TW200743665A - Chemical mechanical polishing method and slurry composition - Google Patents

Chemical mechanical polishing method and slurry composition

Info

Publication number
TW200743665A
TW200743665A TW095118822A TW95118822A TW200743665A TW 200743665 A TW200743665 A TW 200743665A TW 095118822 A TW095118822 A TW 095118822A TW 95118822 A TW95118822 A TW 95118822A TW 200743665 A TW200743665 A TW 200743665A
Authority
TW
Taiwan
Prior art keywords
particle
chemical mechanical
mechanical polishing
polishing method
slurry composition
Prior art date
Application number
TW095118822A
Other languages
Chinese (zh)
Other versions
TWI340163B (en
Inventor
Andy Chun-Xiao Yang
Chris Chang Yu
Original Assignee
Anji Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anji Microelectronics Co Ltd filed Critical Anji Microelectronics Co Ltd
Priority to TW095118822A priority Critical patent/TWI340163B/en
Publication of TW200743665A publication Critical patent/TW200743665A/en
Application granted granted Critical
Publication of TWI340163B publication Critical patent/TWI340163B/en

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  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention discloses a chemical mechanical polishing slurry including at least one kind of abrasive particle, at least one kind of oxidant and at least one kind of carrier. The abrasive particle comprises one selected from the following group consisting of soft particle, particle with soft outside and tough inside, charged particle, magnetized particle and hollow particle. The base for polishing is one selected from the following group consisting of aluminum, copper, titanium, nitride titanium, silver, tungsten, alloy of the aforesaid metals, oxide, nickel-phosphorous or Si3N4.
TW095118822A 2006-05-26 2006-05-26 Chemical mechanical polishing method and slurry composition TWI340163B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095118822A TWI340163B (en) 2006-05-26 2006-05-26 Chemical mechanical polishing method and slurry composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095118822A TWI340163B (en) 2006-05-26 2006-05-26 Chemical mechanical polishing method and slurry composition

Publications (2)

Publication Number Publication Date
TW200743665A true TW200743665A (en) 2007-12-01
TWI340163B TWI340163B (en) 2011-04-11

Family

ID=55855724

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118822A TWI340163B (en) 2006-05-26 2006-05-26 Chemical mechanical polishing method and slurry composition

Country Status (1)

Country Link
TW (1) TWI340163B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114286846A (en) * 2019-08-30 2022-04-05 圣戈本陶瓷及塑料股份有限公司 Fluid compositions and methods for performing material removal operations

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114286846A (en) * 2019-08-30 2022-04-05 圣戈本陶瓷及塑料股份有限公司 Fluid compositions and methods for performing material removal operations
US11518913B2 (en) 2019-08-30 2022-12-06 Saint-Gobain Ceramics & Plastics, Inc. Fluid composition and method for conducting a material removing operation
CN114286846B (en) * 2019-08-30 2023-06-06 圣戈本陶瓷及塑料股份有限公司 Fluid compositions and methods for performing material removal operations

Also Published As

Publication number Publication date
TWI340163B (en) 2011-04-11

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