TW200816901A - Mounting bracket and heat dissipation device using the same - Google Patents

Mounting bracket and heat dissipation device using the same Download PDF

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Publication number
TW200816901A
TW200816901A TW95135208A TW95135208A TW200816901A TW 200816901 A TW200816901 A TW 200816901A TW 95135208 A TW95135208 A TW 95135208A TW 95135208 A TW95135208 A TW 95135208A TW 200816901 A TW200816901 A TW 200816901A
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TW
Taiwan
Prior art keywords
plate
heat sink
mounting
heat
baffle
Prior art date
Application number
TW95135208A
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Chinese (zh)
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TWI302432B (en
Inventor
Chun-Chi Chen
Shi-Wen Zhou
Guo Chen
Li He
Peng Liu
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Foxconn Tech Co Ltd
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Priority to TW95135208A priority Critical patent/TWI302432B/en
Publication of TW200816901A publication Critical patent/TW200816901A/en
Application granted granted Critical
Publication of TWI302432B publication Critical patent/TWI302432B/en

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Abstract

A heat dissipation device includes a heat sink having a plurality of fins and a plurality of mounting brackets buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate mounted on a top of the heat sink for mounting the fan onto the heat sink and a baffle plate extending from one side of the mounting plate to a bottom of the heat sink. A plurality of fasteners extends through the baffle plates of the mounting brackets without interference to the fins to mount the heat dissipation device onto a printed circuit board.

Description

200816901 九、發明說明: 【犛明所屬之技術領域】 尤指1 重帶有安裝支架之 本發明涉及一種散熱裝置 散熱裝置。 【先前技術】 隨著電子産業的迅速發展,如電腦中電子 狄 速度大幅度提高,其産生的熱量也隨之劇增=异 元件的熱量散發出去,以保證其正常運行,θ —直是業: 需解決的問題。眾所周知,絲在主機板上之^處理 是,系統的核心,當電腦運行時’中央處生' =熱量會導致中央處理器無法正常運行。為有效散里發 中央處理器在運行過程中產生之熱量。 =,中央處理器上加裝—如圖5所示之散熱裝D 便將八産生的熱量散發出去。該散熱裝置主要由—散敎哭沙 和一風扇90組成’其中風扇9〇鎖在散熱器上8〇,散埶写別 置於中央處理器上,從而中央處理器工作時產生的熱量, 方面從政熱益80散發,另一方面風扇9〇運轉產生有力 的風吹向散熱器80,以持續從散熱器8〇帶走熱量,避免中 央處理器過熱而降低工作效率,甚至損壞。 …在該散熱褒置安裝過程中,首先需要在散熱器8〇頂部 f裝I*對固定片7〇,該固定片70之二側邊通過螺絲鎖固於 政熱器80的散熱鰭片84相對兩側,從而將風扇90通過螺 絲鎖固於置於風扇固定片7〇頂部;將風扇90安裝至散熱 200816901 器80頂後心要將—對安裝支架⑽通過螺絲鎖固於 散熱器80底部的相對兩側,以供數個扣具穿設,為了安裝 ^扇90及固疋整個散熱裝置均需分別設置對應的功能元 L = ”能元件利用率不佳,不具多功能性。 【發明内容】 有馨於此,有必要提供一種具有多功能安裝支架之散 ”、、,置肖女衣支架不僅可以將風扇固定於散熱裝置上而 且退可以將該帶有風扇的整個散熱裝置固定至電路板上。 -㈣熱裝置’包括—散熱器、_風扇及複數安裝支 架,其中該散熱器包括複數散熱鰭片,每 一置於散熱器上之安裝板,哕 叉系匕括 熱器上,-擋板自該安驗固定於散 身 衣极4折延伸,稷數固定桿件穿過 該擋板將該散熱裝置固定於一電路板上。 -安裝支架,包括:—安装板,該安裝板上形成一供 =插入之收容孔;-卡板,係自該安褒板一邊緣向下延 申认置^及-擒板,係自該安裝板另—相對邊緣料延伸。 相較於習知技術,該安裝支架同時提供了可 固定於散熱器頂部及供整個散熱裝置固定於電上^ 構’具多功能集成的優點。 【實施方式】 請參閱圖1’本發明之散熱裝置1〇〇用以對安 路板(圖未*)上之-發熱f子树(目未^)進^ 括一散熱器1〇,四安裝支架20及一風扇3〇,其;、該= 200816901 支架20不僅可以將風扇3〇固定於散熱器1〇上而且可以將 散熱裝置100固定於電路板上。 該散熱器10包括一多稜體之主體部12及從該主體部 12之稜邊向外延伸設置之分叉板⑽。在本實施例中該主 體部12為四棱體。複數散熱轉片14自主體部12及分叉板 120之側面延伸設置’該等散熱鰭片…分成四組,該四組 散熱鰭片14分別位於不同的四個方向,兩組相鄰之散熱鰭 f片14所在方向相互垂直。主體部12之四側面及分叉板12〇 开乂成四區域,母組散熱鰭片14分別位元於相應的區域中。 ”中一相郇之放熱鰭片組之間形成一用以收容扣具之安 裝空間1〇2。該扣具50具有一固定桿件(圖未標)及套置於 該固定桿件上之彈簧(圖未標)。 請同時參閱圖2及圖3,每一安裝支架2〇與同一區域 :之一相#散熱||片14卡合。該安裝支架如包括一矩形 安,板22、一自該安裝板22的一縱向邊緣末端垂直向下延 伸"又置卡板24及-自該安裝板22的另—相對縱向邊緣末 端垂直向下彎折設置L形擔板25。該擔板25包括一與卡板 2山4相對且平行的縱長狀支撐板26及-自該支標板26之末 端垂直延伸設置之墊板28;該支撐板26的延伸長度較卡板 24長該墊板28與該安裝板22位於支撐板%的同一側, 且該塾板28與該安裝板22的延伸方向相互垂直。該安裝 板22置於其中一散熱鰭片組的二相鄰散熱鰭片14頂部, ^該二相鄰散熱.鰭片14之間的間隙遮住,其中該二相鄰 鰭片14臨近其所在該散熱鰭片組最外側的一散熱鰭片 200816901 14。該安裝板22之延伸方向與該二相鄰散熱鰭片14之水 平延伸方向相同,其自該二相鄰散熱鰭片14頂部末端延伸 至該散熱鰭片組相應的散熱器10的分叉板120上。該分叉 板120上設有一螺紋孔122,該安裝板22之一自由端對應 於分叉板120之螺紋孔122處設有一定位孔222。 該安裝 板22另一端對應於卡板24與支撐板26處設有一收容孔 224,該收容孔224臨近二相鄰散熱鰭片14之外端且與該 二相鄰散熱鰭片14之間的間隙相連通,用以供一自攻螺絲 40插入。該支撐板26之高度與散熱鰭片14之高度相當, 該支撐板26與卡板24的相對内壁之間的間距與該二相鄰 散熱鰭片14外壁之間的間距大致相同以便支撐板26與卡 板24的相對内壁抵靠於該二相鄰散熱鰭片14之外壁上從 而將該二相鄰散熱鰭片14夾置其間,從而避免自攻螺絲40 插入二相鄰散熱鰭片14之間的間距中時,散熱鰭片14受到 擠壓而向外變形。一對彈性臂262自支撐板26與卡板24之 頂緣向上延伸設置,其位於安裝板22的收容孔224的二相 對邊緣。每一彈性臂262包括一下臂264及一上臂266,該 下臂264自支撐板26及卡板24二者之一的中間頂緣向上 且向内彎折設置,該上臂266自下臂264末端向上且向外 彎折設置。一接觸部(圖未標)形成於該下臂264與上臂266 的連接處,以便使二相對下臂264之間的間距比支撐板26 及卡板24之間的間距小,該接觸部用以將自攻螺絲40夾 置其間。該墊板28抵靠於散熱鰭片14底部末端且延伸至 二相鄰散熱鰭片14靠近的安裝空間102内。該墊板28具有一位 9 200816901 於安裝空間102的扇形角2 ,一 & 282上用以供扣具5〇穿過。&立孔284设於該扇形角 凊再次參閱圖戶如七 框體32中之馬達34,圓形框體32及收容於 延伸之三角狀凸耳320。每=成有四物 緣延伸之第-凸耳322及自^耳32G包括—自桓體%底 324^^^ 324 1ί!:!32 一凸耳322卜< ^ 耳322相隔且相對設置。每 凸耳322 h又有一貫穿孔(圖未標)以 請參閱圖1及圖4,本發明爾置 安穿支羊安I空間搬之區域中,使 之卡板24及支撐板26與所在區域之二 熱鰭片14卡合,四螺絲6〇穿 *· 進而與分叉板12〇之螺紋孔裝板/之定位孔222 m ^ Z螺鎖,由此將該安裝支牟 20之安裝板22固定於散埶琴1〇 ” 欣”、、态10頂部,風扇30置於散熱器 之貝和風扇30凸耳細之貫穿孔對準安裝支架加安 1一之收谷孔222,自1文螺絲40穿過位於風扇30底部 ^凸耳322後通過安裝板22之收容孔222進-步伸入 二相鄰散熱縛片14之間的間隙’通過該自攻螺絲4 0自攻 螺紋與該二相鄰散熱鰭片14螺鎖,從而將該風扇3〇穩固 安褒於散熱H K)之頂部;扣具5G穿過安裝支架2Q之塾板 =形角以82之定位孔284及電路板後與電路板下面之 月板(圖未不)鎖合,從而將該散熱裝置1〇〇固定於該電路 板上。 如疋,本發明之安裝支架2〇同時提供了可以將風扇如 200816901 固定於散熱器10頂部及供整個散熱裝置100固定於電路板 上之結構,具多功能集成的優點。 '綜上所述,本發明符合發明專利要件,爰依法提出專 利申請。惟,以上該者僅為本發明之較佳實施例,舉凡熟 悉本案技藝之人士,在爰依本發明精神所作之等效修飾或 變化,皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體分解圖。 圖2係圖1散熱裝置中安裝支架之放大圖。 圖3係圖1散熱裝置中安裝支架與散熱器之組合圖。 圖4係圖1之組合圖。 圖5係習知技術之一散熱裝置組合圖。 【主要元件符號說明】 [習知] 安裝支架 60 固定片 70 散熱器 80 散熱鰭片 84 風扇 90 [本發明] 散熱器 10 安裝空間 102 主體部 12 分叉板 120 螺紋孔 122 散熱鰭片 14 安裝支架 20 安裝板 22 收容孔 222 > 224 卡板 24 11 200816901 擋板 彈性臂 上臂 扇形角 風扇 凸耳 第二凸耳 自攻螺絲 螺絲 支撐板 26 下臂 264 墊板 28 定位孔 284 框體 32 第一凸耳 322 馬達 34 扣具 50 散熱裝置 100 12200816901 IX. Description of the invention: [Technical field to which the invention belongs] In particular, the invention relates to a heat sink with a heat sink. [Prior Art] With the rapid development of the electronics industry, such as the computer's electronic Di speed is greatly improved, the heat generated by it will also increase dramatically = the heat of the different components is emitted to ensure its normal operation, θ - straight : The problem to be solved. As we all know, the processing of the wire on the motherboard is the core of the system. When the computer is running, the 'centrality' = heat will cause the central processor to fail to operate normally. In order to effectively dissipate the heat generated by the central processing unit during operation. =, installed on the central processor - as shown in Figure 5, the heat sink D will dissipate the heat generated by the eight. The heat dissipating device is mainly composed of - a divergent crying sand and a fan 90. The fan 9 is locked on the heat sink 8 〇, and the heat is generated when the central processing unit is operated. On the other hand, the fan 9 〇 runs, generating a powerful wind blowing to the radiator 80, in order to continue to take away heat from the radiator 8 ,, to avoid overheating of the central processor to reduce work efficiency, and even damage. In the installation process of the heat dissipation device, first, the I* pair of fixing pieces 7〇 are mounted on the top of the heat sink 8〇, and the two sides of the fixing piece 70 are screwed to the heat dissipation fins 84 of the political heater 80 by screws. On opposite sides, the fan 90 is screwed to the top of the fan fixing piece 7〇; the fan 90 is mounted to the top of the heat dissipation 200816901 80. The mounting bracket (10) is screwed to the bottom of the radiator 80. The opposite sides of the two sides are provided for several fasteners. In order to install the fan 90 and the whole heat sink, it is necessary to separately set the corresponding function element L = "the energy utilization rate of the component is not good, and it is not multifunctional. Contents] In this case, it is necessary to provide a versatile mounting bracket. The shawl bracket can not only fix the fan to the heat sink but also fix the entire heat sink with the fan to On the board. - (4) The thermal device 'includes a heat sink, a fan, and a plurality of mounting brackets, wherein the heat sink includes a plurality of heat sink fins, each of which is disposed on the heat sink, the fork is a heat exchanger, and the baffle Since the safety test is fixed to the pole piece, the extension is extended by 4 folds, and the fixed number of fixed rods are fixed to a circuit board through the baffle. - mounting bracket, comprising: - a mounting plate, the mounting plate forming a receiving hole for inserting and inserting; - a card plate extending downward from an edge of the mounting plate and a see-up plate The mounting plate is further extended relative to the edge material. Compared with the prior art, the mounting bracket also provides the advantage of being able to be fixed to the top of the heat sink and for the entire heat sink to be fixed on the electrical structure. [Embodiment] Please refer to FIG. 1 'The heat dissipating device 1 of the present invention is used to add a heat sink 1 to the heat-emitting sub-tree on the Anlu board (not shown). The mounting bracket 20 and a fan 3〇; the =200816901 bracket 20 can not only fix the fan 3〇 to the heat sink 1 but also fix the heat sink 100 to the circuit board. The heat sink 10 includes a body portion 12 of a polygonal body and a furcation plate (10) extending outwardly from an edge of the body portion 12. In the present embodiment, the main body portion 12 is a quadrangular body. The plurality of heat dissipating fins 14 extend from the side of the main body portion 12 and the bifurcation plate 120. The heat dissipating fins are divided into four groups, and the four groups of heat dissipating fins 14 are respectively located in different four directions, and two sets of adjacent heat dissipating heat are disposed. The fins 14 are oriented perpendicular to each other. The four sides of the main body portion 12 and the bifurcation plate 12 are opened into four regions, and the female fins 14 are respectively positioned in the corresponding regions. Between the heat-dissipating fin groups of the first phase, a mounting space for accommodating the fasteners is formed. The fastening device 50 has a fixing rod (not shown) and is placed on the fixing rod. Spring (not shown) Please refer to Figure 2 and Figure 3, each mounting bracket 2〇 and the same area: one phase #热热||片14. The mounting bracket includes a rectangular amp, board 22, An L-shaped support plate 25 is disposed from a longitudinal edge of the mounting plate 22 and extends vertically downwardly. Further, the card plate 24 and the other opposite longitudinal edge end of the mounting plate 22 are bent downwardly and vertically. The plate 25 includes an elongated support plate 26 opposite to and parallel to the card plate 4 and a pad 28 extending perpendicularly from the end of the support plate 26; the support plate 26 has a longer extension than the card plate 24 The backing plate 28 and the mounting plate 22 are located on the same side of the supporting plate, and the extending direction of the sill plate 28 and the mounting plate 22 are perpendicular to each other. The mounting plate 22 is disposed on two adjacent heat dissipation fins of the heat dissipating fin group. The top of the fins 14, ^ the two adjacent heat sinks. The gap between the fins 14 is hidden, wherein the two adjacent fins 14 are adjacent to the a heat dissipating fin of the outermost fin of the heat dissipating fin group 200816901 14. The extending direction of the mounting board 22 is the same as the horizontal extending direction of the two adjacent heat dissipating fins 14, and extends from the top end of the two adjacent heat dissipating fins 14 to The heat dissipating fin set is disposed on the bifurcation plate 120 of the corresponding heat sink 10. The branching plate 120 is provided with a threaded hole 122, and one of the free ends of the mounting plate 22 is corresponding to the threaded hole 122 of the branching plate 120. Positioning hole 222. The other end of the mounting plate 22 is provided with a receiving hole 224 corresponding to the card board 24 and the supporting plate 26, and the receiving hole 224 is adjacent to the outer end of the two adjacent heat dissipating fins 14 and the two adjacent heat dissipating fins. The gap between the 14 is connected for insertion of a self-tapping screw 40. The height of the support plate 26 is comparable to the height of the heat dissipation fins 14, and the spacing between the support plate 26 and the opposite inner wall of the card 24 is The spacing between the outer walls of the two adjacent heat dissipation fins 14 is substantially the same so that the opposite inner walls of the support plate 26 and the card 24 abut against the outer walls of the two adjacent heat dissipation fins 14 to sandwich the two adjacent heat dissipation fins 14 In between, thus avoiding the insertion of the self-tapping screws 40 into the two adjacent heat sink fins When the spacing between the 14 is between, the heat dissipation fins 14 are pressed and deformed outwardly. A pair of elastic arms 262 extend upward from the top edge of the support plate 26 and the card plate 24, and are located at the receiving holes 224 of the mounting plate 22. Two opposite edges. Each resilient arm 262 includes a lower arm 264 and an upper arm 266 that is bent upwardly and inwardly from an intermediate top edge of one of the support plate 26 and the card plate 24, the upper arm 266 The end of the lower arm 264 is bent upward and outward. A contact portion (not shown) is formed at the junction of the lower arm 264 and the upper arm 266 so that the spacing between the two opposing lower arms 264 is greater than the support plate 26 and the card. The spacing between the plates 24 is small, and the contact portion is used to sandwich the tapping screws 40 therebetween. The backing plate 28 abuts against the bottom end of the heat dissipating fins 14 and extends into the mounting space 102 where the adjacent fins 14 are adjacent. The pad 28 has a sector angle of 2 200816901 in the installation space 102, a & 282 for the fastener 5 to pass through. The & vertical hole 284 is disposed in the fan-shaped corner. Referring again to the motor 34 in the seven-frame 32, the circular frame 32 and the triangular-shaped lug 320 received therein. Each of the first and second lugs 322 and the self-shoulder 32G include - the self-body 32% 324 ^ ^ ^ 324 1 ί!: ! 32 a lug 322 b < ^ ear 322 separated and opposite . Each lug 322 h has a consistent perforation (not shown). Referring to Figures 1 and 4, the present invention is placed in the area where the armor is placed in the space, so that the card 24 and the support plate 26 are located The second heat fin 14 of the area is engaged, the four screws 6 are worn*, and further, the threaded hole mounting plate/the positioning hole 222 m ^ Z of the branching plate 12 is screwed, thereby mounting the mounting bracket 20 The plate 22 is fixed on the top of the 埶 埶 〇 欣 欣 、 、 、 、 、 、 , , , , , , , , , , , , , , 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 222 222 222 The screw 40 is inserted into the gap between the two adjacent heat-dissipating fins 14 through the receiving hole 222 of the mounting plate 22 through the bottom of the fan 30. The self-tapping screw 40 is self-tapping. The two adjacent heat dissipating fins 14 are screwed, so that the fan 3〇 is firmly mounted on the top of the heat sink HK); the clip 5G passes through the mounting plate 2Q and the positioning hole 284 and the circuit are 82 The rear of the board is locked with the moonboard under the circuit board (not shown), thereby fixing the heat sink 1〇〇 to the circuit board. For example, the mounting bracket 2 of the present invention simultaneously provides a structure for fixing a fan such as 200816901 to the top of the heat sink 10 and for fixing the entire heat sink 100 to the circuit board, and has the advantages of multifunctional integration. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink of the present invention. Figure 2 is an enlarged view of the mounting bracket in the heat sink of Figure 1. 3 is a combination diagram of a mounting bracket and a heat sink in the heat sink of FIG. 1. Figure 4 is a combination of Figure 1. FIG. 5 is a combination diagram of a heat sink of a conventional technique. [Main component symbol description] [General] Mounting bracket 60 Fixing plate 70 Heat sink 80 Heat sink fin 84 Fan 90 [The present invention] Heat sink 10 Mounting space 102 Main body portion 12 Bifurcation plate 120 Threaded hole 122 Heat sink fin 14 Mounting Bracket 20 mounting plate 22 receiving hole 222 > 224 card board 24 11 200816901 baffle elastic arm upper arm fan angle fan lug second lug self tapping screw support plate 26 lower arm 264 pad 28 positioning hole 284 frame 32 One lug 322 motor 34 clip 50 heat sink 100 12

Claims (1)

200816901 十、申請專利範圍: 工· 一種散熱裝置,包括: •放熱器’其上形成有複數散熱鰭片; 一風扇’安裝於該散熱器上;及 複數安裝支架,每-安裝支架包括一置於散熱器上之安 裝板,該風扇藉由該安裝板固定於散熱器上;一擋板自 該安裝板彎折延伸,複數固定桿件穿過該擋板用以將該 散熱裝置固定於一電路板上。 2·如申请專利範圍第1項所述之散熱裝置,其中每一安裝 ^架進一步包括一自安裝板延伸設置之卡板,該卡板與 擋板共同夾置二相鄰散熱鰭片於其間。 3·如申請專利範圍第2項所述之散熱裝置,其中該卡板與 擋板分別自該安裝板相對二側緣同向延伸。 4·如申睛專利範圍第2或3項所述之散熱裝置,其中該擋 板包括一與該卡板相對且平行之支撐板,該卡板與支撐 板之二相對内壁抵靠該二相鄰散熱鰭片之相對外壁。 5·如申凊專利範圍第4項所述之散熱裝置,其中該擋板進 一步包括一自該支撐板末端垂直延伸且抵靠於該二相 郴政熱鰭片末端之墊板,該固定桿件穿過該墊板將散熱 裝置固定於該電路板上。 6·如申凊專利範圍第5項所述之散熱裝置,其中該安裝板 與墊板位於支撐板之同一側,且該墊板之延伸方向垂直 於該安裝板之延伸方向。 13 200816901 7. 如申μ專利範圍第4項所述之散熱裝置,其中該安裝板 ^形成有擋板及卡板之一端頂面上設有一收容孔,該收 谷孔與該二相鄰散熱鰭片之間的間距連通。 8. ·如申請專利範圍第7項所述之散熱裝置,其中—螺絲穿 過該風扇及安裝板上之收容孔進而與該二相鄰散熱鰭 片之間的間隙配合。 • ^申4專利範圍第8項所述之散熱裝置,其中該卡板及 擋板頂緣形成有一對夾持該螺絲之彈性臂。 10·如申請專利範圍第9項所述之散熱裝置,其中該彈性臂 G括自卡板及擋板頂緣向上且向内彎折設置之下臂 及自下臂末端向上且向外彎折設置之上臂,該上臂與下 臂鄰接處形成一夾持螺絲之接觸部。 U·如申請專利範圍帛10項所述之散熱裝置,其中該螺絲 為自攻螺絲。 如申請專利範圍第2項所述之散熱裝置,其中該散熱器 包括一多稜體狀之主體部及從該主體部之側稜邊向外 L伸η又置之为叉板,該散熱鰭片自該主體部及分叉板之 側面延伸設置,該主體部之側面及分又板形成相應之區 域,相鄰區域之間形成一收容該固定桿件之安裝空間。 13·如申請專利範圍第12項所述之散熱裝置,其中該安裝 板鎖固於該散熱器之分叉板頂面。 14·一安裝支架,包括: 一安裝板,該安裝板上形成一供螺絲插入之收容孔; 14 200816901 一卡板,係自該絲板—邊緣向下延伸設置;及 一撞板’係自該安裝板另—相對邊緣彎折延伸。 15. 如申請專利範圍第14項所述之安裝支架,其中該擋板 包括-與該卡板相對且平行之支樓板及自 該支撐板末 端垂直延伸之墊板。 16. 如申請專利範_ 15項所述之安裝支架,其中該安裝 ,置於一散熱器頂部,用以將一風扇固定置該散熱器頂 Ο ϋ專利犯圍第16項所述之安裝支架,其中該塾板 二政熱器底# ’用以供一固定桿件穿設,將該散熱器 固疋至一電路板上。 15200816901 X. Patent application scope: Work · A heat sink device, including: • a radiator that has a plurality of heat sink fins formed thereon; a fan 'mounted on the heat sink; and a plurality of mounting brackets, each of which includes a mounting bracket a mounting plate on the heat sink, the fan is fixed on the heat sink by the mounting plate; a baffle is bent and extended from the mounting plate, and a plurality of fixing rods are passed through the baffle for fixing the heat dissipating device to the heat sink On the board. 2. The heat dissipating device of claim 1, wherein each mounting frame further comprises a card plate extending from the mounting plate, the card plate and the baffle sandwiching two adjacent heat dissipating fins therebetween . 3. The heat sink of claim 2, wherein the card and the baffle extend from opposite sides of the mounting plate. 4. The heat sink according to claim 2, wherein the baffle comprises a support plate opposite to the card plate, and the opposite inner wall of the card plate and the support plate abut the two phases Adjacent to the opposite outer wall of the fin. 5. The heat sink according to claim 4, wherein the baffle further comprises a pad extending perpendicularly from the end of the support plate and abutting against the end of the two-phase heat fin, the fixing rod The piece passes through the backing plate to fix the heat sink to the circuit board. 6. The heat sink according to claim 5, wherein the mounting plate and the backing plate are located on the same side of the supporting plate, and the extending direction of the pad is perpendicular to the extending direction of the mounting plate. The heat dissipating device of claim 4, wherein the mounting plate is formed with a baffle plate and a top surface of the card plate is provided with a receiving hole, and the receiving hole and the two adjacent heat dissipation The spacing between the fins is connected. 8. The heat sink according to claim 7, wherein the screw passes through the receiving hole of the fan and the mounting plate to cooperate with the gap between the two adjacent heat radiating fins. The heat sink of claim 8, wherein the card and the top edge of the baffle are formed with a pair of resilient arms that hold the screw. 10. The heat dissipating device of claim 9, wherein the elastic arm G comprises an upper arm that is bent upward and inward from the top edge of the card and the baffle, and is bent upward and outward from the end of the lower arm. An upper arm is disposed, and the upper arm forms a contact portion of the clamping screw adjacent to the lower arm. U. The heat sink according to claim 10, wherein the screw is a self-tapping screw. The heat dissipating device of claim 2, wherein the heat sink comprises a polygonal body portion and an outwardly extending edge from the side edge of the main body portion and is a fork plate. The sheet extends from the side of the main body portion and the branching plate, and the side surface of the main body portion and the divided plate form corresponding regions, and an installation space for accommodating the fixing rod member is formed between the adjacent regions. 13. The heat sink of claim 12, wherein the mounting plate is secured to a top surface of the furcation plate of the heat sink. 14. A mounting bracket, comprising: a mounting plate, the mounting plate forming a receiving hole for screw insertion; 14 200816901 a card plate extending downward from the wire plate-edge; and a striker plate The mounting plate is further bent to extend relative to the edge. 15. The mounting bracket of claim 14, wherein the baffle comprises - a slab opposite and parallel to the slat and a slat extending perpendicularly from the end of the support. 16. The mounting bracket of claim 15 wherein the mounting is placed on top of a heat sink for securing a fan to the top of the heat sink. The top plate of the slab is used for a fixed rod to fix the heat sink to a circuit board. 15
TW95135208A 2006-09-22 2006-09-22 Mounting bracket and heat dissipation device using the same TWI302432B (en)

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Application Number Priority Date Filing Date Title
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TW200816901A true TW200816901A (en) 2008-04-01
TWI302432B TWI302432B (en) 2008-10-21

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