TW200741999A - A group clamp for fixing IC package - Google Patents

A group clamp for fixing IC package

Info

Publication number
TW200741999A
TW200741999A TW095114462A TW95114462A TW200741999A TW 200741999 A TW200741999 A TW 200741999A TW 095114462 A TW095114462 A TW 095114462A TW 95114462 A TW95114462 A TW 95114462A TW 200741999 A TW200741999 A TW 200741999A
Authority
TW
Taiwan
Prior art keywords
block
fixing
package
group clamp
bottom block
Prior art date
Application number
TW095114462A
Other languages
Chinese (zh)
Other versions
TWI305402B (en
Inventor
Yen-Kun Chi
Hsiu-Chin Wang
Tzung-Lin Chuang
Chi-Feng Hung
Chun-Hao Huang
Ming Chin Chen
Chiu Ping Huang
Chih Wei Chen
Chin Lung Yu
Yungfa Liu
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW095114462A priority Critical patent/TWI305402B/en
Publication of TW200741999A publication Critical patent/TW200741999A/en
Application granted granted Critical
Publication of TWI305402B publication Critical patent/TWI305402B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)

Abstract

A group clamp for fixing IC package mainly includes a top block and a bottom block. The top block has a first surface, a second surface and at least one first cavity that through the first surface and the second surface. The bottom block has a second cavity corresponding to the first cavity, at least one fixing device is placed in the bottom block and the top block is combined with the bottom block by the fixing device. We just separate the top block from the bottom block if need to change the top block or the bottom block, it has efficiency for cost down.
TW095114462A 2006-04-21 2006-04-21 A group clamp for fixing ic package TWI305402B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095114462A TWI305402B (en) 2006-04-21 2006-04-21 A group clamp for fixing ic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095114462A TWI305402B (en) 2006-04-21 2006-04-21 A group clamp for fixing ic package

Publications (2)

Publication Number Publication Date
TW200741999A true TW200741999A (en) 2007-11-01
TWI305402B TWI305402B (en) 2009-01-11

Family

ID=45071139

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114462A TWI305402B (en) 2006-04-21 2006-04-21 A group clamp for fixing ic package

Country Status (1)

Country Link
TW (1) TWI305402B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108346594A (en) * 2017-01-25 2018-07-31 日月光半导体制造股份有限公司 Semiconductor packages limited part

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108346594A (en) * 2017-01-25 2018-07-31 日月光半导体制造股份有限公司 Semiconductor packages limited part
CN108346594B (en) * 2017-01-25 2022-08-09 日月光半导体制造股份有限公司 Semiconductor package limiting part

Also Published As

Publication number Publication date
TWI305402B (en) 2009-01-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees