TW200804629A - Power supply for anodizing - Google Patents
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- TW200804629A TW200804629A TW096108466A TW96108466A TW200804629A TW 200804629 A TW200804629 A TW 200804629A TW 096108466 A TW096108466 A TW 096108466A TW 96108466 A TW96108466 A TW 96108466A TW 200804629 A TW200804629 A TW 200804629A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/024—Anodisation under pulsed or modulated current or potential
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200804629 九"發明說明: 【發明所屬之技術領域】 本發明係有關於-種銘合金陽極氡化方法及銘合金陽 極氡化電源。 5【先前技術】 過去,為提鬲鋁合金表面硬度和耐磨性、耐蝕性以及 -=著色性,而使用硫酸、乙二酸、磷酸等水溶液浸泡,待 # 陽極氧化後’於該紹合金表面形成氧化膜。該陽極氧化膜, 係由細緻的阻障層與多孔質的多孔層所構成,其 10化鋁。 在【金屬表面技術,,p.512 (觸)】、【近畿銘表面 、 處理研究H⑽,P.1 (1988)】與特許公開公報 2000-282294號及2004-35930號中已有揭示,為了獲得所 需特性之薄膜,施加電力的方法有直流法、電流反轉法、 15交直流重疊法、以及脈衝波形法等。 • 以直流法高速的形成薄膜時,-旦外加可流通大電流的 高電壓,則前述阻障層所發生之焦耳熱的發熱量即會增 • 加,而導致在氧化膜上產生-種呈現燒钱的缺陷。因此, • 狀含有大量_、銅、鐵等電流不易流通_鑄造物以 2〇及銘屋鑄材質,直流法並無法在短時間内形成厚的陽極氧 化膜。 相對的,為了不使氧化膜形成「薄膜燒餘」的缺陷, 而,以良好的生產性在短時間内形成所需的氧化膜,一般 來說,使用包含電流反轉法的脈衝電解法會比使用直流法 5 200804629 為佳。例如,【金屬表面技術,I仰川988)】揭示,於 硫酸浸泡液中5間歇地施加負電流之電流反轉法的陽極氧 化比起直流法的陽極氧化更能在較低的氧化電壓下高速 的形成氧化膜。此外,於【近畿!呂表面處理研究諸,Ν〇· 1334 ρ·1 (1988)】中揭示’將銘Α1080Ρ放入2〇°c、混合 有20重量百分比(wt%)硫酸與1〇 g/L乙二酸的浸泡液中, 以電流反轉法,於頻率13·3 Hz、電流密度4 A/dm2、及功 率(duty)95%的條件下電解65分鐘之後,可獲得% μιη的 鋁陽極氧化薄膜(成膜速度1·4μιη/πήη)。可是,這些方法 在數10 Hz單位的頻率,尤其是合金元素含量多的銘壓禱 材負,會有成膜速度無法加速的問題。還有,必須外加正 電壓、負電壓、以及所使用的電源為複雜的兩極式等問題。 特許公開公報2000-282294號顯示在交流外加直流的 交直流重疊法中,在交流成分中不含負成分,並且,於交 15流成分中含有直流成分5%以上的電解條件下,能夠在鋁合 金表面形成具有優越耐熱性,以及良好耐腐蝕性的鋁陽極 氧化膜。可是,適當的電流密度甚低,僅有0.1到2 A/dm2, 在這個電流密度下的成膜速度極為緩慢,而有生產性以及 成本的問題存在。還有,這個方法必須使用交流電源和直 流電源,因此也具有電源系統複雜化的問題。 此外’特許公開公報2004_35930號揭示從生產性目的 來提高銘陽極氧化膜之成膜速度的方法,係在硫酸水溶液 浸泡液中’使200到5000Hz (較佳為600到2000 Hz)的 正弦波高頻率電流與直流電流重疊的電流通電方法。也就 6 200804629 是,將銘合金ADC12置於17。〇 5 1〇%的水溶液浸泡液中, 使頻率1000 Hz、電壓±20 v的正弦波之高頻率與則乂直 流電壓重疊,電解處理時間20分鐘,可獲得22 _的陽極 氧化膜(成膜速度U μπι/min)。還有,在該文獻中揭示, 5電解開始5分鐘後的電流密度為13.8A/dm2,但是,頻率限 制在200到5000 Hz之間。並且,由於實務上所使用的是 正弦波,所以與矩形波相比,會存在有其單位時間内輸入 的電流較少的問題。還有,由於必須使用交流電源和直流 電源,因此也會產生電源系統複雜化的問題。 10 此外,特許公開公報2006-83467號揭示了一種以提高 耐蝕性、耐衝擊性為目的,使陽極氧化膜的分子在鋁或= ,金表面呈現隨機方向地成長,以形成不具配向性的陽極 氧化膜的方法。具體的方法為使用含有矽等不純物的合 金,重複實施外加正電壓和消除電荷的程序,每外加i次 15正電壓的時間為25到100 ps (頻率5到20 KHz)。 消除電荷的程序,係暫時終止正電壓的外加,進行極 紐路或外加負電壓。雖然前述之文獻敘述了薄膜分子方向 的隨機性等形態學,但是對於薄膜的成長速度並未記載, 因此並不清楚。 在考寸許出願2005-376323號中描述,為了提高成膜速度 之目的,發明人提出藉由不外加脈衝電壓時,將陽極氧化 用陽極和陽極氧化用陰極加以短路,並輸入負電流(與外 加脈衝電壓時相反方向的電流),以緩和脈衝電壓外加時所 形成之阻障層内的鋁離子(Al3+)或氧離子(02·)的濃度曲 200804629 線 以及在固體液體界面之電雙層的放電5並在 脈衝私壓$卜加時9能夠輸人大電顏方法。此方法外 3 =然後再料短路的方式,_可消除外加電壓時 電ΐ外力,式的_性問題,然而另—方面卻存在脈衝 的1^正電H 2G A/dm2 ’而負電流卻高達13 【發明内容】 ίο is 2〇 上所述,雖然可知提高成膜速度的方法,較佳為在 脈衝電壓時,將陽極氧化用陽極和陽極氧化用陰極 但是,在短路時卻會有產生極大負電流的問題。 ㈣兔發明係針對上述問題點而創作,本發明所欲解決之 成膜;^抑制或輸人負電流’即可提供—種提升薄膜的 八胳fr ’並提高生產性的18合金陽極氧化方法以及紹合 化電源。此外,本發明所欲解決之其他問題,係 加脈衝雜時輸人最大電流的頻率,藉以提供一 賴的成膜速度,並提高生產性的叙合金陽極氧化 万法以及鋁合金陽極氧化電源。 為達耻狀目的,本發明所提供馳合金陽極氧化 =,其舰係如f請專利範圍第丨項所述,係使用脈衝 ,並於不外加脈衝電壓時,使陽極氧化用陽極和陽極 乳化用陰極予靖_方法巾,將触路賴設為低於Μ 又 ’本發明t料觀圍第2項之特徵為在中請專利 8 200804629 範圍第i項所述之鋁合金陽極氧化方法,其中, 路時間可低於5 ps。 5 10 15 20 又,本發明申請專利範圍第3項之特徵為在申請專利 ^圍第1項或第2項所述之!g合金陽極氧化方法其中, 别述脈衝電力之波形係依照脈衝電遷外加時間⑸、待機护 間(Td)、以及短路時間(Ts)的順序所構成。 寸 又,本發明申請專利範圍第4項之特徵為在申請專利 範圍第!項或第2項所述之铭合金陽極氧化方^:利 前述之脈衝電力的頻率在8a35KHz之間。 、 本發明申請專利範圍第5項之特徵為在申請專利 _弟1項或第2項所収齡金陽極氧化方法,盆中, 珂述之脈衝電力的頻率在10到30 KHz之間。 /、 本發明所提供的銘合金陽極氧化電源,其特徵如 圍第6項所述,在使用脈衝電力陽極氧化!呂合 ^的紹合金陽極氧化電源中,當脈衝輕未產生時,使連 =陽極氧制陽極之端子與連接於陽極氧仙陰 子的短路時間低於15 μ8。 知 範發明申δ月專利範圍第7項之特徵為在申請專利 =:紹合金陽極氧化電源,其中,前述之短 範圍請專利範圍第8項之特徵為在申請專利 Hr _、或¥ 7項所述之㉟合金陽極氧化電源,其中, ;二、氏电力之波形係依照脈衝電壓外加時間(τ+)、待機時 間(Td)、以及短路時間(Ts)的順序所構成。 9 200804629 又,本發明申請專利範圍第9項之特徵 _第6項或第7項所述之銘合金陽極氧化電:$利 前述之脈衝電力的頻率在8到35 KHz之間。 八 5 又,本發明申請專利範圍第10項之特徵為在 ^圍第6項或第7項所述之齡金陽極氧化電源,其中, 前述之脈衝電力的頻率在10到30 KHZ之間。 /、 藉由實施本發明,提供一種幾乎不需輪入負電流即 可提高成騎度與生錄_合金陽極氧化方法以及紹合 金陽極氧化電源。此外,藉由實施本發明,亦可提供一^ 言f定在外加脈衝電壓時,能_通大電流之頻率,並可提 高成膜速度與生紐_合金雜祕枝以聽合金 極氧化電源。 口 【圖式簡單說明】 第一圖係為本發明的薄膜成長速度與有效電流密度的 關係圖。 圖係為本發明的電源以及電解槽架構的示意圖。 第三圖係為本發明的脈衝設定以及實際電壓、的 波形圖。 弟四圖係為本發明之陽極氧化方法的薄膜成長穩定狀 恶圖。 々第五圖係為本發明的電流波形與頻率的關係圖。 第六圖係為本發明的實驗結果圖表。 :七圖係為本發明的短路時間與負電流的關係圖。 第八圖係為本發明短路時之負電麼與負電流的關係 200804629 圖。 【貫施方式】 本發明之發明人等在使用脈衝電力之鋁合金陽極氧化 5方法中,發現不外加電壓時,將陽極氧化用陽極和陽極氧 化用陰極予以短路,並流通若干量的負電流即可提高成膜 速度。並且,發現薄膜成長速度和有效電流密度係成正比 (弟一圖)。此處之有效電流费度,係外加脈衝電壓時的正 電流密度和不外加脈衝電壓時的負電流密度的差值(有效 1〇電流密度=正電流密度一負電流密度)。但是,發現負電流 存在著密度過大的問題。例如,在某一個陽極氧化條件下 的正電流密度為18A/dm2時,負電流密度為12 8A/dm2。 因此,本發明之發明人等,為提高生產性,因而繼續 研究薄膜成長速度的提升方法。 15 也就是,降低上述之負電流,並且自下個脈衝中流通 大電流。結果發現如下所述幾乎不須流通負電流,並且在 下個脈衝中流通大電流的脈衝波形以及頻率。根據這個嶄 新的發現,本發明之發明人等研創出下述的發明。 第二圖係為本發明所使用之電源以及電解槽架構的示 2〇意圖。陽極氧化電源10係由正向直流電源u、反覆頻率產 生器12、正向脈衝產生廻路13、短路端脈衝產生廻路14、 正向斷波器開關15、防止逆流二極體16、短路電流控制廻 路17、正向斷波器閘體擴大器25、以及短路端閘體擴大器 26所構成,輸出端子18係連接於電解槽19内的陽極2〇 200804629 與陰極21。此外,還設置有正向輸出電壓計(Ει)22、電解 槽電壓計(EB)23以及電解槽電流計(Ab)24。 使用如第二圖所示之陽極氧化電源5以下列條件進行 陽極氧化。試驗片係使用導電性佳的代表性材料A11〇〇p。 5此時,試驗片的尺寸為50 mm X 50 mm x le5 mm (()& dm2)。此外,導電性不良的代表性材料則使用ADCl2材料。 此時,試驗片的尺寸為50 mm X 50 mm X 3e〇 mm (Q 56 dm )。電解槽的電解液篁約為200 l,使用液體循環以及微 曝氣方式攪拌,並以板式熱交換器冷卻,陰極棒使用鉛材 1〇質,陰極板使用碳材質。浸泡液的成分為濃度15〇g/L的游 離石’IL酸,而次泡液溫度為1〇。(^。陽極氧化電流密度的變化 實施至20 A/dm2。此外,陽極氧化處理之後,以井水流動 水沖洗大約2分鐘,以熱風強制乾燥。 第三圖所示為脈衝設定條件以及實際的電壓、電流的 I5波形圖。圖中,T+為脈衝電壓外加時間、Td為脈衝電流為 零且為操作電極之間短路所需的待機時間(這段期間,成 為迴路狀態),Ts為短路時間。 電壓波形係依照T+的設定上升,Td之間則稍微下降, 几之間顯示為零。 20 電流波形,在I的初期急遽增加,經過最大值之後下 降’ Td之間為零,進入Ts的瞬間流入大電流,其後立即回 復為零’ 1\之間幾乎不流通,經過几之後負電流增加,經 過最大值之後開始減少。 這種波形,可以做如下證明:按,永山政一、高橋英 12 200804629 明、甲田滿所著之「!g陽極氧化膜的成膜、溶解之情形」 【金屬表面技術,V〇L3(),N。。9,p438_456(1979)】,陽極 •匕的败狀態如第四圖所示,(第四_係第四圖⑷所示 之陽極氧倾架射的轉層敎目)。也就是,隔著 電解液配設有陽健合金和陰極碳,在陽極的崎氧化變200804629 九"Invention: [Technical Field] The present invention relates to an alloy anode anodicization method and a galvanic anode power source. 5 [Prior Art] In the past, in order to improve the surface hardness and wear resistance, corrosion resistance and -= colorability of aluminum alloy, it was immersed in an aqueous solution such as sulfuric acid, oxalic acid or phosphoric acid, and was treated with anodized An oxide film is formed on the surface. The anodized film is composed of a fine barrier layer and a porous porous layer, and is made of aluminum. It has been disclosed in [Metal Surface Technology, p. 512 (Touch)], [Near Mingming Surface, Treatment Research H (10), P. 1 (1988)] and Japanese Patent Laid-Open Publication Nos. 2000-282294 and 2004-35930, A film for obtaining a desired characteristic, and a method of applying electric power include a direct current method, a current inversion method, a 15 AC/DC superposition method, and a pulse waveform method. • When a film is formed at a high speed by the direct current method, if a high voltage at which a large current can flow is applied, the amount of heat generated by the Joule heat generated in the barrier layer is increased, resulting in generation on the oxide film. The defect of burning money. Therefore, • The current contains a large amount of _, copper, iron, etc. The current is not easily circulated. The casting is made of 2〇 and Ming House. The DC method does not form a thick anodic oxide film in a short time. In contrast, in order to prevent the oxide film from forming a "film burn-in" defect, a desired oxide film is formed in a short time with good productivity. Generally, a pulse electrolysis method including a current inversion method is used. It is better than using DC method 5 200804629. For example, [Metal Surface Technology, I Yangchuan 988]] reveals that the anodic oxidation of the current reversal method in which 5 negatively applies a negative current in the sulfuric acid soaking solution can be performed at a lower oxidation voltage than the anodic oxidation by the direct current method. An oxide film is formed at a high speed. In addition, in [Near 畿! Lu surface treatment research, Ν〇 1334 ρ·1 (1988)] revealed that 'Input Α 1080 Ρ into 2 ° ° c, mixed with 20% by weight (wt%) sulfuric acid and 1 〇 g In the soaking solution of /L oxalic acid, after electrolysis for 65 minutes at a frequency of 13·3 Hz, a current density of 4 A/dm 2 , and a power of 95% under a current inversion method, % μηη can be obtained. Aluminum anodized film (film formation rate 1·4 μιη/πήη). However, these methods have a problem that the film formation speed cannot be accelerated at a frequency of several 10 Hz units, especially a negative pressure of the alloying element. Also, it is necessary to apply a positive voltage, a negative voltage, and a power source that is a complicated two-pole type. In the AC/DC superposition method in which an alternating current plus direct current is applied, the AC component does not contain a negative component, and in the case where the AC component contains a DC component of 5% or more under an electrolysis condition, the aluminum alloy can be used in aluminum. The surface of the alloy forms an anodized aluminum film having superior heat resistance and good corrosion resistance. However, the appropriate current density is very low, only 0.1 to 2 A/dm2, and the film formation speed at this current density is extremely slow, and there are problems of productivity and cost. Also, this method must use AC power and DC power, so it also has a problem of complicating the power system. Further, the 'Proc. Publication No. 2004_35930 discloses a method for improving the film formation speed of the anodic oxide film from the viewpoint of productivity, which is a high frequency of sine wave of 200 to 5000 Hz (preferably 600 to 2000 Hz) in an aqueous solution of sulfuric acid solution. A current energization method in which current and DC current overlap. In other words, 200804629, the Ming alloy ADC12 is placed at 17. 〇5 1〇% of the aqueous solution soaking solution, the high frequency of the sine wave with a frequency of 1000 Hz and a voltage of ±20 v is overlapped with the 乂DC voltage, and the electrolytic treatment time is 20 minutes, and an anodized film of 22 _ can be obtained. Speed U μπι/min). Also, it is disclosed in the document that the current density after 5 minutes from the start of electrolysis is 13.8 A/dm2, but the frequency is limited to between 200 and 5000 Hz. Further, since a sine wave is used in practice, there is a problem that a current input per unit time is smaller than a rectangular wave. Also, since the AC power source and the DC power source must be used, there is also a problem that the power system is complicated. In addition, Japanese Laid-Open Patent Publication No. 2006-83467 discloses that for the purpose of improving corrosion resistance and impact resistance, molecules of an anodized film are grown in a random direction on an aluminum or a gold surface to form an anode having no alignment. A method of oxidizing a film. The specific method is to repeat the procedure of applying a positive voltage and eliminating the charge using an alloy containing impurities such as ruthenium, and each time 15 positive voltages are applied for 25 to 100 ps (frequency 5 to 20 KHz). The procedure for eliminating the charge temporarily terminates the addition of the positive voltage and performs a pole or an applied negative voltage. Although the above-mentioned literature describes morphology such as the randomness of the molecular direction of the film, the growth rate of the film is not described, and thus it is not clear. In order to increase the film formation speed, the inventors propose to short-circuit the anode for anodizing and the cathode for anodizing, and input a negative current (for the purpose of increasing the film formation speed). The current in the opposite direction when the pulse voltage is applied) to alleviate the concentration of aluminum ions (Al3+) or oxygen ions (02·) in the barrier layer formed when the pulse voltage is applied, and the electric double layer at the interface of the solid liquid Discharge 5 and in the pulse private pressure $ 卜 加 9 can lose the large electric method. This method is 3 = then the way to short-circuit, _ can eliminate the external force of the electric force when the voltage is applied, the _ sex problem of the formula, but the other side has the pulse of 1 ^ positive H 2G A / dm2 ' while the negative current As described above, although it is known that the film forming speed is increased, it is preferable to use an anode for anodizing and a cathode for anodizing at a pulse voltage, but it may be generated in the case of a short circuit. The problem of extremely negative current. (4) The invention of the rabbit is aimed at the above problems, and the film forming method to be solved by the invention; the method of suppressing or inputting a negative current can provide an 18-alkaline anodizing method for improving the productivity of the film and improving productivity. And the Shaohua power supply. In addition, the other problem to be solved by the present invention is to increase the frequency of the maximum current input by the pulse, thereby providing a film forming speed and improving the productivity of the alloy anodizing method and the aluminum alloy anodizing power source. In order to achieve the purpose of masquerading, the present invention provides an alloy anodizing=, the ship system is as described in the scope of the patent scope of the f, which uses a pulse, and anodicizes the anode and the anode for anodizing without applying a pulse voltage. The cathode is used to treat the _ method towel, and the contact ray is set to be lower than Μ. The second item of the present invention is characterized by the anodizing method of the aluminum alloy described in the scope of the patent of No. 8 200804629. Among them, the road time can be less than 5 ps. 5 10 15 20 Further, the third item of the scope of the patent application of the present invention is characterized in that the patent application is as described in item 1 or item 2! In the g-alloy anodization method, the waveform of the pulse power is formed in the order of the pulse electromigration time (5), the standby guard (Td), and the short-circuit time (Ts). In addition, the fourth item of the scope of the patent application of the present invention is characterized by the scope of the patent application! Item or the anodizing method of the alloy described in item 2: The frequency of the aforementioned pulse power is between 8a35KHz. The fifth aspect of the patent application scope of the present invention is characterized in that the frequency of the pulsed electric power in the basin is between 10 and 30 KHz in the method of anodizing the gold received in the patent or the second item. /, the alloy anodizing power supply provided by the invention is characterized by the use of pulse electric anodizing in the anodizing power source of the pulverized electric anodizing, which is not used when the pulse is light. = The terminal of the anode oxygen anode and the short circuit time connected to the anode oxygen fairy are less than 15 μ8. The seventh item of the patent scope of the invention is the patent application =: Shao alloy anodizing power supply, wherein the short range of the aforementioned patent scope is characterized by the application of patent Hr _, or ¥ 7 The 35-alloy anodized power source, wherein the waveform of the second power is formed in the order of the pulse voltage application time (τ+), the standby time (Td), and the short-circuit time (Ts). 9 200804629 Further, the feature of claim 9 of the present invention is the anodic oxidation of the alloy described in item 6 or item 7: the frequency of the aforementioned pulse power is between 8 and 35 KHz. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; By implementing the present invention, it is possible to provide a method for improving the riding degree and the raw material _ alloy anodizing and the gold anodizing power supply with almost no need to carry a negative current. In addition, by implementing the present invention, it is also possible to provide a frequency that can be used to increase the frequency of the current when the pulse voltage is applied, and can increase the film formation speed and the alloy. . Port [Simplified description of the drawings] The first figure is a graph showing the relationship between the film growth rate and the effective current density of the present invention. The figure is a schematic diagram of the power supply and electrolytic cell architecture of the present invention. The third figure is a waveform diagram of the pulse setting and actual voltage of the present invention. The fourth figure is the film growth stability diagram of the anodizing method of the present invention. The fifth figure is a diagram showing the relationship between the current waveform and the frequency of the present invention. The sixth graph is a graph of the experimental results of the present invention. : Seven figures are the relationship between the short circuit time and the negative current of the present invention. The eighth figure is the relationship between the negative current and the negative current when the invention is short-circuited. [Invention] The inventors of the present invention have found that the anode for anodizing and the cathode for anodizing are short-circuited and a certain amount of negative current is flown in the method of anodizing the aluminum alloy using pulsed electric power. The film formation speed can be increased. Also, it was found that the film growth rate is proportional to the effective current density (different figure). The effective current rate here is the difference between the positive current density when the pulse voltage is applied and the negative current density when the pulse voltage is not applied (effective 1 〇 current density = positive current density - negative current density). However, it has been found that the negative current has a problem of excessive density. For example, when the positive current density under an anodizing condition is 18 A/dm 2 , the negative current density is 12 8 A/dm 2 . Therefore, the inventors of the present invention have continued to study a method for improving the growth rate of the film in order to improve productivity. 15 That is, the above negative current is reduced, and a large current flows from the next pulse. As a result, it was found that there is almost no need to flow a negative current as described below, and a pulse waveform and a frequency of a large current flow in the next pulse. According to this new discovery, the inventors of the present invention have developed the following invention. The second figure is intended to be a power source and an electrolytic cell architecture used in the present invention. The anodizing power source 10 is composed of a forward DC power source u, a reverse frequency generator 12, a forward pulse generating circuit 13, a short circuit pulse generating circuit 14, a forward wave breaker switch 15, a reverse current diode 16, and a short circuit. The current control circuit 17, the forward breaker body amplifier 25, and the short-circuit gate expander 26 are formed, and the output terminal 18 is connected to the anode 2200804629 and the cathode 21 in the electrolytic cell 19. Further, a forward output voltmeter (?) 22, an electrolytic cell voltmeter (EB) 23, and an electrolytic cell galvanometer (Ab) 24 are provided. Anodization was carried out using the anodizing power source 5 as shown in Fig. 2 under the following conditions. As the test piece, a representative material A11〇〇p which is excellent in conductivity is used. 5 At this time, the size of the test piece is 50 mm X 50 mm x le5 mm (()& dm2). In addition, a representative material having poor conductivity uses an ADCl2 material. At this time, the size of the test piece was 50 mm X 50 mm X 3e 〇 mm (Q 56 dm ). The electrolytic cell has an electrolyte enthalpy of about 200 l. It is stirred by liquid circulation and micro-aeration, and is cooled by a plate heat exchanger. The cathode rod is made of lead material and the cathode plate is made of carbon. The composition of the soaking solution was a freezer 'IL acid having a concentration of 15 〇g/L, and the temperature of the secondary bubble was 1 Torr. (^. The change in the anodization current density is carried out to 20 A/dm2. In addition, after the anodizing treatment, it is rinsed with well water flowing water for about 2 minutes, forced drying by hot air. The third figure shows the pulse setting conditions and the actual I5 waveform diagram of voltage and current. In the figure, T+ is the pulse voltage application time, Td is the pulse current is zero, and the standby time required for short circuit between the operation electrodes (this period becomes the loop state), and Ts is the short circuit time. The voltage waveform rises according to the setting of T+, and Td decreases slightly between the two, and the display is zero between the two. 20 The current waveform increases sharply at the beginning of I, and drops after the maximum value. 'Td is zero, and enters Ts. Instantly injects a large current, and immediately returns to zero '1\ between almost no circulation. After a few minutes, the negative current increases, and after the maximum value, it begins to decrease. This waveform can be proved as follows: Press, Yongsan Zhengyi, Gaoqiao English 12 200804629 Ming, Jia Tianman's "!g film formation and dissolution of anodized film" [metal surface technology, V〇L3 (), N. 9, p438_456 (1979)], The failure state of the anode and the crucible is as shown in the fourth figure, (the fourth _ series is shown in the fourth diagram (4) of the anode oxygen tilting projection layer). That is, the anode alloy is provided through the electrolyte. And cathode carbon, the oxidation of the anode
1010
成氧她,陰_氫離子被_絲。此時 長說明如下·。 干《 _二=:)接①屬,被陽極氧化成為Oxygenated her, Yin_hydrogen ion is _ silk. At this time, the length is as follows. Dry " _ two =:) connected to 1 genus, anodized to become
Al— A严+3e· (式 υ 2·所產生的輯子,其中一部分在阻障層内部擴 散,向電解液内移動(第四圖(幻②)。 3·-方面’阻障層上方與電解液的界面處,阻障層 組成物質氧化雖l2〇3)受到強力電場作用,分解為鋁離子 和氧離子(02-)(第四圖⑷③): 2ΑΓ丁+ 3α Ζ) 闽,二Γ由上述所產生触離子在電解㈣移動(第四 圖⑻④), 同¥ Ί由上述所產生的氧離子在阻障層内移動 (弟四圖(a)⑤)。 6.在阻障層内移動並到達阻障層(氧她)/紹界面 n’和邊界的金私發生反應,而產 3圖⑻⑥): ^ 2A1 + 30 ~>Al2〇3 + 6e* (式 3) 13 200804629 7。此外在阻層上方的阻障層(氧化銘)/電解液 的界面上水(H2〇)文到強烈電場作用5分解為氮離子田+) 和氧離子(第四圖(a)⑦): H20^2H+ + 0- (式 4) 5 15 此B守,所產生的氧離子,其中一部分透過上述第$、第 6的步驟’和氧化鋁的產生有關聯性。 以上所述為阻障層的成長,透過這個步驟可使陽極氧 化膜繼續成長。 此時,在阻障層内的電荷,以鋁離子和氧離子的形態 移動,鋁離子的移動率大約40。/。,氧離子的移動率大約 60%。還有,越是低溫,該氧化電流密度越是增加,而該鋁 離子的移動率就會下降。也就是,薄膜的成長速度會增加。 此時,假設阻障層附近的電位曲線如第四圖(b)所示。 1·阻障層内的鋁離子濃度,在阻障層/鋁界面端呈現 偏高,在阻障層/電解液界面端呈現偏低的現象(第四圖(b) (曱))。 2·此外,阻障層内的氧離子濃度,在阻障層/A1界面 端呈現偏低,在阻障層/電解液界面端呈現偏高的現象(第 四圖(b)(乙))。 3·並且,氧化鋁中的鋁離子,其擴散速度有其限度。 因此,隨著電解的進行,鋁離子將滯留於鋁/氧化鋁界面 上。因此,界面中的鋁離子濃度將會更高(第四圖(b) (丙))。 4·相同地,氧化銘中的氣離子擴散速度也有極限, 20 200804629 (b) (丁))。,面中的氧離子,濃度將會更高(第四圖 如上料理解,波形、電流波形說明如 Γ βAl—A Yan+3e· (The formula produced by the formula , 2·, part of which diffuses inside the barrier layer and moves into the electrolyte (fourth figure (magic 2). 3·- aspect' above the barrier layer At the interface with the electrolyte, the composition of the barrier layer is oxidized, although l2〇3) is subjected to a strong electric field, and is decomposed into aluminum ions and oxygen ions (02-) (fourth figure (4) 3): 2 ΑΓ + + 3α Ζ) 闽, two触 The contact ions generated by the above are moved in the electrolysis (4) (Fig. 4 (8) 4), and the oxygen ions generated by the above are moved in the barrier layer (Fig. 4(a) 5). 6. Move within the barrier layer and reach the barrier layer (oxygen her) / Shao interface n' and the boundary of the gold private reaction, and produce 3 map (8) 6): ^ 2A1 + 30 ~> Al2〇3 + 6e* (Formula 3) 13 200804629 7. In addition, at the interface of the barrier layer (oxidation)/electrolyte above the resist layer, water (H2〇) is decomposed into a strong ion field 5 into a nitrogen ion field +) and oxygen ions (figure (a) 7): H20^2H+ + 0- (Formula 4) 5 15 This B, the generated oxygen ions, a part of which is related to the production of alumina through the above steps #6 and #6. As described above, the growth of the barrier layer allows the anode oxide film to continue to grow through this step. At this time, the electric charge in the barrier layer moves in the form of aluminum ions and oxygen ions, and the mobility of aluminum ions is about 40. /. The mobility of oxygen ions is approximately 60%. Further, the lower the temperature, the more the oxidation current density increases, and the mobility of the aluminum ions decreases. That is, the growth rate of the film will increase. At this time, it is assumed that the potential curve near the barrier layer is as shown in the fourth diagram (b). 1. The concentration of aluminum ions in the barrier layer is high at the barrier layer/aluminum interface end and low at the barrier layer/electrolyte interface end (Fig. 4(b) (曱)). 2. In addition, the oxygen ion concentration in the barrier layer is low at the barrier layer/A1 interface end and high at the barrier layer/electrolyte interface end (Fig. 4(b)(b)) . 3. Moreover, the diffusion rate of aluminum ions in alumina has its limit. Therefore, as the electrolysis proceeds, the aluminum ions will remain on the aluminum/alumina interface. Therefore, the concentration of aluminum ions in the interface will be higher (Fig. 4(b) (c)). 4. In the same way, there is a limit to the diffusion rate of gas ions in the oxidation, 20 200804629 (b) (D). The oxygen ions in the surface will have a higher concentration (the fourth figure is understood as above, the waveform and current waveform are as follows Γ β
10 1510 15
…,波?之所以在^之間呈現稍微降低(第三圖 疋大…銘/氧化!呂界面的銘離子與氧化銘/電解液界面 的氧離子各自向銘金屬側以及電解液侧擴散。 2·包机波形在τ+之間,開始時之所以會急遽地上升 (第三圖②),是由於追隨電壓的上升(式1)、(式2)、(式 3)的反應而快速地進行。 3. 然後’電流波形經過極大值之後,之所以轉為減 少(第三圖③)’係隨著電解的進行,如第四圖⑼所示, 包含兩界面的阻障層之濃度曲線(電位障礙)增加的關係。 4. 電抓值減少之後,不久外加電壓、電位阻礙趨於 平衡而呈現一定的電流值(第三圖④)。 、 5. Td之間’因為外加電壓為零,因此電流也呈現零 狀態(第三圖⑤)。 6. Ts之間’進人Ts電極之間短路的瞬間,銘/氧化紹 界面的銘離子(或電洞)、氧化紹/電解液界面的氧離子(或 電子)形態的帶電’由於—姐電消除,所以會在極端時 間之間流通電流(第三圖⑥)。 7·接著,在ττ時間的期間,幾乎沒有電流流通(第 三圖⑦)’在Ττ時間之後負電流增加。經過最大之後,開 20 200804629 始減:>、(苐二圖⑧)。該負電流9係由於(式1 )、(式2 )、 (第—圖)所導致的逆反應。此外,凡為這些逆反應♦ 的時間常數,隨銘合金種類和電解液的組成而定。。而…,wave? The reason why it is slightly reduced between ^ (the third picture 疋 big ... Ming / oxidation! Lu interface of the Ming ion and oxidation Ming / electrolyte interface oxygen ions spread to the metal side and the electrolyte side. 2 · charter waveform Between τ+, the reason why it rises sharply at the beginning (third figure 2) is that it progresses rapidly due to the reaction of the rising voltage (formula 1), (formula 2), and (formula 3). Then, after the current waveform has passed the maximum value, it is reduced to reduce (Fig. 3). As the electrolysis progresses, as shown in the fourth figure (9), the concentration curve of the barrier layer including the two interfaces (potential barrier) Increased relationship. 4. After the electric catch value is reduced, the applied voltage and potential obstruction tend to balance and exhibit a certain current value (Fig. 4). 5. Between Td, 'Because the applied voltage is zero, the current is also Presents a zero state (third figure 5). 6. The moment between the Ts' short circuit between the Ts electrodes, the imide ions (or holes) at the interface of the oxidation/oxidation interface, and the oxygen ions at the interface of the oxidation/electrolyte interface ( Or electronic) form of electrification 'due to the elimination of sister electricity, The current will flow between extreme times (Fig. 6). 7. Then, during the period of ττ, almost no current flows (third figure 7). 'The negative current increases after Ττ time. After the maximum, it is turned on. 20 200804629 Start subtraction: >, (Figure 2, Figure 8). This negative current 9 is due to the inverse reaction caused by (Formula 1), (Formula 2), (Phase - Figure). In addition, the time for these inverse reactions ♦ Constant, depending on the type of alloy and the composition of the electrolyte.
由上述5紐路時間凡設為低於尺時5就能夠幾乎 5通負電流。 ^//IL 實驗性的銘合金材料中,導電性良好的A11⑻為例, 如將短路日7間[設為大約2 μ8時,就幾乎不流通負電流。 =外,銘合金材料中,導電性差的ADC12為例,如將短路 ¥間Ts設為大約15 μδ時,就幾乎不流通 10此時的Ττ在Α1100的時候,大约如 斤 J 大約為2 ps。在ADC12的時 候:大約為15叫。此外,在達到5叫之前,縱使有負電流, 也疋很小。 此外’當以A1100為材料的時候,短路時間在達 之前,縱使有負電流,也是很小m ADC12的時 候’短路時間超過15叫的情形,負電流就會急遽地流通。 如上所述,較佳的短路時間,將會隨著紹合金的材質而變 如上所述,只需消除電位障軸_/氧魅界面與氧 化銘/電解液界_部分,藉由接下來料加 20能夠流通大電流。 如上所述,使用A1100材料,短路時間低於5叩,最 佳大約為1到3 μδ左右,所形成的氧化轉膜不會因為負 電流而減少,所以’ _提高氧化__成長速度。一 方面,使用ADC12材料,短路時間設為ΐ5 μ以下時,就 16 200804629 能夠提高氧化鋁薄膜的成長速度。 如第一圖所示可得知9薄膜成長速度和有效電流密度 成正比,短路時負電流會導致有效電流之降低。(以A11〇〇 材料為例)’如上所述將短路時間設在5㈤以下5較理想是 5設在大約1到3恥左右,能夠大幅度地提高(大約2倍) 薄膜成長速度。但又發現到,透過脈衝頻率的最佳化,更 能夠提高薄膜成長速度。 弟五圖所示為弟二圖的電流波形詳細圖。第五圖(a)所 示為頻率低(T+大的情形),第五圖(b)為頻率高的情形(τ+ 10小的情形)。但是,第五圖(b)中,係將Ts設為2 ,即負 電流幾乎不流通的情形。 脈衝的頻率f: %)=l/(T+(i) + Td.Ts) --------(式 5) 陽極氧化使用的電量Q’為第五圖電流波形的積分值S 15 (〇,假設此時的頻率為f(i)時, Q(i)=S(i)-f(i)---------------------(式 6) 這個Q⑴值越大,薄膜成長速度就越大。帶來大Q⑴ 的τ+(〇的範圍,在第五圖中,可視為在電流值為最大之τ+〇η) 與面積(a)=面積⑻之TV⑹之間。 20 透過實驗所求出的電流波形得到·· T+㈣25 pis T+(e)= 90 |is 對應這些的頻率,如弟五圖(b)所示Td $ 5叩,當為 A1100 材料時,ts = 2 (is ’ 當為 ADC12 材料時,τ 二 17 200804629 為最佳值的時候9會有 fmax =1/(25+5+2)=313 KHz fmin = 1/(90+5+15)=9.1 KHz 的結果。實務上,實驗性的在8到35 KHz之間,確認能夠 5陽極氧化並無問題。 以下’透過實施例,具體說明本發明的效果。 (實施例1) 如第六圖的實施例1,係將Τ+=80 μδ,Td=5 ps,Ivf故 各種變化,結果顯示1+=20 A/dm2能夠獲得穩定的陽極氧 10化。所以,把這個值予以固定(實施例2、3、4、5、6亦 相同),Ts改變為2、3、4、5、10、20、40 時,負電流 變化的結果。此外,試驗片使用Α1100材料。負電流在Ts=2 μδ時幾乎不流通,在Ts<5 μδ的時候也只有流通少量,並 且在5 ps<Ts的時候急遽地增加。 15 也就是,若要提高氧化鋁薄膜成長速度,必須將短路 時間Ts設在5 μδ以下。最佳設為大約2叫左右,就能夠抑 制或幾乎不流通負電流。 (實施例2) 第六圖的實施例2中,固定τ+=8〇 us,τ丁 H id〜5 ps,Ts 20 =5 ’以及I+=20 A/dm2,結果得到短路時外加0、_2、 -4以及-6伏特(V)的負電壓時,負電流的變化結果。此外, 試驗片使用A1100材料。From the above 5-way time, when it is set to 5 below the ruler, it can be almost 5 negative currents. ^//IL In the experimental alloy material, A11 (8) with good conductivity is taken as an example. If the short circuit date is 7 [set to about 2 μ8, almost no negative current flows. = Outside, in the alloy material, the poor conductivity of the ADC12 is taken as an example. If the short-circuit ¥Ts is set to about 15 μδ, it will hardly flow. 10 When the Ττ is at Α1100, it is about 2 ps. . At ADC12: approximately 15 calls. In addition, even before the 5 call, even if there is a negative current, it is also very small. In addition, when using A1100 as the material, the short-circuit time is before, even if there is a negative current, it is also very small when the ADC12 is short. When the short-circuit time exceeds 15, the negative current will rush. As mentioned above, the better short-circuit time will change with the material of the alloy as described above, and only need to eliminate the potential barrier axis _ / oxygen charm interface and oxidation Ming / electrolyte boundary _ part, by the next material Plus 20 can flow a large current. As described above, with the A1100 material, the short-circuit time is less than 5 叩, preferably about 1 to 3 μδ, and the formed oxidized film is not reduced by the negative current, so __ increases the oxidation__ growth rate. On the other hand, when the ADC12 material is used and the short-circuit time is set to ΐ5 μ or less, 16 200804629 can increase the growth rate of the aluminum oxide film. As shown in the first figure, it can be seen that the growth rate of the 9 film is proportional to the effective current density, and the negative current causes a decrease in the effective current. (A1〇〇 material is taken as an example) The short-circuit time is set to 5 (five) or less as described above. 5 is preferably set at about 1 to 3 shame, and the film growth rate can be greatly improved (about 2 times). However, it has been found that the optimization of the pulse frequency can increase the film growth rate. The fifth picture shows the detailed diagram of the current waveform of the second picture. The fifth diagram (a) shows the case where the frequency is low (the case where T+ is large), and the fifth diagram (b) shows the case where the frequency is high (the case where τ + 10 is small). However, in the fifth diagram (b), Ts is set to 2, that is, the case where the negative current hardly flows. The frequency of the pulse f: %)=l/(T+(i) + Td.Ts) -------- (Formula 5) The electric quantity Q' used for anodizing is the integral value of the current waveform of the fifth graph S 15 (〇, assuming that the frequency at this time is f(i), Q(i)=S(i)-f(i)--------------------- (Equation 6) The larger the Q(1) value is, the larger the film growth rate is. The τ+ (the range of 〇, which in the fifth figure can be regarded as the largest τ+〇η in the fifth figure) and the area with the large Q(1) (a) = area (8) between TV (6). 20 The current waveform obtained by the experiment is obtained. · T+(4)25 pis T+(e)= 90 |is corresponds to these frequencies, as shown in the fifth figure (b) $ 5叩, when it is A1100 material, ts = 2 (is 'when it is ADC12 material, when τ 2 17 200804629 is the best value, 9 will have fmax =1/(25+5+2)=313 KHz fmin = 1 / (90 + 5 + 15) = 9.1 KHz. In practice, it is experimentally between 8 and 35 KHz, and it is confirmed that there is no problem in the anodization of 5. The following is a detailed description of the present invention by way of examples. (Embodiment 1) As in the first embodiment of the sixth embodiment, Τ+=80 μδ, Td=5 ps, and Ivf are variously changed, and the result shows that 1+=20 A/dm2 can be stabilized. The anodic oxygen is 10. Therefore, this value is fixed (the same applies to the examples 2, 3, 4, 5, and 6), and when the Ts is changed to 2, 3, 4, 5, 10, 20, 40, the negative current changes. In addition, the test piece used Α1100 material. The negative current hardly circulates at Ts=2 μδ, and only a small amount flows at Ts < 5 μδ, and increases sharply at 5 ps < Ts. In order to increase the growth rate of the aluminum oxide film, it is necessary to set the short-circuit time Ts to 5 μδ or less. Optimum setting is about 2 Å, and it is possible to suppress or hardly flow a negative current. (Embodiment 2) Embodiment of Fig. 6 2, fixed τ+=8〇us, τ丁H id~5 ps, Ts 20 =5 ' and I+=20 A/dm2, and the result is 0, _2, -4 and -6 volts (V) when short circuit is obtained. The negative voltage is the result of a negative current change. In addition, the test piece uses A1100 material.
Ts=5 p的條件下’負電壓從〇增加到v時,雖然 負電流密度也從0.6增加為0·9 A/dm2,但η,、 ^ 14個增加對 18 200804629 正電流密度20 A/dm2來說,是一個很小的值。也就是,σ 要把短路時間Ts縮小為5 μ3左右5縱使在短路時供應負带 壓,也不會流通大的負電流。由此,短路時間短,換句話 說,可以理解Ττ的重要性。 w (實施例3)Under the condition of Ts=5 p, when the negative voltage increases from 〇 to v, the negative current density increases from 0.6 to 0·9 A/dm2, but η, and 14 increase to 18 200804629 positive current density 20 A/ For dm2, it is a small value. That is, σ is to reduce the short-circuit time Ts to about 5 μ3. 5 Even if a negative voltage is supplied during a short circuit, a large negative current does not flow. Thus, the short circuit time is short, in other words, the importance of Ττ can be understood. w (Example 3)
15 第六圖的實施例3中,固定為T>80ps,Td=5ps,T =40 ps,以及1+ = 20 A/dm2,結果得到短路時先外加〇、_2 ^ -4、-6 V的負電壓時,負電流的變化結果。此外,試驗片 使用A1100材料。如實施例2所示,Ts=5^時只有少數的 負電流。但是,在本實施例中,設為Ts=40岬時,產生高 達約正電流密度20 A/dm2-半數值之大負電流流通。從= 裡,也能夠理解凡的重要性。 (實施例4) 圍的貫施例4中,係固定Τ+=40网,Τ>5 μ8, 及1+=20 A/dm2,Ts變更為2、1〇、2〇、4〇恥時,所得到 負電流變化結果。此外,試驗片使用 ΑΠ00材料。 f電流在短路時間為2 的時候幾乎不流通。但是 短路a守間增為1〇、2〇、4〇μ而急遽地增加。該值 ^路時間40抑時’相對於正電流密度20 A/dm2,負電流 度將高達15A/dm2。 角驗 (實施例5) =第六圖的實施例5中,係固定Τ>40畔,Td=5叩, 5 μ:以及 i+==2〇 A/dm2,短路時外力口 〇、、_心 v * 負電壓時’所得到的負電流變化結果。此外,試驗片使) 20 200804629 A1100材料。 在此例中可得知,和實施例2 -樣地5將短路時間縮 短為5卜8時,即使負電壓從〇増加至_6V時,逆電流也不 會有太大的變化,仍持續維持較小值。 ^ 5 (實施例6) 第六圖的實施例6中,係固定T+=40 us,τ—< 丄 d—5 “s,Ts =20 ps,以及 1+=20 A/dm2,短路時外加 〇、_2、4 ^ ^ 的負電壓時,所得到的負電流變化結果。此外,試驗片使 用Α1100材料。可得知Ts=5 ps的實施例5中,屬於低值的 10逆電流,在本實施例Ts=20 的條件下,顯示以十倍數的 增加。 、 第七圖係為實施例1及4的短路時間和逆電流的關係 圖。從該圖可得知試驗片使用Α1100材料時,負電流在短 路時間為2 ps的情形下,幾乎不會流通。但是,在5 以 15上的時候,就會急遽地增加。 第八圖係為實施例2、3、5、6短路時所外加的負電壓 與負電流之關係圖。可得知,試驗片使用A1100材料時, 在Ts=5 ps之前,無論負電壓大小,都不會流通大的負電 流。但是,大的負電流將會隨著Ts=20 μ8以及Ts==4〇㈣的 20增大而流通。 、 (實施例7) 試驗片使用導電性不良的ADC12材料,固定丁+二郎 叫’ Td=5 ps,以及I+=l〇 A/dm2時,在Ts達到15 之前, 幾乎不會流通負電流。但是,在15 以上時,負電流就會 20 200804629In the third embodiment of the sixth figure, it is fixed to T > 80 ps, Td = 5 ps, T = 40 ps, and 1 + = 20 A/dm2, and the result is that 短路, _2 ^ -4, -6 V are first applied when short circuit is obtained. The negative voltage is the result of a negative current change. In addition, the test piece used A1100 material. As shown in Embodiment 2, there is only a small amount of negative current when Ts = 5^. However, in the present embodiment, when Ts = 40 设为, a large negative current having a positive current density of about 20 A/dm 2 - a half value is generated. From =, you can understand the importance of everything. (Example 4) In Example 4, the Τ+=40 mesh, Τ>5 μ8, and 1+=20 A/dm2 were fixed, and Ts was changed to 2, 1〇, 2〇, 4〇 shame. , the result of the negative current change. In addition, the test piece was made of ΑΠ00 material. The f current hardly flows when the short circuit time is 2. However, the short-circuit a guard increases to 1〇, 2〇, 4〇μ and increases sharply. The value of the time is 40 deg", and the negative current will be as high as 15 A/dm2 with respect to the positive current density of 20 A/dm2. Angle test (Embodiment 5) = In the fifth embodiment of the sixth figure, the fixed Τ > 40, Td = 5 叩, 5 μ: and i + = = 2 〇 A / dm2, external force 〇, _ Heart v * Negative voltage when 'negative current change results. In addition, the test piece makes) 20 200804629 A1100 material. In this example, it can be seen that when the short-circuit time is shortened to 5 b 8 in the same manner as in the example 2, even if the negative voltage is increased from 〇増 to _6 V, the reverse current does not change much, and continues. Maintain a small value. ^ 5 (Embodiment 6) In Embodiment 6 of the sixth figure, T +=40 us, τ - < 丄d - 5 "s, Ts = 20 ps, and 1 + = 20 A/dm2 are fixed. When a negative voltage of 〇, _2, 4 ^ ^ was applied, the resulting negative current was changed. In addition, the test piece was made of Α1100 material. It can be seen that in Example 5 of Ts=5 ps, it is a low-value 10 reverse current. In the case of Ts=20 of the present embodiment, the increase is shown in ten-fold. The seventh figure is the relationship between the short-circuit time and the reverse current of Examples 1 and 4. From this figure, it can be known that the test piece uses Α1100 material. When the short-circuit time is 2 ps, the negative current will hardly flow. However, when 5 is 15, it will increase sharply. The eighth figure is the short circuit of the second, third, fifth, and sixth embodiments. The relationship between the negative voltage and the negative current added at the time. It can be seen that when the test piece uses A1100 material, no large negative current flows before Ts=5 ps regardless of the negative voltage. However, the large negative The current will flow with an increase of Ts=20 μ8 and Ts==4〇(4)20. (Example 7) The test piece uses a poorly conductive ADC12. Material, called fixed Jiro + D 'Td = 5 ps, and when l〇 I + = A / dm2, until Ts reaches 15, the negative current hardly flow. However, when more than 15, a negative current will 20,200,804,629
急遽地流通。此外,將電流密度做各種變化的結果,即使 在1+=10 A/dm2的條件下,也能夠獲得穩定的陽極氧化。所 以,使用這個值作為代表。 21 200804629 【圖式簡單說明】 第一圖係為本發明的薄膜成長速度與有效電流密度的 關係圖。 ’⑴又 圖係為本發_電源以及電解槽㈣的示意圖。 第三圖係為本發明的脈衝設定以及實際電壓、i流的 圖。 第四圖係為本發明之陽極氧化方法的薄膜成長穩定狀 =係為本發明的電流波形與頻率的關係圖。 ^八圖係為本發明的實驗結果圖表。 圖 ϊ t明的贿㈣與負電流的關係圖。 圖係為本發明短路時之負電壓與負電流的關係 15【主要元件符號說明】 11正向直流電源 13正向脈衝產生迴路 15正向斷波器開關 Η短路電流控制迴路 19電解槽 陰極 23電解槽電壓計 25正向斷波器閘體擴大器 27電解液 10陽極氧化電源 12反覆頻率產生器 14短路端脈衝產生迴路 16防止逆流二極體 20 18輸出蠕子 20陽極 22正向輪出電壓計 24電解槽電流計 26短路端閘體擴大器 22Irritable in circulation. Further, as a result of various changes in the current density, stable anodization can be obtained even under the condition of 1 + 10 A/dm 2 . Therefore, use this value as a representative. 21 200804629 [Simple description of the drawings] The first figure is a graph showing the relationship between the film growth rate and the effective current density of the present invention. '(1) Again, the diagram is a schematic diagram of the power supply and the electrolytic cell (four). The third figure is a diagram of the pulse setting and the actual voltage and i-flow of the present invention. The fourth figure is the film growth stability of the anodizing method of the present invention = the relationship between the current waveform and the frequency of the present invention. ^8 is a graph of the experimental results of the present invention. Figure ϊ t Ming's bribe (four) and negative current relationship diagram. The diagram is the relationship between the negative voltage and the negative current in the short circuit of the invention. 15 [Main component symbol description] 11 forward DC power supply 13 forward pulse generation circuit 15 forward wave breaker switch Η short circuit current control circuit 19 electrolytic cell cathode 23 Electrolyzer voltmeter 25 forward wave breaker gate expander 27 electrolyte 10 anodizing power supply 12 reverse frequency generator 14 short circuit end pulse generating circuit 16 prevent countercurrent diode 20 18 output creeper 20 anode 22 forward round Voltmeter 24 electrolytic cell galvanometer 26 short-circuit end gate expander 22
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JP5691135B2 (en) * | 2009-03-31 | 2015-04-01 | スズキ株式会社 | Anodized film and anodizing method |
US20120118748A1 (en) * | 2009-07-23 | 2012-05-17 | Carrier Corporation | Method For Forming An Oxide Layer On A Brazed Article |
EP3430185B1 (en) | 2016-04-27 | 2023-02-22 | Bang & Olufsen A/S | Highly reflecting anodised al surfaces with tailored diffuse and specular content |
CN113981500B (en) * | 2021-12-09 | 2023-03-28 | 陕西宝成航空仪表有限责任公司 | Oxalic acid anodizing process method for hard aluminum alloy shell part |
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US4620661A (en) * | 1985-04-22 | 1986-11-04 | Indium Corporation Of America | Corrosion resistant lid for semiconductor package |
US5268235A (en) * | 1988-09-26 | 1993-12-07 | The United States Of America As Represented By The Secretary Of Commerce | Predetermined concentration graded alloys |
US5660704A (en) * | 1994-02-21 | 1997-08-26 | Yamaha Hatsudoki Kabushiki Kaisha | Plating method and plating system for non-homogenous composite plating coating |
US6461678B1 (en) * | 1997-04-29 | 2002-10-08 | Sandia Corporation | Process for metallization of a substrate by curing a catalyst applied thereto |
JP2000282294A (en) | 1999-03-31 | 2000-10-10 | Kobe Steel Ltd | Formation of anodically oxidized film excellent in thermal crack resistance and corrosion resistance and anodically oxidized film-coated member |
US6739028B2 (en) * | 2001-07-13 | 2004-05-25 | Hrl Laboratories, Llc | Molded high impedance surface and a method of making same |
JP2004035930A (en) | 2002-07-02 | 2004-02-05 | Suzuki Motor Corp | Aluminum alloy material and anodization treatment method therefor |
US6902827B2 (en) * | 2002-08-15 | 2005-06-07 | Sandia National Laboratories | Process for the electrodeposition of low stress nickel-manganese alloys |
US7012333B2 (en) * | 2002-12-26 | 2006-03-14 | Ebara Corporation | Lead free bump and method of forming the same |
JP4075918B2 (en) | 2004-08-20 | 2008-04-16 | スズキ株式会社 | Anodized film and anodizing method |
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