TW200741328A - Illumination optical apparatus, projection exposure apparatus, projection optical system, and device manufacturing method - Google Patents

Illumination optical apparatus, projection exposure apparatus, projection optical system, and device manufacturing method

Info

Publication number
TW200741328A
TW200741328A TW096112420A TW96112420A TW200741328A TW 200741328 A TW200741328 A TW 200741328A TW 096112420 A TW096112420 A TW 096112420A TW 96112420 A TW96112420 A TW 96112420A TW 200741328 A TW200741328 A TW 200741328A
Authority
TW
Taiwan
Prior art keywords
projection
optical system
exposure light
reticle
device manufacturing
Prior art date
Application number
TW096112420A
Other languages
Chinese (zh)
Inventor
Michio Noboru
Naomasa Shiraishi
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200741328A publication Critical patent/TW200741328A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Optical Elements Other Than Lenses (AREA)

Abstract

An illumination optical system IU of a projection exposure apparatus for projecting and exposing a pattern of a reticle R onto a wafer W comprises a secondary relay optical system 22 for forming a plane 62 optically conjugate with a reticle surface between an exposure light source 10 and the reticle R, and an optical path combining mirror 21 for combining exposure light beams IL1 and IL2 from the exposure light source 10 so that they illuminate the reticle surface closely to each other there, wherein the optical path combining mirror 21 includes reflecting surfaces 21a and 21b for respectively reflecting the exposure light beams IL1 and IL2, and wherein a ridge line 21c at the boundary between the reflecting surfaces 21 a and 21b is arranged on or near the plane 62.
TW096112420A 2006-04-12 2007-04-10 Illumination optical apparatus, projection exposure apparatus, projection optical system, and device manufacturing method TW200741328A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006110342A JP4784746B2 (en) 2006-04-12 2006-04-12 Illumination optical apparatus, projection exposure apparatus, projection optical system, and device manufacturing method

Publications (1)

Publication Number Publication Date
TW200741328A true TW200741328A (en) 2007-11-01

Family

ID=38158055

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096112420A TW200741328A (en) 2006-04-12 2007-04-10 Illumination optical apparatus, projection exposure apparatus, projection optical system, and device manufacturing method

Country Status (5)

Country Link
EP (1) EP2005253A1 (en)
JP (1) JP4784746B2 (en)
KR (1) KR20090019782A (en)
TW (1) TW200741328A (en)
WO (1) WO2007119839A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651602B (en) * 2017-01-18 2019-02-21 日商佳能股份有限公司 Evaluation method, article manufacturing method, and evaluation program
TWI736303B (en) * 2019-06-05 2021-08-11 美商應用材料股份有限公司 Apertures for flat optical devices
CN113805439A (en) * 2021-09-23 2021-12-17 上海度宁科技有限公司 Projection photoetching machine, illumination system, control system and method
US11982824B2 (en) 2020-07-20 2024-05-14 Applied Materials, Inc. Integrated conductive apertures for optical devices

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090048541A (en) 2006-07-12 2009-05-14 가부시키가이샤 니콘 Illuminating optical apparatus, exposure apparatus and device manufacturing method
KR20090033165A (en) * 2006-07-12 2009-04-01 가부시키가이샤 니콘 Illuminating optical apparatus, exposure apparatus and device manufacturing method
JP5308638B2 (en) * 2006-07-14 2013-10-09 カール・ツァイス・エスエムティー・ゲーエムベーハー Illumination optical system for microlithographic projection exposure apparatus
DE102006032810A1 (en) 2006-07-14 2008-01-17 Carl Zeiss Smt Ag Illumination optics for a microlithography projection exposure apparatus, illumination system with such an illumination optics, microlithography projection exposure apparatus with such an illumination system, microlithographic production method for components and component produced by this method
JP4883482B2 (en) * 2006-08-18 2012-02-22 株式会社ニコン Illumination optical apparatus, exposure apparatus, and device manufacturing method
US8384875B2 (en) 2008-09-29 2013-02-26 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP5187519B2 (en) * 2008-12-10 2013-04-24 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US8610878B2 (en) * 2010-03-04 2013-12-17 Asml Netherlands B.V. Lithographic apparatus and method
US9081297B2 (en) 2012-05-01 2015-07-14 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus having dual reticle edge masking assemblies and method of use
WO2014111098A1 (en) * 2013-01-17 2014-07-24 Carl Zeiss Smt Gmbh Method of lithographically transferring a pattern on a light sensitive surface and illumination system of a microlithographic projection exposure apparatus
DE102015224522B4 (en) * 2015-12-08 2018-06-21 Carl Zeiss Smt Gmbh Illumination system of a microlithographic projection system and method for operating such a system
US11175487B2 (en) * 2017-06-19 2021-11-16 Suss Microtec Photonic Systems Inc. Optical distortion reduction in projection systems
JP7461454B2 (en) * 2020-03-19 2024-04-03 ギガフォトン株式会社 Exposure system and method for manufacturing electronic device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111601A (en) * 1997-10-06 1999-04-23 Nikon Corp Method and device for exposure
JP2000021742A (en) * 1998-06-30 2000-01-21 Canon Inc Method of exposure and exposure equipment
JP2000021748A (en) * 1998-06-30 2000-01-21 Canon Inc Method of exposure and exposure equipment
JP3969855B2 (en) * 1998-07-02 2007-09-05 キヤノン株式会社 Exposure method and exposure apparatus
JP2000021765A (en) 1998-07-03 2000-01-21 Nikon Corp Illuminating apparatus and projection aligner using the apparatus
JP2000031028A (en) * 1998-07-07 2000-01-28 Canon Inc Exposure method and exposure apparatus
JP2001297976A (en) * 2000-04-17 2001-10-26 Canon Inc Method of exposure and aligner
JP4323903B2 (en) * 2003-09-12 2009-09-02 キヤノン株式会社 Illumination optical system and exposure apparatus using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651602B (en) * 2017-01-18 2019-02-21 日商佳能股份有限公司 Evaluation method, article manufacturing method, and evaluation program
TWI736303B (en) * 2019-06-05 2021-08-11 美商應用材料股份有限公司 Apertures for flat optical devices
US11982824B2 (en) 2020-07-20 2024-05-14 Applied Materials, Inc. Integrated conductive apertures for optical devices
CN113805439A (en) * 2021-09-23 2021-12-17 上海度宁科技有限公司 Projection photoetching machine, illumination system, control system and method

Also Published As

Publication number Publication date
WO2007119839A1 (en) 2007-10-25
JP2007287760A (en) 2007-11-01
KR20090019782A (en) 2009-02-25
EP2005253A1 (en) 2008-12-24
JP4784746B2 (en) 2011-10-05

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