TW200745955A - Chip scale chip card having component embedded in substrate - Google Patents

Chip scale chip card having component embedded in substrate

Info

Publication number
TW200745955A
TW200745955A TW095120082A TW95120082A TW200745955A TW 200745955 A TW200745955 A TW 200745955A TW 095120082 A TW095120082 A TW 095120082A TW 95120082 A TW95120082 A TW 95120082A TW 200745955 A TW200745955 A TW 200745955A
Authority
TW
Taiwan
Prior art keywords
chip
card
substrate
component embedded
scale
Prior art date
Application number
TW095120082A
Other languages
Chinese (zh)
Other versions
TWI307861B (en
Inventor
Hung-Hsin Hsu
Original Assignee
Powertech Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powertech Technology Inc filed Critical Powertech Technology Inc
Priority to TW95120082A priority Critical patent/TWI307861B/en
Publication of TW200745955A publication Critical patent/TW200745955A/en
Application granted granted Critical
Publication of TWI307861B publication Critical patent/TWI307861B/en

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Abstract

A chip scale chip card (CSC) mainly includes a chip carrier having a plurality of external contact fingers and a cavity, at least a micro electronic element, a first chip, a second chip, and an encapsulant. The micro electronic element is embedded in the cavity. The first and second chips are disposed on the carrier. Therein, the chip card has a contact surface from which the external contact fingers are exposed. The cavity for accommodating the micro electronic element is included in chip bond area of the first chip such that the area of the contact surface is between 1.0~1.5 times of that of the active surface of the chip. The chip card will be of chip scale and stack more chips.
TW95120082A 2006-06-06 2006-06-06 Chip scale chip card having component embedded in substrate TWI307861B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95120082A TWI307861B (en) 2006-06-06 2006-06-06 Chip scale chip card having component embedded in substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95120082A TWI307861B (en) 2006-06-06 2006-06-06 Chip scale chip card having component embedded in substrate

Publications (2)

Publication Number Publication Date
TW200745955A true TW200745955A (en) 2007-12-16
TWI307861B TWI307861B (en) 2009-03-21

Family

ID=45071692

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95120082A TWI307861B (en) 2006-06-06 2006-06-06 Chip scale chip card having component embedded in substrate

Country Status (1)

Country Link
TW (1) TWI307861B (en)

Also Published As

Publication number Publication date
TWI307861B (en) 2009-03-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees