200809281 九、發明說明： 【發明所屬之技術領域】 本發明係有關於—種光傳輸人 構，該光傳輸結構係由縣 u基板之結 且於該第-光傳導材料傳導材料編織成一體， 成，復可形成有線路增層社構，士，…4斤構 電路板。， …。構’以構成具有光傳輸結構之 【先前技術】 /隨^電子產業的蓬勃發展，電子產品亦逐漸邁入多功 能的研發方向。為滿足半導體封裝件高積集度 提供/:atlon以及微型化(Miniaturizati〇n)的封裝需求， ，數主、被動元件及線路載接之電路板（circuit Board)亦逐漸由單層板演變成多層板（m Board)。 y 社者:半導體技術之發展曰新月異’除以往講求外形 續短小之封裝外’並且對於資料的儲存容量也逐 ^提昇。除此之外’由於資料的處理量愈來愈大，以相同 Z在單位時間内能最快的速度處理完成，則能展現更高 、处理效率。而提高半導體處理速度最直接的方法即提高 使，頻率，但在資料傳輸達到Gb/s以上時，則面臨高功率 之$熱、讯號時間延遲、電磁干擾（EMI)等瓶頸，對於更高 险此之半導體的製作則愈加困難。尤其傳統以來-直以銅 線=作為資料訊號傳送之媒介的方式，則受材料本身先天 之導電特性的限制’該能達到料電性能有限，因此訊 19513 5 200809281 號傳送的速度難以藉由提高導電性的方式提昇。 —再者，以金屬線材傳送訊號的結構，在傳輪過程中容 易叉外界雜訊的干擾或内部線路之間的干涉，使得訊號在 傳送過耘中因干擾及干涉而造成訊號傳送錯誤的情況γ因 此吼號傳送的結構必須要有相當的防護措施，以防干榫戋 干涉對傳輸訊號產生影響，尤其在高頻傳送中更為明：： :此種防護措施對於電路設計則造成相當程度的困難度及 頜外的結構設計，故難以突破現有的狀況。 又傳統訊號傳送的方式係以電流通過導體的類比式 ^虎傳达’而在各電路内部之訊號處理的方式現在多為數 位式處理，而在訊號傳送過程中經過轉換則容易造成失真 為解決傳統電訊號傳輸結構的缺失，新技術係用2 訊说取代電訊號傳輸方式，最明顯的效果係光訊號幾乎巧 受電磁波的干擾，因此訊號傳送品質較佳，以降低訊號f :時導致失真的情況，並且可減少設計防電磁波干擾二 構。故以光作為訊號傳送的方式已成為未來發展的方向。 圭如弟1圖所示之美國專利公告第6,839,476號即為一 =光作為訊號傳送之電路板，係於—底層n上形成有一 :12於該4層12上形成有複數個溝槽仏，而在該讀 曰a中置入—光纖13(0ptical fiber)，再於該芯層12 面形成-頂層…俾以將光纖13埋在芯層12之中，其上中 之光纖13係於—纖核13a(c〇re)外包覆纖殼 13b⑷adding)。_在錢13的㈣裝設紐射、接收模 19513 6 200809281 組、光被動元件及連接器等 免除電訊號傳送之缺失。 藉由光纖13傳送光訊號，以 然而該光纖13係埋置在芯層12溝 該芯層12必須先經過開曰 ，因此 ㈣内。而該光織13置二光纖13置入溝 2作，有如客知電路板插裳電子元件之插 = 之連接對準性較差，製造速度緩慢，而無法達到二 f的。又，由於光纖13係置於尺寸較大溝槽12a 外士纖13佔據的空間較大’致使最終形成的封|結構體 積增大而不易於微型化。 再者，該光纖13必須依相對應的溝槽12a長度先進 行裁切，然後再將光纖13置於溝槽12a中，使其在"製程中 又夕一道加工製程，因而增加製作的困難度；且光纖Η 的長度不-，故增加製程分類的複雜度，使得整體㈣每 增加，且複雜度提高。 V ^ * 而在芯層12上形成溝槽12a再置入光纖13，於尺寸 設計上因溝槽12a與溝槽12a之間必須保持相當的間隔， 方可將光纖13定位在芯層12中，而間隔大小即影響佈線 '丄度’並且佈線您度受到光纖13線徑大小的影燮，因此無 法達到高密度佈線之目的，相應的使得最終形成的封穿尹 構之頻道數量受到限制。 衣" 此外，該用以傳導光訊號的光纖13係於一纖核13& 外包覆纖殼13b，而可藉由包覆在纖核l3a外面的纖殼i3b 内層作為反射面’使光訊號藉由纖殼13b内層不斷向前反 19513 7 200809281 射以達傳送訊號的目的。而該光纖13與電路板係為不同的 製程結構，故必須以另外的獨立製程製作，同樣會增加製 程整體的困難度’且整合兩種不同製程的產品即增加困難 度。 、 因此，如何提供一種種符合電子裝置輕薄短小需求、 減小訊號傳遞損失、縮短導電路徑、減少雜訊等問題，以 及提升光電訊號傳輸品質、簡化製程、降低製程難度、提 升佈線密度、及提升量產性之光電路板嵌埋光電元件結 構’實為目前業界亟欲解決的課題。 【發明内容】 鑒於習知技術的缺失，本發明之主要目的，係在提供 一種光傳輸結構及其埋入基板之結構，得以符合電子裝置 輕薄短小需求。 ^ 本备明之另-目的，係在提供一種光傳輸結構及其埋 入基板之結構，得以簡化製程、降低製程難度及提升量產 性0 埋 本發明之又-目的，係在提供一種光傳輸結構及其 入基板之結構，得以提升佈線密度。 之基材 本發明之又 本％明之又-目的，係在提供—種光傳輸結構及其埋 該光傳輸結構係為預浸材，俾以增加該基 撐強度’ ^'該光傳輸結構係可為基板增層或核心層 Λ 目的，係在提供一種光傳輸結構及其埋 入基板之結構，得以縮鉬 β 里 、’、Λ唬傳輸路徑以降低訊號傳遞損 19513 8 200809281 失’並減少雜訊及提升光電訊號傳輸品質。 /為達上述及其他目的，本發明提出—種 二包括*複數第一光傳導材料，係經由編織而成：體°;以 及弟一先傳㈣料，係包覆該第—光 一預浸材㈣叫），該第一光傳導材料可傳 增加該光傳輸結構之支撐強度。 了傳輪《 ’亚可 本& '另提供-種光傳輸結構’係包括複數非光傳 材肢至：一第一光傳導材料，係經編織而成-編織體； 材料，係包覆該第一光傳導材料及非光傳 :::所編織成之編織體表面以構成_預浸材〜eg)之 光傳輸結構。 d傳輸結構復可包㈣—線路增層結構，係形成於 ^二光傳導材料表面’且該線路增層結構表面形成有複 電性連接墊’胁該光料結構及線路增層結構中形成 有至v私鍍士通孔(PTH)或導電盲孔；該線路增層結構 _ 2I括有；,i層、疊置於該介電層上之線路層以及形成於 2電層中之導f結構；又可於該線路增層結構表面形成有 防焊層’且該防焊層中形成有複數個開孔，俾以顯露線 路增層結構之電性連接墊。 、、、该第一光傳導材料係例如為光纖或有機光傳導材 料，又該第二光傳導材料係為有機樹脂材料，且該第一光 傳導材料之折射率係大於該第二光傳導材料之折射率。 本發明復提供一種光傳輸結構埋入基板之結構，係包 括· 一基板，該基板形成有至少一開口，·以及至少一光傳 19513 9 200809281 輪結構，係容置於該開口中，該光傳輸結構係由複數第一 先傳導材料編織成一編織體，且於該編織體表 二光傳導材料。 乐 本發明之另—種光傳輸結構埋人基板之結構，係包 .一基板，該基板形成有至少一開口；以及至少一 輸結構’係置於該開口中，該 、 先傳輪〜構係由複數非光傳 =材枓及至少一第一光傳導材料經編織而成一編織體，且 >於該編織體表面包覆有第二光傳導材料。 該光傳輸結構埋人基板之結構復包括於該第二 二才該基板表面形成有線路增層結構，且該線路 二面：成有複數電性連接墊，並於該基板及線路 二二，中形成有至少—電鍍導通孔(ΡΤΗ)或導電盲孔， 增層結構表面形成有—防焊層，且該防焊層中 個開孔，俾以顯露線路增層結構之電 之=層結構係包括有介電層、疊置於該介電層上 及形成於介電層中之導電結構；該 構係利用線路增層製程或璧合〕 曰、、° 上，傀ri搂#日各 D衣私形成於該光傳輸結構 俾以構成-具有光傳輸結構之電路板。 本發明之光傳輸結構及其埋入基板之 光訊號用之第一光俚露分^ 再你马傳輸 再'_織而成—體’於其表面 覆該第-光傳導材料外表面以構成本發明包 後續復可於㈣：光料材 先傳輪、-構， 構成具有光傳輸結構之電路板.2有線路增詹結構，以 电路板，或者將該光傳輸結構嵌埋 19513 200809281 f =板中，再於該基板及料輸結構表面形成有 層結構。 曰 相較於習知技術，本發明係於電路板内部直接佈設 傳輸結構而無須額外形成容置該第一光傳導材料之 從而可簡化製程，俾可降低掣 ^ 平J降低衣私難度，同時可提升線路 線之岔度、&升量產性，符合電子裝置 【實施方式】 μ展赵勢。 以下係藉由特定的具體實施例說明本發明之實施 j ’熟悉此技藝之人士可由本說明書所揭示之内容 瞭解本發明之其他優點與功效。 [弟一實施例] 面示::閱第一圖，係為本發明之光傳輸結構之剖 如第2a圖所示，提供複數第一光傳導材料化該楚 :先傳導材料係為平行編織或交互編織以成為'編織-、-，且該第-光傳導材料係為光纖或有機光傳導材料，、’ 亚不以此為限，而得依需要排列佈設；或如第2A，圖一 不，’將至少一第一光傳導材料21以及複數非光傳導材料 :1’以平行編織或交互編織以成一編織體 ‘ 料21’係為纖維強化材料。 卜尤傳^材 編键2 Μ所示，於該第一光傳導材料21所編織成之 、A體表面形成一第二光傳導材料22以構成一預浸 (Prepreg)之光傳輪結構2;或如2B，圖所示，係將至少— 一光傳導材料2丨及複數非光傳導材料21，以平行編^或弟 19513 11 200809281 j互編織以成—編織體，再將該編織體浸人第 =，：該第二光傳導材料22包覆該編織： 士 w又rePreg)，前述該第二光傳導材料22 .樹m該編_相浸於 導_為有機 俾使光係大於該第二光傳導材料22之折射率， 早使先訊號传以在弟一光傳導材料21中折導。 明麥閲第2C’ ’復可於該第二光傳料2 =二增層結構23’該線路增層結構23係之表面 層231上之線路層232二： 形成有禮數♦ έ 、°構233 ’且該線路增層結構23表面 ^^知數笔性連接墊234;復可於該線路增層結構23上 俾層24’且該防焊層24中形成複數個開孔 = 結構之電性連接塾Μ且該線路增層 增層製程缝合製程形成於該第二光 界所周知之製程技術，其非本案技術特徵二 23二^二圖所示，於該光傳輸結構2及線路增層結構 以電性導電f孔（圖未示），俾 接4傳輸、、，口構2兩表面之線路增層結構23，且 ^路增層結構23表面形成有電 增層結構23表面形成有一防禪層24，又該防焊層 中形成有複數個開孔240’俾以顯露線路增層結構之電 19513 12 200809281 性連接墊234。 本發明復提供一種光傳輸結構2，係包括複數第—光 傳導材料21 ’係經由編織而成一體；以及第二光傳導材料 • 22,係包覆該第一光傳導材料21表面以構成該光傳輪結構 2 ° 本發明另提供一種光傳輸結構2，係包括複數非光傳 導材料21’及至少一第一光傳導材料21，係經編織而成一 編織體；以及第二光傳導材料22，係包覆該第一光傳導材 ⑩料21及非光傳導材料21，所編織成之編織體表面以構成一 預浸材（Prepreg)之光傳輸結構2,該第一光傳導材料21可 供傳輸訊號，並可增加該光傳輸結構2之支撐強度。 再者，於該第二光傳導材料22之表面復可形成有線 ，增層結構23,該線路增層結構23係包括有介電層231、 畳置於該介電層231上之線路層232以及形成於介雷爲 231中之導電結構233,且該線路增層結構23表面开^有 _複數隸連接墊234,另於該線路增層結#23上復可設有 一防焊層24,又該防蟬層24中具有複數個開孔24〇,俾以 顯露線路增層結構23之電性遠接 值於处拔—而 又色良運接墊234,並構成一具有光 …电路板；本發明巾之光傳輸結構2進行光 说5虎傳輸時，可難由七φ -#值=、 該第—光傳導材料21表面之第 傳導材料2^ Μ内側作爲反射面，使光訊號藉由該第一光 中，該光傳於内Λ不斷向前反射以達到傳送訊號之目的；其 板材，如其“構2係可依製程需要而為電路板之任一層 板材如基板增層或核心層之基材，其實施不以本實施例 19513 13 200809281 為限。 [弟一實施例] ^凊芩閱第3A至3C圖，係為本發明之具光傳輸之基板 一構及八衣去第二實施例之剖面示意圖，與前一實施例不 同處^於該光傳輪結構係形成於—基板之開口中。 明 > 閱第3 A圖，提供一基板3，且該基板3具有至少 開口 30 ’該基板3係為一絕緣板、陶瓷板、兩層 電路板。 曰 一凊麥閱第3B圖，於該基板3之開口 3〇中接置一光傳 輸結構2,而該光傳輸結構2係由複數第一光傳導材料21 平^編織或交互編織以成一編織體，且於該編織表面包覆 有第光傳$材料22;或如第犯，圖所示，該光傳輸結構 2:係由複數非光傳導材料21，及至少—第—光傳導材料η 平行、、扁織或父互編織以成一編織體，且於該編織體表面包 覆有第二光傳導材料22。 請參閱第3C圖，接著於該基板3兩表面之第二光傳 導材料22上形成線路增層結構23，該線路增層結構^係 包括有介電層231、疊置於該介電層231上之線路層232 以及形成於介電層231中之導電結構233，並於該基板3 及線路增層結構23中可形成電鍍導通孔（PTH)25或導電盲 孔（圖未示），俾以電性連接該基板3兩面之線路增層結%構 23，且該線路增層結構23表面形成有複數電性連接墊 234 ,復於該線路增層結構23表面形成有一防焊層24,又 該防焊層24中形成有複數個開孔240,俾以顯露線路增層 19513 14 200809281 結構之電性連接墊234。 本务明復揭不-種具光傳輸之基板結構，係包括有 板3’該基板3形成有至少_開口3();以及至少—光= ^構2’係置於該開口 3G中’該光傳輸結構2係為複= -光傳導材料21平行編織或交互編織以成—編織體，且於 該編織體表面包覆有第二光傳導材料。 、 本發明另揭示-種具光傳輸之基板結構，係包括 板3，該基板3形成有至少_開口 3q ;以及至少傳^ 結構2’係置於該開口料，該光傳輸結構2係由複t 光傳導材料21’及至少-第—光傳導材料21平行編織= 互編織以成-編織體’且於該編織體表面包覆 導材料22。 寻 又於該基板3表面及第二光傳導材料22表面形成有 線路增層結構2 3 ’該線路增層結構2 3係包括有介雷爲 加、疊置於該介電層231上之線路層232以及形成介電 _層23i中之導電結構233,且該線路增層結構23表面形成 有複數電性連接墊234;另於該基板3及線路增層結構^ 中形成有電鍍導通孔（PTH)25或導電盲孔（未圖示），俾以 電性連接位於基板3兩表面上之線路增層結構23;又於, 線路增層結構23表面復可形成有一防焊層24，又該防焊Λ 層24中形成有複數個開孔240，俾以顯露線路增層結構之 電性連接墊234，並構成一具有光傳輪結構之電路板；其 中，該光傳輸結構2係嵌埋於該基板3中，該光傳輸結構 2及該基板3係可依製程需要而為該電路板之任一層板 19513 15 200809281 材，如基板增層或核心層 因此，本發明之材’並不以本實施例為限。 4么明之先傳輸結構 為傳輸光訊號用之第一光傳 八土板之結構，係 ，其表面再形成有第二…i 編織而成一體，於 完全包覆該第-光傳導材料外二=第二光傳導材料 結構;後續復可於該第二光傳==發明之光傳輪 構，以構成具有光傳輸結構之電路板；或^線路增層結 構嵌埋在-基板中，再於該幹構^先傳輸結 ，線路增層結構。 ㈣輪⑺構表面形成有 電路板内部直接佈設光傳叫 _::二::形成容置該第-光傳導材料之溝 二布：：：ΓΓ’俾可降低製程難度，同時可提升線 趨勢 提升量產性’符合電子裝置微型化之發展 上述實施例僅為例示性說明本發明之原理及1功 非用於限制本發明。任何熟習此項技藝之I 士均可 鱼=背本發明之精神及範嘴下，對上述實施例進行修飾 。艾化。因此，本發明之權利保護範圍，應如後収 專利範圍所列。 【圖式簡單說明】 第1圖係為美國專利公告第6,839,476號之剖面示意 圖； 〜 第2Α至2D圖係為本發明光傳輸結構及其埋入基板之 結構之第一實施例之剖面示意圖； 19513 16 200809281 第2A’及2B’圖係為本發明光傳輸結構及其埋入基板 之結構之第-光傳導材料及複數非光傳導材料編織成一編 織體之剖面示意圖； 、第3A至3C圖係為本發明具光傳輸之基板結構及其製 法之第二實施例之剖面示意圖；以及 第3B，圖係為本發明具光傳輪之基板結構及並製法之 光傳導材料及複數非光傳導材料編織成—編織 面示意圖。 【主要元件符號說明】 11 底層 12 12a 13 13a 13b 14 2 21 22 22, 23 231 232 233 芯層 溝槽 光纖 核纖 纖殼 頂層 光傳輪結構 第—光傳導材料 第二先傳導材料 非光傳導材料 線路增層結構 介電層 線路層 導電結構 19513 17 200809281 234 電性連接墊 24 防焊層 240 開孔 25 電鍍導通孔 3 基板 30 開口 18 19513200809281 IX. Description of the Invention: [Technical Field] The present invention relates to a light transmission structure which is woven by a junction of a county u substrate and woven into the first light-conducting material conductive material. Into, complex can form a line-building community, Shi, ... 4 kg circuit board. , .... In order to form a "previous technology" with the optical transmission structure / with the booming development of the electronics industry, electronic products have gradually entered the direction of multi-functional research and development. In order to meet the packaging requirements of /: atlon and miniaturized, the circuit boards of several main and passive components and line carriers have gradually evolved from single-layer boards to meet the packaging requirements of semiconductor packages. Multi-layer board (m Board). y Society: The development of semiconductor technology is changing with each passing day, except for the past, and the storage capacity of data has been improved. In addition, the processing capacity of the data is getting larger and larger, and the same Z can be processed at the fastest speed per unit time, which can show higher efficiency and processing efficiency. The most direct way to improve the processing speed of semiconductors is to increase the frequency. However, when the data transmission reaches Gb/s or higher, it faces high power, such as heat, signal time delay, electromagnetic interference (EMI) and other bottlenecks. The production of semiconductors is more difficult. Especially since the traditional - straight copper wire = as the medium of data transmission, it is limited by the inherent conductivity of the material itself', which can achieve limited power performance, so the speed of transmission 19513 5 200809281 is difficult to improve The way of conductivity is improved. - Furthermore, the structure of the signal transmitted by the metal wire is easy to interfere with the interference of the external noise or the interference between the internal lines during the transmission process, so that the signal transmission error occurs due to interference and interference in the transmission. γ, therefore, the structure transmitted by the nickname must have considerable protective measures to prevent the interference of the interference on the transmission signal, especially in the high-frequency transmission::: This protection measures the degree of circuit design to a considerable extent The difficulty and the structural design outside the jaw make it difficult to break through the existing situation. In addition, the traditional signal transmission method is based on the analogy of current passing through the conductor. The signal processing method inside each circuit is now mostly digital processing, and the conversion is easily caused by distortion during signal transmission. The lack of the traditional telecommunication transmission structure, the new technology replaces the telecommunication transmission mode with the 2 channel. The most obvious effect is that the optical signal is almost interfered by the electromagnetic wave, so the signal transmission quality is better, so as to reduce the distortion caused by the signal f: The situation can also reduce the design of anti-electromagnetic interference. Therefore, the way of transmitting light as a signal has become the direction of future development. U.S. Patent Publication No. 6,839,476, which is incorporated herein by reference, is a circuit board for transmitting light as a signal, and is formed on the bottom layer n with a plurality of trenches formed on the four layers 12, In the reading a, an optical fiber 13 is placed, and a top layer is formed on the surface of the core layer 12 to embed the optical fiber 13 in the core layer 12, and the optical fiber 13 is attached to the optical fiber 13 The core 13a (c〇re) is covered with a shell 13b (4) adding). _ In the money (4) installed the new beam, receiving mode 19513 6 200809281 group, optical passive components and connectors, etc. to avoid the lack of transmission of electrical signals. The optical signal is transmitted by the optical fiber 13, but the optical fiber 13 is embedded in the core layer 12. The core layer 12 must first be opened and thus (4). The optical fiber 13 is placed in the trench 2, and the connection between the electronic components of the circuit board is as good as that of the connector. The connection alignment is poor, and the manufacturing speed is slow, and the two f cannot be achieved. Further, since the optical fiber 13 is placed in a large-sized groove 12a, the space occupied by the fiber 13 is large, which results in an increase in the final formed structure of the structure without being easily miniaturized. Furthermore, the optical fiber 13 must be cut according to the length of the corresponding groove 12a, and then the optical fiber 13 is placed in the groove 12a, so that it can be processed in the process of "the process", thereby increasing the difficulty of fabrication. And the length of the fiber Η is not - so the complexity of the process classification is increased, so that the overall (four) increases and the complexity increases. V ^ * and a trench 12a is formed on the core layer 12 and then placed in the optical fiber 13. The optical fiber 13 can be positioned in the core layer 12 due to the necessary spacing between the trench 12a and the trench 12a. However, the size of the interval affects the wiring 'twist' and the degree of wiring is affected by the size of the fiber 13 wire diameter, so that the purpose of high-density wiring cannot be achieved, and accordingly, the number of channels that are finally formed is limited. In addition, the optical fiber 13 for conducting the optical signal is attached to the outer core 13b of the core 13& and the outer layer of the outer shell of the outer shell of the outer core 13b is used as a reflecting surface. The signal is transmitted by the inner layer of the casing 13b continuously forwarded to 19513 7 200809281 for the purpose of transmitting signals. The optical fiber 13 and the circuit board have different process structures, so it must be manufactured in another independent process, which also increases the overall difficulty of the process. The integration of two different processes increases the difficulty. Therefore, how to provide a kind of light, short and short demand for electronic devices, reduce signal transmission loss, shorten conductive paths, reduce noise, etc., and improve the quality of photoelectric signal transmission, simplify the process, reduce the difficulty of the process, increase the wiring density, and improve The mass-produced optical circuit board embedded photoelectric element structure is a problem that the industry is currently trying to solve. SUMMARY OF THE INVENTION In view of the deficiencies of the prior art, the main object of the present invention is to provide an optical transmission structure and a structure embedded in the substrate to meet the light, short, and short requirements of the electronic device. ^ The other purpose of the present invention is to provide an optical transmission structure and a structure embedded in the substrate, which simplifies the process, reduces the difficulty of the process, and improves the mass production. The purpose of the present invention is to provide an optical transmission. The structure and its structure into the substrate increase the wiring density. The substrate of the present invention is also intended to provide an optical transmission structure and to embed the optical transmission structure as a prepreg, to increase the strength of the support '^'. The substrate may be provided with an optical transmission structure and a structure embedded in the substrate to reduce the transmission path of the molybdenum β, ', and Λ唬 to reduce the signal transmission loss 19513 8 200809281 and reduce Noise and improve the quality of optical signal transmission. For the above and other purposes, the present invention proposes that the second type includes a plurality of first light-conducting materials, which are woven by: body; and a first-pass (four) material, which is coated with the first-light prepreg. (d) Calling), the first light-conducting material can transmit the support strength of the light-transmitting structure. The passing wheel "'Accord & 'Alternatively - a kind of light transmission structure" includes a plurality of non-light-transmitting materials to: a first light-conducting material, which is woven into a braid; the material is coated The first light-conducting material and the non-light-transmitting::: the optical transmission structure of the woven body surface to constitute the _prepreg-eg). d transmission structure complex package (4)—the line build-up structure is formed on the surface of the second light-conducting material and the surface of the line-increasing structure is formed with a re-connecting connection pad, which is formed in the light-weight structure and the line-added structure. a v-plated through hole (PTH) or a conductive blind hole; the line build-up structure _ 2I includes; an i-layer, a circuit layer stacked on the dielectric layer, and a guide formed in the second electrical layer f structure; a solder resist layer may be formed on the surface of the line build-up structure and a plurality of openings are formed in the solder resist layer to expose the electrical connection pads of the line build-up structure. The first light-conducting material is, for example, an optical fiber or an organic light-conducting material, and the second light-transmitting material is an organic resin material, and the first light-conducting material has a refractive index greater than the second light-transmitting material. Refractive index. The present invention further provides a structure for embedding a light transmission structure in a substrate, comprising: a substrate formed with at least one opening, and at least one light transmission 19513 9 200809281 wheel structure, the light is placed in the opening, the light The transmission structure is woven from a plurality of first conductive materials into a braid, and the light-transmitting material is on the braid. Another structure of the optical transmission structure embedded in the substrate of the present invention is a substrate, the substrate is formed with at least one opening; and at least one transmission structure is placed in the opening, the first transmission The woven body is woven by a plurality of non-light transmission materials and at least one first light-conducting material, and the surface of the braid is coated with a second light-conducting material. The structure of the buried substrate of the optical transmission structure is further included in the second surface of the substrate, and a line build-up structure is formed on the surface of the substrate, and the two sides of the line are formed with a plurality of electrical connection pads, and the substrate and the circuit are two or two. Forming at least a plated via (ΡΤΗ) or a conductive blind via, a surface of the buildup structure is formed with a solder mask, and the solder resist layer has an opening therein to expose the electrical layer structure of the line buildup structure The invention comprises a dielectric layer, a conductive structure stacked on the dielectric layer and formed in the dielectric layer; the structure is formed by a line build-up process or a combination of 曰, °, 傀ri搂#日日D The optical transmission structure is formed in the optical transmission structure to constitute a circuit board having an optical transmission structure. The optical transmission structure of the present invention and the first optical dew of the optical signal embedded in the substrate are further disposed on the surface of the first light-conducting material to form a surface of the optical transmission structure. The invention package can be subsequently replenished in (4): the light material first transmission wheel, the - structure, constitutes the circuit board with the optical transmission structure. 2 has the line Zeng structure, the circuit board, or the optical transmission structure is embedded 19513 200809281 f In the plate, a layer structure is formed on the surface of the substrate and the material transfer structure. Compared with the prior art, the present invention directly aligns the transmission structure inside the circuit board without additionally forming the first light-conducting material, thereby simplifying the process, and reducing the difficulty of the clothing. It can improve the twist of the line, & increase the mass production, in line with the electronic device [implementation] μ exhibition Zhao potential. The following is a description of the embodiments of the present invention by way of specific examples. Those skilled in the art can understand the other advantages and advantages of the present invention. [Embodiment of the invention]: FIG. 1 is a cross-sectional view of the optical transmission structure of the present invention, as shown in FIG. 2a, providing a plurality of first light-conducting materials: the first conductive material is a parallel weave. Or interweaving to become 'woven-,-, and the first-light-conducting material is an optical fiber or an organic light-conducting material, 'n is not limited thereto, and may be arranged as needed; or as in 2A, FIG. No, 'at least one first light-conducting material 21 and a plurality of non-light-conducting materials: 1' are woven in a parallel or interwoven manner to form a braided material 'material 21' as a fiber-reinforced material. The second light-conducting material 22 is formed on the surface of the body A to form a prepreg light-transmitting wheel structure 2, which is woven by the first light-conducting material 21. Or as shown in Fig. 2B, at least one of the light-conducting material 2丨 and the plurality of non-light-conducting materials 21 are woven together in parallel to form a braid, and then the braid is Immersion ==: the second light-conducting material 22 covers the weave: 士w和rePreg), the second light-conducting material 22, the tree m is immersed in the guide _ is organic 俾 makes the light system larger than The refractive index of the second light-conducting material 22 is transmitted to the first light-transmitting material 21 by the first signal. Ming Mai Yue 2C' 'Recommendation in the second light transfer material 2 = two build-up structure 23' The circuit layer 232 on the surface layer 231 of the line build-up structure 23 is formed: a number of rituals ♦ έ, ° 233 'and the surface of the line build-up structure 23 is a plurality of pen-shaped connection pads 234; a layer 24' can be applied to the line build-up structure 23 and a plurality of openings are formed in the solder resist layer 24 = The optical connection structure is formed in the second optical field, and the circuit technology is not known in the second optical field. The optical transmission structure 2 and the line increase are shown in the second embodiment. The layer structure is electrically conductive f-holes (not shown), and is connected to the line-enhanced structure 23 of the two surfaces of the port structure 2, and the surface of the layer-added structure 23 is formed with the surface of the electric build-up structure 23 There is a tamper-proof layer 24, and a plurality of openings 240' are formed in the solder resist layer to expose the electric connection layer 234 of the line build-up structure. The present invention further provides an optical transmission structure 2 including a plurality of first light-transmitting materials 21' integrally formed by weaving; and a second light-conducting material 22 covering the surface of the first light-conducting material 21 to constitute the The light transmission structure 2 ° further provides a light transmission structure 2 including a plurality of non-photoconductive materials 21 ′ and at least one first light conductive material 21 , which are woven into a braid; and a second light conductive material 22 Covering the first optically conductive material 10 and the non-photoconductive material 21, and weaving the surface of the braid to form a prepreg light transmission structure 2, the first light conductive material 21 For transmitting signals, and increasing the support strength of the optical transmission structure 2. Furthermore, a wired, build-up structure 23 is formed on the surface of the second light-conducting material 22, and the line build-up structure 23 includes a dielectric layer 231 and a circuit layer 232 disposed on the dielectric layer 231. And a conductive structure 233 formed in the dielectric layer 231, and the surface of the circuit build-up structure 23 has a plurality of connection pads 234, and a solder resist layer 24 is further disposed on the line build-up layer #23. The tamper-evident layer 24 has a plurality of openings 24 〇, which are used to expose the electrical distance between the line build-up structure 23 and the color-good pads 234, and constitute a circuit board. When the optical transmission structure 2 of the present invention performs light transmission, it is difficult to use the seventh φ -# value =, the inner side of the first conductive material 2 Μ on the surface of the first light-conducting material 21 as a reflective surface, so that the optical signal In the first light, the light is transmitted to the inner ridge to continuously reflect forward to achieve the purpose of transmitting the signal; the plate, such as its "system 2" can be layered or laminated on any layer of the circuit board, such as the substrate, according to the needs of the process. The substrate of the core layer is not limited to the embodiment of 19513 13 200809281. [Another embodiment] ^凊芩第FIG. 3A to FIG. 3C are cross-sectional views showing a second embodiment of the optical transmission substrate and the eighth embodiment of the present invention, which is different from the previous embodiment in that the optical transmission structure is formed in the opening of the substrate. Illustrated in Figure 3A, a substrate 3 is provided, and the substrate 3 has at least an opening 30'. The substrate 3 is an insulating plate, a ceramic plate, and a two-layer circuit board. An optical transmission structure 2 is disposed in the opening 3 of the substrate 3, and the optical transmission structure 2 is woven or interwoven by a plurality of first light-conducting materials 21 to form a braid, and is wrapped on the woven surface. Covered with the first light transmission material 22; or as shown in the figure, the light transmission structure 2: is composed of a plurality of non-photoconductive materials 21, and at least - the first - photoconductive material η parallel, flat weave or father Woven to form a braid, and the surface of the braid is coated with a second light-conducting material 22. Referring to FIG. 3C, a line build-up structure 23 is formed on the second light-conducting material 22 on both surfaces of the substrate 3, The line build-up structure includes a dielectric layer 231 and is stacked on the dielectric layer 231. The circuit layer 232 and the conductive structure 233 formed in the dielectric layer 231, and in the substrate 3 and the line build-up structure 23, a plated via (PTH) 25 or a conductive via (not shown) may be formed. The circuit is connected to the two sides of the substrate 3 to form a layered structure 23, and a plurality of electrical connection pads 234 are formed on the surface of the line build-up structure 23, and a solder resist layer 24 is formed on the surface of the line build-up structure 23, and A plurality of openings 240 are formed in the solder resist layer 24 to expose the electrical connection pads 234 of the structure of the circuit layer 19513 14 200809281. The present invention does not disclose the substrate structure with optical transmission, including the board 3 'The substrate 3 is formed with at least the opening 3 (); and at least - the light = 2 is placed in the opening 3G 'the light transmitting structure 2 is a complex = - the light conducting material 21 is woven or interwoven in parallel Forming a braid and coating the surface of the braid with a second light-conducting material. Further disclosed in the present invention is a substrate structure having optical transmission, comprising a plate 3 formed with at least an opening 3q; and at least a structure 2' placed in the opening, the optical transmission structure 2 being The complex t-light conductive material 21' and at least the -first light-conducting material 21 are woven in parallel = interwoven to form a - braided body and the conductive material 22 is coated on the surface of the braid. A line build-up structure 2 3 is formed on the surface of the substrate 3 and the surface of the second light-conducting material 22, and the line-enhanced structure 2 3 includes a line with a dielectric layer added to the dielectric layer 231. a layer 232 and a conductive structure 233 formed in the dielectric layer 23i, and a plurality of electrical connection pads 234 are formed on the surface of the circuit build-up structure 23; and a plating via hole is formed in the substrate 3 and the line build-up structure ( PTH) 25 or a conductive blind via (not shown), electrically connected to the line build-up structure 23 on both surfaces of the substrate 3; further, a solder resist layer 24 may be formed on the surface of the line build-up structure 23, The solder mask layer 24 is formed with a plurality of openings 240 for exposing the electrical connection pads 234 of the line build-up structure, and forming a circuit board having a light transmission structure; wherein the light transmission structure 2 is embedded Buried in the substrate 3, the optical transmission structure 2 and the substrate 3 can be any layer of the circuit board of the circuit board 19513 15 200809281, such as a substrate build-up layer or a core layer. Therefore, the material of the present invention is It is not limited to this embodiment. The first transmission structure of the Mingming is the structure of the first light-transmitting eight-soil board for transmitting optical signals, and the surface thereof is further formed with a second...i woven into one body, completely covering the first-light-conducting material. = a second light-conducting material structure; subsequently replenished in the second light-transmitting == invented light-transmitting wheel structure to form a circuit board having an optical transmission structure; or the circuit-adding layer structure is embedded in the -substrate, and then In the dry structure, the junction is first transmitted, and the line is layered. (4) The surface of the wheel (7) is formed by directly arranging the light transmission inside the circuit board. _:: 2:: forming the groove 2 cloth:::ΓΓ'俾 which can accommodate the first-light-conducting material can reduce the difficulty of the process and increase the line trend. The present invention is merely illustrative of the principles of the invention and is not intended to limit the invention. Any of the above-mentioned embodiments can be modified by the spirit of the invention and the spirit of the invention. Aihua. Therefore, the scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of US Pat. No. 6,839,476; FIG. 2 to 2D are schematic cross-sectional views showing a first embodiment of the structure of the optical transmission structure and the embedded substrate thereof; 19513 16 200809281 FIG. 2A' and 2B' are schematic cross-sectional views showing the optical transmission structure of the present invention and the structure of the first-light-conducting material and the plurality of non-optical conductive materials woven into the substrate; FIG. 3A to FIG. 3C The present invention is a cross-sectional view of a second embodiment of a substrate structure having light transmission and a method for fabricating the same; and FIG. 3B is a substrate structure of the optical transmission wheel of the present invention, and a photoconductive material and a plurality of non-optical conduction methods. The material is woven into a braided surface schematic. [Main component symbol description] 11 Bottom layer 12 12a 13 13a 13b 14 2 21 22 22, 23 231 232 233 Core grooved fiber core fiber shell top light transmission wheel structure - Photoconductive material Second first conductive material Non-optical conductive material Line build-up structure Dielectric layer Conductor structure 19513 17 200809281 234 Electrical connection pad 24 Solder mask 240 Opening 25 Plating via 3 Substrate 30 Opening 18 19513