TW200812737A - Laser processing device and laser processing method using same - Google Patents

Laser processing device and laser processing method using same Download PDF

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Publication number
TW200812737A
TW200812737A TW096130845A TW96130845A TW200812737A TW 200812737 A TW200812737 A TW 200812737A TW 096130845 A TW096130845 A TW 096130845A TW 96130845 A TW96130845 A TW 96130845A TW 200812737 A TW200812737 A TW 200812737A
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TW
Taiwan
Prior art keywords
probe
laser
laser processing
laser light
distance
Prior art date
Application number
TW096130845A
Other languages
Chinese (zh)
Inventor
Keiji Okino
Yurii Ichiki
Original Assignee
Omrom Laserfront Inc
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Publication date
Application filed by Omrom Laserfront Inc filed Critical Omrom Laserfront Inc
Publication of TW200812737A publication Critical patent/TW200812737A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042Automatically aligning the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0096Portable laser equipment, e.g. hand-held laser apparatus
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626Energy control of the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

In the laser processing device, laser light is transmitted to an emitting optical unit by an optical transmission part, and the laser light is radiated to a workpiece by the emitting optical unit to perform laser processing. The emitting optical unit has a torch body, a workpiece detection probe provided to the distal end of the torch body, a focusing lens for emitting the laser light at a focal point positioned a prescribed distance from the distal end of the torch body, a first circuit for providing a power supply to the probe and calculating the distance using the input of a signal that changes based on the distance between the probe and the workpiece, a second circuit for detecting contact between the probe and the workpiece on the basis of the signal from the probe, and a control unit for controlling the generation of the laser light according to contact of the probe with the workpiece and the distance between the probe and the workpiece. This configuration makes it possible to provide a highly safe handheld laser processing device that is capable of detecting the relative position of the workpiece using a simple structure.

Description

200812737 九、發明說明: 【發明所屬之技術領域】 本發明係關於雷射處理裝置及使用該雷射處理裝置的雷射處, 理方法,尤其是關於具有手持式發光單元的雷射處理裝置,以及 使甩該雷射處理裝置的雷射處理方法。 【先前技術】 焊接有時係由握著暫時固定熔接等所用之手持式發光單元的 來施行丄但利用自動化設備的雷射焊接不必然適合手持式發 光單元。在這種情況中,雷射處理裝置通常裝備有安全裝置以避 ^射照射到非必要照射部分,並且避紅人因疏_曝露到雷 同時賴工人及其他人免於發射出的高能雷射光,偵測 ^光早70及作部件之間的位置關係,以進行品質_致性的雷射 逆理斑且只有當位置關係在規定範圍内時,雷射照射方得以施行。 舉例來說,在曰本公開專利公報第5_318158、5_318159及 fΛW Π 5"318158 ' 5-318159 ^2002-239771 以後稱為喷燈)以備測工作部件的技術, 為,測先早兀及工作部件之間的位置關係的方法。 用以:露的噴燈具有電路構造,其中 一錐形嗔嘴2出的雷射光之光纖之發射端係位於有 發射_$置於其㈣處德柄外罩_,聚焦鏡片被設置在 i面附上使ΐί發ί端所發出的雷射光聚焦在噴嘴之前端 盡器被啟動:因此以,雷射振 ㈣一段必要轉之翻絲體被狀 6 200812737 壓力感應s,其制以在顯氣體由倾之前端翻、且喷嘴 f端距牛-_巨離時,鐘縮氣體的麵力何; 減H:、線圈附加到喷燈,並設置感應型近顧應器(感應 感巧,mjUCtlonsensor),用以偵測線圈之電感變化;以及設帝200812737 IX. Description of the Invention: [Technical Field] The present invention relates to a laser processing apparatus and a laser processing method using the same, and more particularly to a laser processing apparatus having a hand-held lighting unit, And a laser processing method for causing the laser processing apparatus. [Prior Art] Welding is sometimes performed by a hand-held light-emitting unit for holding a temporary fixed welding or the like, but laser welding using an automated device is not necessarily suitable for a hand-held light-emitting unit. In this case, the laser processing apparatus is usually equipped with a safety device to avoid the irradiation of the unnecessary irradiation portion, and the high-energy laser light that is avoided by the worker and others by being exposed to the lightning. The detection of the positional relationship between the light and the component is performed to perform the quality-induced laser spectroscopic spot and the laser irradiation can be performed only when the positional relationship is within the prescribed range. For example, in the Japanese Laid-Open Patent Publication Nos. 5_318158, 5_318159, and fΛW Π 5"318158 '5-318159 ^2002-239771, hereinafter referred to as a blowtorch, to prepare a working component, for the first time, work and test A method of positional relationship between components. The lamp used for the dew has a circuit structure, wherein the emitting end of the optical fiber of the laser light from a tapered nozzle 2 is located at the hood of the stalk placed at the (four), and the focusing lens is disposed on the i-side. The laser light emitted by the ΐί hair ー end is focused on the nozzle before the end of the nozzle is activated: therefore, the laser vibration (four) is necessary to turn the tumbling body into a shape 6 200812737 pressure sensing s, which is made by the gas When the tip is turned over and the nozzle f is far away from the cow-_, the surface force of the gas is reduced; minus H:, the coil is attached to the burner, and the inductive type is placed close to the sensor (inductive sensory, mjUCtlonsensor) To detect the change in inductance of the coil;

sens〇r),M 端已二=:光當糊姐的前 #且ί日專利公報第2002-239771號所揭露的yag雷射噴 或接觸之第—偵測裝置,用以在開始處 r:及======理: 作料縣時,雜料_才ί被ί t 第Γΐ娜才mG雷射縫器。在這些噴燈 亦可部件時, YAGlttl^rf _2·239771號揭露一種喷i,其中當 出可見之™啟時,同時發 詈午使用一可見光偵測器作為第,镇測裝 雷射處理_產生於處、,以偵測在 ,作為第二雜置’在獅 _工作部;所發出的處地理發= 200812737 是在限制關及J1作部件不再彼此魏時亦铁。 工作料衫躲,且对部件 測乾圍内時,可發射YAG ★射光。 、好包感應為之摘 部件的材料是否為金屬:非處理之前決定工作 •發射YAG雷射光,二it屬田,t由運作限制開關決定是否 |的偵測範圍内時’才會發射中工作部件位於近接感應器 報第曰本,利公 ,夺會停止雷射振盪,因此再, =f趁似情況時,就不可能持續地λ里 南 的感應器以偵測喷燈對工作‘;、或其他類型 ?振董;且因為當噴燈之末端未=里件測之後允許雷 射’不像在曰本公開專利公報第觸…仍可發射雷 術中,去丰叙网明ΐ本公開專利公報第5-318159號所揭 險,“====,光非預期發:之: 被感,器__物品,喊工^^或其他可 .在曰本公開專利公報繁==貞_攸接近工作部件。 具有兩麵測II,因此噴㈣有-1號巾所揭露的噴燈,因為 協調及維持是相當困難I广、有㈣構造,而兩種感應器之間的 【發明内容】 200812737 置,供—種高度安全的手持式雷射處理裝 用該雷^理裝^雷作部件的相對位置’並提供使 傳送㈣光,括:-光學傳送部’用以 簡彳湯處理。該發光單元包括-㈡ 用以在位於該倾域末端;—聚焦鏡片, 第一電路,肋抑_ϊΐ規疋麟的焦點處發出該雷射光;一 針與該工作部件之^:供_雜針且糊輸人—基於該探 玫田、,Γ 間的距離而改變的訊號以計算距離·-第-雷 工作部件技n早,部件_感應器在雷射處理之前债側 及工距i在雷射處理過程中偏工料 探針及工作部件之間的接 全的預期雷射光發射的可能性,因而可獲得高度安 件之電電容感應探針,喊係依據探針及工作部 容之偵測訊’該訊號可為探針及卫作部件之間的靜電電 可且以為一過電流(〇vercurrei_*應器之探針,該探針 而ΐ應益線圈,而訊猿係依據探針及工作部件之間的距離 而改^該訊號可為感應線圈之阻抗之_訊號。⑽距離 上。、4狀况為將用以指示雷射發射之f動開關設置於嗔燈主體 亦可將用以指示雷射發射之腳踏開關設置於噴燈主體附近之 9 200812737 位置上 關設置在噴燈主體 或噴;個裳置停機的安全開 按照本發明的一種雷射處 件,探針,及_工作部=測 驟: 探針 兀以將供應至該工作部件;^ ^ 而:用控制單 盪器观發電流至藉以獲得:η兀以增加雷射振 在彼此相距-規定距離範圍内之位置上卩件=位 地進行該雷射處理。 师城疋距知_時,持續 J化發光單元構造、減少發光單元成;且提; 【實施方式】 本發明的實施例將於後參照 _ 照本發日 雷4為顯示按照本發明實施例1藉由 發财關之雷顧縣置的雷織理控ί’ 的範^ 細示設定C/V電壓輸出的偵測訊號位準之範圍 10 200812737 .在如圖i所不之本貫施例之雷射卢柿狀里士 11輸出的雷射光經由光纖或其他光“ j’、從雷射振盪器 係從喷燈主體1〇〇之末端發射出如^傳达’而雷射光6 中’係將錐形圓柱握把外罩絕緣部3貼^ ^=燈主體100 導體所形成以作為工作部件偵 々丄握把外罩1 ’而將由一 針4設置於握把外罩絕緣部3之端%,U感應器的感應探 …噴燈。在握把外罩!内侧,放置針4也可作為 的中央軸及雷射光的光學軸彼此—致了 j ’+使件握把外罩1 ,端-規定轉的位置上之聚焦鎊奢观主體·之末 _射振盡器11輪出並藉由光學傳片ϋ、立的焦點處,發射從雷 由磨平金屬所組成的工作部达 =射光6。可藉由將 作部件2〇進行雷射處理。°又置於,、、、點U焦位置)上而對工 將賀燈主體100連接到虛理$ Μ .程中及其他時間時依需在雷射處理過 理位置十由4(=的4末端饋入至工作部件20的處 射缝器1卜令冷;東器14冷卻噴燈主體及雷 於噴燈主體KK)、!·、呆+1^可精以啟動雷射發射之手動開關5設置 體100係以如此方式配置。 1由連接ί ίί 5連接到處理裝置控制單元8,將 出75及^觸電谷偵測電路7所輸出之C/V電壓輸 主體理裝_單元8。在喷燈 理袋置控制=置=有腳踏開關16’而腳踏開關16連接到處 用,故操腳踏開關16具有與手動開關5相同的功 射發射'。' 、a使用腳踏開關16取代手動開關5來啟動雷 器7設有:⑴第—電路,用以藉由侧振盡 测量靜雷ϋ木十、,及工作部件20之間施加交流電流訊號,以 間的距變^^用^^則基於感應揲針4及工作部件20之 、靜包電谷Cx,以及根據靜電電容&來計算感 11 200812737 及工作部件20之間的距離;以及(2)第二電路 ,交 導出的電紐C/V放大器72放大, 73而被轉換到C/v電壓輸出75作為直流電壓 V ^換益 3^^置控解元8。靜電電容Cx根據感應探i 4 作缓:’且c/v輕輸出75隨著感應探針4 /Γ ° a 之間的距離減少而增加,如圖3所示。 ?〇=ii二==觸感應探針4的物;二?:? 所偵測到触與縣接觸期間 的材料及/或形狀來設定c/v電壓$作部件20 屬接觸時,可將雷射發成即,在感應探針^ 光之照射而增加安全性開啟’操作員因此可免於雷射 由利用工作部件2G脖^ 7射處理過財的㈣位置,也可藉 75的偵測訊號位準作61之焦f位置時之c/v電壓輸出 訊號位準之蚊範mi。’來蚊c/v電壓敝75的偵測 訊號地監測外部連鎖訊號9,該外部連鎖 關於用叫叫操作㈣著保翁技其他安全措施的訊 12 200812737 ι〇,] 定接觸偵測電壓輸出76的補、則;^啟日守,處理衣置控制單元8判 «ίί =破F全 明。…、η歹1中如同則逑设計的雷射處理裝置的操作說 工作部件2Q接^就定位且感應探針4與 的結果到處理裝置控制單;觸偵測電壓輪出76 ^,田听7处埋的預備步驟。 丨〜又J 當操作員移動感應探針4而使盆 ,靜電餘Cx根據•摸斜4芬、脱f與工作部# 20之翻 職私針4及工作部件20之_距編 進行j他雷射處理的預備步‘,又件必要輪出的程度^ 時 23 200812737 ,Η 黃争 广· 經由c/v轉換以藉由C/V放大器72被放大, 號,並將其輪出到處理^置和I .讀輪出75以作為直流電壓訊 偵測到C/V電壓輪中^工制早凡8。當處理裝置控制單元8 判定允許產均射=,鱗纽絲®…也就是經 用下被輪出到雷射择I nX射叩7汛號10在連鎖訊號9沒有作 經由光纖或其他光m’且從雷射器11輸出之雷射光6 在距離噴燈主體L、i末端^人噴燈主體觸。 主體ωο的雷射光6經由=距離的位置上,進入喷燈 件20在聚焦位置時,、2聚焦並加以發射。當工作部 75的偵測訊號位準 J衣置控^單元8使得C/V㈣輸出 件20而進行雷射處理、。二壯=内,,此發射雷射光6到工作部 持續地監測C/V電壓!^ = 控制單元8也在雷射處理過程中 杏择作^^輸出的摘測訊號位準。 工作部件20 ϋ= 5(麵踏關16)、或是感應探針4與 準在規定範圍之外時,處^ ’且t電壓^ 75的侧訊號位 此停止將雷射發射令人 、彳工制早兀8判定不產生雷射,因 此停止並停止^輸出顺射振魅11,雷射產生藉 例。接下純述触本實施例雷射處縣置的控侧序的一個範 探針階,首先,使喷燈主體_感應 施就定位、?使傾裝置他安全措 測電壓輪出76小於規定細纽準、錢接觸偵 彼此未接觸)之狀態下,處理f ^^感應f f 4及工作部件2〇 射處理(步驟D,如圖到已完成準備雷 觸,處理裝置控制單以才與工作部件20接 物體或疋其她物’且αν電_ 75在規定伽訊號位g 14 200812737 圍之内、’仍不會將雷射發射命令訊號1G輸出到 大此可以消除非預期發射雷射光之風險。 、遺态’ 接觸偵測電壓輸出76等同或大於規定偵测 在的處理裝置控制單元8藉此開啟二射 衣置之振盥器之外部快門(未顯示),視 味,田射女王 或其相似物到工作部件20的處理地點 :Π的妨電流至藉以獲得必要輸 m驟f^。雷射 接下末敘述雷射處理程序。如圖5A , 士口 置或其他安全措施蚊 ^在彳f歧保護裝 操作員開啟丰叙d θ M Ir^」(步驟2)的狀態), 20咐進π 作件(準υ的接近狀態及距離工作部件 ^75 雷射^器聯驟句 在所有步驟中,外邱遠銷4咕η〆丄上卞件20(乂驟5)。 續地監測,1中外由處理裝置控制單元8持 裝置料龄〜^錢#U摘於肋指示操作員穿戴保護 ί #外部連鎖訊號9未在作用中時 振盪(當步手驟動踏開關16)為關閉時,下列情形會停止雷射 件20且C/ν αΛ/位準2時、或當感應探針4靠近工作部 ί ^ ^ 、 : · ' ' : 1) 接著必須重新啟^圖4中 200812737 所示之雷射處理預備階段,以錢啟動雷射處理。 理門=2,,藉由利用單-工作部件偵測探針以在雷射處 射主體100及工作部件20之間的接觸,且在雷 化主體1ίΚ)及工作部件20之間的距離’可簡 ^ Γοο 100 乂 確認噴燈主體100及工作部件20之間的接觸,接著口有 處===== 全下進行雷射處理。 、个“以田射先’而可在向度安 中為例2 °工作部件_感應器在實施例1 所Ϊ=ΓΓ_)感應器。本實施例的其他樣態與實施例1中 抑ii實施例的雷射處理裝置中,係設置過電流感應器的感應 =斜二持式發光單兀前方的工作部件^貞測感應器。i應 3„,且高頻磁場係藉由施加高頻電流至感應i圈 、驗i、、L§玉作部件在爾之_,磁通量通過丄作部件表面, 餘方向流過電磁電感,喊應線圈的阻抗改變。過電 ===㈣所造成的振盪狀態上之變化來測量距離, its減少。關财考波形的相位差係隨著感應線圈及工 ^件之間的距離減少而增加。藉由侧振幅或相位上之改變、 偵測直流電壓上之改變’可測量感應探 除使㈣f域應1作為工作料彳貞观應器、之外 理裝置的麟樣態、操作及效果與實施例1的^處 16 200812737 發光單元的維持性===,、減少發光單元成本且增加 雷射處理之前鋼=部測感應器以在 單元才會輕^出 到件接觸’處理裝置控制 程中偵測焦點ί置以之間的接觸,接著在雷射處理過 時不會發射雷射,’且當工作部件為非金屬 的雷射處理。 、不曰*路到每射光,而可進行高度安全 例。’但本發明絕非受限於上述實施 及Ah斤拍的技術靶圍中可能對本發明有許多改變,u 及錯由上述改_雷射處理裝置亦包含财發明的技Μ 【圖式簡單說明】 ,按照本發明實施例1之雷射處理裝置構造圖. 圖2為f示噴燈主體100之構造圖; α, =ίϊ示f電電容偵測電路7的c/v電壓輸出的範例圖. 理預=段的雷射處理控咖序之範姻; 田射處 控^nr按照本發明實施例1之雷射處理裝置的雷射處理 圖。圖5B為顯* c/v電壓輪出的偵測訊號大小設定範11的範例 【主要元件符號說明】 1握把裝置 2聚焦鏡片 17 200812737 3絕緣零件 4感應探針. 5手動開關 6雷射光 7靜電電容偵测電路 8處理裝置控制單元 9外部連鎖訊號 10雷射光命令訊號 11雷射振盪器’ 12處理氣體供應單元 13氣體控制電磁閥 14氣冷冷凍器 15光學傳送部 16腳踏開關. 17安全開關 18指示燈 20工作部件 71偵測振盪器 72C/V放大器 73C/V轉換器 74接觸偵測放大器 75C/V電壓輸出 76接觸偵測電壓輸出 100噴燈主體Sens〇r), M end has been two =: the first yag laser spray or contact detection device disclosed in the former # and ί 日 patent publication No. 2002-239771, used at the beginning r : and ====== Rational: When the county is made, the _ _ ί ί ί 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 才 m When these torches can also be used as parts, YAGlttl^rf _2·239771 discloses a spray i, in which when a visible TM is turned on, a visible light detector is used as the first at the same time, and the laser is processed by the town. In the place, to detect in, as the second miscellaneous 'in the lion _ work department; the haircut issued by the place = 200812737 is in the limit and J1 as the parts are no longer in each other. When the work shirt is hidden, and the parts are measured inside the dry circumference, YAG ★ can be emitted. The good package senses whether the material of the component is metal: the work is decided before the non-treatment; the YAG laser light is emitted, the second is the field, and the operation limit switch determines whether it is within the detection range. The component is located in the proximity sensor report , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Or other types? Zhen Dong; and because the laser is allowed to pass after the end of the torch is not tested, it is not like in the 公开 公开 公开 仍 仍 仍 仍 仍 仍 仍 仍 仍 仍 仍 仍 仍 仍 仍 仍 仍 仍 仍 , , 丰 丰 丰Bulletin No. 5-318159, "====, light is not expected to be issued: it is: sensation, device __ article, shouting ^^ or other can. In this 公开 公开 公开 繁 = 贞 ==贞_攸 Close to the working part. With two-sided test II, therefore, the spray (4) has the blower light exposed by the No.-1 towel, because coordination and maintenance are quite difficult, I-wide, and (four) structure, and the contents of the invention between the two sensors 200812737, for a highly secure handheld laser processing device with this lightning device ^ The relative position of the component is provided and the transmission (four) light is provided, including: - the optical transmission portion is used for the processing of the soup. The illumination unit includes - (2) for being located at the end of the tilting region; - the focusing lens, the first circuit, The laser light is emitted from the focus of the 肋 ϊΐ 疋 疋 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Distance·------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- The possibility of obtaining a highly capacitive electrical capacitance sensing probe, the shouting is based on the detection of the probe and the working part. The signal can be an electrostatic electricity between the probe and the guard component. Overcurrent (〇vercurrei_* probe of the probe, the probe is the coil of the benefit coil, and the signal is changed according to the distance between the probe and the working part. The signal can be the signal of the impedance of the induction coil. (10) Distance. 4 conditions are the switch settings that will be used to indicate the laser emission. The main body of the xenon lamp can also be disposed at the position of the lamp body or the spray at the position of the 2008 12737, which is disposed near the main body of the torch, and is safely opened according to the present invention. Piece, probe, and _work = test: the probe 兀 will be supplied to the working part; ^ ^ and: use the control unit to observe the current to obtain: η 兀 to increase the laser vibration in the distance from each other - performing the laser processing at a position within a predetermined distance range. When the distance is _, the configuration of the illuminating unit is continued, and the illuminating unit is reduced; and an embodiment is provided. The example will be described later in accordance with the present invention. In accordance with the first embodiment of the present invention, the detection of the C/V voltage output is set by the specification of the Leiwei control ί' The range of the test signal level is 10 200812737. The laser light output from the laser-like persimmons 11 in the present example of the present example is via fiber optics or other light "j', from the laser oscillator The end of the lamp body 1 发射 emits a signal such as ^transmitting 'and the laser light 6' The tapered cylindrical grip cover insulating portion 3 is attached to the main body of the lamp body 100 as a working member to detect the grip cover 1' and the needle 4 is disposed at the end of the grip cover insulating portion 3, U is induced Inductive detection of the device... blowtorch. In the grip cover! On the inside, the placement of the needle 4 can also be used as the central axis and the optical axis of the laser light to each other - causing the j '+ to make the grip of the cover 1 , the end - the position of the specified position of the focus on the luxury of the main body · the end of the vibration The device 11 rotates and emits the working portion composed of the polished metal from the mine by the optical transfer film and the focus of the vertical light. The laser processing can be performed by the component 2〇. ° is placed at the position of , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 4 end feeding to the working part 20 where the slitter 1 is cold; the east 14 cooling the main body of the blowtorch and the main body of the blowtorch KK), !·, +1 ^ can be fine to start the laser switch 5 The setting body 100 is configured in this manner. 1 is connected to the processing device control unit 8 by the connection ίίί 5, and the C/V voltage source main assembly_unit 8 outputted by the 75 and ^ electric valley detecting circuit 7 is output. In the blower control control = set = there is a foot switch 16' and the foot switch 16 is connected to the place, so the foot switch 16 has the same power emission ' as the manual switch 5. ', a uses the foot switch 16 instead of the manual switch 5 to activate the lightning device 7 is provided with: (1) a first circuit for measuring the static lightning raft ten by the side vibration, and applying an alternating current signal between the working components 20 The distance between the two is based on the induction pin 4 and the working component 20, the static electricity valley Cx, and the distance between the sensor 11 200812737 and the working component 20 according to the electrostatic capacitance & (2) The second circuit, the derived circuit C/V amplifier 72 is amplified, 73 is converted to the C/v voltage output 75 as the DC voltage V^, and the control solution 8 is set. The electrostatic capacitance Cx is slowed according to the inductive probe i' and the c/v light output 75 increases as the distance between the inductive probes 4 / Γ ° a decreases, as shown in FIG. ?〇=ii===Touch the sensor 4; Second? :? When the material and/or shape during contact with the county is detected to set the c/v voltage for the contact of the component 20, the laser can be generated, and the safety of the sensing probe is increased. 'The operator can therefore avoid the (4) position of the laser that has been processed by the 2G neck of the working part, or the c/v voltage output signal position when the position of the detection signal of the 75 is 61. The quasi-mosquito fan mi. 'Detection signal of the mosquitoes c/v voltage 敝75 monitors the external chain signal 9, the external chain is about the use of the call operation (4) the other security measures of the insurance technology 12 200812737 ι〇,] fixed contact detection voltage output 76's supplement, then; ^ start the day, handle the clothes control unit 8 sentence «ίί = broken F full Ming. In the operation of the laser processing device, as in the case of η歹1, the working part 2Q is connected and the result of the sensing probe 4 is connected to the processing device control list; the touch detection voltage is rotated 76 ^, Tian Listen to the preliminary steps buried in 7.丨~又J When the operator moves the sensor probe 4 to make the basin, the static residual Cx is based on • slanting 4 fen, detaching f and working part # 20 翻 私 私 4 and working part 20 The preparatory step of laser processing, and the extent to which it is necessary to turn round ^ 23 200812737, Η Huang Zhengguang · via c/v conversion to be amplified by C/V amplifier 72, number, and turn it out to processing And I. The read-out 75 is used as a DC voltage signal to detect the C/V voltage wheel. When the processing device control unit 8 determines that the allowable production is equal to, the scales are ..., that is, after being used to rotate to the laser to select the I nX, the number 7 is not used in the chain signal 9 via the optical fiber or other light m. 'And the laser light 6 output from the laser 11 is touched at the end of the burner body L, i. The laser light 6 of the main body ωο passes through the position of the distance, enters the burner unit 20 at the focus position, and is focused and emitted. When the detection signal level of the working unit 75 is set, the control unit 8 causes the C/V (four) output unit 20 to perform laser processing. Two strong = inside, this launches the laser light 6 to the working part to continuously monitor the C/V voltage! ^ = Control unit 8 also selects the signal level of the output of the apricot during the laser processing. When the working part 20 ϋ = 5 (face step 16), or when the sensing probe 4 is outside the specified range, the side signal of the voltage '^ and the voltage ^ 75 stops to emit the laser. The system determines that no laser is generated, so stop and stop the output of the fascination, and the laser produces a borrowing. Next, a vane probe step of the control side sequence of the laser station in the embodiment of the present embodiment is first described. First, the main body of the burner is positioned to sense the position, and the tilting device is safely measured. In the state of fine contact, money contact and mutual contact, the processing f ^ ^ sensing ff 4 and the working part 2 smashing processing (step D, as shown in the figure, the preparation of the lightning touch, the processing device control list is only working with The component 20 is connected to the object or the other object' and the αν electric_75 is within the range of the specified gamma bit g 14 200812737, 'the laser emission command signal 1G will not be output to the greater extent to eliminate the unintended emission of the laser light. The risk of the contact detection voltage output 76 is equal to or greater than the external detection shutter (not shown) of the vibrator that is required to be turned on by the processing device control unit 8 (see not shown), depending on the taste, the field queen Or the similarity to the processing location of the working component 20: Π 妨 至 至 至 以获得 以获得 以获得 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 In the 彳f differential protection installation operator open the rich d θ M Ir^" (state of step 2)), 20 π π workpiece (proximity of the υ 及 and distance working part ^ 75 laser ^ 联 骤 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在The upper member 20 (step 5). Continued monitoring, 1 inside and outside by the processing device control unit 8 holding the device age ~ ^ money #U picking the rib to indicate the operator wear protection ί # external interlocking signal 9 is not in effect When the oscillation (when the stepping switch 16) is off, the following conditions will stop the laser 20 and C/ν αΛ/level 2, or when the sensing probe 4 is close to the working part ί ^ ^ , : · ' ' : 1) Then you must restart the laser preparation preparation phase shown in 200812737 in Figure 4 to start the laser processing with money. Gate = 2, by using a single-working component detection probe to contact the contact between the body 100 and the working component 20 at the laser, and the distance between the lightning body 1 and the working component 20'简^ Γοο 100 乂 Confirm the contact between the torch body 100 and the working member 20, and then the laser is processed all the way down =====. For example, "Taiwan first" can be used as an example 2 ° working part _ inductor in the embodiment 1 Ϊ = ΓΓ _ sensor. The other aspects of this embodiment and the embodiment 1 ii In the laser processing apparatus of the embodiment, an inductive sensor of the overcurrent sensor is provided, and a working component in front of the oblique dichroic illumination unit is provided. i should be 3 „, and the high frequency magnetic field is applied by applying a high frequency. The current reaches the induction i-turn, the test i, and the L§ jade component are in the _, the magnetic flux passes through the surface of the component, and the remaining direction flows through the electromagnetic inductance, and the impedance of the coil is changed. Over-current === (d) The change in the oscillation state caused by the measurement to measure the distance, which is reduced. The phase difference of the waveform of the closed test increases as the distance between the induction coil and the workpiece decreases. By detecting the change in the amplitude or phase of the side, detecting the change in the DC voltage, the measurable sensing can be used to make the (f) domain 1 as the working material, the lining state, the operation and the effect of the external device. The maintenance of the light-emitting unit of the embodiment of the invention is as follows: ===, the cost of the light-emitting unit is reduced, and the steel is measured before the laser treatment, and the sensor is touched to the touch of the device. The detection focus is set to the contact between the two, and then the laser is not emitted when the laser is processed, 'and when the working part is non-metallic laser processing. There is no way to go to every light, but to be highly secure. 'But the present invention is by no means limited to the above-mentioned implementation and the technical target of the Ah Jin shot may have many changes to the present invention, and the above-mentioned modified laser processing apparatus also includes the technology of the invention. Fig. 2 is a structural diagram of the torch body 100; α, =ίϊ shows an example of the c/v voltage output of the capacitor detecting circuit 7. The laser processing of the laser processing device of the pre-segment is controlled by the laser processing device of the laser processing device according to the first embodiment of the present invention. Figure 5B shows an example of the detection signal size setting mode 11 of the *c/v voltage rotation. [Main component symbol description] 1 grip device 2 focusing lens 17 200812737 3 Insulation part 4 induction probe. 5 manual switch 6 laser light 7 electrostatic capacitance detection circuit 8 processing device control unit 9 external interlocking signal 10 laser light command signal 11 laser oscillator '12 processing gas supply unit 13 gas control solenoid valve 14 air-cooled freezer 15 optical transmission part 16 foot switch. 17 safety switch 18 indicator light 20 working part 71 detection oscillator 72C / V amplifier 73C / V converter 74 contact detection amplifier 75C / V voltage output 76 contact detection voltage output 100 torch body

Claims (1)

200812737 十、申請專利範圍: 1.種雷射處理裝置,包括: 二,學,送部,用以傳送雷射光;及 光到-&該光學傳送部接收該雷射光’且發射該雷射 光】工作邛件以進行雷射處理, 該發光單元包括: 一噴燈主體; 二^作部件_探針,設置於該喷燈主體之末端; 點處光用以在位於距該喷燈主體之末端規定距離的焦 工作部基於來自該探針的訊號而偵測該探針與該 針盥’用以根據該工作部件與該探針之接觸以及該探 、十工作邛件之間之距離,而控制該雷射光的產生。 2·如申請專利範圍第丨項之 ,^ ^ 件,接觸時才會產生= 申明專利範圍第1或第2 j頁之雷射處理裝置,苴中 該探針為一靜電電容感應器之探針;及 ’、 探針該1作部件之間的距_改變之該訊號,為該 抓^、該υ件H該靜電電容的细描號。 ^申請專利範圍第1或第2項之雷射處理裝置,其中 δ亥探針為一過電流感應器之探針; 該探針具有一感應器線圈;及 針f該工作部件之間的距離而改變之該訊號,為該 感應态線圈的阻抗之偵測訊號。 以/干tlttf ϋ第1或第2項之雷射處理裝置,其中係將用 以才曰不雷射發射之手動開關設置於該噴燈主體。 19 200812737 6·如申明專利範圍第1或第2項之 以指示雷射發射之腳踏開於該噴燈主體位置中^^用 利H第1或第2項之f射處理裝置,其中係將用 關設置於該噴燈主體或該喷燈主體附近 8.—種雷射處理方法,包括: 中们匕奴,一雷射處理預備階段及一雷射處理程序階段,其 該雷射處理預備階段包括下列步驟· 工作至—工作轉侧骑,賴繼探針及 工作該接觸時,視需要·—控制單元以供應氣體至該 要輸Sim元以增加發電流至藉以獲得必 該雷射處理進行階段包括下列步驟: 規定及該工作部咖 雷射該ϊ制單秘收到雷射發射命令時,產生雷射光以啟動 離範Si作探針及紅作部件之_距離在該規定距 乾国内蚪,持續地進行該雷射處理。 疋Ε 十一、圖式: 20200812737 X. Patent application scope: 1. A laser processing device, comprising: two, a learning, a sending portion for transmitting laser light; and a light to -& the optical transmitting portion receiving the laser light and transmitting the laser light a working element for performing laser processing, the lighting unit comprising: a burner body; a second component _probe disposed at an end of the burner body; the point light is located at an end from the torch body The focal working portion of the predetermined distance detects the probe and the butt ' based on the signal from the probe for the contact between the working member and the probe and the distance between the probe and the ten working piece. Control the generation of the laser light. 2. If the scope of the patent application is not included in the scope of patent application, the laser processing device of the first or second page of the patent scope will be generated. The probe is an electrostatic capacitance sensor. The needle; and the signal of the distance _ change between the components of the probe are the fine-grained numbers of the electrostatic capacitance of the clamp and the component H. ^The laser processing apparatus of claim 1 or 2, wherein the Δ海 probe is a probe of an overcurrent sensor; the probe has an inductor coil; and the distance between the working parts of the needle f The signal that is changed is the detection signal of the impedance of the inductive coil. The laser processing apparatus of the first or second item of the tlttf ,, wherein a manual switch for emitting laser light is provided to the main body of the burner. 19 200812737 6 · As stated in the first or second paragraph of the patent scope, the foot of the laser emission is indicated in the position of the main body of the burner, and the f-processing device of the first or second item of the item H is used. 8. A laser processing method disposed on the main body of the burner or near the main body of the burner, comprising: a slave, a laser preparation stage and a laser processing stage, the laser processing preparation stage Including the following steps: work to - work to the side ride, Lai Ji probe and work contact, as needed - control unit to supply gas to the Siyuan to be increased to increase the current to obtain the necessary laser processing The stage includes the following steps: stipulations and the work of the Ministry of the Department of Labor, when the single secret receives the laser emission command, the laser light is generated to start the off-axis Si as the probe and the red component. Oh, the laser processing is continuously performed.十一 XI, schema: 20
TW096130845A 2006-08-21 2007-08-21 Laser processing device and laser processing method using same TW200812737A (en)

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JPWO2018216275A1 (en) * 2017-05-24 2020-04-02 パナソニックIpマネジメント株式会社 Capacitance type height sensor, laser processing nozzle using the same, and laser processing apparatus
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Publication number Priority date Publication date Assignee Title
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