microcomputer output terminal or the like to the pads 29 and 31. 121928.doc 200827226 One end portion of the wire 43 is connected to the pad 30. One end portion of the wire 44 is connected to the pad 32. The wires 43 and 44 transmit electrical signals input from the one end portions on the sides of the pads 3 and 32 to the other end portion. One end portion of the wire 45 is connected to the other end portion of the wire 43. The other end portion of the wire 45 is connected to the pad 2. Further, one end portion of the wire 46 is connected to the other end portion of the wire 44. The other end portion of the wire 46 is connected to the pad 5. Wires 45 and 46 will be on the sides of wires 43 and 44
等一末端部分輸入的電信號傳輸至在焊盤2及5側的該等另 一末端部分。 導線47之一末端部分連接至導線45之中間部分。導線47 之另一末端部分連接至焊盤26。此外，導線48之一末端部 分連接至導線46之一中間部分。導線48之另一末端部分連 接至焊盤28。導線47及48將自在導線45及46側的該等一末 端部分所輸入之電信號傳輸至在焊盤26及28側的該等另一 末端部分。請注意，導線47之一末端部分亦可連接至導線 43之中間部分或導線48之_末端部&亦可連接至導線料之 中間部分。 導線49之一末端部分連接至焊盤25。導線49之另一末端 4刀連接至佈線板8〇之接地層G。自在焊盤25側的導線49 之該一末端部分輸入之電信號由導線49導引至接地層G。 此外^線50之一末端部分連接至焊盤27。導線5〇之另一 末而广77連接至導線49之中間部分。自在焊盤糊的導線 50之4纟端部分輸入之電信號由導線5〇導引至 由導線49導引至接地層請注意，導線5。之該另―末: 121928.doc -19- 200827226 部分亦可直接連接至接地層G。 V線5 1之一末端部分連接至導線43之另一末端部分。導 線5 1之另一末端部分連接至焊盤8。此外，導線52之一末 女而部分連接至導線44之另一末端部分。導線52之另一末端 部分連接至焊盤9。導線51及52將自在導線43及44侧的該 等一末端部分輸入之電信號傳輸至在焊盤8及9側的該等另 一末端部分。 V線5 3之一末端部分連接至導線4丨之一中間部分。導線 53之另一末端部分連接至焊盤33。此外，導線54之一末端 部分連接至導線42之中間部分。導線54之另一末端部分連 接至焊盤35。導線53及54將自在導線41及42側的該等一末 端部分輸入之電信號傳輸至在焊盤33及35側的該等另一末 端部分。 導線55之一末端部分連接至焊盤34。導線55之另一末端 部分連接至佈線板80之接地層G。自在焊盤34側的導線55 之该一末端部分輸入之電信號由導線5 5而導引至接地層 G。此外’導線56之一末端部分連接至焊盤36。導線56之 另一末端部分連接至導線5 5之中間部分。自在焊盤3 6側的 導線56之該一末端部分輸入之電信號由導線56而導引至導 線55並由導線55而導引至接地層G。請注意，導線％之另 一末端部分亦可直接連接至接地層G。 導線57之一末端部分連接至焊盤3 ,且導線58之一末端 部分連接至焊盤6。導線59之一末端部分連接至焊盤12， 且導線60之一末端部分連接至焊盤丨3。此外，導線6〗之一 121928.doc -20- 200827226 末端部分連接至導線57及59之該等另一末端部分，且導線 62之一末端部分連接至導線58及6〇之該等另一末端部分。 儘管未’但是導線61及62之該等另—末端部分經由未 說明之電纜或其類似物而連接至前述零件&至η及其類似物 (參看圖1)。 導線63之一末端部分連接至焊盤4。此外，導線64之_ 末端部分連接至焊盤7。焊盤63及64之另一末端部分連接 至佈線板80之接地層G。自在焊盤4側的導線63之該一末端 部分輸入之電信號由導線63而導引至接地層G。此外，自 在焊盤7側的導線64之該一末端冑分輸入之電信號由導線 64而導引至接地層g。 導線65之一末端部分連接至焊盤1〇。導線65之另一末端 部为連接至佈線板80之接地層G。自在焊盤1〇側的導線65 之該一末端部分輸入之電信號由導線65而導引至接地層 G。此外，導線66之一末端部分連接至焊盤η。導線“之 另一末端部分連接至導線65之中間部分。自在焊盤丨丨側的 導線66之該一末端部分輸入之電信號由導線66而導引至導 線65並由導線65而導引至接地層G。請注意，導線66之另 一末端部分亦可直接連接至接地層G。 上文為佈線板80及安置有佈線板8〇之跨坐型機車9〇的組 態。接下來，將描述電晶體81a及81b&FET 82在佈線板8〇 上的安裝模式。 首先’將描述女裝電晶體8 1 &及8 1 b的狀況。如圖3中所 示電a曰體81a^ I於焊盤2至4上。同時，電晶體81a之三 121928.doc -21 - 200827226 個端子中，基極連接至烊盤2，集電極連接至焊盤3，且發 射極連接至焊盤4。 ’電晶體81b安裝於焊盤5至7 同時f曰曰體81b之二個端子中，基極連接至焊盤$， 集電極連接至焊盤6,且發射極連接至焊盤7。 此外，電阻1116、17、18及19與€晶體81认川安裝在 一起。此時’用於安裝電阻器16、17、18及19的焊盤h、 27、29及31在沿前_後方向延伸之直線u(參看㈣上自前 至後地按次序安置，且焊盤26、28、3〇及32在沿前_後方 向延伸並不同於直線L1之其他直線L2(參看圖2)上自前至 後地按认序安置。此外，焊盤25及焊盤％在一沿左-右方 向L伸之第二直線L3上跨越—預定距離彼此鄰近地安置。 焊盤27及焊盤28在一沿左-右方向延伸之第四直線L4上跨 越一預定距離彼此鄰近地安置。焊盤29及焊盤3〇在一沿 左1右方向延伸之第五直線^上跨越一預定距離彼此鄰近 地女置。焊盤31及焊盤32在一沿左_右方向延伸之第六直 線1^6上跨越一預定距離彼此鄰近地安置。由於焊盤25至32 之此配置’四個電阻器16、17、18及19彼此平行並在關於 左右方向相等之位置中安裝。由於該原因，可使用多連 接曰曰片電阻态X，其中四個電阻器16、17、18及19安裝於 單曰曰片中。因此’在本實施例中，多連接晶片電阻器X 安衣於*干盤25至32上。此時，電阻器16、17、18及19之端 子分別連接至焊盤25至32。 由於上述安裝模式，所以導線41及導線43經由電阻器18 而相互連接’且導線42及導線料經由電阻器丨9而相互連 121928.doc -22- 200827226 接。此外，導線47及導線49經由電阻器1 6而相互連接，且 導線48及導線50經由電阻器17而相互連接。因此，在佈線 板80上，形成一電流控制電路A1，其中輸入至導線41之電 信號經由電阻器I8、導線43、導線45、電晶體8ia及導線 5 7而自導線6 1輸出，及形成一電流控制電路b 1，其中輸入 至導線42之電信號經由電阻器19、導線44、導線46、電晶 體81b及導線58而自導線62輸出。The electrical signals input at the end portions are transmitted to the other end portions on the pads 2 and 5 sides. One end portion of the wire 47 is connected to the intermediate portion of the wire 45. The other end portion of the wire 47 is connected to the pad 26. Further, one end portion of the wire 48 is connected to an intermediate portion of the wire 46. The other end portion of the wire 48 is connected to the pad 28. The wires 47 and 48 transmit electrical signals input from the one end portions on the sides of the wires 45 and 46 to the other end portions on the sides of the pads 26 and 28. Note that one end portion of the wire 47 may also be connected to the middle portion of the wire 43 or the end portion of the wire 48 & or may be connected to the middle portion of the wire material. One end portion of the wire 49 is connected to the pad 25. The other end of the wire 49 is connected to the ground layer G of the wiring board 8A. An electric signal input from the one end portion of the wire 49 on the pad 25 side is guided to the ground layer G by the wire 49. Further, one end portion of the ^ wire 50 is connected to the pad 27. The other end of the wire 5 is connected to the middle portion of the wire 49. The electrical signal input from the 4th end portion of the wire 50 of the pad paste is guided by the wire 5 to the ground layer by the wire 49. Note that the wire 5 is. The other end: 121928.doc -19- 200827226 part can also be directly connected to the ground plane G. One end portion of the V line 51 is connected to the other end portion of the wire 43. The other end portion of the wire 51 is connected to the pad 8. In addition, one of the wires 52 is partially connected to the other end portion of the wire 44. The other end portion of the wire 52 is connected to the pad 9. The wires 51 and 52 transmit electrical signals input from the one end portions on the sides of the wires 43 and 44 to the other end portions on the sides of the pads 8 and 9. One end portion of the V line 53 is connected to one of the intermediate portions of the wire 4丨. The other end portion of the wire 53 is connected to the pad 33. Further, one end portion of the wire 54 is connected to the intermediate portion of the wire 42. The other end portion of the wire 54 is connected to the pad 35. The wires 53 and 54 transmit electric signals input from the one end portions on the sides of the wires 41 and 42 to the other end portions on the sides of the pads 33 and 35. One end portion of the wire 55 is connected to the pad 34. The other end portion of the wire 55 is connected to the ground layer G of the wiring board 80. The electric signal input from the one end portion of the wire 55 on the side of the pad 34 is guided to the ground layer G by the wire 55. Further, one end portion of the wire 56 is connected to the pad 36. The other end portion of the wire 56 is connected to the intermediate portion of the wire 55. The electrical signal input from the end portion of the wire 56 on the side of the pad 36 is guided by the wire 56 to the wire 55 and guided to the ground layer G by the wire 55. Note that the other end of the wire % can also be directly connected to the ground plane G. One end portion of the wire 57 is connected to the pad 3, and one end portion of the wire 58 is connected to the pad 6. One end portion of the wire 59 is connected to the pad 12, and one end portion of the wire 60 is connected to the pad 丨3. Further, one end of the wire 6121928.doc -20-200827226 is connected to the other end portions of the wires 57 and 59, and one end portion of the wire 62 is connected to the other ends of the wires 58 and 6〇 section. Although not the same, the other end portions of the wires 61 and 62 are connected to the aforementioned parts & to η and the like via an unillustrated cable or the like (see Fig. 1). One end portion of the wire 63 is connected to the pad 4. Further, the end portion of the wire 64 is connected to the pad 7. The other end portions of the pads 63 and 64 are connected to the ground layer G of the wiring board 80. An electric signal input from the one end portion of the wire 63 on the pad 4 side is guided to the ground layer G by the wire 63. Further, an electrical signal input from the one end of the wire 64 on the side of the pad 7 is guided by the wire 64 to the ground layer g. One end portion of the wire 65 is connected to the pad 1A. The other end portion of the wire 65 is a ground layer G connected to the wiring board 80. The electrical signal input from the end portion of the wire 65 on the side of the pad 1 is guided to the ground layer G by the wire 65. Further, one end portion of the wire 66 is connected to the pad n. The other end portion of the wire is connected to the middle portion of the wire 65. The electrical signal input from the end portion of the wire 66 on the side of the pad is guided by the wire 66 to the wire 65 and guided by the wire 65 to Ground layer G. Please note that the other end portion of the wire 66 can also be directly connected to the ground layer G. The above is the configuration of the wiring board 80 and the straddle locomotive 9 安置 in which the wiring board 8 is placed. Next, The mounting mode of the transistors 81a and 81b & FET 82 on the wiring board 8 will be described. First, the condition of the women's crystals 8 1 & and 8 1 b will be described. As shown in Fig. 3, the electric a body 81a ^ I is on pads 2 to 4. At the same time, among the transistors 121a, 121928.doc -21 - 200827226, the base is connected to the pad 2, the collector is connected to the pad 3, and the emitter is connected to the pad Disk 4. 'The transistor 81b is mounted on the pads 5 to 7 while the two terminals of the body 81b are connected, the base is connected to the pad $, the collector is connected to the pad 6, and the emitter is connected to the pad 7. In addition, the resistors 1116, 17, 18, and 19 are mounted together with the crystal 81. At this time, 'for mounting resistors 16, 17, 1 The pads h, 27, 29, and 31 of 8 and 19 are arranged in a line along the front-rear direction (see (4) in order from front to back, and the pads 26, 28, 3, and 32 are in the front_ The other straight line L2 (see Fig. 2) extending in the rear direction and different from the straight line L1 is placed in order from front to back. Further, the pad 25 and the pad % are on a second straight line L3 extending in the left-right direction L. The spans 27 are placed adjacent to each other. The pads 27 and the pads 28 are disposed adjacent to each other across a predetermined distance in a fourth straight line L4 extending in the left-right direction. The pads 29 and the pads 3 are on one edge. The fifth straight line extending in the left-right direction is disposed adjacent to each other across a predetermined distance. The pads 31 and the pads 32 are adjacent to each other across a predetermined distance in a sixth straight line 1^6 extending in the left-right direction. Placement. Since the pads 25 to 32 are configured, the four resistors 16, 17, 18, and 19 are parallel to each other and mounted in a position equal to the left and right direction. For this reason, a multi-connected chip resistance state can be used. X, wherein four resistors 16, 17, 18 and 19 are mounted in a single cymbal. Thus, in this embodiment The multi-connection wafer resistor X is mounted on the *dry disks 25 to 32. At this time, the terminals of the resistors 16, 17, 18 and 19 are respectively connected to the pads 25 to 32. Due to the above mounting mode, the wires 41 and The wires 43 are connected to each other via the resistor 18 and the wires 42 and the wires are connected to each other via a resistor 丨 9 to 121928.doc -22- 200827226. Further, the wires 47 and the wires 49 are connected to each other via the resistor 16 and The wire 48 and the wire 50 are connected to each other via a resistor 17. Therefore, on the wiring board 80, a current control circuit A1 is formed, in which an electrical signal input to the wire 41 is output from the wire 61 through the resistor I8, the wire 43, the wire 45, the transistor 8ia, and the wire 57, and is formed. A current control circuit b1, wherein the electrical signal input to the wire 42 is output from the wire 62 via the resistor 19, the wire 44, the wire 46, the transistor 81b, and the wire 58.
接下來，將描述安裝FET 82的狀況。如圖4中所示，FET 82安裝於焊盤8至13上。此時，FET 82之六個端子中，兩 個閘極端子分別連接至焊盤8及9，兩個源極端子分別連接 至焊盤12及13，且兩個汲極端子分別連接至焊盤1〇及丨ι。 此外，電阻器18、19、20及21與FET 82安裝在一起。此 日守，用於安裝電阻器18、19、20及21之焊盤29、31、33及 35在沿前-後方向延伸之直線L1(參看圖2)上以自前至後之 次序安置’且焊盤3G、32、34及36在沿前後方向延伸並 不同於直線L1之直線L2(參看圖2)上以自前至後之次序安 置。此外，焊盤2 9及焊盤3 0在沿左_右方向延伸之第五直 線L5上跨越一預定距離彼此鄰近地安置。焊盤3ι及焊盤μ 在沿左-右方向延伸之第六直線“上跨越一預定距離彼此 鄰近地安置。焊盤33及焊盤34在沿左_右方向延伸之第七 直線L7上跨越一預定距離彼此鄰近地安置。焊盤35及焊盤 %在沿左-右方向延伸之第八直線。上跨越一預定距離 此鄰近地安置。由於焊盤29至36之此配置，所以四個電阻 器19、20及21彼此平行並在關於左-右方向相等的位 121928.doc -23 - 200827226 置中安裝。由於該原因，所以可使用多連接晶片電阻器 Y，其中四個電阻器18、19、20及21安裝於單一晶片中。 因此，在本實施例中，多連接晶片電阻器Y安裝於焊盤29 至36上。此時，電阻器18、19、20及21之端子分別連接至 焊盤29至36。 由於上述安裝模式，所以導線41及導線43經由電阻器18 而相互連接，且導線42及導線44經由電阻器19而相互連 接。此外，導線53及導線55經由電阻器20而相互連接，且 導線54及導線56經由電阻器21而相互連接。因此，在佈線 板80上，形成一電壓控制電路A2，其中輸入至導線41之電 信號經由電阻器18、導線43、導線51、FET 82及導線59而 自導線61輸出，及形成一電壓控制電路B2，其中輸入至導 線42之電信號經由電阻器19、導線44、導線52、FET 82及 導線60而自導線62輸出。此外，電路a〇(參看圖2)係由電 流控制電路A1及電壓控制電路A2形成，且電路B〇(參看圖 2)係由電流控制電路…及電壓控制電路b2形成。 如上文所描述，可將諸如電晶體81&及gib及FET 82之不 同類型開關元件選擇性地安裝於與本實施例相關的佈線板 80上。由於該原因，電流控制電路A1與B1及電壓控制電 路A2與B2可選擇性地形成於單一佈線板8〇上。因此，佈 線板80可與規格不同（例如，其中輸出信號之目標不同）的 複數個跨坐型機車之電子控制設備共同使帛。目此，佈線 板80具有極佳的大規模生產率，且可減少與每一機車相關 的成本。 121928.doc -24- 200827226 此外，在佈線板80中，由於焊盤25至36之規則配置，所 以電阻器16至21可彼此平行並在左-右方向上相等之位置 中安裝。由於該原因，當安裝電晶體81a及8ib時，可使用 其:四個電阻器]6至19安裝於單一晶片中的多連接晶片電 阻器X，且當安裝FET 82時，可使用其中四個電阻器似 21安裝於單-晶片中的多連接晶片電阻器Y。因此，使用 相同佈線板80可易於安裝電阻器16至19或電阻器“至以， 〇 1可減少安裝之時間及成本。此外，當使用多連接晶片電 ㉟器時，與一次一個地安裝電阻器時相比，可減少板上需 要確保的空間。因此，根據佈線板8〇，亦可減少板面積。 請注意，電阻器18及19在安裝電晶體81a及8ib時的電阻值 可不同於或相同於安裝！?£丁 82時之電阻值。 此外’在佈線板80中，導線41、焊盤29及3〇及導線Μ被 電流控制電路A1與電壓控制電路A2共用。此外，導線 42干盤31及32及導線44被電流控制電路]^與電壓控制電 。 路B2共用。因此’用於安裝多連接晶片電阻器X之空間與 用於安裝多連接晶片電阻器γ之空間可部分地重疊（在本實 施例中，電阻器18及19)。因此，還可更加減少用於安裝 電阻器16至21之空間，且亦可減少板面積。 在本實施例中’焊盤25比焊盤26更遠地安置於左側，且 焊盤27比焊盤28更遠地安置於左側。然而，亦可颠倒焊盤 25與26及焊盤27與28的配置。此外，焊盤33比焊盤μ更遠 地安置於左側’且焊盤35比焊盤36更遠地安置於左側。然 而，亦可顛倒焊盤33與34及焊盤35與36的配置。 121928.doc •25- 200827226 在佈線板80中，將兩個電路A1及B1安置為電流控制電 路且將兩個電路A2及B2安置為電壓控制電路，但即使當 僅安置包含電流控制電路A1及電壓控制電路A2之電路 A〇(參看圖2)或包含電流控制電路B1及電壓控制電路…之 黾路80(《看圖2)時，也可獲得與前述效應相同之效應。 此外’亦可添加與電流控制電路A1及B丨相同組態的電 路及14電壓控制電路A2及B2相同組態的電路至佈線板 80 ° 在此狀況下，如圖5中所示，對應於電路A丨之焊盤25或 龟路則之;fep盤27的焊盤25c在前-後方向上鄰近於直線li上 之焊盤25與27的一者或二者而安置。對應於電路A1之焊盤 26或電路B1之焊盤28的焊盤26c在前_後方向上鄰近於直線 L2上之焊盤26與28的一者或二者而安置。對應於電路A2 之焊盤33或電路B2之焊盤35的焊盤33c在前_後方向上鄰近 於直線L1上之焊盤33與35的一者或二者而安置。對應於電 路A2之焊盤34或電路B2之焊盤36的焊盤34c在前·後方向上 鄰近於直線L2上之焊盤34與36的一者或二者而安置。對應 於電路A1及A2之焊盤29或電路B1&B2之焊盤31的焊盤29c 在前-後方向上鄰近於直線L1上之焊盤29與31的一者或二 者而安置。對應於電路A1及A2之焊盤30或電路扪及…之 焊盤32的焊盤30c在前-後方向上鄰近於直線L2上之焊盤％ 與32的一者或二者而安置。在圖5中，焊盤及2^在焊 盤25及26之前側鄰近於焊盤25及26而安置，焊盤29c及3〇c 在焊盤29及30之前側鄰近於焊盤29及3〇而安置，且焊盤 121928.doc -26 - 200827226 33c及34c在焊盤33及34之前側鄰近於焊盤33及34而安置。 藉由以此方式安置焊盤之每一者，即使當一次一個地添 加與電流控制電路A1及B1相同組態之電路及與電壓控制 電路A2及B2相同組態之電路，藉由使用其中六個電阻器 平行排列的多連接晶片電阻器Xc及YC也可獲得與前述效 應相同之效應。請注意，即使當添加並非一個而是複數個 與電流控制電路A1及B1相同組態之電路及複數個與電壓 控制電路A2及B2相同組態之電路，也可獲得相同效靡。 f 1 在與本實施例相關之電路1中，電路經組態成可選擇性 地安裝一電流控制第一開關元件及一電壓控制第二開關元 件，將電晶體81a及81b用作第一開關元件，且將FET以用 作第二開關元件。然而，第一及第二開關元件不限於此 等。此外’在與本實施例相關之電路1中，將雙極電晶體 用作電晶體81a及81b，且將安置有兩個閘極端子、兩個汲 極端子及兩個源極端子之封裝型FET用作FET 82。然而， 電晶體81a及81b及FET 82不限於此等。 (弟二實施例） 在本實施例中，跨坐型機車90之總組態與第—實施例之 組態相同，所以將省略其描述。此外，如圖6中所示，類 似於第一實施例之佈線板8〇，一經組態成可選擇性地安裝 電晶體81a及81b(參看圖7)及FET 82(參看圖8)的電路ι〇ι = 置於本實施例之佈線板180上。電路1〇1之組態被部分地盥 第一實施例之電路i之組態共用，且以與第一實施例之彼 等方式大致相同之方式組態用於安裝電晶體8u及(參 121928.doc •27- 200827226 看圖7)之焊盤2至4及5至7及用於安裝FET(參看圖8)之焊盤 8至13及導線57至66。由於該原因，將省略此等之描述且 將僅描述不同部分。下文，圖6之頂側將被稱為前側，底 侧將被稱為後側，左側將被稱為左侧，且右側將被稱為右 側0Next, the state in which the FET 82 is mounted will be described. As shown in FIG. 4, the FET 82 is mounted on the pads 8 to 13. At this time, of the six terminals of the FET 82, two gate terminals are respectively connected to the pads 8 and 9, the two source terminals are respectively connected to the pads 12 and 13, and the two germanium terminals are respectively connected to the pads. 1〇 and 丨ι. Further, resistors 18, 19, 20 and 21 are mounted with FET 82. This day, the pads 29, 31, 33, and 35 for mounting the resistors 18, 19, 20, and 21 are placed in a front-to-back order on a straight line L1 (see FIG. 2) extending in the front-rear direction. And the pads 3G, 32, 34, and 36 are arranged in a front-to-back order on a straight line L2 (see FIG. 2) extending in the front-rear direction and different from the straight line L1. Further, the pad 2 9 and the pad 30 are disposed adjacent to each other across a predetermined distance in the fifth straight line L5 extending in the left-right direction. The pads 3 and the pads μ are disposed adjacent to each other across a sixth straight line extending in the left-right direction. The pads 33 and the pads 34 span across a seventh line L7 extending in the left-right direction. A predetermined distance is disposed adjacent to each other. The pad 35 and the pad % are in an eighth straight line extending in the left-right direction. The upper portion is disposed adjacent to each other across a predetermined distance. Due to the configuration of the pads 29 to 36, four The resistors 19, 20 and 21 are parallel to each other and are mounted in positions 121928.doc -23 - 200827226 which are equal in the left-right direction. For this reason, a multi-connection wafer resistor Y can be used, of which four resistors 18 19, 20, and 21 are mounted in a single wafer. Therefore, in the present embodiment, the multi-connection wafer resistor Y is mounted on the pads 29 to 36. At this time, the terminals of the resistors 18, 19, 20, and 21 are respectively Connected to the pads 29 to 36. Due to the above-described mounting mode, the wires 41 and the wires 43 are connected to each other via the resistor 18, and the wires 42 and the wires 44 are connected to each other via the resistor 19. Further, the wires 53 and 55 are connected via resistors 20 connected to each other and wire 5 4 and the wires 56 are connected to each other via the resistor 21. Therefore, on the wiring board 80, a voltage control circuit A2 is formed in which an electric signal input to the wire 41 passes through the resistor 18, the wire 43, the wire 51, the FET 82, and the wire 59 is output from the wire 61, and a voltage control circuit B2 is formed, wherein the electrical signal input to the wire 42 is output from the wire 62 via the resistor 19, the wire 44, the wire 52, the FET 82, and the wire 60. Further, the circuit a〇 (See Fig. 2) is formed by current control circuit A1 and voltage control circuit A2, and circuit B (see Fig. 2) is formed by current control circuit ... and voltage control circuit b2. As described above, such as a transistor Different types of switching elements of 81 & gib and FET 82 are selectively mounted on the wiring board 80 associated with the present embodiment. For this reason, the current control circuits A1 and B1 and the voltage control circuits A2 and B2 are selectively formed. It is on a single wiring board 8. Therefore, the wiring board 80 can be combined with electronic control devices of a plurality of straddle locomotives having different specifications (for example, the target of the output signal is different). The board 80 has excellent mass productivity and can reduce the cost associated with each locomotive. 121928.doc -24- 200827226 Further, in the wiring board 80, the resistor 16 is arranged due to the regular arrangement of the pads 25 to 36. To 21 can be mounted parallel to each other and in the left-right direction at equal positions. For this reason, when the transistors 81a and 8ib are mounted, they can be used: four resistors 6 to 19 mounted in a single wafer The wafer resistor X is connected, and when the FET 82 is mounted, a multi-connection wafer resistor Y in which four resistors 21 are mounted in a single-wafer can be used. Therefore, the use of the same wiring board 80 makes it easy to mount the resistors 16 to 19 or the resistors "to, the 〇1 can reduce the time and cost of installation. In addition, when using the multi-connection wafer 35, the resistors are mounted one at a time. Compared with the device, the space required for the board can be reduced. Therefore, the board area can be reduced according to the wiring board 8〇. Note that the resistance values of the resistors 18 and 19 when the transistors 81a and 8ib are mounted may be different. Or the same as the resistance value of the installation! In addition, in the wiring board 80, the wire 41, the pads 29 and 3, and the wire Μ are shared by the current control circuit A1 and the voltage control circuit A2. In addition, the wire 42 The dry disks 31 and 32 and the wires 44 are controlled by the current control circuit and the voltage control circuit B. Therefore, the space for mounting the multi-connection wafer resistor X and the space for mounting the multi-connection wafer resistor γ can be partially The ground overlap (in the present embodiment, the resistors 18 and 19). Therefore, the space for mounting the resistors 16 to 21 can be further reduced, and the board area can also be reduced. In the present embodiment, the 'pad 25 ratio The pad 26 is placed further away The side, and the pad 27 is disposed on the left side farther than the pad 28. However, the configuration of the pads 25 and 26 and the pads 27 and 28 may be reversed. Further, the pad 33 is disposed farther to the left than the pad μ' And the pad 35 is disposed on the left side farther than the pad 36. However, the configuration of the pads 33 and 34 and the pads 35 and 36 may be reversed. 121928.doc • 25- 200827226 In the wiring board 80, two circuits are A1 and B1 are placed as current control circuits and two circuits A2 and B2 are placed as voltage control circuits, but even when only circuit A including current control circuit A1 and voltage control circuit A2 (see Fig. 2) or current control is included When the circuit B1 and the voltage control circuit are connected to the circuit 80 (see Figure 2), the same effect as the aforementioned effect can be obtained. In addition, the circuit with the same configuration as the current control circuits A1 and B丨 and the 14 voltage can be added. Control circuit A2 and B2 are configured with the same circuit to the wiring board 80 °. In this case, as shown in FIG. 5, corresponding to the pad 25 of the circuit A or the turtle path; the pad 25c of the fep disk 27 is Placed in the front-rear direction adjacent to one or both of pads 25 and 27 on line li The pad 26c corresponding to the pad 26 of the circuit A1 or the pad 28 of the circuit B1 is disposed adjacent to one or both of the pads 26 and 28 on the line L2 in the front-rear direction. Corresponding to the soldering of the circuit A2 The pad 33c of the pad 35 or the pad 35 of the circuit B2 is disposed adjacent to one or both of the pads 33 and 35 on the straight line L1 in the front-rear direction. Corresponding to the pad 34 of the circuit A2 or the circuit B2 The pad 34c of the pad 36 is disposed adjacent to one or both of the pads 34 and 36 on the line L2 in the front-rear direction. The pad 29 corresponding to the circuits A1 and A2 or the pad of the circuit B1 & B2 The pad 29c of 31 is disposed adjacent to one or both of the pads 29 and 31 on the straight line L1 in the front-rear direction. The pads 30c corresponding to the pads 30 of the circuits A1 and A2 or the pads 32 of the circuits 扪 and ... are disposed adjacent to one or both of the pads % and 32 on the straight line L2 in the front-rear direction. In FIG. 5, pads and pads are disposed adjacent to pads 25 and 26 on the front side of pads 25 and 26, and pads 29c and 3〇c are adjacent to pads 29 and 3 on the front side of pads 29 and 30. The pads 121928.doc -26 - 200827226 33c and 34c are disposed adjacent to pads 33 and 34 on the front side of pads 33 and 34. By arranging each of the pads in this manner, even when the same configuration circuit as the current control circuits A1 and B1 and the same configuration circuit as the voltage control circuits A2 and B2 are added one at a time, by using six of them The multi-connection wafer resistors Xc and YC in which the resistors are arranged in parallel can also obtain the same effects as the aforementioned effects. Note that the same effect can be obtained even when a circuit that is configured not the same as the current control circuits A1 and B1 and a plurality of circuits configured the same as the voltage control circuits A2 and B2 are added. f 1 In the circuit 1 related to the present embodiment, the circuit is configured to selectively mount a current control first switching element and a voltage control second switching element, and the transistors 81a and 81b are used as the first switch The component and the FET is used as the second switching element. However, the first and second switching elements are not limited thereto. Further, in the circuit 1 related to the present embodiment, a bipolar transistor is used as the transistors 81a and 81b, and a package type in which two gate terminals, two NMOS terminals, and two source terminals are disposed will be disposed. The FET is used as the FET 82. However, the transistors 81a and 81b and the FET 82 are not limited thereto. (Second Embodiment) In the present embodiment, the overall configuration of the straddle locomotive 90 is the same as that of the first embodiment, so the description thereof will be omitted. Further, as shown in Fig. 6, similar to the wiring board 8A of the first embodiment, a circuit configured to selectively mount the transistors 81a and 81b (see Fig. 7) and the FET 82 (see Fig. 8) Ι〇ι = is placed on the wiring board 180 of this embodiment. The configuration of the circuit 101 is shared in part by the configuration of the circuit i of the first embodiment, and is configured to mount the transistor 8u and in substantially the same manner as the first embodiment (see 121928). .doc •27- 200827226 See pads 2 to 4 and 5 to 7 of Figure 7) and pads 8 to 13 and wires 57 to 66 for mounting the FET (see Figure 8). For this reason, the description of these will be omitted and only different parts will be described. Hereinafter, the top side of Fig. 6 will be referred to as the front side, the bottom side will be referred to as the rear side, the left side will be referred to as the left side, and the right side will be referred to as the right side 0.
焊盤111至122安置於電路ιοί上。焊盤至122配置於 一網格中。焊盤111至114在一沿前-後方向延伸之第一直 線L11上自前側至後側按次序安置。焊盤115至U8在第一 直線L11之右側的一沿前-後方向延伸之第二直線l丨2上自 前側至後側按次序安置。焊盤119至122在第二直線L12之 右側的一沿前-後方向延伸之第三直線L13上自前側至後側 按次序安置。此外，焊盤111、115及119在一沿左_右方向 延伸之第四直線L14上自左側至右側按次序配置。焊盤 112、116及120在第四直線L14之後側的一沿左-右方向延 伸之第五直線L1 5上自左侧至右側按次序配置。焊盤丨丨3、 117及121在第五直線L15之後側的一沿左_右方向延伸之第 六直線L16上自左側至右側按次序配置。焊盤114、ιΐ8及 122在第六直線L1 6之後側的一沿左-右方向延伸之第七直 線L17上自左側至右側按次序配置。 儘管其將在稍後加以描述，但是焊盤U1s114為用於安 裝電阻器172至175(參看圖7)之每一者的一端子的焊盤，且 焊盤119至122為用於安裝電 者的一端子的焊盤。此外， 172(參看圖7)之另一端子或 阻器176至179(參看圖8)之每一 焊盤115為一用於安裝電阻器 電阻器176(參看圖8)之另一端 121928.doc •28- 200827226 :的焊盤。焊盤116為—用於安裝電阻器i73(參看圖7)之另 一端子或電阻器177(參看圖8)之另—端子的焊盤。焊盤in 為一用於安裝電阻器m(參看圖7)之另—端子或電阻器 參看圖8)之另一端子的焊盤。焊盤ιΐ8為一用於安裝電 阻器175(參看圖7)之另_端子或電阻器179(參看圖之另 一端子的焊盤。 導線141及142(其之每一者的一末端部分連接至微電腦 輸出碥子或其類似物（未圖示））安置於電路1〇1中。導線Mi 之另一末端部分連接至焊盤U1，且導線142之另一末端部 分連接至焊盤113。導線141及142將自微電腦輸出端子或 其類似物輸入的電信號傳輸至連接至焊盤丨丨丨及丨13之其他 末端部分。 導線143之一末端部分連接至焊盤115。此外，導線144 之一末端部分連接至焊盤117。導線143及144將自在焊盤 11 5及117側的該等一末端部分輸入之電信號傳輸至另一末 端部分。 導線45之一末端部分連接至導線143之另一末端部分。 導線45之另一末端部分連接至焊盤2。此外，導線46之一 末端部分連接至導線144之另一末端部分。導線46之另一 末端部分連接至焊盤5。導線45及46將自在導線143及144 側的該等一末端部分輸入之電信號傳輸至在導線2及5側的 該等另一末端部分。 導線147之一末端部分連接至焊盤11 5。導線147之另一 末端部分連接焊盤112。此外，導線148之一末端部分連接 121928.doc -29- 200827226 至焊盤117。導線148之另一末端部分連接至焊盤114。導 線147及148將自在焊盤115及117側的該等一末端部分輸入 之電信號傳輸至在焊盤112及114側的該等另一末端部分。 導線149之一末端部分連接至焊盤116。導線149之另一 末端部分連接至佈線板180之接地層G。此外，導線15〇之 一末端部分連接至焊盤118。導線150之另一末端部分連接 至佈線板1 80之接地層g。自在焊盤116及11 8側的導線149 及150之該等一末端部分輸入之電信號由導線149及丨5〇而 導引至接地層G。 導線5 1之一末端部分連接至導線143之另一末端部分。 導線5 1之另一末端部分連接至焊盤8。此外，導線52之一 末端部分連接至導線144之另一末端部分。導線152之另一 末端部分連接至焊盤9。導線51及52將自在導線143及144 側的該等一末端部分輸入之電信號傳輸至在焊盤8及9側的 該等另一末端部分。 導線170之一末端部分連接至導線141之一中間部分。導 線1 70之另一末端部分連接至焊盤丨丨9。此外，導線17 1之 一末知部分連接至導線142之中間部分。導線171之另一末 知部分連接至焊盤121。導線17〇及i7i將自在導線141及 142側的该等一末端部分輸入之電信號傳輸至在焊盤丨19及 12 1側的該等另一末端部分。 導線153之一末端部分連接至導線170之一中間部分。導 線153之另一末端部分連接至焊盤。此外，導線154之 末端邛刀連接至導線171之中間部分。導線1 54之另一末 121928.doc -30- 200827226 端部分連接至桿盤122。導線153及154將自在導線l4l及 142側的該等—末端部分輸人之電信號傳輸至在焊盤120及 122側的該等另一末端部分。 上文為佈線板18 〇及佈線板丨8 〇上所安置之電路丨〇丨的組 恶。接下來，將描述電晶體81a與81b及FET 82在佈線板 180上的安裝模式。 首先，將描述安裝電晶體81a及81b的狀況。請注意，因 為電晶體81a及8ib之安裝與第一實施例相同，所以將簡化 描述。 如圖7中所示，當女裝電晶體81&及gib時，電阻器172、 173、174及175與其一起安裝。此時，用於安裝電阻器 172、173、174及175之每一者的一端子之焊盤lu至114在 沿前-後方向延伸之第一直線L11上自前側至後側按次序安 置。此外，用於安裝電阻器172、173、174及175之其他端 子的電阻焊盤115至11 8在第一直線L11之右側的沿前_後 方向延伸之第二直線L12上自前側至後側按次序安置。由 於焊盤111至11 8之此配置，所以四個電阻器丨72、i 73、 174及175彼此平行並在關於左-右方向相等的位置中安 裝。由於該原因，可使用多連接晶片電阻器X，，其中四個 電阻器172、173、174及175安裝於單一晶片中。因此，多 連接晶片電阻器X，安裝於焊盤111至118上。此時，電阻器 172、173、174及175之端子分別連接至焊盤^丨丨至丨^。 由於上述安裝模式，所以導線141及143經由電阻器172 而相互連接，且導線142及144經由電阻器ι74而相互連 121928.doc -31 - 200827226 接。此外，導線147及149經由電阻器1 73而相互連接，且 導線148及150經由電阻器175而相互連接。因此，在佈線 板180上，形成一電流控制電路All，其中輸入至導線141 之電信號經由電阻器172、導線143、導線45、電晶體8 la 及導線5 7而自導線6 1輸出，及形成一電流控制電路b 11， 其中輸入至導線142之電信號經由電阻器174、導線144、 導線46、電晶體81b及導線58而自導線62輸出。 接下來，將描述安裝FET 82之狀況。請注意，因為FET 82之安裝與第一實施例中相同，所以將簡化描述。 如圖8中所示，當安裝FET 82時，電阻器176、177、178 及179與其一起安裝。此時，用於安裝電阻器176、m、 178及179之其他端子的焊盤115至118在第一直線L11之右 側的沿前-後方向延伸之第二直線L12上自前側至後側按次 序安置。此外，用於安裝電阻器176、177、178及179之每 一者的一端子之焊盤119至122在第二直線L12之右側的沿 前-後方向延伸之第三直線L13上自前側至後側按次序安 置。由於焊盤115至122之此配置，所以四個電阻器176、 Π7、178及179彼此平行並在關於左右方向相等的位置中 安裝。由於該原因，可使用多連接晶片電阻器γ，，其中四 個電阻器176、177、178及179安裝於單一晶片中。因此， 多連接晶片電阻器γ，安裝於焊盤115至122上。此時，電阻 器176、177、178及179之端子分別連接至焊盤115至122。 由於上述安裝模式，導線170及導線143經由電阻器176 而相互連接，且導線171及導線144經由電阻器178而相互 121928.doc -32- 200827226 連接。此外，導線153及導線149經由電阻器177而相互連 接，且導線154及導線150經由電阻器179而相互連接。因 此，在佈線板1 80上，形成一電壓控制電路A12，其中輸入 至導線141之電信號經由導線170、電阻器176、導線143、 導線51、FET 82及導線59而自導線61輸出，及形成一電壓 控制電路B 12 ’其中輸入至導線142之電信號經由導線 171、電阻器178、導線144、導線52、FET 82及導線60而 自導線62輸出。此外，電路A10(參看圖6)係由電流控制電 路All及電壓控制電路A12形成，且電路B0(參看圖6)係由 電流控制電路B 11及電壓控制電路B 12形成。 如上文所述，根據與本實施例相關之佈線板1 8 〇，可以 相同於與第一實施例相關之佈線板8 〇的方式來選擇性地安 裝諸如電晶體81a及81b及FET 82之不同類型開關元件。由 於該原因’可將電流控制電路A11及b 11及電壓控制電路 A12及B 12選擇性地形成於單一佈線板1 8 〇上。因此，可配 合規格不同的跨坐型機車之電子控制設備來使用佈線板 180。因此，佈線板180具有極佳的大規模生產率，且可減 少與每一機車相關之成本。 此外，在佈線板180中’因為焊盤lu至122安置於一網 格中，所以電阻器172至175及電阻器176至179可彼此平行 並在左_右方向上相等的位置中安裝。由於該原因，亦在 佈線板180中，當安裝電晶體81a及81b時，可使用其中四 個電阻器172至175安裝於單一晶片中的多連接晶片電阻器 X’，且當安裝FET 82時，可使用其中四個電阻器176至179 121928.doc -33 - 200827226 安裝於單一晶片中的多連接晶片電阻器γ，。因此，藉由使 用佈線板180，可易於安裝電阻器172至175或電阻器至 179，且可減少安裝之時間及成本。此外，藉由使用多連 接晶片電阻器，亦可減少板面積。 此外’在佈線板180中，焊盤115至11 8被電流控制電路 All及Β11與電壓控制電路Α12及Β12共用。因此，可將焊 盤之數目減少至2/3。此外，藉由允許焊盤115至U8被電 流控制電路A11及Β 11與電壓控制電路a 12及Β 12共用，亦 可共用導線143及144以及導線149及1 5 0。因此，根據佈線 板1 8 0，可減少板面積。 在佈線板180中，將兩個電路All及B11安置為電流控制 電路且將兩個電路A12及B12安置為電壓控制電路，但是 即使當僅安置包含電流控制電路Al 1及電壓控制電路A1 2 之電路A10(參看圖6)或包含電流控制電路β 11及電壓控制 電路B12之電路B10(參看圖6)時也可獲得與前述效應相同 之效應。 此外，亦可添加與電流控制電路A11及Β 11相同組態之 電路及與電壓控制電路A12及B 12相同組態之電路。在此 狀況下，一對應於電路All之焊盤111或電路B11之焊盤113 的焊盤及一對應於電路All之焊盤112或電路B11之焊盤114 的焊盤安置於第一直線L11上。另外，藉由使用一其中六 個電阻器安裝於單一晶片中的多連接晶片電阻器，可獲得 與前述效應相同之效應。此外，即使當添加並非僅一個而 是複數個與電流控制電路Al 1及Β 11相同組態之電路及複 121928.doc -34- 200827226 數個與電壓控制電路A12及B 12相同組態之電路，也可獲 得相同效應。 [工業實用性] 如上文所述，本發明在佈線板及安置有該佈線板之跨坐 型機車方面係有用的，且尤其在經組態成可選擇性地安裝 不同類型開關元件之佈線板及安置有該佈線板之跨坐型機 車方面係有用的。 【圖式簡單說明】 圖1為一展示一與第一實施例相關之跨坐型機車的側視 圖。 圖2為一安置於與第一實施例相關之佈線板上的電路之 組態圖。 圖3為一展示當電晶體安裝於圖2之電路上時的組態之 圖。 圖4為一展示當FET安裝於圖2之電路上時的組態之圖。 圖5為一展示與一修改相關的電路之一部分的圖。 圖6為一安置於與第二實施例相關之佈線板上的電路之 組態圖。 圖7為一展示當電晶體安裝於圖6之電路上時之組態的 圖。 圖8為一展示當FET安裝於圖6之電路上時之組態的圖。 圖9為一安置於習知佈線板上的電路之組態圖。 圖1 〇為一展示當電晶體安裝於圖9之電路上時之組態的 圖0 121928.doc -35- 200827226 圖11為一展示當FET安裝於圖9之電路上時之組態的圖 電路 【主要元件符號說明】 1 2、5 3 > 6 4 7 8、9 10、11 12、13 16、17 16c 18、19 18c 20、21 20c 25、27 25c 26 、 28 卜 26c 29、 31 29c 30、 32 30c 焊盤（第七焊盤） 焊盤（第八焊盤） 焊盤 焊盤 焊盤（第九焊盤） 焊盤 焊盤（第十焊盤） 電阻器（第一電阻器） 電阻器 電阻器（第二電阻器、第三電阻器） 電阻器 電阻器（第四電阻器） 電阻器 焊盤（第一焊盤） 焊盤 焊盤（第二焊盤） 焊盤 焊盤（第三焊盤） 焊盤 焊盤（第四焊盤） 焊盤 121928.doc -36- 200827226 33 > 35 33c 、 34c 34、36 41、42 43、44 45、46 47、48 49、50 (' 51、52 53、54 55、56 57、58 59、60 61 、 62 、 63 、 64 ' 焊盤（第五焊盤） 焊盤 焊盤（第六焊盤） 導線（第一導線) 導線（第二導線) 導線（第二導線) 導線（第五導線) 導線（第六導線) 導線（第四導線) 導線（第七導線) 導線（第八導線) 導線（第九導線) 導線（第十導線) 導線 65 ^ 66 80 、 180 81a、81b 82 90 91 92 93 101 111、112、113、114、 佈線板 電晶體（第一開關元件） FET(第二開關元件） 跨坐型機車 機車本體 蓋The pads 111 to 122 are disposed on the circuit ιοί. Pads 122 are arranged in a grid. The pads 111 to 114 are arranged in order from the front side to the rear side on a first straight line L11 extending in the front-rear direction. The pads 115 to U8 are disposed in order from the front side to the rear side on a second line l2 extending in the front-rear direction on the right side of the first straight line L11. The pads 119 to 122 are disposed in order from the front side to the rear side on a third straight line L13 extending in the front-rear direction on the right side of the second straight line L12. Further, the pads 111, 115 and 119 are arranged in order from the left to the right on a fourth straight line L14 extending in the left-right direction. The pads 112, 116, and 120 are arranged in order from the left side to the right side on a fifth straight line L1 5 extending in the left-right direction on the rear side of the fourth straight line L14. The pads 丨丨3, 117, and 121 are arranged in order from the left side to the right side on a sixth straight line L16 extending in the left-right direction on the rear side of the fifth straight line L15. The pads 114, ι 8 and 122 are arranged in order from the left to the right on a seventh straight line L17 extending in the left-right direction on the rear side of the sixth straight line L1 6 . Although it will be described later, the pad U1s114 is a pad for mounting one terminal of each of the resistors 172 to 175 (refer to FIG. 7), and the pads 119 to 122 are for mounting the electrician One terminal pad. Further, each of the pads 172 (see FIG. 7) or each of the pads 176 to 179 (see FIG. 8) 115 is the other end of the resistor resistor 176 (see FIG. 8) 121928.doc • 28-200827226: The pad. Pad 116 is the pad for mounting the other terminal of resistor i73 (see Figure 7) or the other terminal of resistor 177 (see Figure 8). The pad in is a pad for mounting the resistor m (see Figure 7) or a resistor for the other terminal of Figure 8). The pad ΐ8 is a further terminal or resistor 179 for mounting the resistor 175 (see FIG. 7) (see the pad of the other terminal of the figure. The wires 141 and 142 (one end portion of each of them is connected) The microcomputer output dice or the like (not shown) is disposed in the circuit 101. The other end portion of the wire Mi is connected to the pad U1, and the other end portion of the wire 142 is connected to the pad 113. The wires 141 and 142 transmit electrical signals input from the microcomputer output terminal or the like to other end portions connected to the pads 丨 and 丨 13. One end portion of the wire 143 is connected to the pad 115. Further, the wire 144 One end portion is connected to the pad 117. The wires 143 and 144 transmit electrical signals input from the one end portions on the pads 11 5 and 117 side to the other end portion. One end portion of the wire 45 is connected to the wire 143. The other end portion of the wire 45 is connected to the pad 2. Further, one end portion of the wire 46 is connected to the other end portion of the wire 144. The other end portion of the wire 46 is connected to the pad 5. Wires 45 and 46 will be free The electrical signals input to the one end portions of the lines 143 and 144 are transmitted to the other end portions on the sides of the wires 2 and 5. One end portion of the wire 147 is connected to the pad 115. The other end of the wire 147 Partially connected to the pad 112. Further, one end portion of the wire 148 is connected to 121928.doc -29-200827226 to the pad 117. The other end portion of the wire 148 is connected to the pad 114. The wires 147 and 148 will be free from the pad 115 and The electrical signals input to the one end portion of the 117 side are transmitted to the other end portions on the sides of the pads 112 and 114. One end portion of the wire 149 is connected to the pad 116. The other end portion of the wire 149 is connected to The ground layer G of the wiring board 180. Further, one end portion of the wire 15 is connected to the pad 118. The other end portion of the wire 150 is connected to the ground layer g of the wiring board 180. From the pads 116 and 118 side The electrical signals input to the end portions of the wires 149 and 150 are guided by the wires 149 and 丨5〇 to the ground layer G. One end portion of the wire 51 is connected to the other end portion of the wire 143. The other end portion is connected to the pad 8. This One end portion of the wire 52 is connected to the other end portion of the wire 144. The other end portion of the wire 152 is connected to the pad 9. The wires 51 and 52 are input from the end portions of the wires 143 and 144 side. The signals are transmitted to the other end portions on the sides of the pads 8 and 9. One end portion of the wire 170 is connected to one of the intermediate portions of the wires 141. The other end portion of the wire 170 is connected to the pad 丨丨 9. One of the wires 17 1 is connected to the middle portion of the wire 142. The other known portion of the wire 171 is connected to the pad 121. The wires 17A and i7i transmit electrical signals input from the one end portions on the sides of the wires 141 and 142 to the other end portions on the sides of the pads 19 and 121. One end portion of the wire 153 is connected to one of the intermediate portions of the wire 170. The other end portion of the wire 153 is connected to the pad. Further, the end of the wire 154 is connected to the intermediate portion of the wire 171. The other end of the wire 1 54 121928.doc -30- 200827226 is connected to the hub 122. The wires 153 and 154 transmit electrical signals input from the end portions of the wires 11 and 142 to the other end portions on the pads 120 and 122 sides. The above is the circuit board 18 and the circuit board placed on the wiring board 丨8 〇. Next, the mounting patterns of the transistors 81a and 81b and the FET 82 on the wiring board 180 will be described. First, the state in which the transistors 81a and 81b are mounted will be described. Note that since the mounting of the transistors 81a and 8ib is the same as that of the first embodiment, the description will be simplified. As shown in Figure 7, resistors 172, 173, 174 and 175 are mounted together with the women's transistors 81 & gib. At this time, the pads lu to 114 of one terminal for mounting each of the resistors 172, 173, 174, and 175 are sequentially disposed from the front side to the rear side on the first straight line L11 extending in the front-rear direction. Further, the resistance pads 115 to 11 8 for mounting the other terminals of the resistors 172, 173, 174, and 175 are pressed from the front side to the rear side on the second straight line L12 extending in the front-rear direction on the right side of the first straight line L11. Order placement. Due to this configuration of the pads 111 to 117, the four resistors 丨 72, i 73, 174 and 175 are parallel to each other and mounted in positions equal to the left-right direction. For this reason, a multi-connection wafer resistor X can be used in which four resistors 172, 173, 174 and 175 are mounted in a single wafer. Therefore, the multi-connection wafer resistor X is mounted on the pads 111 to 118. At this time, the terminals of the resistors 172, 173, 174, and 175 are connected to the pads, respectively. Due to the above mounting mode, the wires 141 and 143 are connected to each other via the resistor 172, and the wires 142 and 144 are connected to each other via the resistor ι 74 121928.doc -31 - 200827226. Further, the wires 147 and 149 are connected to each other via the resistor 173, and the wires 148 and 150 are connected to each other via the resistor 175. Therefore, on the wiring board 180, a current control circuit A1 is formed, in which an electric signal input to the wire 141 is output from the wire 61 through the resistor 172, the wire 143, the wire 45, the transistor 8 la and the wire 57, and A current control circuit b11 is formed, wherein the electrical signal input to the wire 142 is output from the wire 62 via the resistor 174, the wire 144, the wire 46, the transistor 81b, and the wire 58. Next, the state in which the FET 82 is mounted will be described. Note that since the mounting of the FET 82 is the same as in the first embodiment, the description will be simplified. As shown in Fig. 8, when the FET 82 is mounted, the resistors 176, 177, 178, and 179 are mounted together therewith. At this time, the pads 115 to 118 for mounting the other terminals of the resistors 176, m, 178, and 179 are in order from the front side to the rear side on the second straight line L12 extending in the front-rear direction on the right side of the first straight line L11. Placement. Further, the pads 119 to 122 of one terminal for mounting each of the resistors 176, 177, 178, and 179 are on the third straight line L13 extending in the front-rear direction on the right side of the second straight line L12 from the front side to the front side The rear side is placed in order. Due to this configuration of the pads 115 to 122, the four resistors 176, Π 7, 178, and 179 are parallel to each other and mounted in positions equal to each other in the left-right direction. For this reason, a multi-connection wafer resistor γ can be used, in which four resistors 176, 177, 178 and 179 are mounted in a single wafer. Therefore, the multi-connection wafer resistor γ is mounted on the pads 115 to 122. At this time, the terminals of the resistors 176, 177, 178, and 179 are connected to the pads 115 to 122, respectively. Due to the above mounting mode, the wires 170 and the wires 143 are connected to each other via the resistor 176, and the wires 171 and the wires 144 are connected to each other via the resistor 178 to each other 121928.doc - 32 - 200827226. Further, the wires 153 and the wires 149 are connected to each other via the resistor 177, and the wires 154 and the wires 150 are connected to each other via the resistor 179. Therefore, on the wiring board 180, a voltage control circuit A12 is formed, in which an electrical signal input to the wire 141 is output from the wire 61 via the wire 170, the resistor 176, the wire 143, the wire 51, the FET 82, and the wire 59, and A voltage control circuit B 12 ′ is formed in which an electrical signal input to the wire 142 is output from the wire 62 via the wire 171, the resistor 178, the wire 144, the wire 52, the FET 82, and the wire 60. Further, the circuit A10 (see Fig. 6) is formed by the current control circuit All and the voltage control circuit A12, and the circuit B0 (see Fig. 6) is formed by the current control circuit B11 and the voltage control circuit B12. As described above, according to the wiring board 18 〇 associated with the present embodiment, the difference such as the transistors 81a and 81b and the FET 82 can be selectively mounted in the same manner as the wiring board 8 相关 associated with the first embodiment. Type switching element. For this reason, the current control circuits A11 and b 11 and the voltage control circuits A12 and B 12 can be selectively formed on the single wiring board 18 〇. Therefore, the wiring board 180 can be used with electronic control equipment for straddle locomotives of different specifications. Therefore, the wiring board 180 has excellent mass productivity and can reduce the cost associated with each locomotive. Further, in the wiring board 180, since the pads lu to 122 are disposed in a grid, the resistors 172 to 175 and the resistors 176 to 179 may be parallel to each other and mounted in positions equal in the left-right direction. For this reason, also in the wiring board 180, when the transistors 81a and 81b are mounted, the multi-connection wafer resistor X' in which the four resistors 172 to 175 are mounted in a single wafer can be used, and when the FET 82 is mounted A multi-connected chip resistor γ, in which a plurality of resistors 176 to 179 121928.doc -33 - 200827226 are mounted in a single wafer, can be used. Therefore, by using the wiring board 180, the resistors 172 to 175 or the resistors to 179 can be easily mounted, and the time and cost of mounting can be reduced. In addition, the board area can be reduced by using a multi-connected chip resistor. Further, in the wiring board 180, the pads 115 to 11 are shared by the current control circuits All and Β11 with the voltage control circuits Α12 and Β12. Therefore, the number of pads can be reduced to 2/3. Further, by allowing the pads 115 to U8 to be shared by the current control circuits A11 and Β11 with the voltage control circuits a 12 and Β 12, the wires 143 and 144 and the wires 149 and 150 can be shared. Therefore, the board area can be reduced according to the wiring board 180. In the wiring board 180, the two circuits All and B11 are placed as current control circuits and the two circuits A12 and B12 are placed as voltage control circuits, but even when only the current control circuit A1 and the voltage control circuit A1 2 are disposed The same effect as the aforementioned effect can also be obtained when the circuit A10 (see Fig. 6) or the circuit B10 (see Fig. 6) including the current control circuit β11 and the voltage control circuit B12. In addition, circuits identical to those of the current control circuits A11 and Β11 and circuits identical to those of the voltage control circuits A12 and B12 may be added. In this case, a pad corresponding to the pad 111 of the circuit All or the pad 113 of the circuit B11 and a pad corresponding to the pad 112 of the circuit All or the pad 114 of the circuit B11 are disposed on the first straight line L11. . In addition, by using a multi-connection wafer resistor in which six resistors are mounted in a single wafer, the same effects as the aforementioned effects can be obtained. In addition, even when not only one is added, but a plurality of circuits having the same configuration as the current control circuits A1 and Β11 and a plurality of circuits having the same configuration as the voltage control circuits A12 and B12 are added. The same effect can also be obtained. [Industrial Applicability] As described above, the present invention is useful in a wiring board and a straddle locomotive in which the wiring board is disposed, and particularly in a wiring board configured to selectively mount different types of switching elements And the straddle locomotive in which the wiring board is placed is useful. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side elevational view showing a straddle locomotive associated with a first embodiment. Fig. 2 is a configuration diagram of a circuit disposed on a wiring board associated with the first embodiment. Figure 3 is a diagram showing the configuration when the transistor is mounted on the circuit of Figure 2. Figure 4 is a diagram showing the configuration when the FET is mounted on the circuit of Figure 2. Figure 5 is a diagram showing a portion of a circuit associated with a modification. Fig. 6 is a configuration diagram of a circuit disposed on a wiring board associated with the second embodiment. Figure 7 is a diagram showing the configuration of a transistor when it is mounted on the circuit of Figure 6. Figure 8 is a diagram showing the configuration of a FET when it is mounted on the circuit of Figure 6. Figure 9 is a configuration diagram of a circuit disposed on a conventional wiring board. Figure 1 is a diagram showing the configuration when the transistor is mounted on the circuit of Figure 9. 121928.doc -35- 200827226 Figure 11 is a diagram showing the configuration of the FET when it is mounted on the circuit of Figure 9. Circuit [Key component symbol description] 1 2, 5 3 > 6 4 7 8, 9 10, 11 12, 13 16, 17 16c 18, 19 18c 20, 21 20c 25, 27 25c 26 , 28 卜 26c 29, 31 29c 30, 32 30c pad (seventh pad) pad (eighth pad) pad pad pad (ninth pad) pad pad (tenth pad) resistor (first resistor) Resistor resistor (second resistor, third resistor) resistor resistor (fourth resistor) resistor pad (first pad) pad pad (second pad) pad pad (third pad) pad pad (fourth pad) pad 121928.doc -36- 200827226 33 > 35 33c , 34c 34 , 36 41 , 42 43 , 44 45 , 46 47 , 48 49 , 50 ('51, 52 53, 54 55, 56 57, 58 59, 60 61 , 62 , 63 , 64 ' pad (fifth pad) pad pad (sixth pad) wire (first wire) wire (second guide Wire (second wire) wire (fifth wire) wire (sixth wire) wire (fourth wire) wire (seventh wire) wire (eighth wire) wire (ninth wire) wire (tenth wire) wire 65 ^ 66 80 , 180 81a , 81b 82 90 91 92 93 101 111 , 112 , 113 , 114 , wiring board transistor (first switching element ) FET (second switching element ) straddle locomotive locomotive body cover
引擎控制單元/ECU 電路 焊盤 121928.doc -37· 200827226 115 、 116 、 117 、 118 、 119 、 120 、 121 、 122 141 、 142 、 143 、 144 、 147 、 148 、 149 、 150 、 152 、 153 、 154 、 170 、 171 導線 172 、 173 、 174 、 175 、 176 、 177 、 178 、 179 200 201a、201b 202 210 211 、 212 、 213 、 214 、 電阻器 板 電晶體 FET 電路 焊盤 215 、 216 、 217 、 218 、 219 、 220 、 221 、 222 、 223 、 224 、 225 、 226 、 227 、 228 、 229 、 230 、 231 、 232 、 233 、 234 a AO、A1、A10、All、 A12、A2、BO、B1、 BIO、Bll、B12、B2 b c 起動繼電器 電路 電池 空檔開關 121928.doc 38- 200827226 f d AC馬達 e 起動馬達 f 噴射器 g 火花塞 G 接地層（接地端） h 點火線圈 I 燃油泵 j 前燈 k 儀錶 1 離合器開關 LI、Lll、L12、L13、 直線 L14、L15、L16、L17、 L2、L3、L4、L5、L6、 L7、L8 m 主繼電器 n 調整器Engine Control Unit / ECU Circuit Pad 121928.doc -37· 200827226 115 , 116 , 117 , 118 , 119 , 120 , 121 , 122 141 , 142 , 143 , 144 , 147 , 148 , 149 , 150 , 152 , 153 , 154, 170, 171 wires 172, 173, 174, 175, 176, 177, 178, 179 200 201a, 201b 202 210 211, 212, 213, 214, resistor plate transistor FET circuit pads 215, 216, 217, 218, 219, 220, 221, 222, 223, 224, 225, 226, 227, 228, 229, 230, 231, 232, 233, 234 a AO, A1, A10, All, A12, A2, BO, B1 BIO, B11, B12, B2 bc Start relay circuit battery neutral switch 121928.doc 38- 200827226 fd AC motor e starter motor f injector g spark plug G ground plane (ground) h ignition coil I fuel pump j headlight k meter 1 Clutch switch LI, L11, L12, L13, straight line L14, L15, L16, L17, L2, L3, L4, L5, L6, L7, L8 m Main relay n regulator
R1、R2、R3、R4、R5、 電阻器 R6 X 多連接晶片電阻器（第一多連接 晶片電阻器） X’ 多連接晶片電阻器R1, R2, R3, R4, R5, Resistor R6 X Multi-connected Chip Resistors (First Multi-Connected Chip Resistors) X' Multi-connected Chip Resistors
Xc 多連接晶片電阻Is Y 多連接晶片電阻器（第二多連接 晶片電阻器） 121928.doc •39- 200827226 Υ, 多連接晶片電阻器 Yc 多連接晶片電阻器 Γ 121928.doc 40-Xc Multi-connected chip resistor Is Y Multi-connected chip resistor (second multi-connected chip resistor) 121928.doc •39- 200827226 Υ, Multi-connected chip resistor Yc Multi-connected chip resistor Γ 121928.doc 40-