TW200739081A - Inspecting method and adjusting method of pressure of probe - Google Patents
Inspecting method and adjusting method of pressure of probeInfo
- Publication number
- TW200739081A TW200739081A TW095112818A TW95112818A TW200739081A TW 200739081 A TW200739081 A TW 200739081A TW 095112818 A TW095112818 A TW 095112818A TW 95112818 A TW95112818 A TW 95112818A TW 200739081 A TW200739081 A TW 200739081A
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- region
- pressure
- test
- inspecting
- Prior art date
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
A method for inspecting the pressure of a probe is provided. A wafer having a reference region and a test region on a scribe line is provided. When a probe is contacted to the reference region and/or is contacted to at least one sub-region of the test region, a voltage is applied to electrically connect the probe with a first device in the reference region and/or a second device in the sub-region, such that values of a reference current and/or a test current are obtained correspondingly. A data-processing step is performed using the values of the reference current and the test current to obtain a total area of the sub-region. The total area is compared with a standard value to obtain a relationship between the pressure of the probe and a standard pressure of the probe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95112818A TWI302201B (en) | 2006-04-11 | 2006-04-11 | Inspecting method and adjusting method of pressure of probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95112818A TWI302201B (en) | 2006-04-11 | 2006-04-11 | Inspecting method and adjusting method of pressure of probe |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200739081A true TW200739081A (en) | 2007-10-16 |
TWI302201B TWI302201B (en) | 2008-10-21 |
Family
ID=45070425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95112818A TWI302201B (en) | 2006-04-11 | 2006-04-11 | Inspecting method and adjusting method of pressure of probe |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI302201B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103207293A (en) * | 2012-01-12 | 2013-07-17 | 旺矽科技股份有限公司 | Probe needle pressure correction method and correction equipment thereof |
CN112014710A (en) * | 2020-08-27 | 2020-12-01 | 泉芯集成电路制造(济南)有限公司 | Needle pressure adapting method and device, needle testing equipment and readable storage medium |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201337287A (en) * | 2012-03-01 | 2013-09-16 | Mpi Corp | Probe probing force setting method and probing method and system using the method |
CN103293503B (en) * | 2013-05-24 | 2017-02-08 | 上海华虹宏力半导体制造有限公司 | Probe card detecting method |
-
2006
- 2006-04-11 TW TW95112818A patent/TWI302201B/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103207293A (en) * | 2012-01-12 | 2013-07-17 | 旺矽科技股份有限公司 | Probe needle pressure correction method and correction equipment thereof |
CN103207293B (en) * | 2012-01-12 | 2016-01-06 | 旺矽科技股份有限公司 | Probe needle pressure correction method and correction equipment thereof |
CN112014710A (en) * | 2020-08-27 | 2020-12-01 | 泉芯集成电路制造(济南)有限公司 | Needle pressure adapting method and device, needle testing equipment and readable storage medium |
CN112014710B (en) * | 2020-08-27 | 2023-04-21 | 泉芯集成电路制造(济南)有限公司 | Acupressure adaptation method, acupressure adaptation device, acupressure equipment and readable storage medium |
Also Published As
Publication number | Publication date |
---|---|
TWI302201B (en) | 2008-10-21 |
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