TW200739937A - Method and device for manufacturing the evaporated film pattern of light-emitting diode - Google Patents

Method and device for manufacturing the evaporated film pattern of light-emitting diode

Info

Publication number
TW200739937A
TW200739937A TW095113301A TW95113301A TW200739937A TW 200739937 A TW200739937 A TW 200739937A TW 095113301 A TW095113301 A TW 095113301A TW 95113301 A TW95113301 A TW 95113301A TW 200739937 A TW200739937 A TW 200739937A
Authority
TW
Taiwan
Prior art keywords
positioning
manufacturing
wafer
emitting diode
light
Prior art date
Application number
TW095113301A
Other languages
Chinese (zh)
Other versions
TWI303114B (en
Inventor
Zheng Gong
Original Assignee
Tyntek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyntek Corp filed Critical Tyntek Corp
Priority to TW095113301A priority Critical patent/TW200739937A/en
Publication of TW200739937A publication Critical patent/TW200739937A/en
Application granted granted Critical
Publication of TWI303114B publication Critical patent/TWI303114B/zh

Links

Abstract

Disclosed are a method and a device for manufacturing evaporated film pattern of light-emitting diode, wherein the method comprises the following steps: (a) positioning a carrier on a magnetic attraction element, (b) positioning a wafer in the carrier, (c) positioning a non-magnetic metal mask on the wafer to allow the non-magnetic metal mask to be retained by the magnetic attraction of the magnetic attraction element in order to clamp and thus fix the wafer, and (d) positioning a plurality of above-described devices on a spherical portion of a evaporation turntable to allow the metal vapor source to form the coated images with an angle nearly perpendicular to the wafers. Products manufactured with the above steps can substantially reduce the manufacturing costs and mass production can be easily realized.
TW095113301A 2006-04-14 2006-04-14 Method and device for manufacturing the evaporated film pattern of light-emitting diode TW200739937A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095113301A TW200739937A (en) 2006-04-14 2006-04-14 Method and device for manufacturing the evaporated film pattern of light-emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095113301A TW200739937A (en) 2006-04-14 2006-04-14 Method and device for manufacturing the evaporated film pattern of light-emitting diode

Publications (2)

Publication Number Publication Date
TW200739937A true TW200739937A (en) 2007-10-16
TWI303114B TWI303114B (en) 2008-11-11

Family

ID=45070637

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113301A TW200739937A (en) 2006-04-14 2006-04-14 Method and device for manufacturing the evaporated film pattern of light-emitting diode

Country Status (1)

Country Link
TW (1) TW200739937A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI612166B (en) * 2016-04-08 2018-01-21 Method and device for forming light-emitting diode evaporation film pattern with non-magnetic metal mask and high temperature resistant and high magnetic magnetic adsorption component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI612166B (en) * 2016-04-08 2018-01-21 Method and device for forming light-emitting diode evaporation film pattern with non-magnetic metal mask and high temperature resistant and high magnetic magnetic adsorption component

Also Published As

Publication number Publication date
TWI303114B (en) 2008-11-11

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