TW200814279A - Power/ground stripe of an integrated circuit and layout method - Google Patents

Abstract

A layout method of a power/ground stripe of an integrated circuit is disclosed. Standard cells of the integrated circuit are horizontally arranged. The power/ground stripe includes a plurality of horizontal metal lines formed on a metal layer and a plurality of vertical metal lines formed on another second metal layer. The horizontal metal lines include a horizontal power metal line and a horizontal ground metal line. The vertical metal lines include a vertical power metal line and a vertical ground metal line. The vertical power metal line is coupled to the horizontal power metal line and only covered with a power line of the standard cell. The vertical ground metal line is coupled to the horizontal ground metal line and covered with a ground line of the standard cell.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit, and more particularly to a power ground network of an integrated circuit and a method of arranging the same. [Previous technology #?]

The integrated circuit technology has developed rapidly, the scale of the circuit is getting larger and larger, and the speed is getting faster and faster. At the same time, the number of circuit units in the circuit is increasing. Integrated circuits require a reliable power supply to ensure good operation. The expansion of the circuit scale requires the use of more and more circuit units. In order to effectively control the area of the wafer, the circuit elements are mostly implemented in a stacked structure, so how to supply power to these circuit units is an important problem. Generally, there are two different power supply methods depending on the package method. One is called top-on power supply, which is often used for Flip Chip package, and the other is called Bonding. Compared with the two, the top of the Qiuqiu electric method is better. The electrical components in the integrated circuit itself are of a laminated structure, and the above-mentioned ones are mentioned above. In order to effectively control the area of the wafer, the circuit unit is also p _ laminated structure, so that such a structure brings a power supply to solve the problem. Difficulty in the provision of a Flip Chip package. For electrical problems, Power/Ground Stripe is used to supply power to each TV. That is, the power line and the ground and the line of the circuit unit of various functions are connected to the power line and the ground line of the power ground network, and the power source is connected to the external power source to supply power.

Client's Docket N〇.:S3U05-0050-TW TT's Docket No:0608-A40992-TW/Final /Joanne 5 200814279 For convenience of explanation, in the following description, the circuit unit regardless of what function is implemented will be simplified to have power The circuit elements of the line and ground are called "standard cells". At the same time, all standard cells have the same height, and the width of the circuit cells can be designed differently. Here, the height of this unified standard unit is referred to as "standard height". In the current large-scale integrated circuit design, the size of the circuit is getting larger and faster, and the speed of the circuit is increasing. Although the multi-layer metal wiring is used, the interconnection resources (that is, the power supply network resources) are relatively short. In order to get more of the interconnect resources, the wafer area has to be expanded. However, it will bring problems such as cost, timing, and IR-drop. At present, the power grid design of a large integrated circuit does not consider the size of the standard unit and its power supply and grounding wire, as shown in Figure 1A. Figure 1A shows a layout of the power ground network in which the "standard unit" is omitted, using only its power line Vdd and ground line Vss. It should be noted here that the Vdd and Vss shown in Figure 1A are spaced, and the interval between Vdd and Vss is the "standard height", just placing a "standard_unit", and the two adjacent "standard cells" are Reversed, both share the same Vdd or Vss. Of course, other arrangements are also possible for those skilled in the art. Similarly, only the appropriate modification is needed when applying the technical solution of the present invention, and the comparison described in conjunction with FIG. 1A is described in the following description. The common way is to proceed. In general, the row direction of a standard cell is referred to as a horizontal direction (it is to be noted that "vertical" and horizontal directions refer to the direction of the wiring parallel to the surface of the wafer surface" of the standard cell's row direction. It is called the horizontal direction, and the direction perpendicular to it is called

Client's Docket N〇.:S3U05-0050-TW TT^s Docket No:0608-A40992-TW/Final /Joanne 6 200814279 for vertical direction), general power ground network design uses high-rise metal wires in the horizontal direction, vertical direction For the lower metal wire, refer to FIG. 1A. In the prior art, the width of the metal wire is not calculated, so it is usually wider than the standard height of 2 times, so that it is involved in the width coverage of one metal wire. To the power supply line Vdd and the ground line Vss of the standard unit, therefore, it is necessary to use a metal layer higher than the power supply line vdd of the standard unit or the ground line Vss as the vertical metal lines ιοιρ and i〇1G, the metal of the high n+l layer The layers serve as horizontal metal lines 102P and 102G (the view angle in Fig. 1A is from bottom to top, so Vdd and Vss are first seen, while vertical metal lines 101P and 101G and horizontal metal lines i〇2P and l〇) The 2G part will be blocked. The reason for this is to ensure that all standard unit power lines Vdd or ground line Vss can be connected to the vertical metal line. According to Figure 1A, Vdd and Vss pass through. Via llO is connected to 101G and 101P. Since the power supply line Vdd and the ground line Vss of the standard unit are horizontally arranged, they will be connected to the vertical metal wire, and in order not to cause a short circuit of the power supply, the vertical metal wire must be a low-level metal 'horizontal metal wire. It is a high-rise metal. If the upper metal wire is vertical, the lower metal wire is horizontal, that is, a metal layer higher than the standard cell power supply line Vdd or the ground line Vss is used as the horizontal metal line, and the high n+1 layer metal layer is used as the vertical metal. Line, such as the one shown in Figure 1. At this time, the power line vdd or the ground line Vss of the standard unit may have some areas blocked by the low-level power supply ground network, and cannot be connected to the vertical power ground network route, causing an ohm pressure drop or other problems. Refer to Figure 1B (again, the view in the figure)

Clienfs Docket N〇.:S3U05-0050-TW TT^s Docket No:0608-A40992-TW/Final /Joanne 7 200814279 The figure angle is also from bottom to top), higher than the standard unit's power line Vdd or ground line Vss The +1 layer metal lines 103P and 103G are vertical, and the n-layer metal lines 104P and 104G are horizontal than the power line Vdd or the ground line Vss of the standard cell, at this time, for example, at a region such as the region 105, due to the low-level metal line 104Ρ And 104G blocks the upper metal wire 103Ρ or 103G, so that the standard unit cannot connect its power line Vdd or ground line Vss to the upper metal wire 103P or 103G' respectively, causing ohmic voltage drop or other problems. For this reason, in the current design, if the chip uses a 2n-layer metal fabrication process and a Flip Chip package, the 2n-1 layer metal is set to the horizontal direction of the power ground network, and the 2n-2 layer metal and The 2n-th layer metal superposed above is used as the power ground line in the vertical direction, that is, there are two layers of power ground lines in the vertical direction to eliminate the occurrence of the overlap condition as shown in FIG. 1B. However, this will take up too much wiring resources. Through the above analysis, it is known that the current use of wiring resources is unreasonable. One of the main reasons for the high cost is that the design of the power ground network is not reasonable. The layout of the metal wires is not well considered, resulting in unreasonable resources. Therefore, a more reasonable layout of the power ground network is needed to adapt to the needs of the chip design. SUMMARY OF THE INVENTION It is an object of the present invention to provide a new power ground network arrangement that accommodates the needs of more and more circuit units by more rationally arranging power ground networks. According to an object of the present invention, there is provided a power supply ground circuit of an integrated circuit, wherein a standard unit array of integrated circuits is arranged in a horizontal direction,

Client's Docket N〇.:S3U05-0050-TW TT's Docket No:0608-A40992-TW/Final /Joanne ζ 200814279 The power ground network consists of horizontal metal wires and vertical metal wires arranged in different metal layers. Horizontal metal wires include a horizontal power supply line and a horizontal metal line, the vertical metal line includes a vertical power supply line and a vertical metal line, wherein the horizontal and vertical lines of the power line and the ground line are respectively connected to each other; The width of the horizontal metal wire is such that the horizontal power supply metal wire only covers and is in communication with the power supply line of the standard unit, and the horizontal metal wire only covers and is in communication with the ground line of the standard unit. According to the power ground network of the present invention, the width of the horizontal metal wire is small by 2 times the standard height of the standard cell. According to an embodiment, the width of the horizontal metal line is not more than: 2x standard height - lx standard unit line width - 2 x line spacing; wherein the standard unit line width is the standard unit power line, the standard unit ground line width, standard The unit power line and the standard unit ground line have the same width; the line spacing is the separation distance between the horizontal metal line and the standard unit power line or the standard unit ground line. Wherein the width and interline spacing of the metal lines are calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard cell array. When two horizontal metal lines are adjacent, the width of the horizontal metal line is not greater than: 1.5x standard height - 0.5X metal line spacing - 0 · 5 χ standard unit line width - lx line spacing; wherein, metal The spacing between lines is the separation distance between two horizontal metal lines. The width and interline spacing of the metal lines are calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard cell array. According to the power ground network of the present invention, the vertical metal wire uses a specific water

Clients Docket N〇.:S3U05-0050-TW TT^ Docket No:0608-A40992-TW/Final /Joanne 200814279 Flat metal wire is one layer higher or lower metal layer. The power ground network according to the present invention is characterized in that the density of the horizontal metal lines and the vertical metal lines in the power ground network is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, and noise. , integrated circuit design rules, repeatability of standard cell arrays. According to an embodiment, the respective communication of the power line and the ground line in the horizontal metal line and the vertical metal line, and the respective communication of the vertical metal line and the power line and the ground line of the standard unit are achieved through the through holes. The present invention further provides a method for arranging a power ground network of an integrated circuit, wherein the standard cell array of the integrated circuit is arranged in a horizontal direction, the method comprising: arranging horizontal metal lines and vertical metal lines in different metal layers Wherein the horizontal metal line comprises a horizontal power supply metal line and a horizontal metal line, the vertical metal line comprises a vertical power supply metal line and a vertical ground metal line; respectively connecting the power supply line and the ground line in the horizontal metal line and the vertical metal line; a power line connecting the vertical power supply metal line and the standard unit, a vertical ground metal line, and a ground line of the standard unit; wherein the step of arranging the horizontal metal line and the vertical metal line includes setting the power ground network The width of the horizontal metal lines of the road is such that the horizontal power supply metal lines only cover the power supply lines of the standard unit array, and the horizontal metal lines only cover the ground lines of the standard unit array. According to the method of the present invention, the width of the horizontal metal wire is set to be not more than twice the standard height of the standard cell. According to an embodiment, the width of the horizontal metal line is set to be no greater than: 2x standard height - lx standard cell line width - 2 x line spacing; wherein the standard cell line width is a standard cell power line,

Client's Docket N〇.:S3U05-0050-TW TT^ Docket No:0608-A40992-TW/Final /Joanne 10 200814279 Standard unit ground wire width 'Standard unit power line and step unit ground line have the same width; line room The interval is the separation distance between the horizontal metal line and the standard unit power line or the standard unit ground line. Wherein, the method further comprises calculating the inter-line spacing based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard cell array. When two horizontal metal lines are adjacent to each other, the width of the horizontal metal line is set to be not greater than: 1. 5 χ standard height _ 〇 · 5 χ metal line spacing - 〇 · 5 χ standard unit line width - lx line spacing; Wherein, the spacing between the metal wires is the separation distance between the two water and 10 flat metal wires. The method also includes calculating the spacing of the metal lines based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, repeatability of the standard cell array. In accordance with the method of the present invention, a vertical gold polyline is disposed in a metal layer that is higher or lower than a layer of a metal layer used for the horizontal metal line. The method according to the present invention further comprises: calculating a density of horizontal metal lines and vertical metal lines in the power ground network based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, standards The repeatability of the unit 伫w column. According to the method of the present invention, the method further includes: erecting a through hole to respectively connect the power line and the ground line of the horizontal metal line and the vertical metal line, and respectively connecting the vertical metal line and the power line and the ground line of the standard unit . According to a third aspect of the present invention, there is provided an integrated circuit structure comprising a standard cell array and a power ground network, wherein the standard cell arrays are arranged in a horizontal direction, and the power ground network comprises horizontal metals arranged in different metal layers Line and vertical metal lines, horizontal metal lines including horizontal power lines and water

Client's Docket No.:S3U05-0050-TW TT^ Docket No:0608-A40992-TW/Final /Joanne 200814279 Flat metal wire, vertical metal wire including vertical power metal wire and vertical metal wire, horizontal metal wire and vertical The power line and the ground line in the metal line are respectively connected to each other; the width of the horizontal metal line of the power ground network is such that the horizontal power supply metal line only covers the power line of the standard unit array, and the horizontal metal line only covers the The ground line of the standard unit column. According to the invention, the width of the horizontal metal wire is not more than twice the standard height of the standard unit. According to an embodiment, the width of the horizontal metal line is not more than: 2x standard height - lx standard unit line width - 2 x line spacing; • wherein the standard unit line width is the width of the standard unit power line, the standard unit ground line, The standard unit power line and the standard unit ground line have the same width; the line spacing is the separation distance between the horizontal metal line and the standard unit power line or the standard unit ground line. Wherein the line spacing is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of a standard early element sequence. When two horizontal metal lines are adjacent, the width of the horizontal metal line is less than: 1. 5 χ standard height - 0.5 x metal line spacing _0 · 5 χ standard unit line о width - lx line spacing; The spacing between the wires is the separation distance between the two horizontal wires. Wherein, the inter-wire spacing is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of standard cell trains. According to the present invention, the vertical metal wire can be arbitrarily used with a metal layer one layer higher or lower than the horizontal metal wire. According to the present invention, the density of the horizontal metal lines and the vertical metal lines in the power ground network is calculated based on at least one of the following factors: ohmic voltage

Client's Docket No"S3U05-0050-TW TT^ Docket No:0608-A40992-TW/Final /Joanne 12 200814279 Regression, power consumption, noise, integrated circuit design rules, repeatability of standard cell arrays. According to the present description, the power lines of the horizontal metal lines and the vertical metal lines and the ground, the springs are connected to each other, and the vertical lines and the power lines and the ground lines of the standard unit are respectively communicated through the through holes. achieve. By adopting the technical scheme of the invention, under the condition of ohmic voltage drop, power consumption and noise, the power ground network is rearranged, and the width of the metal line is determined according to the design rule of the integrated circuit and the repeatability of the unit array, and the width is reduced. Performance defects and waste of routing resources due to improper overlap and line width to accommodate the success of 5 and 50 wafers. The above and other objects, features, and advantages of the present invention will become more apparent and understood. The main purpose is to provide a new arrangement of the power ground network, in which the standard unit arrays of the integrated circuits are arranged in a horizontal direction, and the power ground network includes horizontal metal lines and vertical metal lines arranged in different metal layers, horizontal The metal wire includes a horizontal power metal wire and a horizontal metal wire, and the vertical metal wire includes a vertical power metal wire and a vertical metal wire, and the power wire and the ground wire in the horizontal metal wire and the vertical metal wire are respectively connected to each other. A major improvement in the arrangement of the present invention is that the level of the horizontal metal lines of the power ground network is such that the horizontal power supply lines only cover the power lines of the standard cell array, and the horizontal metal lines only cover the ground lines of the standard cell array. With such a design, the wiring overlap existing in the conventional technology can be greatly reduced.

Client’s Docket No. :S3U05-0050-TW TT^ Docket No:0608-A40992-TW/Final /Joanne 13 200814279 Defects in the waste of line resources. In the arrangement of the invention, the width of the horizontal metal wire is less than twice the standard height of the standard unit. Wherein, for non-adjacent horizontal metal lines, the width should conform to no more than: 2x standard height - lx standard unit line width - 2 x line spacing, where the standard unit line width is the width of the standard unit power line, standard unit ground line The standard unit power line and the standard unit ground line have the same width; the line spacing is the separation distance between the horizontal metal line and the standard unit power line or the standard single meter ground. For two horizontal metal lines adjacent, the width of the horizontal metal line should meet no more than: 1.5x standard height - 0.5x metal line spacing - 0.5x standard unit line width - lx line spacing, where the metal line The line spacing is the separation distance between two horizontal metal lines. The above-mentioned inter-line spacing and inter-wire spacing are calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of standard cell arrays. . Power Ground Network of Integrated Circuit First, according to the purpose of the present invention, a power ground network of an integrated circuit is provided, wherein standard cell arrays of integrated circuits are arranged in a horizontal direction, and power ground networks are arranged in different metals. Horizontal metal lines and vertical metal lines in the layer, horizontal metal lines including horizontal power supply lines and horizontal metal

Clients Docket N〇.:S3U05-0050-TW TT^s Docket No:0608-A40992-TW/Final /Joanne 200814279 Line, vertical metal wire including vertical power metal wire and vertical metal wire, horizontal metal wire and vertical metal wire The power line and the ground line are respectively connected to each other; the width of the horizontal metal line of the power ground network is such that the horizontal power supply metal line only covers the power line of the standard unit array, and the horizontal metal line only covers the standard unit array Ground wire. For metal wires in a power ground network, the wider the wire width, the better the power supply capability. Therefore, it is preferable to select the width of the metal wire as wide as possible, if other conditions permit. However, in the conventional technology, as shown in FIG. 1A or FIG. 1B, since the calculation is not performed, the width of the metal wire is relatively random, and when the width of the metal wire is wide enough to cover the power line Vdd and the ground of the standard cell at the same time. When Vss (more than 2 times the standard height), it will affect the connection of some Vdd or Vss, so that there must be other power lines (ground) for these Vdd or Vss connections, which will take up more The routing resources, so that the utilization of the entire routing resources is reduced. Therefore, the present invention proposes that the horizontal power supply metal line in the horizontal metal line only covers the power supply line of the standard unit, and the horizontal metal line only covers the ground line of the standard unit, which is not heavy, so that the conventional technology can be avoided. The problem that the metal wire is too wide to affect the connection of the power line or ground of the standard unit. At this time, the structure and basic arrangement of the standard cell are studied. Referring to FIG. 2, the distance between each standard cell ground line Vss and the standard cell power line Vdd in the figure is the height of a standard cell, that is, the standard height. Hs (Note that if considering the width of Vss and Vdd, the standard height hs is the distance from the center line of Vdd to the center line of Vss). Any horizontal metal wire (horizontal power metal wire or horizontal metal wire) can achieve

Client’s Docket N〇.:S3U05-0050-TW TT5s Docket No:0608-A40992-TW/Final /Joanne 15 200814279 The maximum width for the overlap is 2hs, which is 2 times the standard height. In practical applications, the width of Vss and Vdd itself needs to be considered. In this case, for a metal wire without other adjacent metal wires on both sides, its width should be no more than: 2hs-Ws-2Sp, ie , 2x standard height - lx standard cell line width - 2x line spacing; wherein, the standard cell line width Ws is the width of the standard cell power line Vdd and the standard cell ground Vdd line, wherein the standard cell power line Vdd and the standard 10 cell The width of the line Vss is the same; the spacing between the lines Sp is the spacing between the horizontal metal line and the standard unit power line or the standard unit ground line. The spacing between the lines is reserved to meet the design requirements of the integrated circuit 'including ohmic voltage drop, Power consumption, noise, integrated circuit design rules, repeatability of standard cell arrays. Therefore, the line spacing Sp is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard cell array. ® Figure 2 shows a block diagram of an embodiment with no other adjacent wires on each side (again, the view angle in Figure 2 is also from bottom to top), where either the horizontal power supply line 202P or the horizontal metal There are no other adjacent metal lines on either side of the line 202G, so their width can be up to 2hs-Ws-2Sp. Of course, depending on factors such as ohmic voltage drop, power consumption, noise, integrated circuit design rules, repeatability of the standard cell array, and the like, the specific arrangement may be a metal wire having a smaller width than the above. There is also a case where the horizontal metal wires are arranged adjacent to each other.

Client's Docket No.: S3U05-0050-TW TT^ Docket No: 0608-A40992-TW/Final /Joame 16 200814279 For example, in the embodiment shown in Figure 3, Figure 3 shows several horizontal metal lines, which are combined with Vdd and Vss - Similarly, the horizontal power supply metal wire and the horizontal metal wire are arranged at intervals. In this case, it is obvious that if the horizontal metal wire and the horizontal power supply metal wire have a similar width, their maximum width should be As follows: When there are two horizontal metal lines adjacent, the width of the horizontal metal line is not greater than: hs-Smp, that is, 1·5χ standard height-0.5x metal line spacing -0.5x standard _ quasi-unit line width- Lx line spacing; where the spacing between metal lines is the separation distance between two horizontal metal lines. Similarly, the spacing between the metal lines is reserved to meet the design requirements of the integrated circuit, including ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard cell array, so the spacing between the metal lines is the same. It is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of standard cell arrays. The maximum width described above is suitable for applications requiring horizontal power lines and horizontal metal lines, which is an advantageous choice for obtaining integrated circuit performance according to an embodiment, if horizontal power lines and horizontal metal lines are not The width is equal. When the width of one of the lines is reduced, the width of the other line can be increased, but the width is not more than 2hs-Ws-2Sp. Figure 3 shows a block diagram of an embodiment with adjacent metal lines on both sides (again, the view angle in Figure 3 is also from bottom to top), and each of the horizontal metal lines, including the horizontal power supply line 302P and level Ground wire

Client’s Docket N〇.:S3U05-0050-TW TT^s Docket No:0608-A40992-TW/Final /Joanne 17 200814279 302G are all equal width, and their width can be up to 2hs-Ws-2Sp. Of course, according to factors such as ohmic voltage drop, power consumption, noise, integrated circuit design rules, repeatability of standard cell arrays, and the like, a specific arrangement may be a metal wire having a smaller width than the above. The arrangement of the horizontal metal lines in the power ground network of the present invention has been discussed above. After the horizontal metal lines are disposed, the present invention can arbitrarily use a metal layer one layer higher or lower than the horizontal metal lines in arranging the vertical metal lines. As described above, the power supply line and the 10 ground line in the horizontal metal line and the vertical metal line are respectively connected, and the power supply line and the ground line of the vertical metal line and the standard unit are also respectively connected. According to the embodiment of the present invention, these connections are transmitted through The through hole is continuous, for example, referring to FIG. 4 (again, the view angle in FIG. 4 is also on the top). FIG. 4 is a standard unit power ground and power ground network according to an embodiment of the present invention. Schematic diagram of the connected structure, it can be seen that the present invention uses the through holes between the different metal layers to make the above-mentioned metal lines communicate with each other 'including the through holes 4 〇 2 connecting the vertical metal lines and the standard unit lines, and connecting the horizontal metal lines And the through hole 4〇6 of the vertical metal wire. • The density of horizontal and vertical metal lines (ie, the grid density of the power ground network) in the power ground network of the present invention is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise , the integrated circuit design rules, the standard early Yuan Weining column repeatability. The structure of the integrated circuit is based on the above-mentioned power ground network, and the present invention also provides an integrated circuit structure 'including a standard unit string and a power ground network, where the standard sheet

Client's Docket N〇.:S3U05-0050-TW TT^ Docket No:0608-A40992-TW/Final /Joanne 18 200814279 The symbol array is arranged horizontally, and the power ground network includes horizontal metal wires arranged in different metal layers. And vertical gold layer lines, horizontal metal wire package horizontal level source metal wire and horizontal ground wire, vertical metal wire including vertical power metal wire and vertical metal wire, horizontal metal wire and vertical metal wire power cable and ground wire They are connected to each other; the visibility of the horizontal metal lines of the power ground network is such that the horizontal power supply lines only cover the power lines of the standard unit array, and the horizontal metal lines only cover the ground lines of the standard unit array. Similar to the foregoing description, the horizontal power supply line in the horizontal metal line of the network of the power source 10 in the integrated circuit structure of the present invention covers only the power supply line of the reference unit, and the horizontal metal line covers only the ground of the standard unit. The lines do not overlap each other, so that the problem of the connection of the power line or the ground line of the standard unit due to the excessive width of the metal line in the conventional art can be avoided. Referring to Figure 2, the distance between each standard cell ground wire vss and the standard cell power line Vdd in Figure 2 is the height of a standard cell, that is, the standard grace hs (requires that if Vss is considered) With the width of Vdd, the standard height hs is the distance from the center line of Vdd to the center line of Vss). The maximum width of any _ horizontal metal wire (horizontal power metal wire or horizontal metal wire) that can achieve no overlap is 2hs, which is 2 times the standard height. In practical applications, the width of Vss and Vdd itself needs to be considered. In this case, for a metal wire without other adjacent metal wires on both sides, its width should be no more than: 2hs-Ws-2Sp, ie , 2χ standard height - ΐχ standard unit line width _2 线 line spacing; where 'standard unit line width Ws is standard unit power line vdd and

Clienfs Docket N〇.:S3U05-0050-TW TT5s Docket No:0608-A40992-TW/Final /Joanne 19 200814279 * The width of the standard unit Vdd line, where the standard unit power line Vdd and the standard unit ground line Vss have the same width The line spacing Sp is the separation distance between the horizontal metal line and the standard unit power line or the standard unit ground line. Similarly, for the integrated circuit structure, the line spacing is reserved in the power ground network to meet the design requirements of the integrated circuit' including ohmic voltage drop, power consumption, noise, integrated circuit design rules, and standard cells. The repeatability of the column. Therefore, the line spacing Sp is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard cell array. Fig. 2 is a structural view showing an embodiment in which there are no other adjacent metal wires on both sides, in which either the horizontal power supply line 202P or the horizontal metal line 202G has no adjacent metal lines on both sides, so that they have the largest width. Can be up to 2hs-Ws-2Sp. Of course, according to factors such as ohmic voltage drop, power consumption, noise, integrated circuit design rules, repeatability of standard cell arrays, and the like, the specific arrangement may be a metal wire having a smaller width than the above. _ There is also a case where the horizontal metal lines are arranged adjacently in some power ground networks, as shown in the embodiment shown in Fig. 3. In Fig. 3, several horizontal metal lines are shown, and they are connected to Vdd. As with Vss, the horizontal power supply wires and the horizontal metal wires are arranged at intervals. In this case, it is obvious that if the horizontal metal wires and the horizontal power supply wires have similar widths, their maximum width is It should be as follows: When there are two horizontal metal lines adjacent, the width of the horizontal metal line is not greater than:

Client's Docket N〇.:S3U05-0050-TW TT^s Docket No:0608-A40992-TW/Final /Joanne 20 200814279 Μ hs-Smp, ie 1,5χ standard height -0.5χMetal line spacing -0.5χ Standard cell line width _lx line spacing; where the metal line spacing is the separation distance between two horizontal metal lines. Similarly, the spacing between the wires in the power ground network is to meet the design requirements of the integrated circuit, including ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard cell array. The spacing between metal lines is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of standard cell arrays. The maximum width described above is suitable for applications requiring horizontal power lines and horizontal metal lines, which are advantageous for obtaining integrated circuit performance according to an embodiment, if horizontal power lines and horizontal metal lines are not equal. Width, when reducing the width of one of the lines, the width of the other line can be increased, but the width should not exceed 2hs-Ws-2Sp. Figure 3 shows a structural view of an embodiment with adjacent metal lines on both sides, and each of the horizontal metal lines, including the horizontal power supply line 302P and the horizontal ground line 302G, are of equal width and their width The maximum can be up to 2hs-Ws-2Sp. Of course, depending on factors such as ohmic voltage drop, power consumption, noise, integrated circuit design rules, repeatability of the standard cell array, and the like, the specific arrangement may be a metal wire having a smaller width than the above. For the integrated circuit structure, after the horizontal metal lines are arranged, it is also necessary to consider the arrangement of the vertical metal lines. The present invention can arbitrarily use a metal layer one layer higher or lower than the horizontal metal lines when arranging the vertical metal lines.

Client's Docket No.:S3U05-0050-TW TT5s Docket No:0608-A40992-TW/Final /Joanne 21 200814279 Similarly, in the integrated circuit structure, the power line and the ground line in the horizontal metal line and the vertical metal line are respectively connected. And the power line and the ground line of the vertical metal line and the standard unit are also respectively connected. According to an embodiment of the present invention, the communication is realized through the through hole, as shown in FIG. 4, which is a diagram according to an embodiment of the present invention. The connection between the standard unit power ground and the power ground network is not intended. As shown, the present invention uses through holes between different metal layers to interconnect the metal wires, including connecting vertical metal lines and standard cells. A through hole 402 of the wire, and a through hole 406 connecting the horizontal metal wire and the vertical metal wire ^. The density of the horizontal metal lines and the vertical metal lines in the power ground network in the integrated circuit structure of the present invention (ie, the mesh density of the power ground network) is calculated based on at least one of the following factors: ohmic voltage drop, Power consumption, noise, integrated circuit design rules, repeatability of standard cell arrays. According to the object of the present invention, a method for arranging a power ground network and a road of an integrated circuit is provided, wherein the standard unit array of the integrated circuit is arranged in a horizontal direction, and FIG. 5 is based on A flowchart of a method of arranging a power ground network of an embodiment of the present invention. First, horizontal metal lines and vertical metal lines (S510) are arranged in different metal layers, wherein the horizontal metal lines include horizontal power supply lines and horizontal metal lines, and the vertical metal lines include vertical power supply lines and vertical metal lines 'where The step of arranging the horizontal metal line and the vertical metal line (S510) includes setting a width of the horizontal metal line of the power ground network so that the horizontal power supply is wide

Client^ Docket N〇.:S3U05-0050-TW TT^ Docket No:0608-A40992-TW/Final /Joanne 22 200814279 The line only covers the power line of the standard unit array, and the horizontal metal line only covers the standard. The ground line of the unit queue. Next, the power line and the ground line in the horizontal metal line and the vertical metal line are respectively connected (S520). Then, the power line connecting the vertical power supply line and the standard unit, the vertical ground line, and the ground line of the standard unit are connected (S530). Similarly, referring to the above analysis, according to the present invention, the width of the horizontal metal line is set to be less than 2 times the standard height of the standard unit, that is, less than 2hs. For the case where there are no other adjacent metal lines on both sides, the horizontal metal line is set. The width is not more than: 2hs-Ws-2Sp, that is, 2x standard height - lx standard cell line width - 2x line spacing; wherein, the standard cell line width Ws is the width of the standard cell power line Vdd and the standard cell ground Vdd line, wherein The standard unit power supply line Vdd and the standard unit ground line Vss have the same width; the line spacing Sp is the separation distance between the horizontal metal line and the standard unit power line or the standard unit ground line. The inter-line spacing is reserved to meet the design requirements of the integrated circuit, including ohmic drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard cell array. Therefore, the line spacing Sp is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard cell array. Set the width of the horizontal metal line when there are two horizontal metal lines adjacent

Clienfs Docket N〇.:S3U05-0050-TW TT5s Docket No:0608-A40992-TW/Final /Joanne 23 200814279 Not greater than: hs-Smp, ie 1.5x standard height -0.5x wire spacing -0.5x standard Cell line width - lx line spacing; where the metal line spacing is the separation distance between two horizontal metal lines. Similarly, the spacing between the metal lines is reserved to meet the design requirements of the integrated circuit, including ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard cell array, so the spacing between the metal lines is the same. It is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard soap element. The maximum width described above is suitable for applications requiring horizontal power lines and horizontal metal lines, which is an advantageous choice for obtaining better integrated circuit performance if horizontal power lines and horizontal metal lines are not equal width. When the width of one of the lines is reduced, the width of the other metal line can be increased, but the widest width does not exceed 2hs-Ws-2Sp. Further, with continued reference to the embodiment illustrated in FIG. 5, the method of the present invention further includes the steps of: arranging vertical metal lines in a metal layer above or below a metal layer used for horizontal metal lines; based on the following factors At least one of the calculations determines the density of the horizontal and vertical metal lines in the power ground network (S540): ohmic voltage drop, power consumption, noise, integrated circuit design rules, and repeatability of the standard cell array. A through hole is provided to connect the power line and the ground line in the horizontal metal line and the vertical metal line, and the power line and the ground line of the vertical metal line and the standard unit.

Clienfs Docket N〇.:S3U05-0050-TW TT^ Docket No:0608-A40992-TW/Final /Joanne 24 200814279 separate connection, refer to Figure 4, it can be seen that the through hole 402 connecting the vertical metal line and the standard unit line And a through hole 406 connecting the horizontal metal wire and the vertical metal wire. By adopting the technical scheme of the invention, under the condition of ohmic voltage drop, power consumption and noise, the network of the power source is rearranged. 'The width of the metal line is determined according to the design rule of the integrated circuit and the repeatability of the unit array, and the width is reduced. Performance defects and waste of routing resources due to improper overlap and line width are accommodated by the increasing demand for circuit units. The present invention has been disclosed in the above preferred embodiments, and is not intended to limit the scope of the present invention, and may be modified by those skilled in the art without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is an arrangement diagram of a power ground network in the prior art, and FIG. 1B is an arrangement structure diagram of another power ground network in the prior art; FIG. 2 is a diagram according to the present invention. FIG. 3 is an arrangement diagram of another power ground network according to an embodiment of the present invention; FIG. 4 is a standard unit power supply according to an embodiment of the present invention; Schematic diagram of the connection structure between the ground line and the power ground network;

Clienfs Docket No.: S3U05-0050-TW ΤΤ 58 Docket No: 0608-A40992-TW/Final / Joanne 25 200814279 Fig. 5 is a flow chart showing a method of arranging a power supply network according to an embodiment of the present invention. [Main component symbol description]

Vdd ··Power cord;

Vss : ground line; 101P, 101G, 102P, 102G, 103P, 103G, 104P, 104G, 202G, 202P, 302G, 302P, P, G: metal line; φ 110, 120, 402, 406, 404: overnight L 105: area; hs: standard height;

Ws: standard unit line width;

Sp : line spacing; S510 ~ S540: steps.

Client’s Docket N〇.:S3U05-0050-TW TT5s Docket No:0608-A40992-TW/Final /Joanne 26

Claims (1)

200814279 X. Patent application scope: 1. A power ground network of an integrated circuit in which standard cell arrays of integrated circuits are arranged in a horizontal direction, and the power ground network includes horizontal metal wires arranged in different metal layers and The vertical metal wire includes a horizontal power metal wire and a horizontal metal wire, and the vertical metal wire includes a vertical power metal wire and a vertical metal wire, and the power wire and the ground wire of the horizontal metal wire and the vertical metal wire are respectively connected to each other. The width of the horizontal metal wire of the power ground network is such that the horizontal power supply metal wire only covers the power supply line of the standard cell array, and the horizontal metal wire only covers the ground line of the standard cell line. 2. The power ground network of claim 1, wherein the horizontal metal wire has a width less than twice the standard height of the standard unit. 3. The power ground network of claim 2, wherein the width of the horizontal metal line is less than: 2χ standard height - lx standard unit line width - 2 line spacing; • wherein, standard unit line The width is the width of the standard unit power line, the standard unit ground line, the standard unit power line and the standard unit ground line have the same width; the line spacing is the interval between the horizontal metal line and the standard unit power line or the standard unit ground line. distance. 4. The power ground network according to claim 3, wherein the line spacing is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit Design rules, repeatability of standard cell arrays. Clients Docket No.:S3U05-0050-TW TT^s Docket No:0608-A40992-TW/Fmal /Joanne 27 200814279 5. The power ground network as described in claim 2, characterized in that When two horizontal metal lines are adjacent, the width of the horizontal metal line is less than: 1.5 Χ standard height - 0.5 x metal line spacing - 0.5 Χ standard unit line width - lx line spacing; wherein, the metal line spacing is The separation distance between two horizontal metal lines. 6. The power ground network according to claim 5, wherein the metal line spacing is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, The integrated circuit design rules and the repeatability of the standard unit array. 7. The power ground network of any of claims 1 to 6, wherein the vertical metal line uses a metal layer that is closer to the standard cell line than the horizontal metal line. 8. The power ground network of claim 7, wherein the vertical metal line uses a metal layer one layer higher or lower than the horizontal metal line. 9. The power ground network of claim 7, wherein the density of the horizontal metal lines and the vertical metal lines in the power ground network is calculated based on at least one of the following factors: an ohmic voltage drop. , power consumption, noise, integrated circuit design rules, repeatability of standard cell arrays. 10. The power ground network according to claim 7, wherein the horizontal wire and the vertical wire are respectively connected to the power wire and the ground wire, and the horizontal wire and the power cable of the standard unit are respectively connected. Clienfs Docket N〇.:S3U05-0050-TW TT5s Docket No:0608-A40992-TW/Final /Joanne 28 200814279 Connected separately and the power and ground wires of the above vertical metal wire and standard unit Both are realized through through holes. 11. A method of arranging a power ground network of an integrated circuit, wherein a standard cell array of the integrated circuit is arranged in a horizontal direction, the method comprising: arranging horizontal metal lines and vertical metal lines in different metal layers, wherein the level The metal wire includes a horizontal power metal wire and a horizontal metal wire, and the vertical metal wire includes a vertical power supply metal wire and a vertical metal wire; respectively connect the power supply wire and the 10 ground wire among the horizontal metal wire and the vertical metal wire; and connect the vertical power supply The power line of the metal line and the standard unit, the vertical ground line and the ground line of the standard unit; wherein the step of arranging the horizontal metal line and the vertical metal line includes setting a width of the horizontal metal line of the power ground network The horizontal power supply metal wire only covers the power supply line of the above-mentioned standard unit array, and the horizontal metal wire only covers the ground line of the above-mentioned standard unit array. 12. The arrangement method according to claim 11, wherein the width of the horizontal metal wire is set to be less than twice the standard height of the standard cell. 13. The method according to claim 12, wherein the width of the horizontal metal line is set to be less than: 2x standard height - lx standard unit line width - 2 x line spacing, wherein the standard unit line width is standard The width of the unit power line, the standard unit ground line, the standard unit power line and the standard unit ground line are the same; the line spacing is horizontal metal line and standard unit power line or standard single Clienfs Docket N〇.:S3U05-0050-TW TT^ Docket No:0608-A40992-TW/Final /Joanne 29 200814279 The distance to be reserved between the ground lines. 14. The method according to claim 13, wherein the method comprises: calculating the line spacing based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit Design rules, repeatability of standard cell arrays. 15. The method according to claim 12, wherein when the two horizontal metal lines are adjacent, the width of the horizontal metal line 10 is set to be less than: 1.5 χ standard height - 〇.5 χ metal line Inter-line spacing - 0.5 χ standard cell line width - 1 χ line spacing. The spacing between metal lines is the separation distance between two horizontal metal lines. 16. The method according to claim 15, wherein the retreating comprises: calculating the inter-line spacing of the metal lines based on at least one of the following factors: ohmic voltage drop, power consumption, noise , integrated circuit design rules, repeatability of standard cell arrays. 17. The method of arranging according to claim 16, wherein the vertical metal line is disposed in a metal layer higher than or lower than a layer of the metal layer used for the horizontal metal line. 18. The method according to claim 16, further comprising: calculating a level of gold in the network of the power source based on at least one of the following factors: Client Ss Docket N〇.: S3U05-0050-TW TT ^s Docket No:0608-A40992-TW/Final /Joanne 30 200814279 ¥ Density of genre and vertical wires: ohmic drop, power consumption, noise, integrated circuit design rules, repeatability of standard cell arrays. 19. The method according to claim 16, further comprising: erecting a through hole to respectively connect the power line and the ground line in the horizontal metal line and the vertical metal line, and the vertical metal line It is connected to the power line and ground of the standard unit respectively. 20. - Integral circuit structure, including standard cell array and power ground network _ Road 5 where the standard grass element array is arranged horizontally 'Power ground network includes horizontal metal lines and vertical metals arranged in different metal layers The horizontal metal wire includes a horizontal power metal wire and a horizontal metal wire, and the vertical metal wire includes a vertical power metal wire and a vertical metal wire, and the power wire and the ground wire in the horizontal metal wire and the vertical metal wire are respectively connected to each other; The feature is that the width of the horizontal metal line of the power ground network is such that the horizontal power supply metal line only covers the power supply line of the standard unit array, and the horizontal metal line covers only the ground line of the standard unit array. The integrated circuit structure according to claim 20, wherein the horizontal metal wire has a width smaller than twice the standard height of the standard cell. 22. The integrated circuit structure according to claim 21, wherein the width of the horizontal metal line is less than: 2x standard height - lx standard unit line width - 2 line spacing; wherein, standard unit line width The width of the standard unit power cord, the standard unit ground, the width of the standard unit power cord and the standard unit ground. Client's Docket N〇.:S3U05-0050-TW TT^s Docket No:0608-A40992-TW/Final / Joanne 31 200814279 Same; the line spacing is the separation distance between the horizontal metal line and the standard unit power line or standard unit ground. 23. The integrated circuit structure according to claim 22, wherein the line spacing is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, integrated circuit Design rules, repeatability of standard cell arrays. 24. The integrated circuit structure according to claim 20, wherein when the two horizontal metal lines are adjacent, the width of the horizontal metal line 10 is less than: 1.5X standard height - 0.5X metal line Interline spacing - 0.5X standard cell line width _1 χ line spacing. The spacing between metal lines is the separation distance between two horizontal metal lines. 25. The integrated circuit structure according to claim 24, wherein the metal line spacing is calculated based on at least one of the following factors: ohmic voltage drop, power consumption, noise, and product. Body circuit design rules, • Repeatability of standard cell arrays. 26. The integrated circuit structure according to claim 20, wherein the vertical metal wire can be arbitrarily used with a metal layer one layer higher or lower than the horizontal metal wire. 27. The integrated circuit structure of claim 26, wherein the density of the horizontal metal line and the vertical metal line in the power ground network is calculated based on at least one of the following factors: ohmic pressure Drop, power consumption, noise, integrated circuit design rules, repeatability of standard cell arrays. Clienfs Docket N〇.: S3U05-0050-TW TT5s Docket No: 0608-A40992-TW/Final / Joanne 32 200814279 28. The integrated circuit structure according to claim 26, characterized in that the horizontal metal The respective communication of the power line and the ground line in the line and the vertical metal line, and the respective communication between the vertical metal line and the power line and the ground line of the standard unit are respectively realized through the through hole. Clienf s Docket N〇.:S3U05-0050-TW TT5s Docket No:0608-A40992-TW/Final /Joanne