TW200740611A - Multi-layer metal printing stencil and its fabricating method - Google Patents

Multi-layer metal printing stencil and its fabricating method

Info

Publication number
TW200740611A
TW200740611A TW095115022A TW95115022A TW200740611A TW 200740611 A TW200740611 A TW 200740611A TW 095115022 A TW095115022 A TW 095115022A TW 95115022 A TW95115022 A TW 95115022A TW 200740611 A TW200740611 A TW 200740611A
Authority
TW
Taiwan
Prior art keywords
film
stencil
micro holes
cover layer
metal cover
Prior art date
Application number
TW095115022A
Other languages
Chinese (zh)
Other versions
TWI306061B (en
Inventor
Po-Chien Lee
Original Assignee
Transonic Prec Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Transonic Prec Ind Inc filed Critical Transonic Prec Ind Inc
Priority to TW95115022A priority Critical patent/TWI306061B/en
Publication of TW200740611A publication Critical patent/TW200740611A/en
Application granted granted Critical
Publication of TWI306061B publication Critical patent/TWI306061B/en

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Abstract

A multi-layer metal printing stencil and its fabricating method are disclosed. The stencil mainly includes a film-like electrocasted body and a metal cover layer film. The body is made of nickel or nickel alloy and has a plurality of micro holes in equal pitch alignment, wherein the depth of the micro holes is between 3~150 μm. The metal cover layer is formed on the body to mask part of the micro holes. In addition, the metal cover layer has at least an empty region which exposing area contains two or more than two of the micro holes. Accordingly, the stencil can replace conventional screen utilized in thick film processes to solve problem of thickness deviation at fabric cross-over for production of a thinner and evener film, and it also provides a good reproducibility for process. Furthermore, conventional photosensitive emulsion may be omitted for production of a patterned film by stencil printing.
TW95115022A 2006-04-27 2006-04-27 Multi-layer metal printing stencil and its fabricating method TWI306061B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95115022A TWI306061B (en) 2006-04-27 2006-04-27 Multi-layer metal printing stencil and its fabricating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95115022A TWI306061B (en) 2006-04-27 2006-04-27 Multi-layer metal printing stencil and its fabricating method

Publications (2)

Publication Number Publication Date
TW200740611A true TW200740611A (en) 2007-11-01
TWI306061B TWI306061B (en) 2009-02-11

Family

ID=45071293

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95115022A TWI306061B (en) 2006-04-27 2006-04-27 Multi-layer metal printing stencil and its fabricating method

Country Status (1)

Country Link
TW (1) TWI306061B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103205781A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A production process for a step electroformed stencil
CN103203966A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A production process for an electroformed step stencil
CN103203964A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A production process for an electroformed stencil

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409173B (en) * 2010-12-31 2013-09-21 Au Optronics Corp A printing system and the printing method thereof
TWI421169B (en) * 2011-09-23 2014-01-01 Transonic Prec Ind Inc Metal printing stencil preventing from rifting of slot hole

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103205781A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A production process for a step electroformed stencil
CN103203966A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A production process for an electroformed step stencil
CN103203964A (en) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 A production process for an electroformed stencil
CN103203966B (en) * 2012-01-16 2017-06-06 昆山允升吉光电科技有限公司 A kind of manufacture craft of step electroforming template

Also Published As

Publication number Publication date
TWI306061B (en) 2009-02-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees