TW200815677A - Pump - Google Patents

Pump Download PDF

Info

Publication number
TW200815677A
TW200815677A TW95135216A TW95135216A TW200815677A TW 200815677 A TW200815677 A TW 200815677A TW 95135216 A TW95135216 A TW 95135216A TW 95135216 A TW95135216 A TW 95135216A TW 200815677 A TW200815677 A TW 200815677A
Authority
TW
Taiwan
Prior art keywords
cover
chamber
pump
impeller
wall
Prior art date
Application number
TW95135216A
Other languages
Chinese (zh)
Other versions
TWI308941B (en
Inventor
Cheng-Tien Lai
Zhi-Yong Zhou
Qiao-Li Ding
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95135216A priority Critical patent/TWI308941B/en
Publication of TW200815677A publication Critical patent/TW200815677A/en
Application granted granted Critical
Publication of TWI308941B publication Critical patent/TWI308941B/en

Links

Abstract

A miniature liquid cooling device in accordance with an embodiment of the present invention includes a casing having an outer wall, a bottom base attached to a bottom end of the outer wall and a top cover attached to a top end of the outer wall. The casing defines a receiving space therein for receiving an impeller therein. A sealed chamber is defined in the casing and isolated from the receiving space. A motor driving unit is attached to the impeller to drive the impeller to rotate. The motor driving unit comprises a motor having a stator and a printed circuit board electrically connecting with the stator. A plurality of electronic components are mounted on the printed circuit board. The top cover covers the motor driving unit and contacts with the electronic components of the printed circuit board for dissipating heat generated by the electronic components when the motor driving unit is operated.

Description

200815677 九、發明說明: 【發明所屬之技術領域】 :本發明涉及-種幫浦,制係—翻於液冷式散 統的幫浦。 【先如技術】 -般帶有熱源的電子産品,均需要有散熱的系統,如 電腦内部設有中央處理it(CPU),由於中央處理器工作時合 發熱’故必驗中央處理器上設置散熱裝置,以防止中: 處理器發生過熱問題。 、 在習知之電腦CPU散埶奘罟由、—人1 ^ 欢熟裝置中,液冷式散熱系統有逐 漸被廣泛應用的趨勢,為τ可你、人” 局了可使冷卻液於液冷式散埶 内部産生循環,一般會設置耿…系、,死 4六/、、>* 幫浦,以該幫浦對冷卻液産 生推力使冷部液産生循環,從而,& y册 曰 i Μ 攸_讓冷部液帶走CPU的埶 1。通常該幫浦包括一筆於菸 …、 ,, 茱輪及驅動該葉輪旋轉之馬達,該 馬達具有一驅動馬達運轉之雷 ^. ^ v 得窀路板,電路板上設置有複數 發熱電子兀件,為防止黾;查+ + A α攸叛 … 之電路板浸水,通常將該g这 置於-密閉之腔室中,缺而,封、々 、吊㈣馬達 曰 “、、 幫浦工作時電路板産生之埶 1散發在密閉腔室中,從而+ 生生之… 對電路板之壽命有極大的影继 至皿度升问,这 效能。因此,如何將密閉腔;中固散熱系統之 之溫度是-個急需解決之問題。’、、、里¥出’降低電路板 【發明内容】 有鐾於此’有必要提供 種幫缚,可有效避免幫浦内 7 200815677 電路板過熱的現象。200815677 IX. Description of the invention: [Technical field to which the invention pertains]: The present invention relates to a pump, a system that turns over a liquid-cooled pump. [First as technology] - The electronic products with heat source all need a system with heat dissipation. For example, the central processing unit (CPU) is installed inside the computer. Because the central processing unit works when it is hot, it must be set on the central processor. Heat sink to prevent medium: The processor has an overheating problem. In the computer CPU of the well-known computer, the liquid cooling system has gradually been widely used, and it can be used to make the coolant liquid-cooled. The inside of the divergence produces a loop, which is generally set to 耿...,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, i Μ 攸 _ Let the cold liquid take away the 埶1 of the CPU. Usually the pump includes a pair of cigarettes..., , , a wheel and a motor that drives the impeller to rotate. The motor has a driving motor running thunder ^. ^ v The circuit board is provided with a plurality of heating electronic components on the circuit board to prevent sputum; the circuit board is immersed in water, and the g is usually placed in a closed chamber, missing, Sealing, boring, hanging (four) motor 曰 ",, the 产生 1 generated by the circuit board when the pump is working is distributed in the closed chamber, so that + is born... The life of the board has a great impact on the degree of the rise, this efficacy. Therefore, how to close the cavity; the temperature of the medium-solid heat dissipation system is an urgent problem to be solved. ',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

,一種幫浦’應用於液冷散熱系統,其包括一殼體,該 殼體包括一具有進水口及出水口之本體、一安裝於本體頂 端之頂蓋及一安裝於本體底端之底座,該殼體具有一收容 空間及與該收容空間相隔離之密閉腔室;一葉輪組收容於 該设體之收容空間内;一驅動該葉輪組之驅動單元收容於 該殼體之密閉腔室内,該驅動單元包括一馬達及一與馬達 電性連接的電路板,複數發熱電子元件置於該電路板上; 該頂蓋罩設於驅動單元頂部且與驅動單元的電路板的電子 元件接觸以散發電子元件産生的熱量。 相較於習知技術,本發明中幫浦之頂蓋與置於密閉腔 室中驅動單元的電路板上的電子元件接觸,可將電子元件 產生的熱里快速散發,從而有效控制冑閉腔室中的溫度, 防止電路板過熱,從而提高幫浦的效率。 【實施方式】 清參照® i至圖3所示,本發明液冷式散熱系統㈣ 〇 一方形殼體10、—組裝於殼體10 Θ之葉輪組20、- 驅動,30、一過遽器17及一吸熱體4〇,其中該葉輪愈 20由該驅動單元30驅動而旋轉。 殼體ίο呈立方體狀其包括具内部空間之本體12、 12頂端之頂蓋15及安裝於本體12底端之底座托 内部空間容置一分隔體“ ’該分隔體14用㈣ 之液體與驅動單元,防止液體進人該驅動^ 70 造成線路的短路。一中空圓柱體11置於本體12户 8 200815677 壁與分隔體14之間且該柱體11分別與本體12之内壁及分 隔體14外壁相連。一密封圈121卡置於本體12底端與底 座16之間,從而防止底座16與本體12卡合後液體外泄。 本體12之一側壁上形成有一供液體流進本體12内之進水 口 122及一供液體流出本體14出水口 124,其中出水口 124 所在位置高於進水口 122所在位置。本體12内之四角落處 形成有帶孔之凸柱120。 該分隔體14用以將驅動單元30與液體隔離開來,其 包括一第一收容部140及一與第一收容部140連通之第二 收容部142,該第一及第二收容部140、142均呈中空圓柱 狀,其中該第一收容部140具有一頂壁143,該頂壁143 向下延伸設置一軸座1430,複數軸向延伸之突肋144形成 於第一收容部140之外壁,以與驅動單元30配合;該第二 收容部142具有一向下開口,其直徑較第一收容部140之 直徑大且與圓柱體11連接。 該底座16大致呈方形設置,四螺絲162穿過該底座16 之四角落進而與本體12内之凸柱120螺合從而將該底座16 鎖固於本體12底部。該底座16與置於一電路板(圖未示) 上之一發熱電子元件(圖未示)貼合,以吸收該電子元件産生 的熱量。 請同時參閱圖4,吸熱體40收容於殼體10中且置於底 座16上,用以與吸收底座16熱量的液體進行熱交換。該 吸熱體40由導熱性好的金屬片體例如銅、銅合金或鋁製 成。在本實施例中,該吸熱體40由複數平行排列的銅制環 9 200815677 形片體42構成。每一片體42外端緣周向設有複數等距且 間隔設置之凹口 422,每一片體42自中央位置處向其外徑 向延伸設有五均勻間隔的縱長槽孔420,每一片體42相鄰 二槽孔420之間形成一換熱部421,該換熱部421上設有一 大致呈V形的凹槽424,該凹槽424之二延伸臂沿徑向方 向延伸,該凹槽424的二對稱延伸臂之間形成一隔片423, 該隔片423的長度小於槽孔420的長度。組裝這些片體42 _ 時,每一片體42之隔片423對準且置於相鄰片體42之槽 孔420,如此這些片體42之間形成複數液體通道44,以供 液體流入該吸熱體40中充分與每一片體42進行熱交換。 一安裝板41置於吸熱體40頂部,該安裝板41設有一 中心孔(圖未標),該中心孔與吸熱體40上槽孔420處於中 央位置的部分對應,從而使該中心孔與吸熱體40之液體通 道44連通。 一罩體13收容於本體12之内部空間且夾置於分隔體 _ 14之第二收容部142之底端與安裝板41之間,該罩體13 包括一圓形頂壁130及自該頂壁130邊緣向下延伸設置之 圓柱形侧壁132,一環形臺階1302形成於頂壁130之邊緣 位置處,且較該頂壁130的位置低,該臺階1302用以與第 二收容部142之底端緊密配合。一圓弧形卡緣1324自侧壁 132底端周向延伸,以卡置於本體12内圓柱體11的相應位 置處;一大致呈倒U形卡緣1326連接於卡緣1324的二自 由端,該倒U形卡緣1326圍成一與進水口 122相對的入口 區137,該入口區137中央位置處設有一與進水口 122相對 200815677 且連通的開口 1320,以使液體從該開口 1320流入罩體13 中/該倒U形卡緣1326與圓柱體11相應的内壁抵靠以使 該入口區137與圓柱體11内壁之間形成一空間,液體可以 從罩體13中流經該空間進而向下流入置於罩體13下方的 吸熱體40中。複數通孔1322周向設置於罩體13侧壁132 上且位於開口 1320的上方位置;罩體13的頂壁130中央 位置處向下凹陷形成一凹陷部134,該凹陷部134周圍形成 馨有複數弧形通孔135,該等通孔135呈圓周圍繞凹陷部 134 ;罩體13的頂壁130對應於通孔135向下延伸形成有 一中空的支撐柱136,該支撐柱136抵靠於安裝板41頂部 且圍繞該安裝板41的中心孔,該支撐柱136的内壁圍繞形 成一容腔1360,該容腔1360與通孔135相連通及吸熱體 40的液體通道44連通以使液體能夠從吸熱體40的通道44 經由支撐柱136内的容腔1360從通孔135流入分隔體14 中。請同時參閱圖5,一具有一定高度的環形臺階1364形 •成於支撐柱136的外壁,且該臺階1364的外壁的二相對側 分別形成一擋板1362,該擋板1362的底部與臺階1364底 部齊平。 該過濾器17收容於罩體13中且套置於罩體13的支撐 柱136外壁上,該過濾器17包括一頂壁170及自該頂壁17〇 末端向下延伸設置的侧壁172。一中心孔1702設於頂壁170 中央位置處,該中心孔1702的直徑與罩體13的支撐柱136 直徑相當以供該支撐柱136穿過。複數小孔1704設置於該 過濾器17的頂壁170及侧壁172,以供液體中混入的氣體 11 200815677 逃出。逃出該等小孔1704的氣體存儲於罩體13中且彙聚 成大的氣泡不此再從該專小孔1704中返回過濾器17中。 該頂壁170抵頂於罩體13的臺階1364及擋板1362上,使 過遽器ί7的頂壁170與罩體13的頂壁13〇隔開,從而利 於氣體從過濾器17的頂壁17〇逃出。二门形框174對稱形 成於過濾器17的側壁m上,其中一门形框174與罩體13 上的開口 1320相對應且該框174的邊緣抵頂於罩體13的A pump is applied to a liquid cooling system, comprising a casing, the casing comprising a body having a water inlet and a water outlet, a top cover mounted on the top end of the body, and a base mounted on the bottom end of the body. The housing has a receiving space and a sealed chamber separated from the receiving space; an impeller group is received in the receiving space of the device; and a driving unit driving the impeller group is received in the sealed chamber of the housing The driving unit includes a motor and a circuit board electrically connected to the motor, and the plurality of heat-generating electronic components are disposed on the circuit board; the top cover is disposed on the top of the driving unit and is in contact with the electronic components of the circuit board of the driving unit to be distributed The heat generated by the electronic components. Compared with the prior art, the top cover of the pump in the present invention is in contact with the electronic components on the circuit board of the driving unit disposed in the sealed chamber, and the heat generated by the electronic component can be quickly dissipated, thereby effectively controlling the closed cavity. The temperature in the chamber prevents the board from overheating, which increases the efficiency of the pump. [Embodiment] As shown in Fig. 3 to Fig. 3, the liquid cooling type heat dissipating system (4) of the present invention has a square housing 10, an impeller group 20 assembled in the housing 10, a drive, 30, and a pass. And a heat absorbing body 4, wherein the impeller 20 is driven to rotate by the driving unit 30. The housing ίο is in the shape of a cube, and comprises a top cover 15 having a top end of the body 12, 12 having an inner space, and a base rest mounted on the bottom end of the main body 12, and a partition body for accommodating the liquid of the partition body (4) The unit prevents the liquid from entering the drive and causes a short circuit of the line. A hollow cylinder 11 is placed between the wall of the body 12 200815677 and the partition 14 and the column 11 and the inner wall of the body 12 and the outer wall of the partition 14 respectively A sealing ring 121 is disposed between the bottom end of the body 12 and the base 16, thereby preventing the liquid from leaking out after the base 16 is engaged with the body 12. One side wall of the body 12 is formed with a liquid for flowing into the body 12. The water outlet 122 and a liquid supply flow out of the water outlet 124 of the body 14, wherein the water outlet 124 is located higher than the water inlet 122. The four corners of the body 12 are formed with a protruding pillar 120. The partition 14 is used for The driving unit 30 is separated from the liquid, and includes a first receiving portion 140 and a second receiving portion 142 communicating with the first receiving portion 140. The first and second receiving portions 140 and 142 are hollow cylindrical. The first containment The top wall 143 has a top wall 143 extending downwardly. A plurality of axially extending ribs 144 are formed on the outer wall of the first receiving portion 140 to cooperate with the driving unit 30. The second receiving portion 142 The utility model has a downward opening, the diameter of which is larger than the diameter of the first receiving portion 140 and is connected to the cylinder 11. The base 16 is substantially square, and the four screws 162 pass through the four corners of the base 16 and the protruding columns in the body 12. 120 is screwed to lock the base 16 to the bottom of the body 12. The base 16 is attached to a heat-generating electronic component (not shown) disposed on a circuit board (not shown) to absorb the electronic component. Referring to FIG. 4, the heat absorbing body 40 is received in the casing 10 and placed on the base 16 for heat exchange with the liquid absorbing the heat of the base 16. The heat absorbing body 40 is made of a metal sheet having good thermal conductivity, for example. Made of copper, copper alloy or aluminum. In the present embodiment, the heat absorbing body 40 is composed of a plurality of parallel-arranged copper rings 9 200815677-shaped sheets 42. The outer edges of each of the sheets 42 are circumferentially equidistantly spaced and spaced apart. Notch 422, each piece 42 A semi-uniformly spaced longitudinal slot 420 is defined in the central portion, and a heat exchange portion 421 is formed between each of the two adjacent slots 420. The heat exchange portion 421 is provided with a substantially a V-shaped groove 424, the two extending arms of the groove 424 extend in a radial direction, and a spacer 423 is formed between the two symmetric extending arms of the groove 424. The length of the spacer 423 is smaller than the length of the slot 420. When the sheets 42 _ are assembled, the spacers 423 of each of the sheets 42 are aligned and placed in the slots 420 of the adjacent sheets 42 such that a plurality of liquid passages 44 are formed between the sheets 42 for liquid to flow into the sheets 42 The heat absorbing body 40 sufficiently exchanges heat with each of the sheets 42. A mounting plate 41 is disposed on the top of the heat absorbing body 40. The mounting plate 41 is provided with a center hole (not shown) corresponding to a portion of the heat absorbing body 40 at the center of the slot 420, so that the center hole and the heat absorbing portion The liquid passages 44 of the body 40 are in communication. A cover 13 is received in the inner space of the body 12 and sandwiched between the bottom end of the second receiving portion 142 of the partition 144 and the mounting plate 41. The cover 13 includes a circular top wall 130 and the top A cylindrical side wall 132 extending from the edge of the wall 130 is formed. The annular step 1302 is formed at an edge of the top wall 130 and is lower than the position of the top wall 130. The step 1302 is used for the second receiving portion 142. The bottom end is tightly fitted. A circular arc-shaped card edge 1324 extends circumferentially from the bottom end of the side wall 132 to be positioned at a corresponding position of the cylinder 11 in the body 12; a substantially inverted U-shaped card edge 1326 is coupled to the two free ends of the card edge 1324. The inverted U-shaped card edge 1326 encloses an inlet region 137 opposite the water inlet 122, and an opening 1320 communicating with the water inlet 122 opposite to the water inlet 122 is provided at a central position of the inlet region 137 to allow liquid to flow from the opening 1320. The inverted U-shaped card edge 1326 of the cover 13 abuts against the corresponding inner wall of the cylinder 11 to form a space between the inlet region 137 and the inner wall of the cylinder 11, through which the liquid can flow from the cover 13 to The lower flow enters the heat absorbing body 40 placed under the cover 13. The plurality of through holes 1322 are circumferentially disposed on the side wall 132 of the cover 13 and located above the opening 1320. The central portion of the top wall 130 of the cover 13 is recessed downward to form a recess 134, and the recess 134 is formed around the recess 134. a plurality of curved through holes 135, the through holes 135 circumferentially surrounding the recessed portion 134; the top wall 130 of the cover 13 extends downwardly corresponding to the through hole 135 to form a hollow support column 136, the support column 136 abuts against the mounting The top surface of the plate 41 surrounds the central hole of the mounting plate 41. The inner wall of the support column 136 surrounds a cavity 1360. The cavity 1360 communicates with the through hole 135 and the liquid passage 44 of the heat absorbing body 40 communicates to enable liquid to pass from. The passage 44 of the heat absorbing body 40 flows into the partition 14 from the through hole 135 via the cavity 1360 in the support column 136. Referring to FIG. 5 , an annular step 1364 having a certain height is formed on the outer wall of the support column 136 , and two opposite sides of the outer wall of the step 1364 respectively form a baffle 1362 , and the bottom of the baffle 1362 and the step 1364 The bottom is flush. The filter 17 is received in the cover 13 and sleeved on the outer wall of the support post 136 of the cover 13. The filter 17 includes a top wall 170 and side walls 172 extending downward from the top end of the top wall 17. A central aperture 1702 is provided at a central location of the top wall 170. The diameter of the central aperture 1702 is comparable to the diameter of the support post 136 of the housing 13 for the support post 136 to pass through. A plurality of small holes 1704 are provided in the top wall 170 and the side wall 172 of the filter 17 for escape of the gas 11 200815677 mixed in the liquid. The gas that escapes the apertures 1704 is stored in the housing 13 and condenses into large bubbles that are no longer returned from the aperture 1704 to the filter 17. The top wall 170 abuts against the step 1364 of the cover 13 and the baffle 1362, so that the top wall 170 of the filter ί7 is spaced apart from the top wall 13 of the cover 13 to facilitate gas from the top wall of the filter 17. 17〇 escaped. The two-shaped frame 174 is symmetrically formed on the side wall m of the filter 17, wherein a sash 174 corresponds to the opening 1320 on the cover 13 and the edge of the frame 174 abuts against the cover 13.

入口區137,而另一相對的门形框174則抵頂於罩體叫目 應側壁132上,如純進水σ 122進人岐體直接從開口 1320進入該過濾器I?中。 該葉輪組20收容於分隔體14中,其包括一具有中心 孔212的葉輪21、一安裝於分隔體14頂壁軸座14卯 中的轉軸23、-套置於轉軸23上的轴承25。其中該轉轴 23及軸承25收容於該葉輪21的中心孔212中。該葉輪^ 包括-圓柱形輪轂21〇及複數自輪轂21〇末端向外發散彎 曲延伸設置的葉片211,該輪轂21〇内喪置一永久磁鐵& ,水久磁鐵22呈中空圓柱狀,設有複數交錯排列的ν極與 極。該葉輪組2G使用兩對環形扁平狀磁環26·29控制葉 的軸向定位。其中磁環26、27 #置於轉轴23上並位 =軸承25上方互相關且相對設置,磁環28、29置於轴 承25下方互相隔開且相對設置;磁環& μ卡置於葉輪 ^中心孔212的上下兩端且隨葉輪U -起轉動,磁環26 :置於軸座剛末端,磁5裒29則卡置於罩體13的頂壁13〇 的凹陷部134中。該兩對磁環26_29相互之間形成的磁力以 12 200815677 ^平衡葉輪21在軸向方向上受到的液體的作用力及葉輪21 本#的重力,使葉輪21工作時處於平衡懸浮狀態。 本發明中,分隔體14、罩體13及安裝板41共同將殼The inlet zone 137, while the other opposing sash 174 abuts against the cover body side wall 132, such as the pure feed water σ 122 entering the body directly into the filter I from the opening 1320. The impeller assembly 20 is housed in a separator 14, which includes an impeller 21 having a central bore 212, a rotating shaft 23 mounted in the top wall housing 14b of the partition 14, and a bearing 25 sleeved on the rotating shaft 23. The shaft 23 and the bearing 25 are received in the central hole 212 of the impeller 21. The impeller includes a cylindrical hub 21〇 and a plurality of blades 211 extending outwardly from the end of the hub 21, and the permanent magnets are disposed in the hub 21, and the permanent magnet 22 is hollow cylindrical. There are complex staggered ν poles and poles. The impeller set 2G uses two pairs of annular flat magnetic rings 26·29 to control the axial positioning of the leaves. The magnetic rings 26, 27 # are placed on the rotating shaft 23 and the position = bearing 25 is cross-correlated and oppositely disposed, and the magnetic rings 28, 29 are placed under the bearing 25 to be spaced apart from each other and disposed oppositely; the magnetic ring & μ card is placed The upper and lower ends of the impeller ^ center hole 212 rotate with the impeller U -, the magnetic ring 26 is placed at the end of the shaft seat, and the magnetic 5 裒 29 is inserted into the recessed portion 134 of the top wall 13 of the cover 13 . The magnetic force formed between the two pairs of magnetic rings 26_29 is balanced by the force of the liquid received by the impeller 21 in the axial direction and the gravity of the impeller 21 by 12 200815677^, so that the impeller 21 is in an equilibrium suspension state during operation. In the present invention, the partition 14, the cover 13 and the mounting plate 41 collectively cover the shell

V 體10分成四個腔室,即第一腔室102、第二腔室104、第 三腔室106和第四腔室108。其中第一腔室102由分隔體 14的内壁及罩體13的頂壁130圍成,用以收容葉輪組20 ; 該第二腔室104圍繞罩體13的支撐柱136且夾置於罩體13 _的頂壁130及安裝板41之間的空間,但不包括由罩體13 支撐柱136所圍成的容腔1360,另外,該第二腔室104還 包括一儲氣室18,該儲氣室18由過濾器17的外壁及罩體 13的内壁所圍成,用以儲存從過濾器17的小孔1704逃出 的氣體;該第三腔室106用以收容吸熱體40,其由容腔1360 及位於該容腔1360下方且夾置於安裝板41及底座16之間 的空間45構成,該第三腔室106通過容腔1360上方的通 孔135與第一腔室102連通,由此該二相互連通的第一及 • 第三腔室102、106共同構成了液體的工作通道。進水口 122 位於第二腔室104相應位置處,液體自該進水口 122進入 該第二腔室104中;出水口 124位於第一腔室102相應位置處,收 容於第一腔室102中的葉輪21以驅動流入第一腔室102中的 液體自該出水口 124流出;第四腔室108位於分隔體14的 第二收容部142上方且圍繞第一收容部140,該第四腔室 108為一密閉腔室其圍繞該第一腔室102,且分別與第一、 第二及第三腔室102、104、106隔離且液體無法流入該密 閉腔室,該第四腔室108用以收容驅動單元30。 13 200815677 收容於第四腔室108中的驅動單元30包括一帶有定子 32的馬達及置於該定子32頂部且與該定子32電性連接的 電路板33。該定子32環繞套置於分隔體14的第一收容部 140的外壁上且與外壁的突肋144配合,其在轴向上由分隔 體14的第二收容部142頂壁支撐,在徑向上由本體12内 的柱體11抵頂,該定子32具有複數纏繞於定子32上線圈 320。電路板33則置於分隔體14頂壁143的上,用以給定 0子32的線圈320提供持續的電流從而産生磁場推動葉輪21 轉動。 置於密閉腔室頂部的頂蓋15大致呈方形設置,該頂蓋 15的四角落處向下延伸設置有插銷152用以與本體12的凸 柱120配合,從而使頂蓋15安裝於本體12的頂端。一向 上的凸出部150自頂蓋中部向上突起,用以容置且接觸驅 動單元30電路板33上的電子元件330,該頂蓋15由導熱 性良好的材料製成,可以是金屬或非金屬材料,在本實施 _ 例中頂蓋15的材料為鋁,用以為電路板33上的電子元件 330產生的熱量進行散熱。為確保頂蓋15的凸出部150與 發熱電子元件330的緊密接觸,具有一定厚度的可壓縮導 熱膠片151貼置於凸出部150與電子元件330所接觸的底 面,用以提高頂蓋15與電子元件330之間的熱傳輸,當電 子元件330工作時其産生的熱量使導熱膠片151變形從而 填滿與電子元件330之間的空隙,使頂蓋15與電子元件330 充分接觸,利用頂蓋15大的散熱面積達到散熱的目的。 本發明在使用時,液體被葉輪21驅動從進水口 124流入置於第二 14 200815677 •腔室104的過濾器17中,經過過濾器17時混入液體中的氣 體彳足過濾器17的小孔1704中逃出,儲存於該儲氣室18中; 在過濾器17中流動一圈的液體經罩體13上的開口 1320流 出,由於液體的重力原因,其自罩體13的入口區137向下 沿著吸熱體40的末端緣流入第三腔室106中,由於底座16 與電路板上的發熱電子元件緊密接觸,從而吸收電子元件 産生的熱量,底座16吸收熱量後傳遞置流入該第三腔室 _ 106的液體,液體流經吸熱體40的通道44中與吸熱體40 的每一片體42進行大面積熱交換;然後液體從罩體13的 通孔135流入第一腔室102中最後通過葉輪21的離心力將 其從出水口 124甩出;同時葉輪21的轉動由位於第四密閉 腔室108的驅動單元30驅動,驅動單元30工作時,其的 電路板33上的電子元件330産生大量的熱,由於頂蓋15 的設置,使電子元件330産生的熱量可迅速傳遞至頂蓋15 上,進而將電路板33上的熱量通過頂蓋15快速散發至周 _ 圍的環境中,從而使第四密閉腔室108的溫度保持在正常 的範圍内,而不會使驅動單元30的電路板33溫度過高。 如是,本發明可有效避免因驅動單元30的電路板33處 於密閉腔室中而導致其溫度過高進而降低電路板33使用壽 命的現象。 綜上所述,本發明符合發明專利要件,爰依法提出專 利申請。惟,以上該者僅為本發明之較佳實施例,舉凡熟 悉本案技藝之人士,在爰依本發明精神所作之等效修飾或 變化,皆應涵蓋於以下之申請專利範圍内。 15 200815677 【圖式簡單說明】 ^ _圖1係本發明幫浦之立體分解圖。 圖2係本發明幫浦之立體組合圖。 圖3係沿圖2中線ΠΙ-ΙΙΙ之剖示圖。 圖4係圖1中吸熱體之立體分解圖。 圖5係圖1中罩體之立體圖。 圖6係圖1中頂蓋之立體圖。 φ 【主要元件符號說明】 殼體 10 第一腔室 102 第二腔室 104 第三腔室 106 第四腔室 108 圓柱體 11 本體 12 凸柱 120 密封圈 121 進水口 122 出水口 124 罩體 13 頂壁 130、143、 170臺階 1302、1364 側壁 132、172 開口 1320 通孔 1322 卡緣 1324 、 1326 凹陷部 134 通孔 135 支撐柱 136 容腔 1360 擋板 1362 入口區 137 空間 138 、 45 分隔體 14 第一收容部 140 第二收容部142 16 200815677The V body 10 is divided into four chambers, namely a first chamber 102, a second chamber 104, a third chamber 106, and a fourth chamber 108. The first chamber 102 is surrounded by the inner wall of the partition body 14 and the top wall 130 of the cover body 13 for receiving the impeller group 20; the second chamber 104 surrounds the support column 136 of the cover body 13 and is sandwiched between the cover body The space between the top wall 130 of the 13 _ and the mounting plate 41, but does not include the cavity 1360 surrounded by the support column 136 of the cover 13 . In addition, the second chamber 104 further includes a gas storage chamber 18 . The air plenum 18 is surrounded by the outer wall of the filter 17 and the inner wall of the cover 13 for storing the gas escaping from the small hole 1704 of the filter 17; the third chamber 106 is for accommodating the heat absorbing body 40, The cavity 1360 is formed by a space 45 located under the cavity 1360 and sandwiched between the mounting plate 41 and the base 16. The third cavity 106 communicates with the first cavity 102 through a through hole 135 above the cavity 1360. Thus, the first and third chambers 102, 106 that are in communication with each other together constitute a working channel for the liquid. The water inlet 122 is located at a corresponding position of the second chamber 104, and the liquid enters the second chamber 104 from the water inlet 122; the water outlet 124 is located at a corresponding position of the first chamber 102, and is received in the first chamber 102. The impeller 21 flows out of the water outlet 124 to drive the liquid flowing into the first chamber 102. The fourth chamber 108 is located above the second receiving portion 142 of the partition 14 and surrounds the first receiving portion 140. The fourth chamber 108 a closed chamber surrounding the first chamber 102 and isolated from the first, second and third chambers 102, 104, 106, respectively, and liquid cannot flow into the closed chamber, the fourth chamber 108 being used for The drive unit 30 is housed. 13 200815677 The drive unit 30 housed in the fourth chamber 108 includes a motor with a stator 32 and a circuit board 33 placed on top of the stator 32 and electrically connected to the stator 32. The stator 32 is disposed on the outer wall of the first receiving portion 140 of the partition body 14 and cooperates with the protruding rib 144 of the outer wall, which is axially supported by the top wall of the second receiving portion 142 of the partition body 14 in the radial direction. The cylinder 11 is abutted against the cylinder 11 in the body 12, and the stator 32 has a plurality of coils 320 wound around the stator 32. The circuit board 33 is placed on the top wall 143 of the separator 14 to provide a continuous current to the coil 320 of the given sub-32 to generate a magnetic field to urge the impeller 21 to rotate. The top cover 15 disposed on the top of the closed chamber is substantially square. The four corners of the top cover 15 are extended downwardly with pins 152 for engaging with the protrusions 120 of the body 12, so that the top cover 15 is mounted on the body 12. The top of the. An upward protrusion 150 protrudes upward from a middle portion of the top cover for accommodating and contacting the electronic component 330 on the circuit board 33 of the driving unit 30. The top cover 15 is made of a material having good thermal conductivity, and may be metal or non-metal. In the present embodiment, the material of the top cover 15 is aluminum for dissipating heat generated by the electronic component 330 on the circuit board 33. In order to ensure the close contact between the protruding portion 150 of the top cover 15 and the heat-generating electronic component 330, a compressible heat-conductive film 151 having a certain thickness is attached to the bottom surface of the protruding portion 150 and the electronic component 330 for contacting the top cover 15 The heat transfer between the electronic component 330 and the heat generated by the electronic component 330 deforms the thermal conductive film 151 to fill the gap between the electronic component 330 and the top cover 15 and the electronic component 330. The large heat dissipation area of the cover 15 achieves the purpose of heat dissipation. When the invention is in use, the liquid is driven by the impeller 21 from the water inlet 124 into the filter 17 placed in the second 14 200815677 • chamber 104, and the gas mixed into the liquid passes through the small hole of the filter 17 when passing through the filter 17. Escaped in 1704 and stored in the gas storage chamber 18; the liquid flowing in the filter 17 flows out through the opening 1320 in the casing 13, and from the inlet region 137 of the casing 13 due to the gravity of the liquid The bottom portion flows into the third chamber 106 along the end edge of the heat absorbing body 40. Since the base 16 is in close contact with the heat-generating electronic components on the circuit board, thereby absorbing heat generated by the electronic component, the base 16 absorbs heat and then transfers to the third chamber. The liquid of the chamber _106, the liquid flows through the passage 44 of the heat absorbing body 40, and exchanges heat with each of the bodies 42 of the heat absorbing body 40; then the liquid flows from the through hole 135 of the hood 13 into the first chamber 102. The impeller 21 is pulled out from the water outlet 124 by the centrifugal force of the impeller 21; at the same time, the rotation of the impeller 21 is driven by the drive unit 30 located in the fourth closed chamber 108, and the electronic component 330 on the circuit board 33 thereof is generated when the drive unit 30 operates. Mass Heat, due to the arrangement of the top cover 15, the heat generated by the electronic component 330 can be quickly transferred to the top cover 15, and the heat on the circuit board 33 can be quickly dissipated through the top cover 15 to the surrounding environment, thereby making the first The temperature of the four closed chambers 108 is maintained within the normal range without causing the temperature of the circuit board 33 of the drive unit 30 to be too high. As a result, the present invention can effectively avoid the phenomenon that the temperature of the circuit board 33 is lowered due to the circuit board 33 of the driving unit 30 being in the sealed chamber, thereby reducing the life of the circuit board 33. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. 15 200815677 [Simple description of the figure] ^ _ Figure 1 is a perspective exploded view of the pump of the present invention. Figure 2 is a perspective assembled view of the pump of the present invention. Figure 3 is a cross-sectional view taken along line ΠΙ-ΙΙΙ in Figure 2. Figure 4 is an exploded perspective view of the heat absorbing body of Figure 1. Figure 5 is a perspective view of the cover of Figure 1. Figure 6 is a perspective view of the top cover of Figure 1. Φ [Main component symbol description] housing 10 first chamber 102 second chamber 104 third chamber 106 fourth chamber 108 cylinder 11 body 12 stud 120 sealing ring 121 water inlet 122 water outlet 124 cover 13 Top wall 130, 143, 170 step 1302, 1364 side wall 132, 172 opening 1320 through hole 1322 card edge 1324, 1326 recess 134 through hole 135 support column 136 cavity 1360 baffle 1362 inlet area 137 space 138, 45 partition 14 First receiving portion 140 second receiving portion 142 16 200815677

轴座 1430 突肋 144 頂蓋 15 凸出部 150 導熱膠片 151 插銷 152 底座 16 螺絲 162 過濾器 17 中心孔 1702 小孔 1704 门形框 174 > 175 儲氣室 18 葉輪組 20 葉輪 21 輪轂 210 葉片 211 中心孔 212 永久磁鐵 22 轉軸 23 轴承 25 磁環 26、27、28、29 驅動單元 30 定子 32 線圈 320 電路板 33 電子元件 330 吸熱體 40 安裝板 41 片體 42 槽孔 420 換熱部 421 凹口 422 隔片 423 凹槽 424 通道 44 17Shaft seat 1430 rib 144 Top cover 15 Projection 150 Thermal film 151 Pin 152 Base 16 Screw 162 Filter 17 Center hole 1702 Hole 1704 Door frame 174 > 175 Gas storage chamber 18 Impeller group 20 Impeller 21 Hub 210 Blade 211 Center hole 212 Permanent magnet 22 Shaft 23 Bearing 25 Magnetic ring 26, 27, 28, 29 Drive unit 30 Stator 32 Coil 320 Circuit board 33 Electronic component 330 Heat sink 40 Mounting plate 41 Sheet 42 Slot 420 Heat exchange 421 Concave Port 422 septum 423 groove 424 channel 44 17

Claims (1)

200815677 申請專利範圍: 一種幫浦,應用於液冷散熱系統,其包括一殼體,該 殼體包括一具有進水口及出水口的本體、一安裝於本 體頂端的頂蓋及一安裝於本體底端的底座,該殼體具 有一收容空間及與該收容空間相隔離的密閉腔室;一 葉輪組收容於該殼體的收容空間内;一驅動該葉輪組 的驅動單元收容於該殼體的密閉腔室内,該驅動單元 包括一馬達及一與馬達電性連接的電路板,複數發熱 兒子元件置於該電路板上;其改良在於:該頂蓋罩設 於驅動單元頂部且與驅動單元的電路板的電子元件接 觸以散發電子元件産生的熱量。 2 4 5 ^申請專利範圍第i項所述之幫浦,其中該頂蓋具有 ,上突起的凸出部,該凸出部用以容置且接觸該驅 動單元電路板上的電子元件。 =請專利範圍第2項所述之幫浦中該凸出部上 一。、子元件接觸的底面貼置有導熱膠片。 其中該頂蓋由鋁 專利範圍第1項所述之幫浦I中該頂蓋由金 如申請專利範圍第4項所述 tv> 肩爾 成° 其中該收容空間 圍繞該第 如申請專利範11第!項所述 包;ίί A 6 — 育浦’共T該 G括一收容葉輪組的第一腔 一腔室。 股至,該密閉容腔 18 6 200815677 7、 如申請專利範圍第6項所述之幫浦,其中一吸熱體收 h谷於該收容空間内且置於該殼體的底座上,該吸熱體 、設有複數與第一腔室連通的通道。 8、 如申請專利範圍第7項所述之幫浦,其中該吸熱體由 複數片體構成,每一片體由銅製成且呈環形設置,該 等片體相互平行疊置。 9、 如申請專利範圍第7項所述之幫浦,其中一安裝板置 於該吸熱體上,該安裝板設有一與該吸熱體的通道連 通的中心孔。 10如申请專利範圍第9項所述之幫浦,其中一罩體置於 該葉輪組底部與安裝板之間。 U、如申請專利範圍第10項所述之幫浦,其中一過濾器收 容於該罩體内,該過濾器與該進水口連通,該過濾器 上形成有複數供液體中混入的氣體逃出的小孔。 12、 如申請專利範圍第11項所述之幫浦,其中該罩體包括 頂壁及自頂壁邊緣向下延伸設置的側壁,該頂壁上 設有複數與第一腔室連通的通孔,該頂壁向下沿伸形 成有一抵頂於該安裝板上的中空的支撐柱,該支撐柱 圍繞該安裝板的中心孔,該支撐柱内壁圍成一第一腔 至及吸熱體的通道連通的容腔。 13、 如申請專利範圍第7項所述之幫浦,其中該過濾器套 置於該罩體的支撐柱外壁上。 4如申凊專利範圍第13項所述之幫浦,其中該收容空間 19 200815677 進一步包括一第二腔室,該第二腔室圍繞該罩體的支 …撐柱且位於罩體的頂壁與安裝板之間;及一第三腔 :室,該第三腔室由罩體支撐柱的容腔及位於該容腔下 方且夾置於安裝板及底座之間的空間構成,其中第一 及第三腔室相互連通構成一工作通道。 15、 如申請專利範圍第14項所述之幫浦,其中一分隔體置 於該殼體内以隔開驅動單元及液體,該罩體的頂壁安 裝於罩體的底冑,該分隔體内壁與罩體頂壁共同圍成 該第一腔室。 16、 如中請專利範圍第15項所述之幫浦,其中耗輪組包 括轉軸、—套置轉轴上的軸承及一具中心孔的葉 輪’該轉轴頂部安裝於轴座上,該轉轴及軸承收容於 葉輪的中心孔中,該葉輪内嵌設有一永久磁鐵。200815677 Patent application scope: A pump applied to a liquid cooling heat dissipation system, comprising a casing, the casing comprising a body having a water inlet and a water outlet, a top cover mounted on the top end of the body, and a bottom mounted on the body a housing of the end, the housing has a receiving space and a sealed chamber separated from the receiving space; an impeller group is received in the receiving space of the housing; and a driving unit driving the impeller group is sealed in the housing Inside the chamber, the driving unit includes a motor and a circuit board electrically connected to the motor, and the plurality of heat generating son elements are disposed on the circuit board; and the improvement is that the top cover is disposed on the top of the driving unit and the circuit of the driving unit The electronic components of the board are in contact to dissipate the heat generated by the electronic components. 2 4 5 ^ The pump of claim i, wherein the top cover has an upper protruding portion for receiving and contacting the electronic components on the driving unit circuit board. = Please refer to the above-mentioned bulge in the pump mentioned in item 2 of the patent scope. The bottom surface of the sub-component contact is provided with a thermal conductive film. Wherein the top cover is covered by the aluminum I described in the first aspect of the aluminum patent range, and the top cover is made of gold as claimed in claim 4 of the scope of claim 4, wherein the receiving space surrounds the patent application model 11 The first! The package described in the item; ίί A 6 - Yupu's total T. The G includes a first chamber and a chamber for housing the impeller group. According to the pump of the sixth aspect of the invention, a heat absorbing body is disposed in the accommodating space and placed on the base of the casing, the heat absorbing body. And a plurality of channels connected to the first chamber. 8. The pump of claim 7, wherein the heat absorbing body is composed of a plurality of sheets, each of which is made of copper and arranged in a ring shape, the sheets being stacked in parallel with each other. 9. The pump of claim 7, wherein a mounting plate is disposed on the heat absorbing body, the mounting plate being provided with a central hole communicating with the passage of the heat absorbing body. 10. The pump of claim 9, wherein a cover is disposed between the bottom of the impeller set and the mounting plate. U. The pump according to claim 10, wherein a filter is received in the cover body, and the filter is connected to the water inlet, and the filter is formed with a plurality of gases for mixing in the liquid to escape. Small hole. 12. The pump of claim 11, wherein the cover comprises a top wall and a side wall extending downward from an edge of the top wall, the top wall being provided with a plurality of through holes communicating with the first chamber The top wall of the top wall is formed with a hollow support column abutting against the mounting plate. The support column surrounds a central hole of the mounting plate, and the inner wall of the support column encloses a first cavity to the passage of the heat absorbing body. Connected cavity. 13. The pump of claim 7, wherein the filter is placed on an outer wall of the support column of the cover. 4. The pump of claim 13, wherein the accommodating space 19 200815677 further comprises a second chamber surrounding the struts of the hood and located at a top wall of the hood And a third cavity: a chamber, wherein the third chamber is formed by a cavity of the cover support column and a space located under the cavity and sandwiched between the mounting plate and the base, wherein the first And the third chambers are connected to each other to form a working channel. 15. The pump of claim 14, wherein a partition is disposed in the housing to separate the drive unit and the liquid, and the top wall of the cover is mounted to the bottom of the cover, the spacer The inner wall and the top wall of the cover together define the first chamber. 16. The pump of claim 15, wherein the consuming wheel set comprises a rotating shaft, a bearing on the set rotating shaft, and an impeller having a central hole, wherein the top of the rotating shaft is mounted on the shaft seat, The rotating shaft and the bearing are housed in a central hole of the impeller, and a permanent magnet is embedded in the impeller. 2020
TW95135216A 2006-09-22 2006-09-22 Pump TWI308941B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95135216A TWI308941B (en) 2006-09-22 2006-09-22 Pump

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95135216A TWI308941B (en) 2006-09-22 2006-09-22 Pump

Publications (2)

Publication Number Publication Date
TW200815677A true TW200815677A (en) 2008-04-01
TWI308941B TWI308941B (en) 2009-04-21

Family

ID=44768859

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95135216A TWI308941B (en) 2006-09-22 2006-09-22 Pump

Country Status (1)

Country Link
TW (1) TWI308941B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI600261B (en) * 2016-05-06 2017-09-21 Sengton Transportation Implements Co Ltd Flexible high-power control device and motor assembly with the device
CN107394946A (en) * 2016-05-16 2017-11-24 厦门信源环保科技有限公司 Bendable high power control device and the motor sub-assembly for having the device
CN112302953A (en) * 2019-07-25 2021-02-02 台达电子工业股份有限公司 Pump mechanism, pump system, and method of manufacturing pump mechanism
US11964811B2 (en) 2022-06-21 2024-04-23 Delta Electronics, Inc. Liquid storage tank

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112502993A (en) * 2020-11-27 2021-03-16 瑞声新能源发展(常州)有限公司科教城分公司 Miniature water pump and electronic equipment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI600261B (en) * 2016-05-06 2017-09-21 Sengton Transportation Implements Co Ltd Flexible high-power control device and motor assembly with the device
CN107394946A (en) * 2016-05-16 2017-11-24 厦门信源环保科技有限公司 Bendable high power control device and the motor sub-assembly for having the device
CN107394946B (en) * 2016-05-16 2019-10-18 厦门信源环保科技有限公司 Bendable high power control device and the motor sub-assembly for having the device
CN112302953A (en) * 2019-07-25 2021-02-02 台达电子工业股份有限公司 Pump mechanism, pump system, and method of manufacturing pump mechanism
US11964811B2 (en) 2022-06-21 2024-04-23 Delta Electronics, Inc. Liquid storage tank

Also Published As

Publication number Publication date
TWI308941B (en) 2009-04-21

Similar Documents

Publication Publication Date Title
US7729118B2 (en) Miniature liquid cooling device having an integral pump
US7753662B2 (en) Miniature liquid cooling device having an integral pump therein
JP4234635B2 (en) Electronics
US20070110592A1 (en) Integrated liquid cooling system
KR100634862B1 (en) Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit
TWI293860B (en)
US10715010B2 (en) Motor controller can with synthetic housing and metal heat sink
JP2015132220A (en) blower fan
US9689627B2 (en) Water-cooling device with waterproof stator and rotor pumping unit
JP6575056B2 (en) Blower fan
US20070107880A1 (en) Heat sink structure
US20140145528A1 (en) Axial flux electrical machines
JP2005315156A (en) Pump and electronic equipment having pump
US20070110559A1 (en) Integrated liquid cooling system
US6945314B2 (en) Minimal fluid forced convective heat sink for high power computers
US11444513B2 (en) Motor controller can with synthetic housing and metal heat sink
TW202203736A (en) Immersion cooling device and electronic device including the same
TW200815677A (en) Pump
WO2000074213A1 (en) Heat sink-equipped fan motor and small flat motor
CN100533341C (en) Pump
CN100533342C (en) Pump
JP2005191452A (en) Radiator, cooling device, and electronic equipment having the same
TW200809093A (en) Pump
TWI304456B (en) Pump
US11085709B2 (en) Heat exchange device for closed electrical apparatus

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees