TW200819233A - Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof - Google Patents

Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof Download PDF

Info

Publication number
TW200819233A
TW200819233A TW95138469A TW95138469A TW200819233A TW 200819233 A TW200819233 A TW 200819233A TW 95138469 A TW95138469 A TW 95138469A TW 95138469 A TW95138469 A TW 95138469A TW 200819233 A TW200819233 A TW 200819233A
Authority
TW
Taiwan
Prior art keywords
heating
joint
plate
guide
substrate
Prior art date
Application number
TW95138469A
Other languages
English (en)
Chinese (zh)
Other versions
TWI301780B (https=
Inventor
Kuan-Yu Chen
Lung-Tien Wu
Original Assignee
Metal Ind Res & Dev Ct
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metal Ind Res & Dev Ct filed Critical Metal Ind Res & Dev Ct
Priority to TW95138469A priority Critical patent/TW200819233A/zh
Publication of TW200819233A publication Critical patent/TW200819233A/zh
Application granted granted Critical
Publication of TWI301780B publication Critical patent/TWI301780B/zh

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
TW95138469A 2006-10-18 2006-10-18 Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof TW200819233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95138469A TW200819233A (en) 2006-10-18 2006-10-18 Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95138469A TW200819233A (en) 2006-10-18 2006-10-18 Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof

Publications (2)

Publication Number Publication Date
TW200819233A true TW200819233A (en) 2008-05-01
TWI301780B TWI301780B (https=) 2008-10-11

Family

ID=44769711

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95138469A TW200819233A (en) 2006-10-18 2006-10-18 Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof

Country Status (1)

Country Link
TW (1) TW200819233A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103517574B (zh) * 2012-06-26 2016-08-10 富葵精密组件(深圳)有限公司 承载治具及软硬结合板的制作方法

Also Published As

Publication number Publication date
TWI301780B (https=) 2008-10-11

Similar Documents

Publication Publication Date Title
JP2002220661A (ja) スパッタリング装置に用いられるバッキングプレートおよびスパッタリング方法
CN111405960A (zh) 液冷套的制造方法
TWI294325B (https=)
CN111515518A (zh) 一种铜合金微通道换热器扩散焊接卡具与方法
TW200902202A (en) Target material backing plate with an embedded cooling passage and manufacturing method thereof
TW201945571A (zh) 框架一體型掩模的製造裝置
CN102059421A (zh) 钛靶铝背板焊接方法
CN202063989U (zh) 靶材背板结构
CN105382417A (zh) 铝锂合金薄板t型接头异种模式激光焊接的方法
TW200819233A (en) Bonding method of heating plate for increasing the temperature of substrate, and heating plate thereof
CN102814568A (zh) 一种浇注式焊接方法
CN106624235A (zh) 靶材组件及其制造方法
CN102764922B (zh) 一种大面积焊接方法
CN114315174A (zh) 一种加厚不透明石英玻璃板的焊接方法
CN100522451C (zh) 用以升温基材的加热板的接合方法及加热板
JP2005281126A (ja) タブレット一体型ガラス管及びその製造方法
CN111408834B (zh) 冷金属过渡焊接在线激光后热处理的装置及方法
CN110569592A (zh) 一种含中间层的靶材背板组件中应力的有限元模拟方法
CN108213681B (zh) 靶材组件的形成方法
US20200025461A1 (en) Method of manufacturing heat dissipation unit
CN102049623B (zh) 一种不同厚度镍铜组件与无氧铜基体的组合焊接方法
CN110414131B (zh) 一种三明治结构Co靶材背板扩散焊组件中间层的选取方法
CN101394726A (zh) 一种无注液管的传热装置的制造方法
TW200826198A (en) Combination method and structure of heating plate of substrate
JP2009016534A (ja) 貼り合せ方法及び貼り合せ用基板