TW200746182A - Ceramic component element, ceramic component and method for the same - Google Patents

Ceramic component element, ceramic component and method for the same

Info

Publication number
TW200746182A
TW200746182A TW096108182A TW96108182A TW200746182A TW 200746182 A TW200746182 A TW 200746182A TW 096108182 A TW096108182 A TW 096108182A TW 96108182 A TW96108182 A TW 96108182A TW 200746182 A TW200746182 A TW 200746182A
Authority
TW
Taiwan
Prior art keywords
sheet
ceramic
functional
ceramic component
ceramic base
Prior art date
Application number
TW096108182A
Other languages
Chinese (zh)
Other versions
TWI367504B (en
Inventor
Kwang-Hwi Choi
Sung-Soo Jo
Sun-Ki Kim
Original Assignee
Joinset Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joinset Co Ltd filed Critical Joinset Co Ltd
Publication of TW200746182A publication Critical patent/TW200746182A/en
Application granted granted Critical
Publication of TWI367504B publication Critical patent/TWI367504B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • C04B35/645—Pressure sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Insulating Bodies (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

A ceramic component element is provided. The ceramic component element includes: an insulating ceramic base with pores formed on its surface and previously fired; and a functional ceramic sheet bonded to the insulating ceramic base and having electrical characteristics. The functional ceramic sheet is physically bonded to the insulating ceramic base by forming pressing a green sheet for the functional ceramic sheet on the insulating ceramic base at constant temperature and pressure so that parts of the green sheet are forced to put into the pores and anchored, and the functional ceramic sheet is chemically bonded to the insulating ceramic base by firing the anchored green sheet in such a manner that functional oxides of the green sheet penetrate the insulating ceramic base by solid diffusion to form a diffusion bonding layer.
TW096108182A 2006-03-10 2007-03-09 Ceramic component element, ceramic component and method for the same TWI367504B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20060022653 2006-03-10
KR1020060057122A KR100693119B1 (en) 2006-03-10 2006-06-23 Ceramic component element and ceramic component and method for the same

Publications (2)

Publication Number Publication Date
TW200746182A true TW200746182A (en) 2007-12-16
TWI367504B TWI367504B (en) 2012-07-01

Family

ID=38103162

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108182A TWI367504B (en) 2006-03-10 2007-03-09 Ceramic component element, ceramic component and method for the same

Country Status (2)

Country Link
KR (1) KR100693119B1 (en)
TW (1) TWI367504B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506900B (en) * 2010-10-15 2015-11-01 Murata Manufacturing Co Electrostatic discharge protection device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101198697B1 (en) 2011-06-14 2012-11-12 (주) 아모엘이디 Non-shrinkage varistor substrate and method for manufacturing the same
KR101483259B1 (en) 2012-08-28 2015-01-14 주식회사 아모센스 Non-shrinkage varistor substrate and method for manufacturing the same
WO2014035143A1 (en) * 2012-08-28 2014-03-06 ㈜ 아모엘이디 Non-shrink varistor substrate and production method for same
KR20140148105A (en) * 2013-06-21 2014-12-31 삼성전기주식회사 Thin-type common mode filter and manufacturing method thereof
KR101508840B1 (en) * 2013-08-14 2015-04-06 삼성전기주식회사 Cutting sintered ceramic sheet and method for producing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506900B (en) * 2010-10-15 2015-11-01 Murata Manufacturing Co Electrostatic discharge protection device

Also Published As

Publication number Publication date
TWI367504B (en) 2012-07-01
KR100693119B1 (en) 2007-03-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees