TW200745780A - Exposure apparatus, exposure method, and device manufacturing method - Google Patents

Exposure apparatus, exposure method, and device manufacturing method

Info

Publication number
TW200745780A
TW200745780A TW096113181A TW96113181A TW200745780A TW 200745780 A TW200745780 A TW 200745780A TW 096113181 A TW096113181 A TW 096113181A TW 96113181 A TW96113181 A TW 96113181A TW 200745780 A TW200745780 A TW 200745780A
Authority
TW
Taiwan
Prior art keywords
exposure
detection light
device manufacturing
exposure apparatus
reception
Prior art date
Application number
TW096113181A
Other languages
English (en)
Inventor
Naoyuki Kobayashi
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200745780A publication Critical patent/TW200745780A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
TW096113181A 2006-04-14 2007-04-14 Exposure apparatus, exposure method, and device manufacturing method TW200745780A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006112015 2006-04-14

Publications (1)

Publication Number Publication Date
TW200745780A true TW200745780A (en) 2007-12-16

Family

ID=38609581

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096113181A TW200745780A (en) 2006-04-14 2007-04-14 Exposure apparatus, exposure method, and device manufacturing method

Country Status (5)

Country Link
US (1) US20070291261A1 (zh)
JP (1) JPWO2007119821A1 (zh)
KR (1) KR20090007282A (zh)
TW (1) TW200745780A (zh)
WO (1) WO2007119821A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111045291A (zh) * 2018-10-12 2020-04-21 佳能株式会社 异物检测装置、曝光装置以及物品的制造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009113528A1 (ja) * 2008-03-11 2009-09-17 株式会社ニコン 形状測定装置
KR20140108348A (ko) * 2009-08-07 2014-09-05 가부시키가이샤 니콘 이동체 장치, 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
WO2012115002A1 (ja) 2011-02-22 2012-08-30 株式会社ニコン 保持装置、露光装置、及びデバイスの製造方法
US11275312B1 (en) 2020-11-30 2022-03-15 Waymo Llc Systems and methods for verifying photomask cleanliness

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100300618B1 (ko) * 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
US5777722A (en) * 1994-04-28 1998-07-07 Nikon Corporation Scanning exposure apparatus and method
JP2000505958A (ja) * 1996-12-24 2000-05-16 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ２個の物品ホルダを有する二次元バランス位置決め装置及びこの位置決め装置を有するリソグラフ装置
US6549271B2 (en) * 1997-01-28 2003-04-15 Nikon Corporation Exposure apparatus and method
US6897963B1 (en) * 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
AU1078700A (en) * 1998-11-06 2000-05-29 Nikon Corporation Exposure method and exposure apparatus
TW529172B (en) * 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
TWI242691B (en) * 2002-08-23 2005-11-01 Nikon Corp Projection optical system and method for photolithography and exposure apparatus and method using same
JP2004095653A (ja) * 2002-08-29 2004-03-25 Nikon Corp 露光装置
CN101349876B (zh) * 2002-11-12 2010-12-01 Asml荷兰有限公司 光刻装置和器件制造方法
KR100585476B1 (ko) * 2002-11-12 2006-06-07 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조방법
US7242455B2 (en) * 2002-12-10 2007-07-10 Nikon Corporation Exposure apparatus and method for producing device
KR101381538B1 (ko) * 2003-02-26 2014-04-04 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
JP2004356290A (ja) * 2003-05-28 2004-12-16 Nikon Corp 露光装置及び露光方法
JP2005085991A (ja) * 2003-09-09 2005-03-31 Canon Inc 露光装置及び該装置を用いたデバイス製造方法
WO2005029559A1 (ja) * 2003-09-19 2005-03-31 Nikon Corporation 露光装置及びデバイス製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111045291A (zh) * 2018-10-12 2020-04-21 佳能株式会社 异物检测装置、曝光装置以及物品的制造方法
CN111045291B (zh) * 2018-10-12 2023-08-11 佳能株式会社 异物检测装置、曝光装置以及物品的制造方法

Also Published As

Publication number Publication date
WO2007119821A1 (ja) 2007-10-25
JPWO2007119821A1 (ja) 2009-08-27
US20070291261A1 (en) 2007-12-20
KR20090007282A (ko) 2009-01-16

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