TW200740611A - Multi-layer metal printing stencil and its fabricating method - Google Patents
Multi-layer metal printing stencil and its fabricating methodInfo
- Publication number
- TW200740611A TW200740611A TW095115022A TW95115022A TW200740611A TW 200740611 A TW200740611 A TW 200740611A TW 095115022 A TW095115022 A TW 095115022A TW 95115022 A TW95115022 A TW 95115022A TW 200740611 A TW200740611 A TW 200740611A
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- stencil
- micro holes
- cover layer
- metal cover
- Prior art date
Links
Landscapes
- Printing Plates And Materials Therefor (AREA)
Abstract
A multi-layer metal printing stencil and its fabricating method are disclosed. The stencil mainly includes a film-like electrocasted body and a metal cover layer film. The body is made of nickel or nickel alloy and has a plurality of micro holes in equal pitch alignment, wherein the depth of the micro holes is between 3~150 μm. The metal cover layer is formed on the body to mask part of the micro holes. In addition, the metal cover layer has at least an empty region which exposing area contains two or more than two of the micro holes. Accordingly, the stencil can replace conventional screen utilized in thick film processes to solve problem of thickness deviation at fabric cross-over for production of a thinner and evener film, and it also provides a good reproducibility for process. Furthermore, conventional photosensitive emulsion may be omitted for production of a patterned film by stencil printing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95115022A TWI306061B (en) | 2006-04-27 | 2006-04-27 | Multi-layer metal printing stencil and its fabricating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95115022A TWI306061B (en) | 2006-04-27 | 2006-04-27 | Multi-layer metal printing stencil and its fabricating method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200740611A true TW200740611A (en) | 2007-11-01 |
TWI306061B TWI306061B (en) | 2009-02-11 |
Family
ID=45071293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95115022A TWI306061B (en) | 2006-04-27 | 2006-04-27 | Multi-layer metal printing stencil and its fabricating method |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI306061B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103205781A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production process for a step electroformed stencil |
CN103203966A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production process for an electroformed step stencil |
CN103203964A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production process for an electroformed stencil |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI409173B (en) * | 2010-12-31 | 2013-09-21 | Au Optronics Corp | A printing system and the printing method thereof |
TWI421169B (en) * | 2011-09-23 | 2014-01-01 | Transonic Prec Ind Inc | Metal printing stencil preventing from rifting of slot hole |
-
2006
- 2006-04-27 TW TW95115022A patent/TWI306061B/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103205781A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production process for a step electroformed stencil |
CN103203966A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production process for an electroformed step stencil |
CN103203964A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production process for an electroformed stencil |
CN103203966B (en) * | 2012-01-16 | 2017-06-06 | 昆山允升吉光电科技有限公司 | A kind of manufacture craft of step electroforming template |
Also Published As
Publication number | Publication date |
---|---|
TWI306061B (en) | 2009-02-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |