200800461 (1) 九、發明說明 【發明所屬之技術領域】 本發明，是關於將雷射光照射於被加工物（以下，稱 爲工件）表面進行開孔等之加工時所產生的熔融飛散物或 ' 是煙等之副產物，從加工區域予以去除的方法及裝置。 ’ 【先前技術】 Φ 近年，相較於以往，作爲藉由簡單的方法而可以多層 化的多層印刷基板，被注目者有palAP (註冊商標）。該 工法，是將圖案加工後的基板予以積層再進行一次性之沖 壓成形者，於該製造程序中，具有：由在單面已貼合有銅 箔之基材及被覆基材之保護薄片所構成之基板形成有底微 孔，於該微孔內充塡作爲印刷基板之層間連接材料之金屬 錫膏之後，將基板予以積層之製程。 上述之有底微孔加工，是將雷射光照射在由基材及保 φ 護薄片所構成之組成不同的2層樹脂層來將樹脂予以燃燒 去除者，不過雷射光在貫穿表層之保護薄片時會引起爆發 性的沸騰，因而所產生之多量熔融樹脂的飛散物或焦灰等 ，會堆積於基板的保護薄片表面，在下一製程充塡金屬錫 ’ 膏時，成爲固化的粒子而進入有底微孔，由於混入到該錫 膏內而會產生連接信賴性變差等之品質不良的情形。 爲了防止此問題，故在充塡金屬錫膏之前必須洗淨工 件表面進行洗淨化，不過由於雷射加工製程是對由基材及 保護薄片所構成之2種類不同組成的樹脂進行加工’所以 200800461 (2) 飛散物爲微細的熔融樹脂，當附著固化於保護薄片表面時 ，會造成不容易由洗淨方式去除之問題。 又，在1片基板由於具有高達數十萬個微孔，所以粒 子掉落於有底微孔內之危險性亦高，粒子落下時，若附著 • 在微孔內部之電路部是難以藉由洗淨等方式來去除，若依 ^ 舊如此地殘留於微孔內時由於會增高導通阻抗，而恐有造 成電路連接不良之虞。 | 如此地，於上述基板之有底微孔的雷射加工中，粒子 之去除爲重要的技術問題。 又，雷射加工是不限於上述之基板的加工，對於其他 工件的加工，隨著加工，會產生濺射或粒子等之熔融飛散 物、煙霧、及蒸氣、焦灰、煙、燃燒氣體等（又，如上述 之隨著雷射加工所產生的副產物，以下，稱爲飛散物）。 因此，必須將此等伴隨著加工的飛散物，從加工區域或是 雷射加工頭周邊予以去除。 φ 以往之雷射加工機作爲對於此等飛散物的對應之策， 例如，周知有如日本特開平1 0-99978號公報所示之如後 圖式說明的第4圖、第5圖。 於第4圖所示者，是在雷射加工區域附近設置流體噴 ’ 嘴22及排氣導管23，利用同時地進行朝向雷射加工區域 的流體噴出以及對其進行抽吸，來防止伴隨雷射加工所產 生的粉塵附著於工件24的表面者，不過其效果，僅限於 流體所噴出之狹窄區域，對於寬廣飛散之粉塵，是無法期 待會有充分之效果。 -6- 200800461 (3) 又第5圖所顯示者爲第4圖所示之改良型，是藉由以 防塵蓋25覆蓋於流體噴嘴及排氣導管，在防塵蓋內所限 定的空間進行流體的噴出及該抽吸，而能夠更有效地防止 伴隨雷射加工之粉塵附著於工件表面。 ' 然而，特別是如上述之基板的有底微孔加工，於短時 • 間在一個加工區域中，進行多數處所之雷射加工之情形時 ，必須在短時間內去除及於廣大範圍的大部分飛散物，在 φ 如此之情形等之情形時，即使於第5圖所示的裝置，其效 果亦不夠充分，並且，當從吹氣噴嘴所噴出之流體之朝向 或散開方式有所變更時，就無法從防塵蓋內之全部區域將 飛散物有效果地去除，且防塵蓋之大小亦是爲有所制限者 〇 其他，諸如周知有：在雷射加工噴嘴的周圍產生旋繞 流，在雷射加工時更有效地去除從工件所產生的熔融物等 之日本特開2000-176672號公報、特公昭59-4 5 475號公報 • 等。 但是，該等者，是與上述噴嘴一體地設置於氣體排風 罩’用以防止集光透鏡受到上述熔融物等所污染者，但是 • 對於防止熔融物等之朝向工件表面的附著，卻不會有效果 . ，且，雷射加工噴嘴爲大型化，並不適合於利用雷射光進 行微細加工者。 【發明內容】 〔發明所要解決之問題〕 200800461 (4) 本發明’有鑑於如上述之狀況，係在提供一種可以迅 速地進行雷射加工時之飛散物的去除，並且即使飛散物附 著於工件表面，藉由下一程序的洗淨可以容易地將之去除 ’之在雷射加工中飛散物的去除方法及裝置，來作爲其課 ' 題。 〔發明解決問題之技術手段〕 爲了解決上述之問題，本發明係以如下所記載來作爲 特徵。 申請專利範圍第1項之在雷射加工中之飛散物的去除 方法之發明，是以：在被加工物的加工面上形成朝向雷射 加工區域之高速的下部氣流之同時，於其上部形成高速的 上部旋繞流，藉由下部氣流，將雷射加工所產生的飛散物 予以冷卻固化，而去除到雷射加工區域的周邊部，並且， 藉由上部旋繞流的減壓效果讓上述飛散物上昇而擴散於雷 射加工區域的周邊部，藉以將上述飛散物從雷射加工區域 高速地去除，之方式來作爲其特徵。 依據此發明，藉由高速的下部氣流與上部旋繞流之作 用，由於可以於短時間將及於廣大範圍之由雷射加工所產 生之熔融樹脂等之許多的飛散物予以去除，將本發明應用 於由雷射光進行印刷基板之有底微孔加工之情形時，可以 確實地進行飛散物之去除，而能夠提高基板的品質。又， 於此時，即使飛散物不能從加工區域去除，而掉落於微孔 內之情形時，藉由下部氣流的冷卻效果飛散物會固化，由 -8- 200800461 (5) 於不會熔著在基板，所以藉由下一製程之洗淨可以容易地 去除。 再者，於以往之飛散物的去除裝置，若要將在工件表 面產生的燃燒煙予以排氣是有困難的，因此，例如進行深 ' 孔加工之情形時等，雷射輸出受到燃燒煙的影響而擴散， - 因而造成高速加工的困難性，但若依據本發明，由於也可 以防止燃燒煙滯留於工件表面，所以能夠有效地利用雷射 φ 輸出，即使在如此之情形下亦能夠高速加工。 申請專利範圍第2項之飛散物的去除方法之發明，係 如該請求項所記載，更進一步地，是以：在被加工物的加 工面上配置圓筒狀的排氣罩，在該排氣罩內形成上述下部 氣流及上部旋繞流，將由雷射加工區域所去除的上述飛散 物從排氣罩內側外周部沿著旋繞流的進行方向予以排氣於 排氣罩外，之方式來作爲其特徵。 依據此發明，可以形成從排氣罩的中心部朝向外周部 φ 之高速的氣流流動，而能夠更加提高申請專利範圍第1項 的發明效果。 申請專利範圍第3項之在雷射加工中之飛散物的去除 - 裝置之發明，是由：配置在被加工物的加工面上，於上面 _ 具有雷射光可通過的窗，並且具有圓筒狀之側面的排氣罩 ;及形成於該排氣罩內，將排氣罩內的上部空間區劃成中 心部之擴散室及外周部之排氣室之環狀的肋；及於該擴散 室內配置在圓周上，於擴散室內形成旋繞流之複數個流體 噴嘴；及在肋下方之空間以包圍雷射加工區域之方式而配 -9- 200800461 (6) 置的複數個流體噴嘴；以及設置在上述排氣罩之側面，連 通於上述排氣室的排氣導管所構成，來作爲其特徵。 藉由簡單之裝置的構成，可以提供能夠確實地實施申 請專利範圍第1項之發明，於雷射加工中藉由使用該裝置 - ，可以確實地得到申請專利範圍第1項之發明效果。 - 申請專利範圍第4項之飛散物的去除裝置之發明，係 ^ 如該請求項所記載，更進一步地，是以：上述流體噴嘴， ^ 是被設定爲其噴射方向帶有向下之角度，並且上述肋，爲 朝向下方並傾斜以使擴散室擴開，之方式來作爲其特徵。 依據此發明，可以形成從擴散室的中心部朝向排氣室 之高速氣流的流動，而能夠更加提高申請專利範圍第3項 的發明效果。 申請專利範圍第5項之飛散物的去除裝置之發明，係 如該請求項所記載，更進一步地，是以：於設置在上述排 氣罩內之上述肋的下方，是將於中央部具有讓雷射光通過 φ 之開口的中間平板，設置成與上述排氣罩的側面隔有間隔 :配置在上述肋下方之空間的流體噴嘴，是受該中間平板 所支撐，之方式來作爲其特徵。 . 依據此發明，可以將已飛散於上方的飛散物確實地從 ' 擴散室朝向排出室排出，並且，可以容易地進行流體噴嘴 之安裝。 申請專利範圍第6項之飛散物的去除裝置之發明，係 如該請求項所記載，更進一步地，將上述排氣導管，以平 行於上述旋繞流之進行方向地設置於上述排氣罩的切線方 -10- 200800461 (7) 向，來作爲其特徵。 依據此發明，於排氣罩內可以形成朝向排氣室之高速 氣流的流動，而能夠更有效果地進行飛散物的去除。 【實施方式】 本發明者們，著眼於如上所述，將作爲工件之被覆著 樹脂之基板進行雷射加工時，所產生的飛散物以熔融狀態 掉落於基板表面進而堅固地熔著於基板，首先，對用以防 止此問題之手段進行檢討。 其結果，由實際觀察得知：在加工範圍內的工件表層 作出高速氣流，將產生的飛散物強制冷卻使之固化，再者 ，藉由該高速氣流，將已固化成球狀之粒子合同同時所產 生的加工煙予以排氣乃十分有效。 又，貼合有基材及保護薄片之2層的基板，於基材與 保護薄片之界面存在有保護薄片之黏著層，進行雷射加工 時’於黏著層所含有的溶劑會沸騰，造成已熔融之保護薄 片的樹脂爆發性的飛散。對於如此之飛散物，思及若是能 夠形成在高速下旋繞之氣流，利用其減壓效果來讓飛散物 上昇擴散，以高速去除已擴散的飛散物之方式，再加上工 件表層的高速氣流，不就可以更有效果地去除飛散物，因 而創造出本發明。 以下，以第1圖〜第3圖詳細說明實施本發明之飛散 物的去除方法及用以實施該方法之裝置之一實施形態。 第1圖，是顯示使用本發明之實施形態中之飛散物去 -11 -200800461 (1) EMBODIMENT OF THE INVENTION [Technical Field] The present invention relates to a molten spatter which is generated when laser light is irradiated onto a surface of a workpiece (hereinafter referred to as a workpiece) to perform drilling or the like. ' is a by-product of smoke, etc., and a method and apparatus for removing it from a processing area. [Prior Art] Φ In recent years, as a multilayer printed circuit board which can be multilayered by a simple method, palAP (registered trademark) has been attracting attention. This method is a method in which a substrate after patterning is laminated and then subjected to one-time press forming, and the manufacturing process includes a protective sheet of a substrate on which a copper foil is bonded to one surface and a coated substrate. The substrate is formed with a bottomed micropore, and the microporous is filled with a metal solder paste as an interlayer connection material of the printed substrate, and then the substrate is laminated. The above-described bottomed micropore processing is performed by irradiating laser light onto two resin layers having different compositions composed of a substrate and a protective sheet to burn the resin, but the laser light passes through the protective sheet of the surface layer. It causes explosive boiling, so that a large amount of molten resin, such as scattered matter or coke, is deposited on the surface of the protective sheet of the substrate. When the next process is filled with the metal tin paste, it becomes a solidified particle and enters the bottom. When the micropores are mixed into the solder paste, quality defects such as poor connection reliability may occur. In order to prevent this problem, it is necessary to wash the surface of the workpiece for cleaning and cleaning before filling the metal solder paste. However, since the laser processing process is processing the resin of two different compositions composed of the substrate and the protective sheet, 200800461 (2) The scattered matter is a fine molten resin. When it adheres to the surface of the protective sheet, it may cause a problem that it is not easily removed by washing. Moreover, since one substrate has up to hundreds of thousands of micropores, the risk of particles falling in the bottomed micropores is high, and when the particles fall, it is difficult to adhere to the circuit portion inside the micropores. It is removed by washing or the like. If it remains in the micropores as it is, it will increase the on-resistance, which may cause a poor connection of the circuit. Thus, in the laser processing of the bottomed micropores of the above substrate, the removal of particles is an important technical problem. Further, the laser processing is not limited to the processing of the above-described substrate, and processing of other workpieces may cause melting of scattered matter, smoke, vapor, coke, smoke, combustion gas, etc., such as sputtering or particles, as the workpiece is processed. Further, as described above, by-products generated by laser processing, hereinafter referred to as "scattered matter". Therefore, it is necessary to remove the scattered matter accompanying the processing from the processing area or the periphery of the laser processing head. φ The conventional laser processing machine is a countermeasure for the above-mentioned scattering materials. For example, FIG. 4 and FIG. 5 which are described later in the Japanese Patent Laid-Open Publication No. Hei No. 10-99978. As shown in Fig. 4, the fluid ejection nozzle 22 and the exhaust conduit 23 are provided in the vicinity of the laser processing region, and the fluid is discharged toward the laser processing region and sucked at the same time to prevent the accompanying lightning. The dust generated by the shot processing adheres to the surface of the workpiece 24, but the effect is limited to a narrow area where the fluid is ejected, and it is not expected to have sufficient effects for the dust which is widely scattered. -6- 200800461 (3) The figure shown in Fig. 5 is a modified version shown in Fig. 4, and the fluid is defined in the space defined by the dust cover by covering the fluid nozzle and the exhaust duct with the dust cover 25. The ejection and the suction can more effectively prevent the dust accompanying the laser processing from adhering to the surface of the workpiece. 'However, in particular, the bottomed micro-hole processing of the substrate as described above, in the case of laser processing of a plurality of spaces in a processing area in a short time, must be removed in a short time and large in a wide range. In the case of φ such as the case of φ, even in the device shown in Fig. 5, the effect is insufficient, and when the direction or the manner of scattering of the fluid ejected from the blowing nozzle is changed Therefore, it is impossible to remove the scattered matter from all areas in the dust cover, and the size of the dust cover is also limited to others. For example, it is known that a swirling flow is generated around the laser processing nozzle. In the case of the injection processing, it is more effective to remove the melt generated from the workpiece, such as JP-A-2000-176672, JP-A-59-4 5475, and the like. However, these are provided integrally with the nozzle in the gas hood "to prevent the concentrating lens from being contaminated by the melt or the like, but to prevent adhesion of the melt or the like to the surface of the workpiece, but not There is an effect. Moreover, the laser processing nozzle is large, and it is not suitable for micro-machining using laser light. SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] 200800461 (4) The present invention has been made in view of the above circumstances, and provides a method for removing a flying object which can be quickly subjected to laser processing, and even if a flying object adheres to the workpiece The surface can be easily removed by the cleaning of the next procedure, and the method and apparatus for removing the scattered matter in the laser processing are taken as the subject matter. [Technical means for solving the problem] In order to solve the above problems, the present invention is characterized as described below. The invention of the method for removing scattered matter in laser processing according to the first aspect of the patent application is characterized in that a high-speed lower airflow toward the laser processing region is formed on the processed surface of the workpiece, and the upper portion is formed at the same time. The high-speed upper swirling flow, the flying material generated by the laser processing is cooled and solidified by the lower airflow, and is removed to the peripheral portion of the laser processing region, and the scattered matter is obtained by the decompression effect of the upper swirling flow. It is characterized in that it is diffused and diffused in the peripheral portion of the laser processing region, whereby the above-mentioned scattered matter is removed from the laser processing region at a high speed. According to the invention, by the action of the high-speed lower airflow and the upper swirling flow, the present invention can be applied since a large amount of scattered matter such as molten resin generated by laser processing can be removed in a short time. When the bottomed microhole processing of the printed substrate is performed by laser light, the removal of the scattered matter can be surely performed, and the quality of the substrate can be improved. Moreover, at this time, even if the scattered matter cannot be removed from the processing area and falls into the micropore, the scattering material will solidify by the cooling effect of the lower airflow, and will not melt by -8-200800461 (5) It is on the substrate, so it can be easily removed by washing in the next process. Further, in the conventional device for removing scattered matter, it is difficult to exhaust the combustion smoke generated on the surface of the workpiece. Therefore, for example, when performing deep hole processing, the laser output is subjected to combustion smoke. The influence is spread, and thus the difficulty of high-speed machining is caused. However, according to the present invention, since the combustion smoke can be prevented from staying on the surface of the workpiece, the laser φ output can be effectively utilized, and even in such a case, high-speed machining can be performed. . The invention of the method for removing a scattered matter according to the second aspect of the patent application is as described in the above claims, and further, a cylindrical exhaust hood is disposed on the processed surface of the workpiece, and the row is arranged in the row The lower airflow and the upper swirling flow are formed in the air hood, and the scattered matter removed by the laser processing region is exhausted from the outer peripheral portion of the exhaust hood to the outside of the exhaust hood in the direction in which the swirling flow progresses. Its characteristics. According to the invention, it is possible to form a high-speed air flow from the center portion of the hood to the outer peripheral portion φ, and it is possible to further enhance the effect of the invention of the first application of the patent application. The invention relates to the removal of the scattered matter in the laser processing according to the third item of the patent application - the invention is composed of: disposed on the processing surface of the workpiece, on the upper surface _ having a window through which the laser light passes, and having a cylinder An exhaust hood on the side of the shape; and an annular rib formed in the hood to divide the upper space in the hood into a diffusion chamber at the center portion and an exhaust chamber at the outer peripheral portion; and the diffusion chamber a plurality of fluid nozzles disposed on the circumference to form a swirling flow in the diffusion chamber; and a plurality of fluid nozzles disposed in the space below the ribs to surround the laser processing region, and arranged in a manner of 9-200800461 (6); The side surface of the exhaust hood is configured by an exhaust duct that communicates with the exhaust chamber. By the configuration of a simple device, it is possible to provide an invention capable of reliably implementing the first aspect of the patent application, and by using the device in laser processing, the effect of the invention of claim 1 can be surely obtained. - The invention of the apparatus for removing scattered matter of claim 4 of the patent scope is as described in the claim, and further, the fluid nozzle, ^ is set to have a downward angle to the direction of the spray And the above-mentioned rib is characterized in such a manner that it faces downward and is inclined to expand the diffusion chamber. According to this invention, the flow of the high-speed airflow from the central portion of the diffusion chamber toward the discharge chamber can be formed, and the effect of the invention of claim 3 can be further enhanced. The invention of the apparatus for removing a scattered matter according to the fifth aspect of the patent application is as described in the above claims, and further, is provided below the rib provided in the exhaust hood, and has a central portion The intermediate plate that allows the laser light to pass through the opening of φ is disposed at a distance from the side surface of the hood: a fluid nozzle disposed in a space below the rib is supported by the intermediate plate. According to this invention, the scattered matter scattered above can be surely discharged from the diffusion chamber toward the discharge chamber, and the installation of the fluid nozzle can be easily performed. The invention of claim 6, wherein the exhaust duct is further disposed in the exhaust hood in a direction parallel to the direction in which the swirling flow is performed, as described in the above claims. Tangent side-10- 200800461 (7) To, come as its characteristics. According to this invention, the flow of the high-speed airflow toward the exhaust chamber can be formed in the exhaust hood, and the removal of the scattered matter can be performed more effectively. [Embodiment] The present inventors focused on the above-described process of performing laser processing on a substrate coated with a resin as a workpiece, and the generated scattering material is dropped on the surface of the substrate in a molten state to be firmly fused to the substrate. First, review the means to prevent this problem. As a result, it is known from actual observation that a high-speed airflow is made in the surface layer of the workpiece in the processing range, and the generated scattering material is forcibly cooled and solidified, and further, by the high-speed airflow, the pellets that have solidified into a spherical shape are simultaneously contracted. It is very effective to exhaust the processed tobacco. Further, a substrate having two layers of a substrate and a protective sheet is bonded to each other, and an adhesive layer for protecting the sheet exists at the interface between the substrate and the protective sheet. When the laser processing is performed, the solvent contained in the adhesive layer boils, causing The resin of the molten protective sheet is explosively scattered. For such a flying object, if it is possible to form a gas stream that is swirled at a high speed, the decompression effect is used to cause the scattering material to ascend and diffuse, and the diffused scattering material is removed at a high speed, and the high-speed airflow of the surface layer of the workpiece is added. The present invention can be created without removing the scattered matter more effectively. Hereinafter, an embodiment of a method for removing a scattering material according to the present invention and an apparatus for carrying out the method will be described in detail with reference to Figs. 1 to 3 . Figure 1 is a view showing the use of the scattering material in the embodiment of the present invention.
200800461 (8) 除裝置1將雷射加工工作台2上的工件3予以加 中的狀態說明圖，圖示出分別於基材3 -2之單面 形成電路之銅箔3-1，而於另一面具有保護薄片 此等所積層之多層印刷基板用之基板來作爲工件 雷射光4在由基材與保護薄片所構成之2層的樹 有底微孔5之情形。又，第2圖，是第1圖之飛 除裝置1之於A-A面之由箭頭方向所觀察的圖面 爲同樣情況之於B-B面之由箭頭方向所觀察的圖 於圖中，在雷射加工機7與工件3的加工面 有排氣罩6，該排氣罩6，係具有由上面部及側 成之高度較低的有底圓筒狀外形，且例如是夾介 裝在雷射加工機的框架。於該排氣罩6內部，其 罩內之空間做上下區分的中間平板8，是配設成 之間設有間隙1 9。該中間平板8，例如是利用支 罩6的上面部以懸吊等之手段被支撐於排氣罩。 於排氣罩6的上部中央，開設有配合雷射加 四角形加工窗9，又，在中間平板8的中央亦設 狀的開口 1 〇，排氣罩6以整體而言是構成爲甜甜 於排氣罩6的上面部下面，其環狀之肋11， 朝向下並傾斜使其內側擴開，排氣罩6之上部側 由該肋11分割爲擴散室12及排氣室13。又，ί 下端與中間平板8之間，形成有間隔14，使得 12之氣流可以流入排氣室13。 於面向擴散室12之排氣罩6的上面，在接 工之加工 具有用以 3_3之由 3，藉由 脂層形成 散物之去 ，第3圖 面。 之間配置 面部所構 托架而安 中將排氣 與排氣罩 柱由排氣 工範圍的 有同一形 圏形狀。 係形成爲 丨的空間， ί令肋1 1的 從擴散室 近於肋1 1 -12- 200800461 (9) 的圓周上，如第2圖所示地，4個位於上部側的流體噴嘴 15，是將噴射方向以朝向內來設置，於各個噴嘴，是由沒 有圖示出的高壓空氣產生裝置經由配管16而被供給高壓 空氣。 - 各流體噴嘴1 5，是以朝向離肋1 1之中心帶有角度之 ' 方向，向下亦帶有角度之方向地噴射出高速空氣20之方 式而設定，從各噴嘴15所噴射之朝向下的高速空氣20， φ 碰擊到圓形肋1 1之內壁而改變方向，作出高速地旋繞之 氣流。 此時，當肋1 1爲朝向下方傾斜時，則旋繞流成爲更 高速的向下旋繞流，利用該減壓效果讓由雷射加工所產生 的飛散物上昇，而可以使得在擴散室1 2所捕集到之飛散 物快速地從間隔1 4流入排氣室1 3。 又，向下旋繞流，由於亦形成從排氣罩外經過加工窗 9而到達擴散室1 2之氣流，故可以防止飛散物經過加工窗 φ 9而附著在雷射加工機7側。 再者，進行深孔加工之情形時，雖有燃燒煙滯留於工 件表面或孔內，使得雷射輸出擴散而造成高速加工困難之 • 情形，但藉由如上述般之利用旋繞流的減壓效果，可以將 : 燃燒煙吸引至擴散室，以防止由於燃燒煙而導致雷射輸出 擴散之現象，因而可以進行高速加工。 於中間平板8的下面，如第3圖所示地，其4個下部 側的流體噴嘴17是被設置成：以包圍雷射加工區域之方 式地，以向內同樣地設置噴出角度。從各噴嘴1 7所噴射 -13-200800461 (8) A state explanatory diagram in which the workpiece 1 on the laser processing table 2 is added, except for the device 1, which shows a copper foil 3-1 which forms a circuit on one side of the substrate 3-2, respectively. On the other hand, a substrate for a multilayer printed circuit board having a protective sheet or the like is used as a case where the project laser light 4 has two layers of tree bottomed micropores 5 composed of a substrate and a protective sheet. In addition, Fig. 2 is a view of the plane of the flying plane 1 of Fig. 1 viewed from the direction of the arrow in the direction of the arrow, which is observed in the direction of the arrow on the BB plane, in the figure, in the laser The processing surface of the processing machine 7 and the workpiece 3 has an exhaust hood 6 having a bottomed cylindrical shape having a lower height from the upper surface and the side, and is, for example, a clip-on laser. The frame of the processing machine. Inside the hood 6, an intermediate plate 8 in which the space in the hood is vertically divided is provided with a gap 19 therebetween. The intermediate flat plate 8 is supported by the exhaust hood by means of hanging or the like on the upper surface portion of the hood 6, for example. In the center of the upper portion of the exhaust hood 6, a matching laser and a quadrangular processing window 9 is opened, and an opening 1 亦 is also formed in the center of the intermediate plate 8. The exhaust hood 6 is configured to be sweet as a whole. On the lower surface of the upper surface of the hood 6, the annular rib 11 is downwardly inclined and extended to the inside, and the upper side of the hood 6 is divided by the rib 11 into the diffusion chamber 12 and the discharge chamber 13. Further, a gap 14 is formed between the lower end of the ί and the intermediate plate 8, so that the air flow of 12 can flow into the exhaust chamber 13. On the upper surface of the exhaust hood 6 facing the diffusion chamber 12, the processing for the processing has a 3:3, 3, and the formation of a foreign matter by the lipid layer, the third surface. The face is configured between the brackets and the exhaust and exhaust hoods are in the same shape of the exhaust manifold. a space formed as a weir, the rib 11 is spaced from the diffusion chamber on the circumference of the rib 1 1 -12- 200800461 (9), as shown in Fig. 2, four fluid nozzles 15 on the upper side, The injection direction is provided inwardly, and each nozzle is supplied with high-pressure air via a pipe 16 by a high-pressure air generating device (not shown). - each of the fluid nozzles 15 is set so as to eject the high-speed air 20 in a direction that is angled from the center of the rib 1 1 and is angled downward, and is ejected from each nozzle 15 The lower high-speed air 20, φ hits the inner wall of the circular rib 1 1 to change direction, and makes a high-speed swirling air flow. At this time, when the rib 11 is inclined downward, the swirling flow becomes a higher-speed downward swirling flow, and the decompression effect is caused by the decompression effect, and the scattering material can be caused to rise in the diffusion chamber 1 2 The captured particulate matter quickly flows into the exhaust chamber 13 from the interval 14. Further, since the flow is swirled downward, the airflow from the outside of the hood through the processing window 9 to the diffusion chamber 12 is also formed, so that the scattered matter can be prevented from adhering to the laser processing machine 7 side through the processing window φ9. Further, in the case of deep hole processing, although the combustion smoke is retained in the surface or the hole of the workpiece, the laser output is diffused and the high-speed machining is difficult, but the decompression using the swirling flow as described above is used. The effect is that: the combustion smoke is attracted to the diffusion chamber to prevent the laser output from being diffused due to the combustion of the smoke, so that high-speed machining can be performed. On the lower surface of the intermediate flat plate 8, as shown in Fig. 3, the four lower side fluid nozzles 17 are provided so as to surround the laser processing region so as to provide a discharge angle in the same direction. Sprayed from each nozzle 17 -13-
200800461 (10) 出的高速空氣21，是在工件3的加工面上形成朝向 工區域之高速的下部氣流。藉此，能夠將雷射加工 之加工面上的熔融飛散物予以冷卻固化，再從雷射 域去除而由排氣罩6與中間平板8之間的間隔1 9 氣室13。 又，此時，也可以調節從流體噴嘴1 7噴出之 朝向或是強度，使空氣碰擊於圓形排氣罩的壁面以 夠形成旋繞流。 又，在圖中，無論流體噴嘴15或是17，全都 用4個爲例來顯示，但其個數並非是受圖面所限定 是可因應隨著加工之飛散物的量或是排氣罩的大小 夠選用適當的數量。 於排氣室1 3，如第2圖所示，在排氣罩之呈偏 置，設置有排氣導管18，藉由沒有圖示出的排氣裝 排氣室內予以排氣。排氣導管1 8之朝向，以沿著 之進行方向之方式地設於排氣罩之切線方向爲理想 藉此，從上部側之流體噴嘴1 5所噴射出的空 是經過加工窗9及下部空間而流入擴散室1 2的氣 經過肋1 1與中間平板8之間隔1 4而流入排氣室1: 排氣導管18藉由排氣裝置而被排放，並且，從下 流體噴嘴1 7所噴射出的空氣、或是從排氣罩外周 氣流，是從形成在排氣罩6與中間平板8之間的 而流入排氣室1 3，同樣地可以被排放。 依據如以上說明之本發明的實施形態，由於藉 雷射加 所產生 加工區 流入排 空氣的 使之能 是以使 者，而 等，能 心的位 置，將 旋繞流 〇 氣、或 ,流，會 3，再由 ‘部側之 丨流入的 間隙19 丨由下部 -14- 200800461 (11) 側之流體噴嘴1 7所噴射的高速空氣2 1來冷卻工件3表面 ，故因雷射加工而飛散的樹脂等熔融物會急速地固化並球 狀化，一部分的樹脂，不會附著於工件表面而從排氣罩6 與中間平板8之間隙1 9而被抽吸至排氣室1 3，再從排氣 - 導管1 8被排放至外部。又，在擴散室1 2中，藉由上部側 η - 之流體噴嘴15所噴射的高速空氣20，如上述般地形成向 ^ 下的高速旋繞流，再者，從擴散室12經由肋11與中間平 板8之間隙1 4，藉由重疊流動於排氣室1 3之氣流以及上 述向下旋繞流，使得從工件面飛散更高之熔融樹脂與燃燒 煙快速地被抽吸至排氣室1 3，與旋繞方向平行地從排氣導 管1 8排放至外部。 其次，顯示使用上述之飛散物的去除裝置，對工件進 行有底微孔加工之例示。 首先，準備具有60mm四方形加工窗之本發明的排氣 罩，以保持3mm之間隙設置於加工工作台上之工件上。 φ 又，作爲工件者，係使用具有基材與保護薄片之2層樹脂 層的基板。然後，藉由排氣裝置，使排氣罩內成爲排氣狀 態之後，對各噴嘴施加〇.2MPa氣壓使空氣於工件表面及 ； 擴散室產生旋繞流。 ' 在此狀態下將雷射光照射於工件上，對工件之50mm 四方之範圍進行1萬個有底微孔之加工。然後，使加工台 移動，將工件移動至下一個加工區域，對所有加工區域依 序進行雷射加工。 對所有加工區域之雷射加工終了後，停止對各噴嘴的 -15- 200800461 (12) 空氣供給，終止排氣裝置，從加工工作台將工件卸下。 在觀察完成加工後之工件時，判定並無強固地附著於 工件表面上的熔融飛散物，因而確認了本發明之方法及裝 置之有效性。 ‘ 在以上的說明當中，作爲成爲雷射加工之對象的工件 a • ，雖然是以具有第1圖所示之基材與保護薄片之2層樹脂 層的基板爲例來做說明，但本發明之飛散物的去除方法及 ^ 裝置，並非僅限定於如此之工件的雷射加工。又，雖然是 顯示使用中間平板8之例示，但在飛散物的量並不是多量 之情形時，未必非得使用不可。於此情形時，以使用中間 平板之支持構造來使其支撐下部側的流體噴嘴1 7亦可。 以上所說明之實施形態爲本發明之例示，本發明，並 不受該實施形態所制限，而僅由申請專利範圍所記載之事 項所限定，對於上述以外的實施形態亦可實施。 φ 〔產業上之可利用性〕 依據本發明，由於可以於短時間及於廣大範圍地將由 雷射加工所產生之熔融樹脂等之許多的飛散物予以去除， 1 將本發明應用於由雷射光進行印刷基板之有底微孔加工之 ~ 情形時，可以確實地進行飛散物之去除，而能夠提高基板 的品質。再者，進行深孔加工之情形時等，由於也可以防 止燃燒煙滯留於工件表面，所以能夠有效地利用雷射輸出 ，即使在如此之情形下亦能夠高速加工等，可以發揮產業 上之有用效果。 -16 - 200800461 (13) 【圖式簡單說明】 第1圖，是用以說明使用本發明之實施形態中之飛散 物去除裝置的雷射加工之圖面。 第2圖，是由第1圖之A-A箭頭方向所示之視圖。 第3圖，是由第1圖之B_B箭頭方向所示之視圖。 第4圖，是用以說明先行例之圖面。 第5圖，是用以說明先行例之圖面。 【主要元件之符號說明】 1 :飛散物之去除裝置 2 :雷射加工工作台 3 :工件 3 · 1 :銅箔 3-2 :基材 3-3 :保護薄片 4 =雷射光 5 :有底微孔 6 :排氣罩 7 :雷射加工機 8 :中間平板 9 :加工窗 10 :開口 11 :肋 -17- 200800461 (14) 1 2 :擴散室 13 :排氣室 1 4 :間隔 1 5、1 7 :流體噴嘴 1 6 :配管 1 8 :排氣導管 1 9 :間隙200800461 (10) The high-speed air 21 is formed by forming a high-speed lower airflow toward the work area on the machined surface of the workpiece 3. Thereby, the molten scattered matter on the processed surface of the laser processing can be cooled and solidified, and then removed from the laser field to be separated by the air chamber 13 between the exhaust hood 6 and the intermediate flat plate 18. Further, at this time, the direction or intensity of the discharge from the fluid nozzles 17 may be adjusted so that the air hits the wall surface of the circular exhaust hood to form a swirling flow. Moreover, in the figure, regardless of the fluid nozzles 15 or 17, all of them are shown as four examples, but the number is not limited by the drawing surface, but may be dependent on the amount of scattered objects or the exhaust hood. The size is sufficient to use the appropriate amount. As shown in Fig. 2, the exhaust chamber 13 is provided with an exhaust duct 18 which is biased in the exhaust hood and is exhausted by a venting chamber (not shown). The direction of the exhaust duct 18 is preferably provided in the direction of the tangential direction of the exhaust hood along the direction in which the venting is performed, and the space ejected from the fluid nozzle 15 on the upper side passes through the processing window 9 and the lower portion. The air flowing into the diffusion chamber 12 through the space flows into the exhaust chamber 1 through the interval 14 of the rib 1 1 and the intermediate plate 8: the exhaust duct 18 is discharged by the exhaust device, and from the lower fluid nozzle 17 The ejected air or the outer peripheral airflow from the exhaust hood flows into the exhaust chamber 13 from between the exhaust hood 6 and the intermediate flat plate 8, and can be discharged in the same manner. According to the embodiment of the present invention as described above, since the processing area flowing into the exhaust air by the laser addition is enabled, the position of the energy center will be swirled, or the flow will be 3. Further, the gap 19 flowing in the 'side of the side 丨 冷却 is cooled by the high-speed air 2 1 sprayed from the fluid nozzle 17 on the lower side of the lower-14-200800461 (11), so that it is scattered by the laser processing. The melt such as resin is rapidly solidified and spheroidized, and a part of the resin is not adhered to the surface of the workpiece, and is sucked from the gap 9 of the exhaust hood 6 and the intermediate plate 8 to the exhaust chamber 13 and then Exhaust - The conduit 18 is discharged to the outside. Further, in the diffusion chamber 12, the high-speed air 20 ejected by the fluid nozzles 15 on the upper side η - is formed into a high-speed swirling flow as described above, and further, from the diffusion chamber 12 via the ribs 11 The gap 14 of the intermediate plate 8 is rapidly sucked to the exhaust chamber 1 by the higher flow of the molten resin and the combustion fumes from the workpiece surface by overlapping the air flow flowing through the exhaust chamber 13 and the downward swirling flow described above. 3. Discharged from the exhaust duct 18 to the outside in parallel with the winding direction. Next, an illustration of the bottomed micropore processing of the workpiece using the above-described removal device for the scattered matter is shown. First, an exhaust hood of the present invention having a 60 mm square-shaped processing window was prepared to maintain a gap of 3 mm on a workpiece on a processing table. φ Further, as the workpiece, a substrate having two resin layers of a substrate and a protective sheet is used. Then, after the exhaust hood is in an exhaust state by the exhaust device, a pressure of MPa 2 MPa is applied to each nozzle to cause air to flow around the surface of the workpiece and the diffusion chamber. In this state, laser light is irradiated onto the workpiece, and 10,000 bottomed micropores are processed in the range of 50 mm square of the workpiece. Then, the processing table is moved, the workpiece is moved to the next processing area, and laser processing is performed sequentially for all the processing areas. After the laser processing of all the machining areas is finished, stop the air supply to each nozzle -15-200800461 (12), terminate the exhaust, and remove the workpiece from the machining table. When the finished workpiece was observed, it was judged that there was no molten fly adhering strongly to the surface of the workpiece, and thus the effectiveness of the method and apparatus of the present invention was confirmed. In the above description, the workpiece a which is the target of laser processing is described as an example of a substrate having two resin layers of the substrate and the protective sheet shown in Fig. 1, but the present invention The method and device for removing the scattered matter are not limited to the laser processing of such a workpiece. Further, although the example in which the intermediate plate 8 is used is shown, when the amount of the scattered matter is not large, it is not necessary to use it. In this case, the fluid nozzle 17 on the lower side may be supported by the support structure of the intermediate plate. The embodiment described above is an exemplification of the present invention, and the present invention is not limited to the embodiment, and is limited only by the matters described in the claims, and may be implemented in other embodiments. φ [Industrial Applicability] According to the present invention, since many scattered materials such as molten resin generated by laser processing can be removed in a short time and in a wide range, the present invention is applied to laser light. When the bottomed micropore processing of the printed substrate is performed, the removal of the scattered matter can be reliably performed, and the quality of the substrate can be improved. In addition, in the case of deep hole processing, it is possible to prevent the combustion smoke from remaining on the surface of the workpiece, so that the laser output can be effectively utilized, and even in such a case, high-speed machining can be performed, and the industrial use can be utilized. effect. -16 - 200800461 (13) [Brief Description of the Drawings] Fig. 1 is a view for explaining the laser processing using the scattering material removing device in the embodiment of the present invention. Fig. 2 is a view taken in the direction of the arrow A-A of Fig. 1. Fig. 3 is a view taken in the direction of the arrow B_B of Fig. 1. Fig. 4 is a view for explaining the drawings of the prior art. Figure 5 is a diagram for explaining the example of the prior art. [Description of Symbols of Main Components] 1 : Removal device for flying objects 2: Laser processing table 3: Workpiece 3 · 1 : Copper foil 3-2: Substrate 3-3: Protective sheet 4 = Laser light 5: Bottom Micropore 6 : Exhaust hood 7 : Laser processing machine 8 : Intermediate plate 9 : Process window 10 : Opening 11 : Rib -17- 200800461 (14) 1 2 : Diffusion chamber 13 : Exhaust chamber 1 4 : Interval 1 5 , 1 7 : Fluid nozzle 1 6 : Piping 1 8 : Exhaust duct 1 9 : Clearance
20、21:局速空氣20, 21: Local speed air
-18--18-