TW200817277A - Modular mounting and connection or interconnection system for microfluidic devices - Google Patents
Modular mounting and connection or interconnection system for microfluidic devices Download PDFInfo
- Publication number
- TW200817277A TW200817277A TW96116578A TW96116578A TW200817277A TW 200817277 A TW200817277 A TW 200817277A TW 96116578 A TW96116578 A TW 96116578A TW 96116578 A TW96116578 A TW 96116578A TW 200817277 A TW200817277 A TW 200817277A
- Authority
- TW
- Taiwan
- Prior art keywords
- rti
- rtigt
- microfluidic
- pressure
- microfluidic device
- Prior art date
Links
- 239000012530 fluid Substances 0.000 claims abstract description 37
- 238000005452 bending Methods 0.000 claims abstract description 7
- 238000010276 construction Methods 0.000 claims description 2
- 230000007774 longterm Effects 0.000 claims 1
- 230000006835 compression Effects 0.000 abstract 3
- 238000007906 compression Methods 0.000 abstract 3
- 238000007789 sealing Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 7
- 239000002241 glass-ceramic Substances 0.000 description 7
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002023 wood Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 206010039740 Screaming Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L9/00—Supporting devices; Holding devices
- B01L9/52—Supports specially adapted for flat sample carriers, e.g. for plates, slides, chips
- B01L9/527—Supports specially adapted for flat sample carriers, e.g. for plates, slides, chips for microfluidic devices, e.g. used for lab-on-a-chip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/56—Labware specially adapted for transferring fluids
- B01L3/565—Seals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B2/00—Friction-grip releasable fastenings
- F16B2/02—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening
- F16B2/06—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening external, i.e. with contracting action
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/00801—Means to assemble
- B01J2219/0081—Plurality of modules
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/0803—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J2219/0805—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
- B01J2219/0807—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes
- B01J2219/0809—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes employing two or more electrodes
