200813559 九、發明說明: 發明所屬之技翁領域 - . . . . ; - . - * . - ... - - / ·. 本發明係關於一種光源組’將別是關於一種具有串聯 式發光二極體(LED)之光源組。 ' . ； - ............ ； ...... 【先前技術】:「 非自發光性的顯示面板，例如液晶面板，通常需要一 背光源才得以進行影像的顯示。在習知諸多種背光源技術 ' ' . .. . ' Γ ： ... 中，侧端入光的背光模組係符合於產品薄型化的需求。 .... . ... \ .... - ' 請參照圖一，圖一為習知背光模組中，光源組1與導 尤板20的示意圖。所謂侧端入光的背光模組，係將光源組 1設置在導光板20的一側端22，此側端22即為導光板的 人光面。光源組1所發出之光線係由導光板2〇之侧端22 進入導光板20。光線在導光板2〇内因介面全反射而散射 其中’最後由一电光面21射出導光板，以提供一均勻的面 光源予一顯示面板(圖中未顯示)使用。 : ..... · .... · ... ' . _ . 先源組1中具有複數個發光二極體111，且這些發光 基板1G上，取提供人賴&板 觀目前最常使用的發光二極體 極體丨1丨時所需的電路， . _ . . -. · · . · .... . .. . 圖一係為習知先源細夕々-立 .， 尤原、、且之甩路不意圖。上诚用以榀从浐 先二極體111的電跋展知朗、从v 上述用以知作發 电路及相關兀件皆分布於基板10上。其 200813559 '中’光渾組1:具有一正電源線路13、複數组 11 (LED string)及驅動蟲片12。 ' ,·. ；; .· .... ...： :，观_ 22’承沿同一直故排列而成。每一發光二極體串η之正極 端與正電轉路:13連接，而負_則以—導减 12 連接。· Λ 12的_’可對各發光二極體串u電顯電流, 以達到發光的致果丨 極跡11，，依 祕卿線’係以單層佈線的方式分 《於基板ω上。因此，各組發光二極體^ -驅動晶片12的备導線必須並列地分佈在基板10上。 ,士承上所述’當光源組10所 證靡片12料線也會愈多’使得所需的： 板威D1也冒跟者增加，以符合佈線面積的需求。 =崎。基板寬請的增加，除;; 讓的外'也需要花費更多的基板二Γ -- - - . ; ::另外”習知光源組10之驅動晶片U i队 時驅動多組發光二極體串u之外曰曰片12主要除了用來同 有感測與控^晶片12本身更具 ， 及•來自發光二極體串Η 200813559 • . :··" . . .. ； ·. :;. . . :.:…' v ： . v -. 白勺溫度資訊’並M此咨％十、 Ί Γ折古译^稭貝訊來分別控制每一組發光二極體串 :11的贵度。因此，驄軏曰u ，200813559 IX. INSTRUCTIONS: The field of technology belongs to the invention - . . . - - - -. - The invention relates to a light source group 'will be related to a type with a series of two A light source group of polar bodies (LEDs). ' . ; - ............ ; ...... [Prior Art]: "A non-self-illuminating display panel, such as a liquid crystal panel, usually requires a backlight to perform imagery. The display of various backlight technologies in the '' . . . ' Γ : ..., the side-end light-emitting backlight module is in line with the needs of thin products. .... \ .... - ' Please refer to Figure 1. Figure 1 is a schematic diagram of the light source group 1 and the guide plate 20 in the conventional backlight module. The so-called side-end light-emitting backlight module sets the light source group 1 in One side end 22 of the light guide plate 20 is the human light surface of the light guide plate. The light emitted by the light source group 1 enters the light guide plate 20 from the side end 22 of the light guide plate 2. The light is on the light guide plate 2 The internal interface is totally reflected and scatters. Finally, a light guide plate is emitted from a light-emitting surface 21 to provide a uniform surface light source for use in a display panel (not shown). : ..... · .... . . ' . _ . The source group 1 has a plurality of light-emitting diodes 111, and these light-emitting substrates 1G are provided with the light-emitting diodes of the most commonly used LEDs. The required circuit, . _ . . -. · · · · ·········································································榀 榀 浐 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 , complex array 11 (LED string) and drive insects 12. ' ,·. ;; .. .... ...: :, view _ 22' along the same straight line. Each light pole The positive terminal of the body string η is connected with the positive electric circuit: 13 and the negative _ is connected with the decreasing voltage 12. The _' of the Λ 12 can electrically display the current to each of the light-emitting diode strings to achieve the result of the light emission. The electrode traces 11, according to the secret line, are divided into the substrate ω by a single layer wiring. Therefore, the backup wires of the respective groups of the light-emitting diodes 12 must be arranged side by side on the substrate 10. According to the above, when the light source group 10 proves that the 12 stock lines will be more, the required ones: The board D1 will also increase the number of followers to meet the wiring area requirements. Increase The external 'also needs to spend more substrate Γ - ; :: :: :: 习 习 习 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源 光源In addition to being used to sense and control the chip 12 itself, and • from the light-emitting diode string 200813559 • . :··" . . . . ; .. :;. . . :.:...' v : . v -. The temperature information 'and M this consultation% ten, Γ 古 古 ancient translation ^ straw Beixun to control each group of LED strings: 11 expensive. Therefore, 骢軏曰u,
别如&步 動日日I 衣程良率不佳;驅動晶只、宮丄、心^ ^… 决谨栳车崎沾公片:運作過程中負載較大，容易產 典運作失效的問題。 ........ 二’. . ·''. ... . 供一 輕韻_缝，對此提 貝一有效的解決方案，係為當前技術所必需。 • ·\ . ·,. · · ...'.·· · . 【發明内容】 + 月〈目的係在於改良習知光源組之電路佈線方 式’以縮減秦板的使用寬度輿使用面積。 奠明之另“目_ 性更高的光源紐。Don't be as good as & stepping day I clothing rate is not good; drive crystal only, Gong Yi, heart ^ ^... 栳 栳 栳 栳 沾 沾 沾 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : . ........ 2' . . . ''. . . For a light rhyme _ seam, an effective solution for this, is necessary for the current technology. • ····························································································· The other is to clarify the source of the lighter.
本發明所提供之光源組係包括一基板與設置於基板上 複數個次驅動晶片及複數組發先二極體串(LED string)。 主軀動晶片，設置於基板上，並連接於正電源線路。 複^個次驅動晶片，設置於基板上，且連接於正電源線路， 且這些次驅動晶片與主驅動晶片並聯於正電源線。發光二 極體串之正極端係連接於次驅動晶片，負極端連接於負電 驗路。其中，每一個次驅動晶片至少連接一 體串， - · · - ‘ 另外，發光二極體串之正極端亦可連接於主驅動晶 月。主驅動晶片或次驅動晶片所連接之發光二極體串超過 兩組時’發光二極體串係以並聯的方式連接於主驅動晶片 200813559 . . ； .- ’： .:. * * .- . . .... ι _、 · / ^、: ’邊系更詳細的實施方式可 ；-. -'Λ： ·：'·ν- - V ;.-,； ； ν'·；-/:-v^.· ；· ' : ：： . .；·\ . ；：；'：：'.-；' ν' r^：:· ；：- ：'' ^ .·-·：'；·； ::::—':【貫施方:丨 本贅明之光源組3主要包括一基板3〇與鼓置於基板3〇上 的一正線路33、1 肩_次鶴晶片34及複數組發光二極體串31 (led: string) 〇 :,^；·· ^^;"；v^ Λ.：'·· -:；.：".'；；；^'·：'：^ ,.'" " --'：/ '/；： 在_實施例中’正電源線路33與㈣ 30 ^ ^ 30 〇 32 ¾ 未顯示）。賊個次‘轉晶片34皆連接於正電源 線_ 上述之主驅_ 32淑 互相並聯的方式連接於正電源線33。 31 ’係由__贱二紐Μ】串聯而 二^組發光二_串3!之正極端皆連接於次驅動晶 .34，^ 係為白光LED。 : —極體 • · · ' . . — · — 在-較佳實施例中，發光二杨體㈣之正極端—可連 接於主驅觸32。主._郎32與每—個次驅動晶片 200813559 -·.. · . ... _ ' · : ·: ' : ’ ... .-· ·. - :極體串終係顺聯的方式祕録域晶片 · ''-'；-·： · -.. .. ..v -- ' . -'： ： ； . ； -.」.. 主驅^晶說32及次驅動晶片34可提供電能^ 串31謂負電源線路35的電塵位準，實際上與正電源線' ... :.; *- . - - · . · ，- ·. · .. .. ... ·..,: - .. -. ’ 33之驅動電麗也準具有一定的夏降即可。或者，可將負 電源轉路35之電壓位準設為择地電壓位準（GM))。 , 1 · * · .··'.· - . . ·.·.·.. ...·.. · ,；· ’ . . * : ,. ..’ * . , . . τ. 异变一我號傳輪線37 (d故aI/O lto ... . „ . · . --. - 置於暴板30上，並由主驅動晶片32串聯到各個次驅動晶 :片34 ’以交換訊號。其中，該訊號傳輸線37可為串列匯 k排（serial bus)、I2C 規格的命^ (PWM)編碼方式·.·等傳輸型態，來傳送訊號。 ^ - -· . · . - . - — - — . - . * , · - .. .: . . . 由於發光二極體的亮度與其本身的溫度有關，所以可 ... -·... - — . . · ... · · · ... : ^ ' , 藉由溫度的感測，來得知發光二極體的亮度情形。因此， 本發明之主驅動晶片32與次驅動晶片34皆具有一溫度感 :.. ... . - 測器，用以偵測所連接之發光土極體串31之溫度資訊，以 掌控光繆紙3中發光二極體311的亮度。並且，可藉由訊 號傳輸線37傳送各個次驅動晶片34之溫度感測器所感測 .. .... - 到的溫度資訊至主驅動晶片32y當然，主驅動晶片32亦 200813559 ..:可藥击本身的溫度感測器，來偵財所連接的發光二極體串 -；.；,； -- ；.. -； ,.VV·'·, ·. ；: .；' ^ ： ：V；, -Λ.；· ：. ：；..., ： ' ： , ... · : , ..... . . . . \ ... . . ..... _ . . . · . 曰曰編^ 渗:偷、對庳的玛饋信號。而此^ :緣戀 -· - · ··-...: ' - - - - . — -. ... Λ . -. ' . ·.: -·，，*''- _ .. .' - . . . ' ： - _-... 另外,，主驅動晶片32及次驅動晶片34皆包舍 寻元’例如脈波寬度調變（pulse獨她M〇dulati〇n，pwM ) ▲制為。當上终之四饋偉號傳送到主驅動晶片32或次驅動 :晶片34時’控制單元可根據所攆收之回饋信號調整傳送到 發光二極體串31的電流，以調整發光二極體串31之亮度。 " · * .. ' . ..... . . . . ’ .· · ... . _ : 在實際馮用上，本發明之光源組3不僅可應用於侧端 八光的背光模組，亦可綱於直下式背光模組。在一實施 例中，直下式背光模組的背光源係可由複數個光溽組3並 排且—合而成。 ，’ .； . .. . . ；. · 藉由上述本發明之技術手段，可使光源組3的電路佈 線更為精簡，即使發光二極體串31增加，也不會產生導線 並排的現象。如圖乓所示，本發明之先源組3的基板寬度 D2，比習知光源組1之基板寬度m 基板的面積需求。 _ ；. . . 一般來說’光源组之基板為一散熱紹基板，其成本仍 -. -- . . - .- . ' .: .·- -. . ..-: ... . .,· *.·...' ； . .. · · · ： · · - · . ·. ·. · ·.·，·. ' , · - -.:. ... .·.- —— .. ..- ..'.> ·. ... ... -. - ... '. . ；.^··>- ；/.； .；.;·- ";；; ·'；. ;·' .- ' ：_.' ' ''-' ' ' · : . ： r .- ::·為不低。袭應用本發明之技術手段，可減少散熱銘基板之 .- .· . ·- . . · · - .*--·····,-.,-.· . · .... · .. ....· ,·, ' .·. :’擔i藥乘晶片 : .. ." / ；* -.. - *. - .- ·. · .- '/ . . ' : · : - · 的說格需求不需要取高，其製造喪率扭對的也較習知之驅 . 動晶片12為两。因此，考量晶片生產良率與電路運作穩定 '. · ./' : - ：. ..... .... . . .... 功政。是以，在不脫離本發明之精神與範圍内所作之修改， ::…:. _.... .... ...….…... ........ ' · V； .： :^i:·： ：：；^:;^ V·.- :,. . .·-···；： , -' . .'：，" '"', '. ·' .·-' , - ... V: .... .，..... ：. . - . ' . ..... - . 圖式簡單說明】警 - . . : · - ； ... - - . - . - - -.. ； ； *’：.... ' 藉由以下詳纟田之描述結合所附圖示，將可輕易的了解 :上述内容及此璜發明之諸多優點，其中: ..广......'..· . — .-' ... ... . . ·· . ·.-···· ·..··· ... .··..·- ·. · . .. -:. - .. , . . :〇 圖二係為習知光源組之電路示意圖；及 -. · \ ; ， - · . ——. . - ... .' · · : ' '. . . — . ' ' 圖三係為本發明光源組之電路示意圖。 200813559 【主要元件符號說明】 光源組1、3 發光二極體串11、31 導光板20 嘗 侧端22 :The light source assembly provided by the present invention comprises a substrate and a plurality of sub-drive wafers and a plurality of array LED strings disposed on the substrate. The main body moving chip is disposed on the substrate and connected to the positive power supply line. The plurality of sub-driving wafers are disposed on the substrate and connected to the positive power supply line, and the sub-driving wafers are connected in parallel with the main driving chip to the positive power supply line. The positive terminal of the LED string is connected to the secondary drive chip, and the negative terminal is connected to the negative test circuit. Wherein, each sub-driver wafer is connected to at least one body string, - □ - ‘ In addition, the positive terminal of the LED string can also be connected to the main drive crystal. When the LED array connected to the main driver chip or the sub-driver chip exceeds two groups, the LED array is connected in parallel to the main driver chip 200813559 . . . . . . . . ι _, · / ^,: 'The more detailed implementation of the edge can be;-. -'Λ: ·:'·ν- - V ;.-,; ; ν'·;-/ :-v^.· ;· ' : :: . .;·\ . ;:;'::'.-;' ν' r^::· ;:- :'' ^ .·-·:'; ·;:::—': [Cheng Shifang: The light source group 3 of 丨本赘明 mainly includes a substrate 3〇 and a positive line 33 on the substrate 3〇, a shoulder_second crane wafer 34 and plural Group of light-emitting diode strings 31 (led: string) 〇:,^;·· ^^;";v^ Λ.:'·· -:;.:".';;;^'·:' :^ ,.'"" --':/ '/;: In the _ embodiment, 'positive power line 33 and (four) 30 ^ ^ 30 〇 32 3⁄4 not shown). The thief times ‘the transfer chip 34 is connected to the positive power supply line _ the above-mentioned main drive _ 32 淑 is connected to the positive power supply line 33 in parallel with each other. 31 ′ is composed of __贱二纽Μ] series and two groups of illuminating two _ string 3! The positive terminals are connected to the secondary driving crystal. 34, ^ is a white LED. : - Pole body · · · ' . . - In the preferred embodiment, the positive terminal of the light-emitting body (four) - can be connected to the main drive 32. Main._lang32 and each-time drive wafer 200813559 -·.. · . . . _ ' · : · : ' : ' ... .-· ·. - : The way the polar body is finally connected Secret Recording Area Chip · ''-';-·: · -.. .. ..v -- ' . -': : ; . ; -.".. Main drive ^ crystal said 32 and sub-drive wafer 34 Providing electric energy ^ string 31 is the electric dust level of the negative power supply line 35, and actually with the positive power supply line ' ... :.; *- . - - · · · · · · ·. · .. .. ... ..,: - .. -. ' The drive of 33 is also allowed to have a certain summer drop. Alternatively, the voltage level of the negative power supply 35 can be set to the ground voltage level (GM). , 1 · * · .··'.· - . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I pass the line 37 (d) so aI/O lto .... „ . . . . . . - placed on the storm board 30, and the main drive chip 32 is connected in series to each sub-drive crystal: sheet 34 ' The signal transmission line 37 can transmit signals by using a serial bus, an I2C standard (PWM) encoding method, etc. to transmit signals. ^ - -· . - . - - - - . - . * , · - .. .: . . . Since the brightness of the light-emitting diode is related to its own temperature, it can be... -·... - — . . · .. The brightness of the light-emitting diode is known by the sensing of the temperature. Therefore, the main driving chip 32 and the secondary driving chip 34 of the present invention both have a temperature sense: The measuring device is configured to detect the temperature information of the connected light-emitting earth body string 31 to control the brightness of the light-emitting diode 311 in the optical paper 3. Further, each of the signals can be transmitted through the signal transmission line 37. The temperature sensor of the secondary drive chip 34 senses ..... - the temperature information to the main The movable chip 32y, of course, the main driving chip 32 is also 200813559..: can be used to detect the temperature sensor of its own, to detect the connected light-emitting diode string-;.;,; -- ;.. -;,. VV·'·, ·. ;: .;' ^ : :V;, -Λ.;· :. :;..., : ' : , ... · : , ..... . . . . \ ... . . . . . _ . . . . . 