TW200744954A - Process for production of copper powder and copper powder obtained by the process - Google Patents

Process for production of copper powder and copper powder obtained by the process

Info

Publication number
TW200744954A
TW200744954A TW096109738A TW96109738A TW200744954A TW 200744954 A TW200744954 A TW 200744954A TW 096109738 A TW096109738 A TW 096109738A TW 96109738 A TW96109738 A TW 96109738A TW 200744954 A TW200744954 A TW 200744954A
Authority
TW
Taiwan
Prior art keywords
copper
slurry
suboxide
copper powder
reducing agent
Prior art date
Application number
TW096109738A
Other languages
Chinese (zh)
Inventor
Takahiko Sakaue
Katsuhiko Yoshimaru
Yoshinobu Nakamura
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200744954A publication Critical patent/TW200744954A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks

Abstract

The invention aims at providing a process for producing copper powder composed of uniform fine particles by a wet reduction method efficiently and high-quality copper powder excellent in particle size distribution. In order to attain the aim, a process for the production of copper powder is employed, which comprises reacting an aqueous solution of copper ions with an alkali solution to form a copper hydroxide slurry, adding a reducing agent to the slurry to conduct the first reduction treatment of the slurry and thereby form a copper suboxide slurry, allowing the copper suboxide slurry to stand to precipitate copper suboxide particles, removing the formed supernatant, washing the copper suboxide particles by the addition of water to form a washed copper suboxide slurry, and adding a reducing agent to the suboxide slurry to conduct the second reduction treatment of the slurry and thereby form copper powder, characterized in that in the first reduction treatment, both a hydrazine as a reducing agent and aqueous ammonia as a pH regulator are added to the copper hydroxide slurry.
TW096109738A 2006-03-24 2007-03-21 Process for production of copper powder and copper powder obtained by the process TW200744954A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006082457A JP5144022B2 (en) 2006-03-24 2006-03-24 Copper powder manufacturing method and copper powder obtained by the manufacturing method

Publications (1)

Publication Number Publication Date
TW200744954A true TW200744954A (en) 2007-12-16

Family

ID=38541149

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109738A TW200744954A (en) 2006-03-24 2007-03-21 Process for production of copper powder and copper powder obtained by the process

Country Status (5)

Country Link
JP (1) JP5144022B2 (en)
KR (1) KR20080104020A (en)
CN (1) CN101394961A (en)
TW (1) TW200744954A (en)
WO (1) WO2007111231A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI450778B (en) * 2010-01-11 2014-09-01 Oriental Happy Entpr Co Ltd A method of industry-scale for producing sub-micro and nano copper powder

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CN101722314B (en) * 2009-11-20 2014-08-20 云南大学 Method for preparing Cu2O-Cu composite microsphere by adopting bean flour as template
JP2011174144A (en) * 2010-02-25 2011-09-08 Jx Nippon Mining & Metals Corp Fine powder of copper and method for producing the same
JP5720693B2 (en) * 2010-10-06 2015-05-20 旭硝子株式会社 Method for producing conductive copper particles
JP5785433B2 (en) * 2011-04-28 2015-09-30 三井金属鉱業株式会社 Low carbon copper particles
CN102274979B (en) * 2011-09-20 2013-04-24 南京林业大学 Method for preparing nano copper powder in micromolecular viscous medium
JP5926644B2 (en) * 2011-09-30 2016-05-25 Ｄｏｗａエレクトロニクス株式会社 Cuprous oxide powder and method for producing the same
US10141082B2 (en) * 2012-11-02 2018-11-27 Korea Institute Of Science And Technology Oxidation resistant copper nanoparticles and method for producing same
JP5872063B2 (en) 2012-11-26 2016-03-01 三井金属鉱業株式会社 Copper powder
CN103480855A (en) * 2013-05-28 2014-01-01 昆明物语科技有限公司 Preparation method of superfine copper powder for copper paste
CN103658675B (en) * 2013-12-23 2015-06-24 广东东硕科技有限公司 Copper nanowire and preparation method thereof
WO2015122251A1 (en) 2014-02-14 2015-08-20 三井金属鉱業株式会社 Copper powder
CN104028763B (en) * 2014-06-11 2017-01-04 杭州前进齿轮箱集团股份有限公司 A kind of pyrite strengthens the manufacture method of wet copper-based friction plate
CN104858415B (en) * 2015-04-23 2017-03-01 金川集团股份有限公司 A kind of washing methods of super fine silver powder
JP6811012B2 (en) * 2015-12-02 2021-01-13 Ｄｏｗａエレクトロニクス株式会社 How to make copper powder
WO2018025562A1 (en) 2016-08-03 2018-02-08 株式会社Adeka Method for producing copper powder
JP6549298B1 (en) 2018-09-21 2019-07-24 Ｊｘ金属株式会社 Pulverizable copper powder and method for producing the same
CN111957986B (en) * 2020-08-20 2023-04-18 湖南泽宇新材料有限公司 Spherical nano copper powder and preparation method and application thereof
CN113523269B (en) * 2021-06-08 2023-06-16 五邑大学 Copper powder and preparation method and application thereof
JP7000621B1 (en) * 2021-06-17 2022-01-19 古河ケミカルズ株式会社 Method for manufacturing copper fine particles
WO2023223586A1 (en) * 2022-05-18 2023-11-23 三井金属鉱業株式会社 Copper powder and method for producing same

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JPS6299406A (en) * 1985-10-28 1987-05-08 Mitsui Mining & Smelting Co Ltd Production of copper powder
JP2728726B2 (en) * 1989-05-10 1998-03-18 正同化学工業株式会社 Method for producing fine copper powder
JP2638271B2 (en) * 1990-09-06 1997-08-06 住友金属工業株式会社 Production method of copper fine powder
JPH06235006A (en) * 1993-02-09 1994-08-23 Sumitomo Metal Mining Co Ltd Laminated silver powder, flaky silver powder, their production, conductive paste composition and conductive adhesive composition
JP2911429B2 (en) * 1997-06-04 1999-06-23 三井金属鉱業株式会社 Production method of copper fine powder
JP4639395B2 (en) * 2001-08-09 2011-02-23 Ｄｏｗａエレクトロニクス株式会社 Method for producing silver particles
JP4145127B2 (en) * 2002-11-22 2008-09-03 三井金属鉱業株式会社 Flake copper powder, method for producing the flake copper powder, and conductive paste using the flake copper powder
JP4252349B2 (en) * 2003-04-11 2009-04-08 石原産業株式会社 Copper powder, method for producing the same, copper paste using the copper powder, copper paint, electrode
JP4208704B2 (en) * 2003-12-04 2009-01-14 石原産業株式会社 Copper powder, method for producing the same, fluid composition containing the same, and electrode using the same
JP2005206931A (en) * 2003-12-26 2005-08-04 Sumitomo Electric Ind Ltd Method for producing metal powder
JP4868716B2 (en) * 2004-04-28 2012-02-01 三井金属鉱業株式会社 Flake copper powder and conductive paste

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI450778B (en) * 2010-01-11 2014-09-01 Oriental Happy Entpr Co Ltd A method of industry-scale for producing sub-micro and nano copper powder

Also Published As

Publication number Publication date
KR20080104020A (en) 2008-11-28
WO2007111231A1 (en) 2007-10-04
JP5144022B2 (en) 2013-02-13
CN101394961A (en) 2009-03-25
JP2007254846A (en) 2007-10-04

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