TW200739707A - Substrate processing device and substrate processing method - Google Patents

Substrate processing device and substrate processing method

Info

Publication number
TW200739707A
TW200739707A TW095149003A TW95149003A TW200739707A TW 200739707 A TW200739707 A TW 200739707A TW 095149003 A TW095149003 A TW 095149003A TW 95149003 A TW95149003 A TW 95149003A TW 200739707 A TW200739707 A TW 200739707A
Authority
TW
Taiwan
Prior art keywords
substrate processing
introduction
chamber
processing device
room
Prior art date
Application number
TW095149003A
Other languages
Chinese (zh)
Inventor
Hiroshi Nagayasu
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200739707A publication Critical patent/TW200739707A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A substrate processing device in which an airflow that is straightened in one direction can be achieved in a chamber. The substrate processing device (40) has the chamber (50), an introduction path (52) connected to the chamber and supplying gas into the chamber, a partition member (60) provided in the chamber and partitioning the inside of the chamber into both a processing room (44) for receiving a substrate to be processed and an introduction room (46) connected to the introduction path, and a flow straightening member (66) provided on the partition member in the introduction room. The introduction room has a first introduction section (46a) connected to the introduction path and also has a second introduction path (46b) provided across the flow straightening member from the first introduction section. Through-holes (62) are formed in that portion of the partition member (60) which corresponds to the second introduction section.
TW095149003A 2005-12-27 2006-12-26 Substrate processing device and substrate processing method TW200739707A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005374585A JP2009064795A (en) 2005-12-27 2005-12-27 Substrate processing device and substrate processing method

Publications (1)

Publication Number Publication Date
TW200739707A true TW200739707A (en) 2007-10-16

Family

ID=38217828

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149003A TW200739707A (en) 2005-12-27 2006-12-26 Substrate processing device and substrate processing method

Country Status (3)

Country Link
JP (1) JP2009064795A (en)
TW (1) TW200739707A (en)
WO (1) WO2007074607A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706433B (en) * 2016-07-12 2020-10-01 大陸商盛美半導體設備（上海）股份有限公司 Method and device for cleaning and drying integrated circuit substrate

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10573507B2 (en) 2014-03-28 2020-02-25 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method
US10553421B2 (en) 2015-05-15 2020-02-04 Tokyo Electron Limited Substrate processing apparatus, substrate processing method and storage medium
JP6642597B2 (en) * 2018-02-02 2020-02-05 信越半導体株式会社 Wafer cleaning apparatus and wafer cleaning method
JP6602940B2 (en) * 2018-11-22 2019-11-06 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT413162B (en) * 2001-09-26 2005-11-15 Sez Ag RINGTONED RECORDING DEVICE FOR A ROTATING SUPPORT FOR RECEIVING A DISCONNECTED OBJECT SUCH AS A SEMICONDUCTOR WAFER
JP4187069B2 (en) * 2003-09-18 2008-11-26 大日本スクリーン製造株式会社 Substrate processing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706433B (en) * 2016-07-12 2020-10-01 大陸商盛美半導體設備（上海）股份有限公司 Method and device for cleaning and drying integrated circuit substrate

Also Published As

Publication number Publication date
WO2007074607A1 (en) 2007-07-05
JP2009064795A (en) 2009-03-26

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