200824197 九、發明說明： 【發明所屬之技術領域】 本發明係與記憶體模組插槽之擴充結構有關，尤其是指一種 。己L體模、、且插槽之擴充結構’可於主機板上增力口記憶名模組組設 • 數量。 【先前技術】 電細主機的中央處理單元（CentralPr〇cessingUnit，cpu)係 釀 以P甩枝存取圯憶體（Rand〇m Access硫刪^)當作資料儲 存區’中央處理單元的計算結果與程式指令皆放置於隨機存取記 憶體，而當程式執行需要時，可取用儲存區裡的資料。 但現今電腦主機的功能越來越強大，對於運算功能之要求亦 相應增加，所以隨機存取記憶體之數量要求也隨之提高。請參閱 第1A圖」、「第1B圖」所示，其中「第lA圖」係為記憶體模 ,置於域板之侧姻，「f 1B圖」係為記㈣模組之立體示 •意圖。主機板施（M〇ther B眶i)上設有北橋晶片21a (North Bridge) ’鄰近於北橋晶片21a設有複數個記憶體模組插槽仏， 此記憶麵組插槽22a可供記憶體模組5〇a以金手指方式(G〇iden Finger)來插置，此記憶體模組施更包含有印刷電路板仙及複 數個記憶體❿，而各記憶體52a係分別組設於印刷電路板％ 之兩端面上，岐橋晶片2la主要控制中央處理單元與記憶體模 組50a之間的訊號傳輸。 ▲因此在制歧速度與龍量日益增加的情形下，所搭配的 記憶體模組容量越來越高的_，相應地記聽模_槽數目亦 5 200824197 越多，以供記憶賴組之插置。可是記憶賴__直接躲 主機板表面上，倘若欲組設更多數量之記憶體模組，得在主機板 表面上增加記憶體模組插槽的數目’記體體模組插槽的數目越多 便佔用主機板不少的面積，在有_域板組設_下，將排擠 其他電子元件雜設。或是社機板之崎加大，讀設較多^ 目生的記憶麟組減，但主機板之_增崎使得電腦主機的體 和增加，而與電駐齡向短小輕薄之趨勢相背馳。 【發明内容】 上述習知技射’欲增加記憶難組容量時，必須增加主機 才f面上的記憶體模組插槽，因此佔用了不少主機板之面積。有 鑒於以上的問題，因而本發明 + 提供—種記憶體模組插 槽之擴充結構，不需佔用太多主楼 體模組之容量 钱板之組故面積，即可擴充記憶 根據本發贿揭示之記‘隐__槽之齡結構 -主機板，主敵並設有複數鱗—記憶 組插槽之擴充結構包含有—電路 糟^獅 一端分獅心u s 4·-接板及—基板。電轉接板之 刀別域互為導通之第—連接端子及第二連接端子， 連接&子#、紐賴於第—記憶體模祕槽其巾之—= ，-侧面設有至少—第二記㈣模組插槽，另—側面 二柄 第三記憶體模組插槽，复中第二 、又知數個 〃 #二魏體鋪係紐連接於第二記 L體拉組插槽’且電路轉趣之第二連接端子係紐輕 記憶體模_槽’藉簡觀紐餘 第^ 憶體模組插槽，經由電路轉接板與第一記憶心 200824197 接，而與主機板進行訊號傳輸。 本發明所揭示之記憶體模組插槽之擴充結構，其功效在於， 不需佔用太多主機板之組設面積，即可在有限的空間中擴充記憶 ‘體模組’除能大幅減少記憶體模組職狀域板表面面積外， * 亦能發揮記㈣模組的最大效能，而且記體體模組係_電路轉 ’接板與基板而層疊於主機板，因此使用者可依據需求來擴充記憶 體模組。而且’電路轉接板除了可當成基板的支架外，亦為主機 _ 板絲板之_連接管道，而無需額物裝連結^，以降低製造 成本。 以下在貫施方式中詳細敘述本發明之詳細特徵以及優點，其 内容足以使任何抑_技藝者了解本發明之技_容並據以實 施，且根據本說明書所揭露之内容、申請專利範圍及圖式，任何 熟習相關技藝者可輕糾理解本發_關之目的及優點。 【實施方式】 • 〜根據本發明所揭示之記憶體模組插槽之擴充結構，而記憶體 杈、、且的型式例如有單線記憶體模組（&蛛h也〇 Mem〇jy200824197 IX. Description of the Invention: [Technical Field] The present invention relates to an expansion structure of a memory module slot, and particularly to a type. The L phantom, and the expansion structure of the slot can be added to the motherboard. [Prior Art] The central processing unit (CentralPr〇cessingUnit, cpu) of the electric host is the calculation result of the central processing unit of the data storage area of the data storage area (Rand〇m Access sulphur deletion) The program instructions are placed in the random access memory, and the data in the storage area can be accessed when the program needs to execute. However, the functions of computer mainframes are becoming more and more powerful, and the requirements for computing functions are correspondingly increased, so the number of random access memories is also increasing. Please refer to Figure 1A and Figure 1B. Among them, "Map 1A" is a memory model, placed on the side of the domain board, and "f 1B" is a three-dimensional display of the module. intention. A north bridge wafer 21a (North Bridge) is disposed on the motherboard (M〇ther B眶i). A plurality of memory module slots 设有 are provided adjacent to the north bridge wafer 21a, and the memory surface group slot 22a is available for memory. The module 5〇a is inserted by a G〇iden Finger, and the memory module further includes a printed circuit board and a plurality of memory ports, and each memory 52a is separately set in the printing. On both ends of the board %, the bridge wafer 2la mainly controls the signal transmission between the central processing unit and the memory module 50a. ▲ Therefore, in the case of increasing the speed of disambiguation and the increasing amount of dragons, the capacity of the matched memory modules is getting higher and higher, and accordingly, the number of recording _ slots is also 5 200824197, so that the memory group can be used. Insert. However, the memory __ directly hides the surface of the motherboard. If you want to set up a larger number of memory modules, you need to increase the number of memory module slots on the surface of the motherboard. The more you occupy the large area of the motherboard, the more _ domain board set _, will crowd out other electronic components. Or the increase of the social machine board, the reading of more than the memory of the memory group, but the motherboard _ Zengqi makes the body of the computer and increase, and the trend of the electric age is short and thin Chi. SUMMARY OF THE INVENTION In order to increase the memory capacity of the above-mentioned conventional technology, it is necessary to increase the memory module slot on the host surface, thus occupying a large area of the motherboard. In view of the above problems, the present invention provides an expansion structure of a memory module slot, which does not need to occupy too much of the capacity of the main building module, and can expand the memory according to the disclosure of the bribe. The story of 'hidden__ slot age structure-host board, the main enemy and has a plurality of scales - the expansion structure of the memory group slot contains - the circuit is bad ^ lion end of the lion heart us 4 · - board and - substrate. The knives of the electrical adapter plate are mutually conductive - the connection terminal and the second connection terminal, the connection & sub #, the New Zealand - the memory module cavity - the towel -=, - the side is provided with at least - The second (4) module slot, the other side of the second handle of the third memory module slot, the second in the complex, and a number of 〃 #二魏体铺系纽 connected to the second L body pull group The second connection terminal of the slot 'and the circuit is interesting, the light memory modal _ slot' by the simple view of the ^ ^ memory module slot, connected to the first memory heart 200824197 via the circuit adapter board, and the host The board transmits signals. The expansion structure of the memory module slot disclosed by the invention has the function of expanding the memory 'body module' in a limited space without occupying too much set area of the motherboard, in addition to greatly reducing memory In addition to the surface area of the body module domain board, * can also play the maximum performance of the (4) module, and the body module is connected to the motherboard and the substrate is stacked on the motherboard, so the user can To expand the memory module. Moreover, the circuit adapter board can be used as a bracket for the substrate, and is also a connection pipe for the main board _ board, without the need for a connection to reduce the manufacturing cost. The detailed features and advantages of the present invention are described in detail in the following detailed description, which is sufficient to enable the skilled in the art to understand the structure of the present invention, and the scope of the disclosure, the scope of the patent application, and Schematic, anyone familiar with the relevant art can easily understand the purpose and advantages of this issue. [Embodiment] - The expansion structure of the memory module slot according to the present invention, and the memory type, for example, has a single-line memory module (& spider h also 〇 Mem〇jy
Module > SIMM)，(Dual In-line Memoiy Module ^ DMM)、記憶體匯流敎憶龍組（Rambus Mne M_y RIMM) # ’但料崎上紅記鐘模組，在以下本 ㈣的具體實麵t ’將以雙線峨顧絲作為本發明之最佳 實施例。 月’閱第2A圖」、「第2B圖」與「第3圖」所示，其中厂第 2A圖」係為本發明實施例之未設記憶體擴充卡立體示意圖，「第 7 200824197 2B圖」係為本發明實施例之已設記憶體擴充卡立體示意圖，「第3 圖」係為本發明實施例之已設記憶體擴充卡側視示意圖。此記憶 體模組插槽之擴充結構係應用於主機板20上，且包含有電路轉接 ' 板30與基板40。又，主機板20上設有中央處理單元、北橋晶片 ’ 21及其他電子元件，鄰近於北橋晶片21設有複數個第一記憶體 模組插槽22，此第一記憶體模組插槽22可供全緩衝式記憶體模 組50 (Fully BufferedDIMMs)以金手指方式來插置。全緩衝式記 藝憶體模組50更包含有電路板51、複數個記憶體52及先進記憶體 緩衝日日片 53 (Advanced Memory Buffer，AMB)，而各記憶體 52 係刀別組δ又於電路板51之兩端面上，先進記憶體缓衝晶片53亦 組設於電路板51之端面上。另外，北橋晶片21主要控制中央處 理單元與全緩衝式記憶體模組50之間的訊號傳輸。如此，中央處 理早兀便可執行程式，且能隨時儲存資料或從儲存區中讀取資料。 包路轉接板30係為一具有訊號傳輸線路之印刷電路板，其二 • 端分別形成互為導通之第一連接端子31與第二連接端子32，其 中’第-連接端子31係插置於主機板2〇第一記憶體模組插槽22 其中之-，另端係朝向遠離主機板2〇之方向延伸，用以撐起基板 40，進而使基板4〇料通於主機板2〇。電路轉接板如之數目係 能滿足在主機板上穩固基板40之最低數目為主，使得基板4〇 不致傾倒，在此，電路轉接板30之數目為二，但並非以此為限。 基板4〇的一侧面設有至少一第二記憶體模組插槽42，另一 侧面設有複數個第三記憶體模組插槽43，第三記憶體模組插槽43 係電性連接於第二記憶體模組插槽。其中，基板4〇的第二記二體 200824197 模組插槽42係對瘅於+ 路轉接㈣之第:^镇接板30之第二連接端子％，以供電 42係供各全緩衝气^子電性連結，而各第三記憶體模組插槽 式记體模組50以金手指方式彳 ^ 二記憶體模組插槽42 夺曰方式插置。在此，弟 記憶體模_槽㈣但並細此為限，且每一第二 請續參閱「第絲模組插槽43。 閱「第4圖」、「第5圈圖」鱼「t2B圖」與「第3圖」，並合併參 圖」14厂第6圖」，其中，「第4fi 路轉接板插置於㈣ $ 4圖」係為包 為電路轉接板插置巧：：槽之舰示意圖，「第5圖」係 置於弟二战體模組插槽之頂視示意圖，「第6 二立圖、、二曰曰片透過匯流排與全緩衝式記憶體模組之訊號傳輸 ，圖。根據上述構件，在組裝時，將電路轉接㈣之第一連接 端子Μ插置社機板Μ之第—記憶體麵插槽η内，以作為基 板40的支木雜，接著，基板4〇的第二記憶體模組插槽似係對 ，電路轉接㈣之第二連接端子32,贿第二連接端子Μ插置 第二記憶體模組插槽42 達成電性連結，使得基板4〇與主機板 20係互為平行，且兩者之間具有一間隔距離，如此，基板牝便 架豐於主敵20的帛—記憶體模祕槽22上方。帛_記憶體模 組插槽22與第三記憶體模組插槽43係可供組裝者插置全緩衝式 記憶體模組5G。在此，本發明實施例之全麟式記憶體模組％ 之數目為八，並依照其位置分有第一組C1、第二組C2、第三組 C3與第四組C4共四組，其中，插置於第一記憶體模組插槽η 之全緩衝式記憶體模組5〇係分有C1與C2兩組，而插置於第三 記憶體模組插槽43之全緩衝式記憶體模組5〇係分有C3與c4兩 200824197 =旦但數目不以此為限。組裝者視全緩衝式記憶體模組％之所需 里而u金手指方式插置於第—記憶體模組插槽^ 體模組插槽43。 ，、乐一己 在只際應用時，北橋I g。， ° 0片21係會透過匯流排60傳送訊號至Module > SIMM), (Dual In-line Memoiy Module ^ DMM), Memory Bus Residents (Rambus Mne M_y RIMM) # 'But the Kawasaki Red Clock Module, in the following (4) specific real face t' will be taken as a preferred embodiment of the invention with a double wire. The monthly "View 2A", "2B" and "3", the factory 2A" is a three-dimensional diagram of the memory expansion card without the memory expansion of the embodiment of the present invention, "7th 200824197 2B FIG. 3 is a schematic perspective view of a memory expansion card according to an embodiment of the present invention. FIG. 3 is a schematic side view of a memory expansion card according to an embodiment of the present invention. The expansion structure of the memory module slot is applied to the motherboard 20 and includes a circuit transfer board 30 and a substrate 40. Moreover, the main board 20 is provided with a central processing unit, a north bridge chip '21 and other electronic components, and a plurality of first memory module slots 22 are disposed adjacent to the north bridge chip 21, and the first memory module slot 22 Fully buffered memory modules 50 (Fully Buffered DIMMs) can be inserted in a gold finger manner. The full buffer type memory module 50 further includes a circuit board 51, a plurality of memories 52 and an advanced memory buffer 53 (AMB), and each memory 52 is a group δ On both end faces of the circuit board 51, the advanced memory buffer chip 53 is also disposed on the end surface of the circuit board 51. In addition, the north bridge chip 21 mainly controls signal transmission between the central processing unit and the fully buffered memory module 50. In this way, the central processing can execute the program as soon as possible, and the data can be stored or read from the storage area at any time. The bypass adapter plate 30 is a printed circuit board having a signal transmission line, and the two ends respectively form a first connection terminal 31 and a second connection terminal 32 which are electrically connected to each other, wherein the 'the first connection terminal 31 is interposed The other end of the first memory module slot 22 of the motherboard 2 extends, and the other end extends away from the motherboard 2 to extend the substrate 40, thereby causing the substrate 4 to pass through the motherboard 2 . The number of the circuit adapter boards can be such that the minimum number of the stable substrates 40 on the main board is such that the substrate 4 is not dumped. Here, the number of the circuit transfer boards 30 is two, but not limited thereto. At least one second memory module slot 42 is disposed on one side of the substrate 4 , and a plurality of third memory module slots 43 are disposed on the other side, and the third memory module slot 43 is electrically connected In the second memory module slot. Wherein, the second recording body of the substrate 4 2008 200824197 module slot 42 is opposite to the second connection terminal % of the + way switch (4): the power supply 42 system for each full buffer gas The sub-memory is connected, and each of the third memory module slot type capsule modules 50 is inserted in a gold finger manner. Here, the younger memory modal _ slot (four) is limited to this, and each second please continue to refer to the "wire module slot 43. Read "4th picture", "5th circle" fish "t2B Figure "and Figure 3", and incorporate the "Figure 6 of Figure 14", in which "the 4fi way adapter board is inserted in (4) $4" is the package for the circuit adapter board: The schematic diagram of the ship of the trough, "figure 5" is a top view of the slot of the second body of the brothers, "the 6th two-figure, the two-piece through the busbar and the fully buffered memory module According to the above-mentioned components, during assembly, the first connection terminal of the circuit switch (4) is inserted into the first memory-slot slot η of the social machine board to serve as a support for the substrate 40. Then, the second memory module slot of the substrate 4 is similar to the pair, the second connection terminal 32 of the circuit switch (4), and the second connection terminal is inserted into the second memory module slot 42 to achieve electrical connection. The substrate 4〇 and the motherboard 20 are parallel to each other with a separation distance therebetween, so that the substrate squat rack is rich in the main enemy 20 帛-memory model Above the slot 22, the memory module slot 22 and the third memory module slot 43 allow the assembler to insert the fully buffered memory module 5G. Here, the all-in-one embodiment of the present invention The number of memory modules % is eight, and according to their positions, there are four groups of the first group C1, the second group C2, the third group C3 and the fourth group C4, wherein the first memory module is inserted. The fully buffered memory module 5 of the slot η is divided into two groups of C1 and C2, and the fully buffered memory module 5 inserted in the third memory module slot 43 has C3 and C4 two 200824197 = but the number is not limited to this. The assembler regards the full buffer memory module as needed and u gold finger is inserted into the first memory module slot ^ body module slot 43. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ,
、、C3與C4 ’亦即插置於第—記憶體模組麵U 憶體模組插槽43之全缕徐Α ，、乐一^己 〜 ' 式‘炫肢模組50能接收到訊號。但是, C3 and C4 'is also inserted in the first memory module surface U memory module slot 43 of the full Xu Wei, Le Yi ^ ~ ~ 'style' glare module 50 can receive the signal . but
Ik者王緩衝式記憶體模組5〇 同。盆中，之位置抑，减雜之路徑各有不 产排’60至ΓΓ 至C1、C2之路徑係僅經過主機板20。而匯 :細 、C4’係_主機板20後縣舰過二電 至第三記,_組插槽Μ。如此，插置於第三記憶 -減謂43之全_式記憶體模組$ 之 北橋晶片21進行資料與訊號傳輪。、倾2〇上之 二=’電路轉接板4〇之高度係考量到電腦主機内部沾 ^子32插置於第_記憶體 ^-連接 時，基板40與主齡R-弟一己—插槽42 模組5〇插則^ 離，彡狀於全緩衝式記憶體 ^ _ 體模組插槽22後的高度，以免基被40芦 及位於第一記u丞扳4〇壓 成損壞。為_槽22之全緩衝細總無50，而造 同理’依照上述組裝步驟，可於 20之方向層疊有g 孜4ϋ冉朝向_主機板 ^ ,另一基板，以因應組裝者之需求。 —θ Κ本發明係採用向上堆疊的方式來增力17¾俨 之容量，在記掊鹏4〜 、♦日體模組 *輪、、且之容量不足或欲因應組裝者之需求時，透 200824197 過電路轉接板以在域板組設有記㈣模_區域上架起基板， 用以增1更多的記鐘模組，如此，域板不需再增加組設面積 以設置記憶體模組插槽，而讓記憶體模組插槽佔用太多主機板面 積，而能大量地減少其所佔用主機板的面積。此外，組裝者僅須 :電路#r接細㈣置於材的記憶體模祕槽，便能使基板與 ^機板達^電性連結，以進行兩者_:#料傳輸，而無須增設另 的連…益以即省成本。再者，在主機板有限的使用面積下，朝 主機板上方來擴充記紐模_樣能發揮其最佳效能。 雖然本發明之實施例揭露如上所述，然並非用以限定本發 明’任何邮目關技藝者，在不脫離本發明之精神和範圍内，兴 凡=本fx明申知騎述之形狀、構造、特徵及精神當可做 之變更，因此本發明之專利保護範圍須視本說 ς喜 利範圍所界定者為準。 ㈣之甲4 【圖式簡單說明】 f 1Α圖，習知記憶體模組插置於主機板之侧視圖。 第1B圖，習知記憶體模組之立體示意圖。 弟2A圖’本發明實施例未設記憶體擴充卡立體示意圖。 =2B圖，本發明實施例已設記紐擴充卡立體示意圖。 弟3圖，本發明實施例已設記憶體擴充卡侧視示意圖。 第4圖，本發明實施例1路轉制反插置於第—記憶體模組插 槽之頂視示意圖。 第5圖，本發明實施例電路轉細於第三記憶體模組插 槽之頂視示意圖。 11 200824197 第6圖，本發明實施例北橋晶片透過匯流排與全缓衝式記憶 體模組之訊號傳輸示意圖。 【主要元件符號說明】 習知技術 20a............................·····...........主機板 21a..........................................•.北橋晶片 22a............................................記憶體模組插槽Ik King buffer memory module 5 〇 same. In the basin, the position of the doping, the path of the miscellaneous is not the production row '60 to ΓΓ to the path of C1, C2 only through the motherboard 20. And sink: fine, C4' system _ motherboard 20 after the county ship passed the second to the third, _ group slot Μ. In this way, the north bridge chip 21 of the full memory module of the third memory-subtraction 43 is used for data and signal transmission. 2, the second of the 2 = = 'the height of the circuit adapter board 4 考 to the inside of the computer host 子 ^ 32 inserted in the first _ memory ^ - connection, the substrate 40 and the main age R - brother oneself - plug The slot 42 module 5 is inserted and removed from the height of the fully buffered memory ^ _ body module slot 22, so as to prevent the base from being damaged by the 40 gusset and the first 丞 丞 。. For the full buffering of the trough 22, there is no 50, and the same as the assembly step, in the direction of 20, g 孜 4 ϋ冉 can be stacked toward the _ motherboard ^, another substrate, in response to the needs of the assembler. θ Κ Κ Κ Κ Κ Κ Κ Κ Κ Κ 向上 向上 向上 向上 向上 向上 向上 向上 向上 向上 向上 向上 向上 向上 向上 向上 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 Passing the circuit adapter board to set up the substrate on the domain board group (4) mode area for adding more clock modules, so that the domain board does not need to increase the set area to set the memory module. The slot allows the memory module slot to take up too much of the motherboard area, and can greatly reduce the area of the motherboard it occupies. In addition, the assembler only needs to: the circuit #r is connected to the memory module slot of the material, so that the substrate and the board can be electrically connected to carry out the two _:# material transmission without adding Another company can save costs. In addition, under the limited use area of the motherboard, the expansion of the new mode toward the top of the motherboard can achieve its best performance. Although the embodiments of the present invention are disclosed as described above, it is not intended to limit the invention to any of the singularity of the present invention, and the shape of the rider, Structures, features, and spirits are subject to change. Therefore, the scope of patent protection of the present invention is subject to the definition of the scope of the present disclosure. (4) A 4 [Simple description of the diagram] f 1 diagram, the conventional memory module is inserted into the side view of the motherboard. Figure 1B is a perspective view of a conventional memory module. 2A is a perspective view of a memory expansion card in the embodiment of the present invention. = 2B diagram, the embodiment of the present invention has been set up a three-dimensional schematic diagram of the expansion card. 3, a schematic diagram of a memory expansion card has been provided in the embodiment of the present invention. Fig. 4 is a top plan view showing the first embodiment of the present invention in which the road conversion system is reversely inserted into the first memory module slot. Fig. 5 is a top plan view showing the circuit of the embodiment of the present invention being thinner than the third memory module socket. 11 200824197 FIG. 6 is a schematic diagram of signal transmission of a north bridge wafer through a bus bar and a fully buffered memory module according to an embodiment of the present invention. [Explanation of main component symbols] Conventional technology 20a............................................. .... motherboard 21a.......................................... .North Bridge Wafer 22a...................................... Memory Module slot
50a...................................................記憶體模組 51a..·.··....··.··.................................................·印刷電路板 52a............................................記憶體 本發明 20·.............................................主機板 21. ······....................................................北橋晶片 22. .......................................................................................................................第一記憶體模組插槽 30···..............................................·······電路轉接板 31..............................................第一連接端子 32..............................................第二連接端子 40.···········..............................···.·…基板 42····......……·…….……·….·…·……第二記憶體模組插槽 43····.....................................................................第三記憶體模組插槽 50 ..............................................全缓衝式記憶體模組 51 ........................................................電路板 52 ..............................................記憶體 12 200824197 53..............................................先進記憶體缓衝晶片 60.................................................匯流排 C1....................................................第一組 C2.....................................................第二組 C3..................···.·..·......................第三組 C4........................................................第四組50a................................................. ..Memory Modules 51a..·........................................................ .....................·Printed circuit board 52a........................ ....................Memory This invention 20·........................ ..................... Motherboard 21. ······................... ................................. North Bridge Wafer 22.............. .................................................. .................................................. ...the first memory module slot 30···............................... ................................ circuit adapter board 31........................ ......................The first connection terminal 32....................... .......................Second connection terminal 40.···········.......... ....................·····...substrate 42····.................................... ...·......Second memory module slot 43····.................................... ....................................3rd memory module plug 50 .............................................. Full buffer Memory module 51 ............................................ ............Circuit board 52 ................................... ...........Memory 12 200824197 53................................. ............Advanced Memory Buffer Chips 60............................... .................. Busbar C1............................. .......................The first group C2....................... ..............................The second group C3................ ..···.·...........................The third group C4.............. ..........................................Fourth group
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