200808494 九、發明說明： 【發明所屬之技術領域】 ’且特別是 本發明是有關於-種加u具的製造方法 有關於一種磨削工具的製造方法。 【先前技術】 磨削工具主要是應用於軟質多孔材料的修整、硬脆材200808494 IX. Description of the invention: [Technical field to which the invention pertains] </ RTI> In particular, the present invention relates to a method of manufacturing an additive tool relating to a method of manufacturing a grinding tool. [Prior Art] Grinding tools are mainly used for the trimming, hard and brittle materials of soft porous materials.
料的磨削以及材料表面粗糙化箄 粑化4領域。目前習知所使用的 具是以所使㈣研磨顆粒來進行分類，依照不同的 研磨顆粒的材料性質，可以使用電鑛或硬焊的方式來製迭 之°目前習知的製造方法所製造的金剛石磨削H剛 石磨料多以不規則的排列方式排列於基材上，且金剛石磨 料的粒徑大小與裸露於基材表面的高度多呈現不均一的情 形。此種情形同樣出現於其他材質㈣磨顆粒i，並不限 於金剛石磨料。 前述提及的研磨顆粒裸露於基材表面的高度不一致的 情形，在負荷較重的磨削工業中，容易造成研磨顆粒受力 的不均勻。研磨顆粒高度的不一致以及受力的不均，不僅 會對加工元件造成損傷，也使得較突出的研磨顆粒較易脫 落，從而影響了磨削速度與品質。 在習知中為了防止研磨顆粒的脫落，開始增加焊接層 的厚度，其結果是造成了僅有小於50 %的研磨顆粒的高度 大出基材表面以及容屑空間的減少。此種情形進一步使得 砂輪容易堵塞，影響工具的使用壽命。因此一種製造高度 與大小均一的研磨顆粒，且研磨顆粒能均勻分佈在基材表 5 200808494 需 面的磨削工具的製造方法為工業界所 【發明内容】 口此本I明的目的之_為提供—種具有裸露高度與大 小均一的磨削工具的製造方法。 、 根據本發明之一實施例所述，提出了_種磨削卫具的 製造方法’包含了先形成膠層於基材上。接著將研磨顆粒 吸附，網板中的多個網板孔上，再將研磨顆粒㈣於膠層 上。取後，再形成一層釺烊層於研磨顆粒與基材之間，此 釺焊層用於固定研磨顆粒於基材的表面。 本毛月貝&例中先採用抽氣機將研磨顆粒吸附於網 板孔中，再進一步將研磨顆粒粘附於膠層上之磨削工具製 這方式可使粘附於於膠層上的研磨顆粒的大小更為一 致，排列更加規則。此外，藉由網板上網板孔的圖案化， 可依磨削工具的需求將網板上的研磨顆粒圖案化，可形成 各種不同排列方式的研磨顆粒於磨削工具上。因此，藉由 本發明所述之製造方法，可以有效地減少人工修補^情 形，大大提南了生產效率。 【實施方式】 第1圖至弟5圖所示為依照本發明一實施例所述之一 種磨削工具的製造方法的剖面結構圖。第1圖中，將經過 清洗、噴砂處理後的基材30上形成一層膠層36。膠層36 的形成可由任何習知的方式來完成。 第2圖中，將研磨顆粒32吸附在一網板38中的網板 6 200808494 孔40上。在本發明的一實施例中，吸附研磨顆粒％的方 、二J用抽氣機在網板的上方抽氣，位於網板38下 、研磨顆粒32由於抽氣機的作用，被吸附到網板％中 的、、周板孔40上。在此實施例中，小於網板孔4〇的研磨顆 粒32將通過網板孔4〇，不會吸附在網板孔4〇上。藉由此 方式、，可使仔吸附在網板孔38的研磨顆粒的粒徑大小與高 度車乂為均。在本發明的一實施例中，研磨顆粒32可以為Grinding of materials and roughening of the surface of the material 粑 4 4 areas. At present, the conventionally used tools are classified according to the (4) abrasive particles, which can be fabricated by electro-mineral or brazing according to the material properties of different abrasive particles. The diamond-grinding H-stone abrasives are arranged on the substrate in an irregular arrangement, and the particle size of the diamond abrasive is not uniform with the height exposed on the surface of the substrate. This situation also occurs in other materials (4) grinding particles i, and is not limited to diamond abrasives. The aforementioned heights in which the abrasive particles are exposed to the surface of the substrate are inconsistent, and in the heavy-duty grinding industry, unevenness in the force of the abrasive particles is liable to occur. The inconsistency in the height of the abrasive particles and the uneven force are not only damage to the machined components, but also make the more prominent abrasive particles easier to fall off, thus affecting the grinding speed and quality. In the prior art, in order to prevent the detachment of the abrasive particles, the thickness of the weld layer is increased, with the result that only less than 50% of the height of the abrasive particles is larger than the surface of the substrate and the space of the chip space. This situation further makes the grinding wheel easy to block and affect the service life of the tool. Therefore, an abrasive particle having uniform height and size can be produced, and the abrasive particles can be evenly distributed on the substrate. Table 5 200808494 The manufacturing method of the grinding tool required by the surface is in the industry [invention] The purpose of this invention is A method of manufacturing a grinding tool having a uniform height and uniform size is provided. According to an embodiment of the present invention, a method for manufacturing a grinding aid is proposed, which comprises forming a glue layer on a substrate. The abrasive particles are then adsorbed onto a plurality of stencil holes in the stencil, and the abrasive particles (4) are then applied to the subbing layer. After taking, a layer of tantalum is formed between the abrasive particles and the substrate, and the solder layer is used to fix the abrasive particles on the surface of the substrate. In the case of the Maoyuebei &, the first use of an air extractor to adsorb the abrasive particles in the hole of the mesh plate, and further grind the abrasive particles on the adhesive layer to make the adhesive layer adhere to the adhesive layer. The abrasive particles are more uniform in size and more regular in arrangement. In addition, by patterning the stencil hole of the stencil, the abrasive particles on the stencil can be patterned according to the requirements of the grinding tool, and abrasive particles of various arrangements can be formed on the grinding tool. Therefore, with the manufacturing method of the present invention, the artificial repairing situation can be effectively reduced, and the production efficiency is greatly increased. [Embodiment] Fig. 1 to Fig. 5 are cross-sectional structural views showing a method of manufacturing a grinding tool according to an embodiment of the present invention. In Fig. 1, a layer of glue 36 is formed on the substrate 30 which has been cleaned and blasted. The formation of the glue layer 36 can be accomplished in any conventional manner. In Fig. 2, the abrasive particles 32 are adsorbed onto a hole 40 of the stencil 6 200808494 in a stencil 38. In an embodiment of the present invention, the side of the adsorbed abrasive particles and the second J are pumped above the stencil by the air extractor, and under the stencil 38, the abrasive particles 32 are adsorbed to the net due to the action of the air extractor. In the plate %, on the perforation 40. In this embodiment, the abrasive particles 32 which are smaller than the stencil hole 4 将 will pass through the stencil hole 4 and will not be adsorbed on the stencil hole 4 。. In this way, the particle size of the abrasive particles adsorbed in the stencil hole 38 can be made uniform with the height rut. In an embodiment of the invention, the abrasive particles 32 may be
金剛石磨料或氮化輔料。在另_實施射，研磨顆粒Μ 為200微米的金剛石磨料。 在第3 ®中’將吸附研磨顆粒32的網板與基材3〇對 位’進-步將研磨顆粒32 _於膠層36之上，並且將網 板移除。 在第4圖與第5圖中，進—步將舒焊層材料·均勾 ，鋪洒在研磨顆粒32與膠層36上，同時置於8〇代到· C的真空爐中進行真空釺焊并傕 ,叶开便膠層36燒毀，用以形成釺 k層4 2 b。接者重覆進行此制私 . 返仃此裊轾，用以達到奸焊層42b所需 的厚度，完成了磨削工具的製作。 第6圖所示為第5圖的俯顏同 ^ ^ J對現圖，其中研磨顆粒32以矩 陣排列的方式排在基材30上。 第7 一圖所示為本發明的另一實施例的剖面結構示意 圖。在此實施例巾’在研磨顆粒32與釺焊層似上覆妾一 層防腐钕層46。防腐崎46可以為電㈣層、陶^料 層、氮化鈦層或類金剛石塗層’但並不限於前述項目。在 ^發明—實施例中，使用物理氣相沉積法來製造此防腐餘 層46,防腐触層46的材料為陶究轴料，厚度為2微米。在 200808494 本發明另一實施例中，防腐蝕層46的厚度為1微米到5微 本發明的實施例中採用抽氣機將研磨顆粒吸附於網板 孔中，再進一步將研磨顆粒粘附於膠層上的磨削工具的製 造方式’可使粘附於於膠層上的研磨顆粒的大小更為一 致’排列更加規則。此外，藉由網板上網板孔的圖案化， 可依磨削工具的需求將網板上的研磨顆粒圖案化，可形成 各種不同排列方式的研磨顆粒於磨削工具上。因此，藉由 本發明所述之製造方法，可以有效地減少人工修補的情 形，大大提高了生產效率。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者’在不脫離本發明之精神 $範圍内，當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 △為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式爷詳細說明如下： 、，第1〜5圖係繪示了依照本發明一實施例所述之一種磨 削工具的製造方法的剖面結構圖。 第6圖係繪示了第5圖的俯視圖。 弟7圖係繪示了依照本發明另一實施例所述之一種磨 、工具的製造方法的剖面結構圖。。 【主要元件符號說明】 200808494 3 0 ··基材 36 :膠層 40 :網板孔 42b :釺焊層 32 :研磨顆粒 38 :網板 42a :釺焊層材料 46 :防腐蝕層Diamond abrasive or nitrided auxiliary. In another shot, the abrasive particles were rubbed into a 200 micron diamond abrasive. In the 3<3>' the stencil of the absorbing abrasive particles 32 is aligned with the substrate 3', the abrasive particles 32 are advanced onto the glue layer 36 and the stencil is removed. In Fig. 4 and Fig. 5, the material of the solder layer is further hooked on the abrasive particles 32 and the glue layer 36, and placed in a vacuum furnace of 8 到 to C for vacuum 釺After welding, the leaf layer 36 is burned to form the 釺k layer 4 2 b. The picker repeats the process of making this. In order to achieve the required thickness of the solder layer 42b, the grinding tool is completed. Figure 6 is a cross-sectional view of Fig. 5 in which the abrasive particles 32 are arranged in a matrix arrangement on the substrate 30. Fig. 7 is a schematic cross-sectional view showing another embodiment of the present invention. In this embodiment, the abrasive particles 32 are overlaid with a layer of anticorrosive layer 46 on the surface of the abrasive particles 32. The anti-corrosion 46 may be an electric (four) layer, a ceramic layer, a titanium nitride layer or a diamond-like coating 'but is not limited to the foregoing items. In the invention-embodiment, the anti-corrosion layer 46 is formed by physical vapor deposition, and the anti-corrosion contact layer 46 is made of a ceramic material having a thickness of 2 μm. In another embodiment of the invention, the thickness of the anti-corrosion layer 46 is from 1 micrometer to 5 micrometers. In the embodiment of the invention, the abrasive particles are adsorbed into the pores of the screen by an air extractor, and the abrasive particles are further adhered to The grinding tool on the glue layer is manufactured in such a way that the size of the abrasive particles adhering to the glue layer can be made more uniform. In addition, by patterning the stencil hole of the stencil, the abrasive particles on the stencil can be patterned according to the requirements of the grinding tool, and abrasive particles of various arrangements can be formed on the grinding tool. Therefore, with the manufacturing method of the present invention, the situation of manual repair can be effectively reduced, and the production efficiency is greatly improved. While the invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and the invention may be modified and modified in various ways without departing from the spirit of the invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. A cross-sectional structural view of a method of manufacturing a grinding tool according to an embodiment of the present invention. Fig. 6 is a plan view showing Fig. 5. Figure 7 is a cross-sectional structural view showing a method of manufacturing a grinding tool according to another embodiment of the present invention. . [Main component symbol description] 200808494 3 0 ··Substrate 36: adhesive layer 40: stencil hole 42b: 釺 solder layer 32: abrasive particles 38: stencil 42a: 釺 solder layer material 46: anti-corrosion layer