200803658 九、發明說明： 【叙明所屬之技術領域】 一種用於移除電路 一種電路板之線路修復方法，尤指 板之線路層中線路之間短路的方法。 【先前技術】 電子產品輕小化已是長久以來眾所皆知之趨勢 動w'手提電腦、手提錄放影機或個人數位助 7 產品之製作便需要使用比以前更小、更薄的Ξ 之半導化之^勢’各種不同功能 因此：广、最耿在一電路板上則有朝更高密度之需求。 產口來」懲：上述更薄且高佈線密度之多層電路板於電子 口口、： ’电路板之製程與設計則將面臨更高之挑戰。 路板之線路層製程為例，隨著電路板之縮小化及 於線路形成過程中難以避免形成各種線路故 錄過程中因電錢銅材料過多而令線路間產生橋 復字li’亦即線路之間產生短路，此種問題如不及時修 影，板之電性功能，由於習知技術中尚盖 式，若於形成電路板線路層之製㈣ 之:路板之線路產生短路，則只能對 之製程後發現前述之電:二成電路板線路層 板報廢，如此即降低了電路板之可靠度及良率。 因此，如何提供一稀用你 — 之短路問題之線路修復方法：：：:二路層中線路間 匕成為目别電路板業界之重 19449 5 200803658 要課題。 【發明内容】 鑑於前述習知技術之缺失，本發 ^ 供-種電路板之線路修復方法，用^ 目的係在提 中線路之間的短路。 ；夕ή路板之線路層 本發明之另一目的，係在提供— 方法，得應用於形成電路板之線…：路板之線路修復 及阻層之前或之後，藉此降低程中移除導電層 電路板之可靠度及良率。板之製程成本以及提昇 為達上述及其他相關目的，本 線路修復方法，係包括:提供一形二、：電路板之 路板，該線路層之線路之間存在有至少二::、路層之電 及於該電路板之線路層中線路之短路位置處以以 (咖r〇-anGde)進行微電解以移除該線路間之短路。电。 該微電極料電解之還原端，㈣另 電路板之線路以成為氧化端，俾藉由 “極接觸該 之短路位置進行微電解以移除該短路。“甩圣於該線路間 又本發明之電路板之線路修復方法之另— 供-電路板至少一表面形成一導電層；以 U提 面爾-阻層，該阻層形成有複數開孔以露：：：：表 層，精由該導電層電鑛以形成該線路層，該線包 之間存在有至少-短路；使該微電 還岸爸之線路 電層則為氧化端，以藉由該微電極於 進行微電解以移除該短路。 路間之紐路位置 19449 6 200803658 本發明復提供—種電路板之線路 有圖案化線路層之電路板，該線路二 線路ΐίΓ—短路（Sh°n);以及於該電路板之線路層中 以移除該線路間:短:一一〇進行_ 上述以微液滴移除線路之間短路的方法，復可岸用於 ==路層之製程中移除阻層及導電層之前，係 m 表面形成—導電層，於該導電層表面 藉該阻層形成有複數開孔以露出該導電層， ^Μ屯鑛㈣成該線路層，該線路層之線路之間 二:：少：短路，藉由該微液滴於該線路間之短路位置 仃仏錢以移除該短路；其後再移除該阻層及導電層。 ^發明透過微電極或微㈣於電路板之線路層中ς …講位置處進行微電解或微㈣以移 間單有效之修復方法，即無需對整個電路板進行重工猎$ =㈣個電路板報廢，進而可降低電路板之製程成本以 及k幵電路板之可靠度及良率。 【實施方式】 、以下係藉由特定的具體實施例說明本發明之實施方 :’熟悉此技藝之人士可由本說明書所揭示之内：輕易地 暸解本發明之其他優點與功效。 1_一實施例 —請參閲» USM，係顯示本發明之電路板之線路 修復方法之第一實施例之流程示意圖。 19449 7 200803658 千如第ΙΑ、1B圖所示，首先，提供一電路板卜於★亥 電路板i至少一表面形成一導電層u，於該導電層^表 成有—阻層12，該阻層U形成有複數開孔120以霖 Η::電層11，藉由該導電層"以形成一包含複數線路 之線路層，其中，該線路131之嶋 之門ΓΓ:圖所示’於該電路板1之線路層中的線路⑶ 位P /路132的位置處以微電極2(mi⑽_anGde)於該 位置處進行微電解以移除短路132 ^ 施例中’該微電極2為還原端，…：板；：、#於本實 為氧化端，將該電路板導電層11 離子之踏m 4 ί 解溶液（例如含金屬 進=二靠近該短路13表面，俾以 使―路13之金屬（例如金屬 反應’藉此移除該柄政〗q x生氧化 第二實_ “仏路13,而可排除線路⑶之間的短路。 第3圖係為本發明之電 _ ^ 施例之剖面示意圖。本垂Μ板之線路修復方法之第二實 在於該阻層及導電層Ϊ:::與第一實施例最大不同之處 電解之還原端，另；=極2為 路⑶而成為氧化端，俾以成為 ;^路板10之線 電極2進行電解以移除該線路‘】、=坦路，以藉由該微 本發明之電路板之線路修復方之::短物。 路板線路層之製程中，亦 ，係應用於形成該電 、’於線路形成後於移除阻層及 19449 200803658 導私層之前，一旦作業人員發現線路間存在有短路問題， 。採用為方法進行及時移除；當然，本實施例之電路板 之線路修復方法亦可應用於形成該電路板線路層之製程 後，亦即，於移除為形成線路層而預先覆蓋之導電層及阻 層之後，一旦操作人員發現線路間存在短路問題，同樣可 採用該方法進行修復。 :㈣第4圖，係顯示本發明之電路板 二=實施例之剖面示意圖。與前_實施不同處在:: 二液：=電路板1之線路層中之線路間的接路位置處 日miC1〇-dr〇plet)進行微触刻以移除該短路132。 1至如第—實施例之電路板卜於該電路板 表面形成一導電層n，於 -阻層12,該阻層12幵^古”"广層U表面形成有 声11，藓μ道干 開孔120以露出該導電 層U，错由该導電層U2 ⑶之線路層；其中，_==成—包含複數線路跡 線路131之間存在有短路132。拉 由係為腐蝕性化學液之 ,路132糟 姓刻以腐钱移除該短路/之商全=短路132表面進行微 除該短路132以排除線路13=(例如金屬銅），藉此移 如31間之短路問題。 第5圖係為本發明之電路板之線 — 把例之剖面示意圖。本實施例愈第二〜/ 之弟四貫 在於該阻層及導電層移除以列取大不同之處 路；即該電路板之線路声 之滴移除線路之間的短 nm來’僅於線路⑶之 19449 9 200803658 間的短路132微蝕刻以腐蝕移除該短路13。同樣地，本實 ^ I列之電路板之線路修復方法係可應用於形成該電路板線 路層之製程中移除阻層及導電層之前或之後，—旦摔作人 員發現線路間存在有短路問題，即可採_方法進行及時 综前所述，本發明之電路板之線路修復方法係透過微 電極或微液滴於f路板線路層中線路間之短路位置處 微電解或微似彳以移除短路，且於形成該電路板線路声之 製程中移除阻層及導電層之前或之後，一旦發現線路二產 生短路日^•即可藉此簡單有效之修復方法而僅對該電路板之 線路層中發生線路之短路位置處進行移除。因此，於 線路之短路問題時’藉由本發明之電路板之線路修復^法 即無需對整個電路板進行重卫，亦無需將整個電路板報 ，，由此降低了電路板之製程成柄及提昇了電路板之可 罪度及良率。 八上述實施例僅例示性說明本發明之原理及其功效， 、非用於限制本發明。任何熟悉此項技藝之人士均可在不土 背本發明之精神及範訂，對上述實施例進行修飾盘改延 變。因此’本發明之權利保護範圍，應如後述之申請專利 範圍所列。 ㈢今〜 【圖式簡單說明】 第IAMB圖係顯示本發明之電路板之線 之電路板之剖視及上視示意圖； * 第2圖係顯示本發明之電路板之線路修復方法之線路 19449 10 200803658 間的移除之第-實施例之剖面示意圖. 弟職順示本發明之電路板 ， 間的短路以微電極移 4方法之線路 第4圖係顯示杯明：：“讀之剖面示意圖； pe 本毛月之電路板之線路修4复古、+ 間的短路以Κ 方法之線路 $ 5 弟二貫施例之剖面示意圖；以刀 間的短路發!之電路板之線路修復方法二 【主要元件符7第四實施例之剖面示意圖。7 11 12 120 130 、 131 132 2 電路板 導電層 F且層 開孔 線路 短路 微電極 微液滴 19449 11200803658 IX. Description of the invention: [Description of the technical field to which it belongs] A method for repairing a circuit board for removing a circuit, especially a method of short-circuiting between lines in a circuit layer of a board. [Prior Art] The lightening of electronic products has long been a well-known trend. The production of mobile computers, portable video recorders or personal digital help 7 products requires the use of smaller, thinner ones than before. The semi-conducting potentials of various functions are therefore wide and most demanding on a circuit board towards higher density. The production of the mouth to punish: the above-mentioned thinner and high wiring density of the multi-layer circuit board in the electronic mouth, : 'the circuit board process and design will face higher challenges. As an example, the circuit board process of the circuit board is difficult to avoid the formation of various lines during the process of forming the circuit. In the process of recording, the copper compound material is generated due to excessive electricity and copper materials. If there is a short circuit between them, if the problem is not repaired in time, the electrical function of the board is due to the conventional technology. If the circuit board layer is formed (4): the circuit board circuit is short-circuited, only After the process can be found, the above-mentioned electricity is found: 20% of the circuit board circuit board is scrapped, thus reducing the reliability and yield of the circuit board. Therefore, how to provide a line repair method that uses your short-circuit problem:::: The line between the two layers is the weight of the industry. 19449 5 200803658 SUMMARY OF THE INVENTION In view of the above-mentioned shortcomings of the prior art, a circuit repair method for a circuit board is used to short-circuit between lines. The circuit layer of the present invention is another object of the present invention, which is provided in a method for forming a circuit board...: before or after the circuit repair and the resist layer of the road board, thereby reducing the removal Reliability and yield of conductive layer boards. The process cost of the board and the improvement to the above and other related purposes, the line repair method includes: providing a shape 2, a circuit board of the circuit board, there are at least two:: road layer between the lines of the circuit layer The micro-electrolysis is performed at a short-circuit position of the line in the circuit layer of the circuit board to remove a short circuit between the lines. Electricity. The reducing end of the microelectrode material electrolysis, (4) the circuit of the other circuit board to become the oxidation end, and the micro-electrolysis is performed by "contacting the short-circuited position of the pole to remove the short circuit." Another circuit repair method of the circuit board - the at least one surface of the circuit board forms a conductive layer; the U-face-resist layer is formed with a plurality of openings to expose the surface layer:::: Layering the electric ore to form the circuit layer, and there is at least a short circuit between the wire packages; and the electric layer of the micro-electric power source is an oxidation end, and the microelectrode is used for micro-electrolysis to remove the Short circuit. Location of the road between the roads 19449 6 200803658 The present invention provides a circuit board having a patterned circuit layer, the circuit 2 is ΓίΓ-short (Sh°n); and in the circuit layer of the circuit board To remove the line between: short: one by one _ the above method of removing the short circuit between the lines by the microdroplet, before the bank can be used in the process of == road layer to remove the resist layer and the conductive layer The surface of the m is formed by a conductive layer, and a plurality of openings are formed on the surface of the conductive layer to expose the conductive layer, and the conductive layer is formed by the germanium (4), and the line between the circuit layers is two:: less: short circuit The micro-droplet is saved by the short-circuit position between the lines to remove the short-circuit; thereafter, the resist layer and the conductive layer are removed. ^Invented through the micro-electrode or micro (four) in the circuit layer of the circuit board to do micro-electrolysis or micro (four) to move the single effective repair method, that is, no need to rework the entire circuit board $ = (four) circuit board Scrap, which in turn reduces the process cost of the board and the reliability and yield of the board. [Embodiment] The following embodiments are described by way of specific embodiments: 'A person skilled in the art can be aware of other advantages and effects of the present invention as disclosed in the present specification. 1 - An embodiment - see » USM, which is a flow chart showing a first embodiment of a circuit repair method for a circuit board of the present invention. 19449 7 200803658 As shown in Fig. 1 and Fig. 1B, firstly, a circuit board is provided on at least one surface of the circuit board i to form a conductive layer u, and the conductive layer is formed with a resist layer 12, the resistor The layer U is formed with a plurality of openings 120 to: an electrical layer 11 through which the conductive layer is formed to form a circuit layer including a plurality of lines, wherein the threshold of the line 131 is as shown in the figure The position of the line (3) in the circuit layer of the circuit board 1 is at the position of the P/路 132 at the position of the microelectrode 2 (mi(10)_anGde) for microelectrolysis to remove the short circuit 132 ^ In the embodiment, the microelectrode 2 is a reduction end, ...: plate;:, # in this actual oxidation end, the circuit board conductive layer 11 ion step m 4 ί solution (for example, containing metal into = two close to the surface of the short circuit 13, so that the metal of the road 13 (For example, the metal reaction 'by removing the handle 〗 〖qx raw oxidation second real _ "仏路13, and can eliminate the short circuit between the lines (3). Figure 3 is the electric _ ^ section of the invention Schematic. The second method of repairing the line of the coveted board lies in the resist layer and the conductive layer Ϊ::: the most The difference between the reduction end of the electrolysis, the other = the pole 2 is the road (3) and becomes the oxidation end, so that the line electrode 2 of the circuit board 10 is electrolyzed to remove the line '], = the road, by The circuit repairing circuit of the micro-invention board:: short object. In the process of the circuit board circuit layer, the system is also applied to form the electricity, and after removing the resist layer and forming the layer, the 19449 200803658 private layer Previously, once the operator found that there was a short circuit problem between the lines, the method was used for timely removal; of course, the circuit repair method of the circuit board of the present embodiment can also be applied to the process of forming the circuit layer of the circuit board, that is, After removing the conductive layer and the resist layer which are pre-covered for forming the circuit layer, once the operator finds that there is a short circuit between the lines, the method can also be used for repair. (4) FIG. 4 shows the circuit board of the present invention. 2 = cross-sectional view of the embodiment. The difference from the previous _ implementation is:: Two liquid: = the junction position between the lines in the circuit layer of the circuit board 1 at the day miC1〇-dr〇plet) is micro-touched to move In addition to the short circuit 132. 1 to The circuit board of the first embodiment forms a conductive layer n on the surface of the circuit board, and the resist layer 12 has a sound 11 formed on the surface of the wide layer U, and the dry opening 120 is formed in the surface of the wide layer U. To expose the conductive layer U, the circuit layer of the conductive layer U2 (3) is wrong; wherein, _== into - contains a short circuit 132 between the plurality of traces 131. The pull is a corrosive chemical liquid, the path 132 The bad name is engraved with the corrupted money to remove the short circuit / the full quotation = short circuit 132 surface to micro-divide the short circuit 132 to eliminate the line 13 = (for example, metal copper), thereby moving the short circuit problem such as 31. Fig. 5 is a cross-sectional view showing a line of a circuit board of the present invention. The second embodiment of the present embodiment is that the resist layer and the conductive layer are removed to take a large difference; that is, the circuit of the circuit board removes the short nm between the lines to 'only A short circuit 132 between the lines (3) of 19449 9 200803658 is microetched to remove the short circuit 13 by etching. Similarly, the circuit repair method of the circuit board of the present invention can be applied to the process of forming the circuit layer of the circuit board before or after the removal of the resist layer and the conductive layer, and the arrester finds that there is a short circuit between the lines. The problem can be taken in a timely manner. The circuit repair method of the circuit board of the present invention is micro-electrolysis or micro-electrolysis through the micro-electrode or micro-droplet at the short-circuit position between the lines in the circuit board layer. In order to remove the short circuit and before or after removing the resist layer and the conductive layer in the process of forming the circuit sound of the circuit board, once the line 2 is found to have a short circuit date, the simple and effective repair method can be used only for the circuit. Removal occurs at the short-circuit location of the line in the circuit layer of the board. Therefore, in the short circuit problem of the line, the circuit repairing method of the circuit board of the present invention eliminates the need to re-protect the entire circuit board and does not need to report the entire circuit board, thereby reducing the process of the circuit board and the process. Increased the guilt and yield of the board. The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Any person skilled in the art can modify the above-described embodiments by modifying the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the scope of the patent application to be described later. (3) Today ~ [Simple Description of the Drawings] The IAMB diagram shows a cross-sectional view and a top view of the circuit board of the circuit board of the present invention; * Figure 2 shows the line 19449 of the circuit repair method of the circuit board of the present invention. 10 200803658 A cross-sectional view of the first embodiment of the removal. The circuit board of the present invention shows the short circuit between the microelectrodes and the method of the fourth method. The fourth figure shows the cup: "Reading the cross section ; pe The circuit board of this month is repaired by 4 retro, + short circuit between Κ Κ Κ Κ Κ Κ $ $ $ $ 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面 剖面Main component 7 is a schematic cross-sectional view of the fourth embodiment. 7 11 12 120 130 , 131 132 2 Circuit board conductive layer F and layer opening line short circuit microelectrode microdroplet 19449 11