- B01J2219/0813—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges involving electrodes employing two or more electrodes employing four electrodes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/02—Adapting objects or devices to another
- B01L2200/026—Fluid interfacing between devices or objects, e.g. connectors, inlet details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/02—Adapting objects or devices to another
- B01L2200/026—Fluid interfacing between devices or objects, e.g. connectors, inlet details
- B01L2200/027—Fluid interfacing between devices or objects, e.g. connectors, inlet details for microfluidic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/02—Adapting objects or devices to another
- B01L2200/028—Modular arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0809—Geometry, shape and general structure rectangular shaped
- B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7504—Removable valve head and seat unit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87153—Plural noncommunicating flow paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87249—Multiple inlet with multiple outlet
Description
200817277 九、發明說明: 【發明所屬之技術領域】 本發明一般係關於微流體裝置之模組安裝或連接或交 互連接系統,以及特別是該系統特別地適用於玻璃,玻璃陶 莞,以及陶曼流體裝置。 【先前技#ί】 已提出各種方法以及結構以使用於按裝以及連接或交 互連接微流體裝置,其包含玻璃,玻璃陶瓷,以及陶瓷微流 體裝置。現存方法包含堆疊裝置彼此直接地靠在一起,並 具有密封或位於其間耦合器,藉由黏接劑等固定金屬或聚 合物流體耦合器至裝置,以及緊壓具有多個壓力密封之多 個端埠連接n絲裝置上。這齡絲未練作為可採用 非常可罪性之微流體裝置的流體連接以及按裝,特別是在 玻璃,玻璃陶瓷,以及陶瓷微流體裝置情況中。因而需要可 利用非常可靠性微流體裝置之流體相互連接以及按裝,特 別是良好地適用於玻璃,玻璃陶瓷,及陶瓷之微流體裝置。 【發明内容】 本發明提供微流體裝置之模組安裝或連接或交互連接 系統。該系統包含一組多個端部緊靠之壓力密封流體連接 态,以及-個或多個夾持結構,其構造將固定一個流體連接 器緊壓地靠在微流體裝置之平面性表面上,以及緊壓靠在 衣置,罪在其另一直接相對平面性表面上,接觸墊或另一流 體連接器。其提供第-平面性表面上塵力之抵抗力,以及 只在流體連接器位置處放置微流體裝置為只有壓力情況下 200817277 °包含各別地可移動之提供壓力元件的每一夾持結構將提 ,可控制之>1力大小。祕更進—步f要包含—個或多個 裝置架構,其構造將承受及固定微流體裝无該微流體裝置 ^有-個或多個連雛中之夹持結構,裝置架顯造成固 疋裝f及連接夹持結構,其藉由只限制一個或兩個夾持結 構使得並無張力或彎矩施加於褒置。 ^系統可更進-步包含一個或多個系統架構以承受及固 定、、且夕個裝置架構彼此靠近為三維之陣列,使得裳置間 所需要流體相互連接之體積能夠減為最低。 士系統架構所需要結構將允許裝置架構各別地去除及按 裝。系統架構亦需要構造成使得任何按裝其中之裝置芊構 按裝於系統架構麵所界定出突出體積内。此提供按裝裝 置之部份機械遮蔽。系、統架構能夠採用三維之 ’以及鹋射裝置輒使得當按裝時,裝置位 於由木構界U突出長謂體翻,接近於其各別結構。 作為一個替代情況,使用於本發明系統中夾持結構可 =_彡_坑舰触圍输_£,流體連接 為此夠保賴力靠在其上面。更需魏,使胁本發明系 :之_結縣G-鱗型式之做,魏綱份地包圍 連接器能夠保持壓力靠在其上面。各 另了移動壓力7L件需要地採用螺紋化軸環型式,其構造將 ”扭力板手讀,藉由扭力㈣鄕啸供受控制之壓力。 本1明其他雖及伽將揭示於下解細綱中,熟 知此技術者可由該說明立即地了解部份,或藉由實施下列 頁 第 200817277 詳細說明,t請糊細以及關之内容而明瞭。 人們了解本綱H般綱及下顺細說明在於 提供概念或架構以了解申請專利範圍界定出本發明之原理 及特性。所包含附圖在於提供更進一步了解本發明,以及 在此加入作為發明綱書之—部份。關顯和本發明不 同的實施例及隨同詳細說明以解釋本發日月之原理及操作。 【實施方式】 圖1為本發明流體連接或交互連接實施例之斷面圖。 微流體裝置20,包括玻璃,玻璃陶瓷或陶£之微流體農置2〇 包含流體輸入或輸出開孔22形成於其平面性表面24中。開 孔22附近平面性表面24之區域與在其結構遠端34處固定於 轉接器32溝槽30中之〇—環28接觸以承受工業或實驗室標準 之流體耦合配件。 轉接為32藉由為麼力螺絲36型式之可控制或可調整壓 力元件壓罪在〇-環28上,期|由護套4〇經由可調整螺紋 化接頭38加以支撐。護套4〇再經由螺紋化接頭42以支撐構 件44加以支撐。壓力螺絲36包含扭轉表面46,其適用於^ 扭力板手唯卩接以施加受控制壓力至〇—環28。 對〇-環28壓力所提供抵抗力藉由按裝至第二支擇構件 50之接觸襯墊48經由螺紋化接頭52施加於微流體裝置2〇之 相對平面性表面26上。賴襯墊48需要直接地對準於相 之 0-環 28。 ' 、 圖1所顯示種類之流體連接或交互連接在許多方面十 分適合於玻璃,玻璃陶瓷,以及陶瓷微流體裝置。例如一項 第7頁 200817277 =在與具有金屬端埠系統或直接地連接至微流體襄置 =他材枓端埠對比,在圖i實施例中,異於微流 本身之_,_喊或_(或其他娜),对 轉接器32接觸進人或賴之魏以及麵 變化。能夠選擇0-環28材料適用於特狐學耐纽^別 柄乍溫度或兩者,轉接H 32材料亦如此。_其他高度化 學抵抗性玻璃’玻璃陶細兗微反應器或微流體裝置: 不受祕水久性轉接金屬或其他配件,其無法適用於某 些用途。 、 如圖2斷面騎示,支撐結構似5()需要部份地為單體 播H貝施例中,為包圍著微流體裝置20之包圍夾持結 辩體央持結構需要只在單-點處夹持於 ,女圖2所示。饭如需要超過一個流體搞合元 能夠使用多個結構。 ’ 使用=圍型式之多個央持結構54a—54c平面圖顯示於 圖3中。每一夾持結構對一個流體耦合配件提供屢力。此 防止,崎承餘何㈣•力,奴防核持結觀 加顯著的扭力或彎矩於微流體裝置。能夠調整每一各別产 體配件以各舰改轉紐或Q—賴力,提: 封於全部微流體裝置上。 山 圖4顯不出本發明流體連接或交互連接另一實施例斷 4實施例中,微流體裝置2〇具有兩個開孔22a及 22b位於裝置之相對平面性表社。因而,接觸襯墊並不提 供0-環壓力之概扣力量,體密封直接 第 8 頁 200817277 地相對於第一 0_環,允許兩個流體接頭只具有—個夹持结 構再^也,由於相對-〇環直接地對準,〇-環及其他組件^ 不會承受任何顯著的扭力,以及微流體裝置承受 扭矩或彎曲力量。 · 八如同圖2-4實施例包圍著夾持結構所需要替代情況,部 伤匕圍C夾持型式結構能夠力口以使用例如圖5戶斤示夾持结 f 56a及56b。使用較小的部份包圍夾持結構%預先決定更 多流體接頭連接至單一裝置以及流體連接位置更多變化, 如圖6流體耦合配件排列所建議情況。 本备&明系統亦需要包含一個或多個裝置架構,其每一 構造將承細及目紐流«置,其财-個衫個夾持 f構連接至其上面。裝置架構所需要構造將允許失持結構 罪在裝置架構中而不會產生配裝力量。該架構58 一項實施 例顯不於圖7平關巾。在纖示實補巾,架構58通常為 平面性結構,其含有凹下60,每一凹下所在位置將承受部份 包圍夾持裝置56之底部。架構58包含洞孔62以容納插銷。 圖8顯示出具有微流體裝置20以及夾持結構56位於其 中之架構58。固定插銷64亦位於洞孔62巾以控制微流體裝 置20之側向位置。一個或多個凹下6〇構造將限制夾持結構 底部承受其中,其方式將使得並無扭力或彎矩施加於裝置 。此能夠藉由部份地限制兩個夾持裝置達成,因而微流體 裝置並不會過度地限制在一起,或藉由只限制一個夾持結 構如在該實施例中所顯示,其中凹下6〇a些微地較小以限制 其承受之部份夾持裝置56b。 第9 頁 200817277 在圖8平面圖所顯示結構斷面顯示於圖9中,圖9中所顯 不為斷面,除了顯示作為參考之插銷64,甚至於為斷面平面 之背景。在圖9中可看到裝置架構58具有凹下以承受部份 夾持結構56,但是夾持結構並不需要如此較遠地承受,使得 微流體裝置靠在裝置架構58上。相反地,微㈣裝置2〇只 靠在〇-環或〇-環以及有關相對接觸櫬墊上,與固定插銷64 較少地接觸。因而非常少彎曲以及扭曲應力由本發明流體 連接或交互連接以及按裝系統施加於微流體裝置。注意當 流體輕合配件形成於微流體裝置2〇兩側於圖相同的位置如 同圖之左侧所示時,裝置架構58需要地包含凹下昍作為流 體耦合配件。裝置架構58亦包含按裝結構例如按裝洞孔68 或任何其他方便規定以按裝於較大系統或系統架構中。注 意如圖9斷面所示之夾持裝置56a及56d並不受到裝置架構 58限制。這些位置以及微流體裝置2〇之位置由顯祕圖7 及8之夾持裝置56b之位置加以控制。 圖10為依據本發明系統架構70 一項實施例之半示音性 透視圖。系、統架構例如系統架構70 f要採用三維立方或^ 方構造型式,優先地由金屬或其他能夠提供—些物理保護、 之材料日所構成。裝置架構58a_58d(具有微流體裝置按裝其 中,但疋為了圖面清楚並不顯示出)需要地按袭 7〇内凹空間%即在最小空間内,其並不具有包含袭置架構 7〇之凹面。在該體積峨裝將使按裝之微流體|置產生一 些保護防止受峨大或外·_擊,該到 構70阻隔。 明糸統木 第10 頁 200817277 外側固裝置均接近於立方或長方裝縣構一個面之 任如圖10所示,其具有數個優點。一項優點為, 力伙:衣置架構’即任何一個微流體裝置能夠卸除以及 並不需要移除任何其他三個。另一優點為如圖 樹置所在位置麟額翻或其他光學監測 =衣置之兩側,但是由於裝置為三轉列(並非為堆疊, 盥=維陣列,或共同平面排列,其為二維排列),兩個裝置 :他兩趙置為直純流動^配健賴之距離仍 然為相當短的。 圖11為依據本發明系統架構另—實施例之半示音性透 棚。圖11之系縣㈣包含可調整轉齡72為許 裝置架構58b以及其相關裝置放置於系統架構7〇任何位置 處。此將提供各種按裝需要之彈性。 …類侧K)關縣魏触即地顧鱗接以 形成大的系統74,其包含多個系統架構,如圖12所示。其以 系統等級提供模組,同時裝置架構以裝置等級提供模組,以 及夾持結構以及相關流體配件以各別耦合配件等級提供模 組。該結果為具有彈性的以及可使用作為微流體裝置 組按裝以及連接或交互連接系統。 、 【圖式簡單說明】 第一圖為本發明流體連接或交互連接-項實施例之 斷面圖。 第二圖為第一圖流體連接或交互連接之斷面圖,其更 進一步顯示出包圍夾持結構。 200817277 第三圖為平面圖,其顯示出多個包圍夹持結 成 使用於fi:流體裝置。 第四圖為本發曰月流體連接或交互連接另—實施例之斷 面圖。 第關為第—圖及第_型式之_交_接_面 圖,其具有部份包圍著c-夾持型式之夾持結構。 第六圖為平面圖,其顯示出多個部份包圍著c—型式夾 持結構排列成使用於微流體裝置。 第七圖為依據本發明裝置架構—項實施例之平面圖。 =為第七圖裝置架構之平面圖,其具有圖6之結構 及叙置排列使用其中。 第九圖為顯示於第八圖中結構斷面圖。 第十圖為依據本發明系統架構一項實施例之半示咅性 透視圖,其具有四條置架構按胁其内凹體積内。。 弟十一圖為依據本發明系統架構一項實 性透視圖。 心 第十二圖為多個系統架顯械性地相互連接之丰示音 性透棚,其可依據本發明使用於形成較大系統中。心 附圖元件數字符號說明: ,流體裝置20;開孔22,22a識平面性表面241 〇-% 28r;m 30;mi§ 32;m 34;im 36;^ ^ 護套40;接頭42· j擔福杜心 、’ ,叉m冓件44;表面46;接觸襯墊48•古 據構件50;接頭52·决胜,士姓^ η 6,文 ^ 1 構 54,54a,54b,54c;央持結構 56, 56a,56b,56c ’5bd’木構现;凹下60,60a;洞孔62;插 第 12 頁 200817277 銷64;凹下66;洞孔68;系統架構70, 70a,70b;系統74。 第 Π 頁
Claims (1)
- 200817277 十、申請專利範圍: 1· 一種微流體裝置之模組按裝以及連接或交互連接系統, 該系統包含: 一組多個端部相鄰壓力密封流體連接器; 一個或多個夾持結構,其均構造成固定流體連接器以壓 力靠在微流體裝置之平面性表面上,以及緊壓於該裝置,在 其另一個直接地相對之平面性表面上,接觸襯墊或另一流 體連接器將提供該壓力之抵抗力,每一夾持結構包含獨立 地可移動之提供壓力元件,其構造將提供可控制數量之壓 2·依據申請專利範圍第1項之系統,其中更進-步包含一個 或多個裝置架構,其構造均承受以及利用一個或多個連接 之处持結構固定微流體裝I裝置架職造為容納裝置以 f連接夾持結構,縣由只_—個或兩嫩持結構以並 热扭力或彎矩施加於該裝置方式達成。 ^多個錢_,其構造成承受朗定—組多個裝置架構3.依據申請專利範圍第2項之系統,其中更進一步包含一個 4·依據申請專利範圍第ί π心示玩,具申一個或多個系 ―冓造成觀錢性何系統架 第14 頁; 200817277 構按裝於該麵轉範_所界定之凸出6·依據申請專利銘圖楚9 ^,7·依據申請專利細第6項之系統,其中 體積内。 3至5項之任何—項系統,其中-個 —個系統雜由三維長謂架構所8·依據申請專利範圍第〗至7項之任何一 t體空間内。 項系統,其中夾持 結構包含能夠包圍鼓體裝置之延伸形狀,流體連接、 壓力地固定靠在該裝置上。 ™ 9·依據申請專利範圍第1至7項之任何一項系統,其中爽 結構為C-夾持型式形狀,其能夠部份包圍微流體裝置,流體 連接器以壓力地固定靠在該裝置上。 ’叫一 10·依據申請專利範圍第1至9項之任何一項系统其 可移動壓力元件包含螺紋化軸環,其構造將與扭力板手可別 啣接,藉由扭力板手旋緊以提供受控制之壓力。 第15 頁
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2006
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- 2006-05-11 DE DE200660021151 patent/DE602006021151D1/de active Active
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2007
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CN107413286A (zh) * | 2017-02-04 | 2017-12-01 | 青岛大学 | 一次性使用的热稳定微小反应器 |
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CN101437618A (zh) | 2009-05-20 |
ATE504354T1 (de) | 2011-04-15 |
US9126202B2 (en) | 2015-09-08 |
JP2009536729A (ja) | 2009-10-15 |
KR20090014203A (ko) | 2009-02-06 |
EP1854543B1 (en) | 2011-04-06 |
DE602006021151D1 (de) | 2011-05-19 |
CN101437618B (zh) | 2011-04-13 |
US20090183791A1 (en) | 2009-07-23 |
EP1854543A1 (en) | 2007-11-14 |
TWI374111B (en) | 2012-10-11 |
JP5022436B2 (ja) | 2012-09-12 |
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