曰曰 ^ 渗 : : 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷 偷- - - - . - -. ... Λ . -. ' . ·.: -·,,*''- _ .. .' - . . . ' : - _-... In addition, the main drive Both the wafer 32 and the sub-driving wafer 34 are packaged with a homing element such as pulse width modulation (pulse uniquely M她dulati〇n, pwM) ▲. When the last four feeds are transmitted to the main drive chip 32 or Sub-drive: When the wafer 34 is on, the control unit can adjust the current transmitted to the LED string 31 according to the received feedback signal to adjust the brightness of the LED string 31. " · * .. ' . . . ... . . . . . . . _ : In actual use, the light source group 3 of the present invention can be applied not only to a side-end eight-light backlight module, but also to a direct-lit backlight module. . In one embodiment, the backlight of the direct type backlight module may be formed by a plurality of aperture groups 3 being combined and combined. By the technical means of the present invention, the circuit wiring of the light source group 3 can be further simplified, and even if the LED strings 31 are increased, the wires are not arranged side by side. . As shown in Fig. 1, the substrate width D2 of the precursor group 3 of the present invention is larger than the substrate width of the conventional light source group 1 by the substrate area requirement. _ ;. . . Generally speaking, the substrate of the light source group is a heat-dissipating substrate, and the cost is still -. . . . . . . . . . . . . . . . . . . . . . ,· *.·...' ; . . . · · · : · · · · · · · · · ····. ' , · - -.:. ... .. .. ..- ..'.> ·. ... -. - ... '. . ;.^··>- ;/.; .;.;·- ";;;';.;·' . . . ' :_.' ' ''-' ' ' · : . : r .- ::· is not low. By applying the technical means of the present invention, it is possible to reduce the heat-dissipating substrate. - . . . - - . . . - - - - - - - - - - - - - - - - - - - - - - - - - - - ..· ,·, ' ... : ' Take the medicine on the wafer: .. ."/;* -.. - *. - .- ·. · .- '/ . . ' : · : - · The demand for the grid does not need to be high, and the manufacturing rate is also better than the conventional one. The moving chip 12 is two. Therefore, consider the wafer production yield and the stability of the circuit operation '. · ./' : - :. ..... .... . . .... Gongzheng. Therefore, modifications made without departing from the spirit and scope of the invention, ::...:. _.... .................................. V; .: :^i:·: ::;^:;^ V·.- :,. . ..·····:, -' . .':,"'"', '. · ' .·-' , - ... V: .... .,..... :. . - . ' . ..... - . Simple description of the diagram] Police - . . : - ; ... - - . - . - - -.. ; ; *':.... ' With the following detailed description of the field, combined with the attached diagram, it will be easy to understand: the above content and this invention Many advantages, including: ..广...'..· . — .-' ... . . . . . . . . . . . . . . . . . . . . . . . . ..·..·- ·· · . . . -:. - .. , . . : Figure 2 is a schematic diagram of the circuit of the conventional light source group; and -. · \ ; , - · . - ... .. · · : ' ' . . . . . ' ' Figure 3 is a schematic diagram of the circuit of the light source group of the present invention. 200813559 [Description of main component symbols] Light source group 1, 3 LED series 11, 31 Light guide plate 20 Taste side end 22:
主驅動晶片3；2 : Y 次驅動晶片34 : / 訊號傳輸線37 基板10、30 發光二極體111、311 出光面21 : 驅動晶片12 - . ：.； '：- 正電源線13、33 負電源線35 丫 ^ 基板寬度m、:D2 12Main drive chip 3; 2: Y drive wafer 34: / signal transmission line 37 substrate 10, 30 light emitting diode 111, 311 light emitting surface 21: drive wafer 12 - . :.; ':- positive power supply line 13, 33 negative Power cable 35 丫^ Substrate width m,: D2 12