200818382 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種晶圓定位裝置及方法，且特別是 有關於一種無線之晶圓定位裝置及方法。 u 【先前技術】 — 隨著半導體製程精密度及自動化程度之提升，大部分 设備供應商均將數種裝置合併設計在同一系統中，内部靠 _ 著機械手臂作為傳輸連接。由於積體電路愈趨複雜，寬度 皆達到微米以下，所以常在無塵潔淨室中製造。此類新型 機系統，為使得處理室維持一定之潔淨度，各晶圓處 里至夕為在閉，而無法經由目視檢測機械手臂放置晶圓的 障幵/若疋晶圓放置時之定位有些許的誤差，可能會降低 生產時的良率。 舉例而言，晶圓在微影製程之處理室中，常因為機械 手#放置不當，而造成晶圓在旋轉盤上有位移或傾斜的情 • 形。此種情形不僅在光阻及顯影液塗佈時，影響旋轉盤旋 轉而塗佈不均，更會在烘烤或降溫冷卻的製程上，造成晶 圓上各部分溫度不同，而使得顯影成像後的線寬不一致， 、，而降低生產之良率。未檢測出之缺陷晶圓，如進入到後 縐的製程才發現其有缺陷的話，則報廢代價就越高。因此， 機械手臂在放置晶圓之定位是否準確，便顯特別重要。 因此，如何精確的定位晶圓之位置，便成為一個重要 的課題。 5 200818382 【發明内容】 因此本發明的目的就是在提供一種晶圓定位設備，包 含一定位板、一監視單元、一顯示單元，以及一無線傳輸 單元。其中定位板係用以模擬一晶圓於一機台之一定位。 監視單元係安裝於定位板上，以提供定位板放置於機台時 之一定位畫面。無線傳輸單元具有一發射端及一接收端， 其中發射端係位於定位板，且與監視單元相連，該接收端 係位於顯示單元，無線傳輸單元係將定位畫面無線傳輸至 顯示單元。其中晶圓定位設備包含一供電單元，安裝於定 位板上，以驅動監視單元與發射端。晶圓定位設備包含一 機械手臂，配置於機台近處，以將定位板放置於機台上。 晶圓定位設備包含一控制單元，與機械手臂相連，以利用 定位晝面校正機械手臂之一路徑，以放置定位板至定位。 其中，機械手臂包含至少一挾持件，以挾持定位板至機台 之定位。定位板可具有至少一開口，以使定位板之重量接 近所模擬之晶圓的重量。其中，監視單元可為一電荷耦合 元件攝影機（charge coupled device camera ; CCD camera) 〇 機台可包含至少一加熱平板，定位板係定位於加熱平板。 機台可包含至少一旋轉盤，定位板係定位於旋轉盤。機台 可包含至少一顯影平台，定位板係定位於顯影平台。機台 可包含至少一冷卻平板，定位板係定位於冷卻平板。機台 可包含至少一沉積平台，定位板係定位於沉積平台。機台 可包含至少一餘刻平台，定位板係定位於I虫刻平台。 本發明之另一態樣係為一種晶圓定位方法，包含利用 一機械手臂放置一定位板於一機台上之步驟；利用安裝於 6 200818382 二位，上之—監視單元，以提供^位板之-定位晝面之+ r ，…、線傳輸定位畫面至一顯干i v 校正機械手臂之-路徑，使定7=’·以及利用定位畫面 ,,^ββ 使疋位板放置於機台之一定位。 本發明之又一態樣係為— 含：一定位板、一監視單元、干、二现控衣置，包 板之一〜1 係安裝於^位板上，以提供定位 n®。無線傳輪單元具有 =:::亀:定― 至顯-…、丁早兀無線傳輪單元係將定位畫面無線傳輸 w^r^j y. 電何耦5疋件攝影機。無線 疋位凰控裝置可包含一供電單元， 動監視單元及發射端。 -、板，以驅 晶圓定位設備可利用盔妗a/ t 用…線疋位監控裝置，以模擬晶圓 t 如此一來’可提供精確之定位資料，以供正式製 私中使用。且無線定位監控模組之供電單元係為乾電池或 畜電池’並利用無線傳輪單元將定位晝面傳輸至顯示單元 :’如此-來，可簡化習知技術中，進行多次定位校正時， 疋位板與外界線路安裝之繁項步驟，以有效地提升校正之 效率，並降低因線路拉扯而造成設備損壞之機率。 【實施方式】 以下將以圖式及詳細說明清楚說明本發明之精神，任 何所屬技術領域中具有通常知識者在瞭解本發明之較佳實 施例後’當可由本發明所教示之技術，加以改變及修飾，' 其並不脫離本發明之精神與範圍。 7 200818382 請參照第1圖，其係繪示本發明之無線定位監控裝置 一較佳實施例之示意圖。無線定位監控裝置1〇()包含一定 位板110,以及一無線監控模組。無線監控模組中，包含一 監視單元120、一無線傳輸單元、一供電單元，以及一顯 f元i5…其中監視單元120與供電單元14〇係直接安裝於 疋位板110之上。無線傳輸單元包含一發射端與一接 ， 收端132’其中發射端130係安裝於定位板11〇上，且與監 視單元120相連，接收端132係安裝於顯示單元15〇上。 _ 監視單元12〇可為-電荷M合元件攝影機⑽零_pied devlce camera ; CCD camera)，以提供定位板丨丨〇放置時之 -定位畫面。此定位畫面可經由發㈣13〇無線傳輸至顯 *單元150中顯示。定位板11〇上之監視單元12〇與發射 端130可經由供電單元14〇驅動。供電單元14〇可為至少 —乾電池或蓄電池’以減少與外部電源之連接線路的使 用。定位板uo上可具有複數個開口 112，以減輕定位板 110之重量。 _ m 2圖，其係繪示本發明之晶圓定位設備-較佳 實施例之示意圖。晶圓定位設備係將第1圖令之無線定位 監控裝置應用於半導體製程中需精確m日圓之製程 • 【間。定位板11G之外型係與晶圓大小相同，以利用定位 片11〇先行模擬晶圓於至少一機台200上定位之情形，待 侍=正確之定位資料後，接著再進行晶圓之正式製程。由 於疋位，110上具有開口 112，因此可更貼近於所模擬之晶 圓之重量，以得到更為精確之結果。晶圓定位設備除了益 線定位監控裝置100之外，更包含配置於機台2〇〇近叙 8 200818382 一機械手臂210,以將無線定位監控裝置100之定位片110 放置於機台200上。無線定位監控裝置100可利用監視單 元120,將定位片110放置於機台200上之定位畫面傳送至 顯示單元150中顯示。晶圓定位設備更包含一控制單元， 與機械手臂210相連，以利用顯示單元150所接收到之定 位畫面，校正機械手臂210之路徑，以放置定位板110至 定位。舉例而言，機台200上可具有一參考點，顯示單元 150之螢幕上可具有一對準點，控制單元可校正機械手臂 210之路徑，使對準點與參考點吻合，如此一來便可達到精 確定位定位片110之功效。在定位校正步驟完成後之正式 製程中，晶圓便可依照校正後之資料，精確地放置於機台 200之定位。 參照第3圖，其係繪示第2圖中之機械手臂一較佳實 施例之示意圖。機台200之數量可為複數個，機械手臂210 中包含至少一挾持件212,以交替地挾持無線定位監控裝置 100之定位片110至機台200上。其中每一個挾持件212 均需進行校正。 晶圓定位設備可應用於一旋塗（spin coating)製程中，則 機台200中可包含複數個旋轉盤（spin disk)，定位板110則 定位於旋轉盤。此設備亦可應用於一軟烤（soft bake)或硬烤 (hard bake)製程，則機台200中可包含複數個加熱平板 (hot-plate)，定位板110則定位於加熱平板上。此設備亦 可應用於晶圓冷卻之製程中，機台200可包含複數個冷卻 平板（cool-plate)，定位板110則定位於冷卻平板上。此設 備可應用於顯影（developing)製程中，機台200可包含複數 9 200818382 個顯影平台，定位板110則定位於顯影平台上。此設備亦 可應用於沉積（deposition)製程，機台2〇〇可包含複數個沉 積平口疋位板110則定位於沉積平台。此設備更可應用 於蝕刻（etching)製程中，則機台200可包含複數個蝕刻平 σ ’疋位板1 1 〇係定位於敍刻平台。 —參照第4圖，其係繪示本發明之晶圓定位方法一較佳 貝施例之洲_私圖。晶圓定位方法3〇〇始自於步驟3，步驟 31〇係利用機械手臂210將定位片11G放置於機台上。 接著，步驟320係利用安裝於定位板11〇上之監視單元 120，提供定位板11〇放置於機台細之定位晝面。接著， 步驟330係為無線傳輸此定位畫面至顯示單元15〇中。最 後，利用定位晝面校正機械手f 21〇之路徑，使定位板ιι〇 放置於機台200之定位。上彼夕+_ π去、一 这之^私可重禝進行，以使機 械手^ 210之每-個挾持件212，皆與每_個機台中之每一 ==平板，或冷卻平板，或顯影平台，或旋轉盤，或沉 積平口 ’或钱刻平台進行校正，以留下校正後之機械手臂 路徑資料，提供給正式製程中之晶圓以進行定位機械手才 由上述本發财紐實_可知，應用本發明具有 k點。晶圓定位設備可南| 圓之定位W 定位監控裝置，以模擬晶 製r中㈣" 美供精確之疋位資料，以供正式 °且减定位監控模組之供電單元係為乾電池 -如此-來；技= :’定位板與外界線路安裝之繁瑣流程，可二= 之效率，並降低因線路拉扯而造成設備損壞之機率。父 200818382 雖…、本！明已以一較佳實施例揭露如上，然其並非用 以限定本發明’任何所屬技術領域中具有通常知識者，在 不脫離本發明之精神和範圍内，當可作各種之更動與潤 飾因此本發明之保護範圍當視後附之申請專利範 定者為準。 【圖式簡單說明】 处為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 弟1圖係繪示本發明之無線定位監控裝置一較佳實施 例之示意圖。 弟2圖係繪示本發明之晶圓定位設備一較佳實施例之 示意圖。 第3圖係繪示第2圖中之機械手臂一較佳實施例之示 意圖。 第4圖係繪示本發明之晶圓定位方法一較佳實施例之 流程圖。 【主要元件符號說明】 1G〇 :無線定位監控裝置 110 ： 定位板 112 :開口 120 ： 監視單元 13〇 :發射端 132 ： 接收端 140 :供電單元 150 ： 顯示單元 2()㈧機台 210 ： 機械手臂 11 200818382 212 ： 挾持件 300 ： 310 ： 步驟 320 ·· 330 ： 步驟 340 ·· 方法 步驟 步驟200818382 IX. Description of the Invention: [Technical Field] The present invention relates to a wafer positioning apparatus and method, and more particularly to a wireless wafer positioning apparatus and method. u [Prior Art] — With the increasing precision and automation of semiconductor processes, most equipment suppliers have combined several devices in the same system, with internal mechanical arms as transmission connections. Since the integrated circuit is more complicated and the width is less than micrometers, it is often manufactured in a clean room. In this type of new machine system, in order to maintain a certain degree of cleanliness in the processing chamber, the wafers are closed at the same time, and it is impossible to visually detect the obstacles placed on the robot arm by the visual inspection. The error may reduce the yield during production. For example, in a processing chamber of a lithography process, the wafer is often displaced or tilted on the rotating disk due to improper placement of the robot #. In this case, not only when the photoresist and the developer are coated, but also the rotation of the rotating disk is affected, and the coating is uneven, and the temperature of each part on the wafer is different in the process of baking or cooling and cooling, so that after development imaging The line width is inconsistent, and, while reducing the yield of production. If the defective wafer is not detected, if it is found to be defective after entering the process, the scrapped cost will be higher. Therefore, it is particularly important that the positioning of the robot in the placement of the wafer is accurate. Therefore, how to accurately position the wafer becomes an important issue. 5 200818382 SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a wafer positioning apparatus comprising a positioning plate, a monitoring unit, a display unit, and a wireless transmission unit. The positioning plate is used to simulate the positioning of a wafer on one of the machines. The monitoring unit is mounted on the positioning plate to provide a positioning screen when the positioning plate is placed on the machine. The wireless transmission unit has a transmitting end and a receiving end. The transmitting end is located at the positioning board and is connected to the monitoring unit. The receiving end is located at the display unit, and the wireless transmission unit wirelessly transmits the positioning picture to the display unit. The wafer positioning device comprises a power supply unit mounted on the positioning plate to drive the monitoring unit and the transmitting end. The wafer positioning device includes a robot arm disposed near the machine to place the positioning plate on the machine table. The wafer positioning device includes a control unit coupled to the robotic arm to align the path of one of the robot arms with the positioning jaws to position the positioning plate to position. Wherein, the robot arm comprises at least one holding member for holding the positioning plate to the positioning of the machine table. The positioning plate can have at least one opening to bring the weight of the positioning plate closer to the weight of the simulated wafer. The monitoring unit may be a charge coupled device camera (CCD camera). The machine may include at least one heating plate, and the positioning plate is positioned on the heating plate. The machine can include at least one rotating disk, and the positioning plate is positioned on the rotating disk. The machine can include at least one development platform positioned to the development platform. The machine can include at least one cooling plate, and the positioning plate is positioned on the cooling plate. The machine can include at least one deposition platform positioned to the deposition platform. The machine can include at least one moment of the platform, and the positioning plate is positioned on the I-worm platform. Another aspect of the present invention is a wafer positioning method comprising the steps of placing a positioning plate on a machine table by using a mechanical arm; using a two-position, monitoring unit installed on 6 200818382 to provide a position + - , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , One of the positioning. According to still another aspect of the present invention, there is: a positioning plate, a monitoring unit, a dry and a second control garment, and one of the panels 1 is mounted on the plate to provide positioning n®. The wireless transmission unit has =:::亀: fixed-to-display-..., Dingzhao wireless transmission unit will wirelessly transmit the positioning picture w^r^j y. Electric coupling 5 piece camera. The wireless digital control device can include a power supply unit, a motion monitoring unit, and a transmitting end. -, board, drive wafer positioning equipment can be used to use the helmet 妗 a / t with the line clamp monitoring device to simulate the wafer t so that it can provide accurate positioning information for official use. And the power supply unit of the wireless positioning monitoring module is a dry battery or a livestock battery' and transmits the positioning surface to the display unit by using a wireless transmission unit: 'so-can simplify the conventional technology, when performing multiple positioning corrections, The complicated steps of installing the clamp board and the external line to effectively improve the efficiency of the correction and reduce the chance of equipment damage caused by the line pull. BRIEF DESCRIPTION OF THE DRAWINGS The spirit of the present invention will be clearly described in the following description and detailed description of the present invention. And modifications, which do not depart from the spirit and scope of the invention. 7 200818382 Please refer to FIG. 1 , which is a schematic diagram of a preferred embodiment of the wireless positioning monitoring device of the present invention. The wireless location monitoring device 1() includes a fixed bit plate 110 and a wireless monitoring module. The wireless monitoring module includes a monitoring unit 120, a wireless transmission unit, a power supply unit, and a display unit i5. The monitoring unit 120 and the power supply unit 14 are directly mounted on the clamping plate 110. The wireless transmission unit includes a transmitting end and a receiving end. The receiving end 130' is mounted on the positioning plate 11A and connected to the monitoring unit 120. The receiving end 132 is mounted on the display unit 15A. The monitoring unit 12 can be a -charge M-component camera (10) zero _pied devlce camera; CCD camera) to provide a positioning screen when the positioning plate is placed. This positioning picture can be wirelessly transmitted to the display unit 150 via the (four) 13〇. The monitoring unit 12A and the transmitting end 130 on the positioning board 11 can be driven via the power supply unit 14A. The power supply unit 14A can be at least a dry battery or a battery to reduce the use of a connection line with an external power source. The positioning plate uo can have a plurality of openings 112 to reduce the weight of the positioning plate 110. The _m 2 diagram is a schematic view of a wafer positioning apparatus of the present invention - a preferred embodiment. The wafer positioning device applies the wireless positioning monitoring device of Figure 1 to the process of precise m-day in the semiconductor process. The type of the positioning plate 11G is the same as the size of the wafer, so that the positioning wafer 11 is used to simulate the positioning of the wafer on at least one of the machines 200. After the correct positioning of the data, the wafer is officially executed. Process. Due to the depression, there is an opening 112 in the 110 so that it can be closer to the weight of the simulated crystal to obtain a more accurate result. In addition to the line positioning monitoring device 100, the wafer positioning device further includes a robot arm 210 disposed on the machine 2 to place the positioning piece 110 of the wireless positioning monitoring device 100 on the machine table 200. The wireless positioning monitoring device 100 can use the monitoring unit 120 to transmit the positioning screen on which the positioning piece 110 is placed on the machine 200 to the display unit 150 for display. The wafer positioning apparatus further includes a control unit coupled to the robot arm 210 for correcting the path of the robot arm 210 to position the positioning plate 110 to the positioning by using the positioning screen received by the display unit 150. For example, the machine 200 can have a reference point, and the display unit 150 can have an alignment point on the screen. The control unit can correct the path of the robot arm 210 to match the alignment point with the reference point. The effect of positioning the positioning piece 110 is precisely positioned. In the formal process after the positioning correction step is completed, the wafer can be accurately placed on the machine 200 in accordance with the corrected data. Referring to Fig. 3, there is shown a schematic view of a preferred embodiment of the robot arm of Fig. 2. The number of the machines 200 can be plural, and the robot arm 210 includes at least one holding member 212 to alternately hold the positioning piece 110 of the wireless positioning monitoring device 100 onto the machine table 200. Each of the holders 212 needs to be corrected. The wafer positioning apparatus can be applied to a spin coating process, and the machine 200 can include a plurality of spin disks, and the positioning plate 110 is positioned on the rotating disk. The apparatus can also be applied to a soft bake or hard bake process, in which the machine 200 can include a plurality of hot-plates, and the positioning plate 110 is positioned on the heating plate. The apparatus can also be used in a wafer cooling process, the machine 200 can include a plurality of cooling plates, and the positioning plate 110 can be positioned on the cooling plate. The apparatus can be applied to a developing process. The machine 200 can include a plurality of 2008 18382 developing platforms, and the positioning plate 110 is positioned on the developing platform. The apparatus can also be applied to a deposition process, and the machine 2 can include a plurality of deposition flats, and the plate 110 is positioned on the deposition platform. The device is more applicable to an etching process, and the machine 200 can include a plurality of etched flat σ ' 疋 plates 1 1 〇 is positioned on the etched platform. - Referring to Figure 4, there is shown a preferred embodiment of the wafer positioning method of the present invention. The wafer positioning method 3 begins with step 3, step 31, using the robot arm 210 to place the positioning piece 11G on the machine table. Next, step 320 is performed by using the monitoring unit 120 mounted on the positioning plate 11 to provide the positioning plate 11 to be placed on the fine positioning surface of the machine. Next, step 330 is to wirelessly transmit the positioning picture to the display unit 15A. Finally, the positioning of the manipulator f 21〇 is used to position the positioning plate ιι〇 on the machine table 200. On the other side of the day +_ π go, one of the ^ can be carried out in a private manner, so that each of the grippers 212 of the robot ^ 210, with each of the == flat, or cooling plate, Or a developing platform, or a rotating disk, or a deposition flat or a money engraving platform for calibration, to leave the corrected robotic arm path data, and to provide the wafer in the formal process for positioning the robot. It can be seen that the application of the present invention has k points. Wafer positioning equipment can be south | round positioning W positioning monitoring device to simulate the crystal r (four) " US for accurate position data for the official ° and reduce the positioning of the monitoring module power supply unit is a dry battery - so - Come; technology = : 'The cumbersome process of positioning board and external line installation, can be two = efficiency, and reduce the chance of equipment damage caused by line pull. Father 200818382 Although..., Ben! The present invention has been disclosed in a preferred embodiment, and is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection of the present invention is subject to the applicant's patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. A schematic diagram of a preferred embodiment of the device. Figure 2 is a schematic view showing a preferred embodiment of the wafer positioning apparatus of the present invention. Fig. 3 is a schematic view showing a preferred embodiment of the robot arm of Fig. 2. Figure 4 is a flow chart showing a preferred embodiment of the wafer positioning method of the present invention. [Main component symbol description] 1G〇: Wireless positioning monitoring device 110: positioning plate 112: opening 120: monitoring unit 13〇: transmitting terminal 132: receiving terminal 140: power supply unit 150: display unit 2 () (eight) machine 210: mechanical Arm 11 200818382 212 : Holder 300 : 310 : Step 320 ·· 330 : Step 340 ·· Method step
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