200815623 九、發明說明： 【發明所屬之技術領域】 本發明係有關於對陶瓷表面金屬化的技術。 * 【先前技術】 習知關於_絲面金屬化雜術，如巾執國糊公報公告編號第 1哪2號。職技術髓仙—金屬層形成_:絲面，該金屬層包含一 種選自鶊及/或_金屬或金屬合金，並以化學氣相沉積法沉積於該陶紐 ，表面。該沉積法大致上係將燒結喊體置入一化學氣相沉積容器，對此容 器抽氣’於適當壓力（介於〇· 01torr與大氣壓力之間）下將選㈣化鶴及/ 或i化域體之第-種氣體或氣體混合物注人該容器中，幾乎是同一時 間，將由至少-種氫化石夕氣體構成的氣體或氣體混合物亦注入此容器中， 在上述齒化物與上述氫化物氡體之間產生反應，沉積一層鶴/及或銷層於該 燒_ Μ上。·㈣賤自氧化紐氧倾祕佳。金屬層之厚度介 於0.5〜600微米之間。 • 又如中華民國專利公報公告編號第刪32號。該案技術特徵大致上係 為一種以錮及/或鎢為基礎的金屬膏於氧化銘的陶瓷基體上，然後對上述金 屬用於具有-預定之氧化還原勢的氣氛中在攝氏聽至麵度的溫度中施 行燒結，再冷卻至室溫，射所述之處理氣氛包括氫與水蒸氣，可選擇性 地含有諸如氬_性氣體。在整個生麵環程序巾，調整氫含量對水含量 的比值，以確保水蒸氣含量在一預定值。 上述兩項習知製程是相當複雜費時的，而且加工過程中環境條件環環 相扣，控制不易，嚴重影響該習知技術之應祕，且金屬層不容易附著於 200815623 該陶瓷體表面。 【發明内容】 本案係在提出一種陶瓷表面金屬化的技術，利用活性低熔點合金使陶 瓷表面金屬化’製程能在大氣環境中且以低於攝氏250度的溫度中進行，不 需昂貴設備。 本案陶瓷與金屬之接合體，包括··一陶瓷基板；一形成於該陶瓷基板 至少其中一表面之金屬層，該金屬層為活性低熔點合金。該活性低熔點合 · ： ..... · . . · . 金係由低熔點金屬或合金基材以及活性元素所合成。 本案陶兗表面金屬化的方法，包括··備一陶兗基—板;備融溶的活性合 金，該活性合金係由合金基材以及活性元素所合成；將該融熔之活性合金 以預定厚度均勻地以塗佈:η具塗佈於該陶錄板至少—職絲面上；將 該陶竟基板與職性合金之接合體進行冷卻，使該活性合金以—預期接著 力附著於該陶瓷基板的預定表面。200815623 IX. Description of the Invention: [Technical Field to Which the Invention Is Ascribed] The present invention relates to a technique for metallizing a ceramic surface. * [Prior Art] It is customary to know about _ silk metallization, such as the towel. Technically, the metal layer is formed - a silk surface, and the metal layer comprises a metal or a metal alloy selected from the group consisting of ruthenium and/or _, and deposited on the surface by chemical vapor deposition. The deposition method generally places the sintered body into a chemical vapor deposition container, and the container is pumped 'at a suitable pressure (between 〇·01torr and atmospheric pressure) to select (four) the crane and/or i The first gas or gas mixture of the domain body is injected into the container, and at about the same time, a gas or a gas mixture composed of at least one type of hydrogen hydride gas is injected into the container, and the hydride and the hydride are A reaction occurs between the corpus callosum, and a layer of crane/and or pin layer is deposited on the sputum. · (4) 贱 贱 氧化 纽 。 。 。 。 。. The thickness of the metal layer is between 0.5 and 600 microns. • Another example is the number of the Republic of China Patent Gazette Announcement No. 32. The technical feature of the case is generally a metal paste based on yttrium and/or tungsten on the oxidized ceramic substrate, and then the above metal is used in an atmosphere having a predetermined redox potential in Celsius. Sintering is carried out at a temperature and then cooled to room temperature, and the treatment atmosphere including hydrogen and water vapor may optionally contain, for example, an argon gas. The ratio of hydrogen content to water content is adjusted throughout the dough ring to ensure that the water vapor content is at a predetermined value. The above two conventional processes are quite complicated and time-consuming, and the environmental conditions in the process are closely linked, and the control is not easy, which seriously affects the secret of the prior art, and the metal layer is not easily attached to the surface of the ceramic body of 200815623. SUMMARY OF THE INVENTION The present invention proposes a technique for metallizing a ceramic surface by using an active low-melting alloy to metallize the surface of the ceramic. The process can be carried out in an atmospheric environment at a temperature lower than 250 degrees Celsius without expensive equipment. The ceramic body and metal joint body of the present invention comprises: a ceramic substrate; a metal layer formed on at least one surface of the ceramic substrate, the metal layer being an active low melting point alloy. The active low melting point is: . . . . . . . . . . The gold is synthesized from a low melting point metal or alloy substrate and an active element. The method for surface metallization of the ceramics in the present case comprises: preparing a ceramic base plate; preparing a molten active alloy, the active alloy is synthesized from an alloy substrate and an active element; and the molten active alloy is predetermined The thickness is uniformly coated: η is coated on the at least the surface of the ceramic board; the joint of the ceramic substrate and the alloy of interest is cooled, and the active alloy is adhered to the a predetermined surface of the ceramic substrate.
與先岫技Φΐϊ相孝父’本案可達成之目的及功效在於利用活性低熔點合金 使陶絲Φ金屬彳b，製雜在域魏巾且峨於攝氏25()度的溫度中進 行，降低製程複雜度，魏條件容易控制，易擴展其應用領域，例如可用 於陶竟接合、喊導電、陶:£導麵喊電龄領域。且糊本案製程使 金屬層容易結合於陶瓷體表面。 【實施方式】 如第一圖，本案一種陶瓷與金屬之接合體，包括 一陶瓷基板（10); 200815623 一形成於該陶瓷基板(10)至少其中一表面之金屬層（20)，該金屬層（20) 之厚度約5至500um，該金屬層為活性低熔點合金，該活性低融點合金係由 合金基材以及活性元素所合成。該合金基材包括至少一選自錫、銦、銦錫、 錫鉍、鉛錫為主要成份，該活性元素添加於該合金基材中，包括占總量 0.5Wt%至l〇Wt%的鈦及O.OlWt%至lWt%的微量稀土元素。此種合金因具有鈦 及稀土等之活性元素，所以可在大氣下、低的溫度與陶瓷表面產生潤溼反 應。若以接合其他物件為目的<金屬層，則可在上述合金中再加入至少一 選自銀、鋼、鋅、銻的元素以增進合金之強度。其添加比例為占合金總量 OWt%至5Wt%的銀、OWt%至3Wt%的銅、OWt%至 15Wt%的辞、〇Wt%至 10Wt%的錄。 如第二圖本案陶瓷表面金屬化的方法，包括： 備一陶兗基板； * . . . . 備融熔的活性合金，該活性合金係由合金基材以及活性元素所合成。 . .. . - ... .. . ..The purpose and effect of this case can be achieved by using the active low-melting alloy to make the ceramic wire Φ metal 彳b, making it in the domain Wei towel and licking at a temperature of 25 degrees Celsius, reducing Process complexity, Wei conditions are easy to control, easy to expand its application areas, for example, can be used for ceramics to join, shouting conductive, Tao: £ guide surface called the age of electricity. Moreover, the paste process allows the metal layer to be easily bonded to the surface of the ceramic body. [Embodiment] As shown in the first figure, a ceramic-metal bonded body includes a ceramic substrate (10); 200815623 a metal layer (20) formed on at least one surface of the ceramic substrate (10), the metal layer (20) The thickness is about 5 to 500 um, and the metal layer is an active low melting point alloy synthesized from an alloy substrate and an active element. The alloy substrate comprises at least one selected from the group consisting of tin, indium, indium tin, tin antimony and lead tin, and the active element is added to the alloy substrate, including titanium in a total amount of 0.5 Wt% to 1〇Wt%. And O.OlWt% to lWt% of trace rare earth elements. Since this alloy has an active element such as titanium and rare earth, it can produce a wetting reaction with the ceramic surface under low temperature and low temperature. If the metal layer is used for the purpose of joining other articles, at least one element selected from the group consisting of silver, steel, zinc, and bismuth may be further added to the above alloy to increase the strength of the alloy. The addition ratio is in the range of OWt% to 5Wt% of silver, OWt% to 3Wt% of copper, OWt% to 15Wt%, and 〇Wt% to 10Wt%. For example, the method for metallizing the surface of the ceramic in the second embodiment includes: preparing a ceramic substrate; and preparing a molten active alloy which is synthesized from an alloy substrate and an active element. . . . . - ... .. . . .
該合金基材包括至少一選自錫、銦、銦錫、錫鉍、錯錫其中一種為主要成 份。該活性元素添加於該合金基材中，包括占總量〇 5?1：%至1〇11;%的鈦及 〇· Oiwt%至lWt%的微量稀土元素。若以接合其他物件為目的之金屬層，則可 在上述合金中再加入至少一選自銀、銅、鋅、銻的元素以增進合金之強度。 其添加比例係以占合金總量owt%至5Wt%的銀、〇Wt^3Wt%的銅、0Wt%至 15Wt%的鋅、〇Wt%至 10Wt%的銻。 將該融溶之活性合金(11)以預定厚度均勻地以塗佈卫具㈣塗佈於該 陶竟基板(1G)至少-預期的表面上’如第三圖；該塗佈加工係在大氣環境 中，以及攝氏120〜250度的溫度實施。 200815623 將陶絲板與活性合金之接合體於大氣_中之_般室溫約说下進 行冷卻0.5〜5分鐘，使該活性合金（⑴以一預期接著力附著於該喊基板 (10)的預定表面。 備上述融熔活性合金的方法，包括·· _絲_熱至騎性合麵·社，龍雜合金置於該陶曼 基板表面使其融化。或 加熱該塗佈I具，以該_上具來加熱紐性合金。 )籲 上述塗紅具包括但不限於—種魏型式，其材料包括但不限於陶 变、不鏽鋼、錄、鐵氟龍。特別是可以被加熱至該活性合金溶點以上的刮 板材料，包括但不限於電鉻鐵，亦可加上超音波震逢器等以加速塗佈的效 果H：佈J1具的形狀視欲金屬化陶竟的幾何形狀而定’包含但不限於圓 錐形、扁平形、刀刃形。 雖然本案是以一個最佳實施例做說明，但精於此技藝者能在不脫離本 、;申'、範可下做各種不同形式的改變。以上所舉實施例僅用以說明本案 ’而已’非用以限制本案之麵。舉凡不違本案餅所從事的種種修改或變 化’俱屬本案申請專利範圍。 【圖式簡單說明】 第-圖為本案陶究與金屬之接合體之剖面示意圖。 第二圖為本_絲面金屬化方法之流程圖。 第三圖為本案於陶兗表面塗佈融熔活性合金之示意圖。 【主要元件符號說明】 200815623 10- 陶曼基板 11- 活性合金 20-金屬層The alloy substrate comprises at least one selected from the group consisting of tin, indium, indium tin, tin antimony and staggered tin as a main component. The active element is added to the alloy substrate, and includes a total amount of 〇 5?1:% to 1〇11;% of titanium and 〇·Oiwt% to lWt% of a trace rare earth element. If a metal layer for the purpose of joining other articles is used, at least one element selected from the group consisting of silver, copper, zinc, and antimony may be further added to the above alloy to increase the strength of the alloy. The addition ratio is in the range of owt% to 5 wt% of the total amount of the alloy, silver, 〇Wt^3Wt% of copper, 0Wt% to 15% by weight of zinc, and 〇Wt% to 10% by weight of ruthenium. Dissolving the molten active alloy (11) uniformly on the at least the intended surface of the ceramic substrate (1G) with a predetermined thickness by a predetermined thickness [as shown in the third figure; the coating processing system is in the atmosphere The environment is implemented at a temperature of 120 to 250 degrees Celsius. 200815623 The joint of the ceramic board and the active alloy is cooled in the atmosphere at room temperature for about 0.5 to 5 minutes, so that the active alloy ((1) is attached to the shattering substrate (10) with an intended adhesion force. Predetermined surface. The method for preparing the above-mentioned molten active alloy includes: · _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The above-mentioned red-coated alloy includes, but is not limited to, a Wei type, and the materials thereof include, but are not limited to, ceramics, stainless steel, recorded, Teflon. In particular, the squeegee material which can be heated above the melting point of the active alloy, including but not limited to electric ferrochrome, may also be added with an ultrasonic oscillating device to accelerate the coating effect. H: The shape of the cloth J1 is desired. Depending on the geometry of the metallized ceramics, it includes, but is not limited to, conical, flat, and knife-edge shapes. Although the present case is illustrated by a preferred embodiment, those skilled in the art can make various changes in form without departing from the present; The above embodiments are merely illustrative of the present invention and are not intended to limit the scope of the present invention. Any modification or change that does not violate the bread of this case is the scope of patent application in this case. [Simple description of the figure] The first figure is a schematic cross-sectional view of the joint body of the ceramic and metal. The second figure is a flow chart of the method for wire surface metallization. The third figure is a schematic diagram of coating the molten active alloy on the surface of the pottery. [Main component symbol description] 200815623 10-Taoman substrate 11- Active alloy 20-metal layer