TW200739081A - Inspecting method and adjusting method of pressure of probe - Google Patents

Inspecting method and adjusting method of pressure of probe

Info

Publication number
TW200739081A
TW200739081A TW095112818A TW95112818A TW200739081A TW 200739081 A TW200739081 A TW 200739081A TW 095112818 A TW095112818 A TW 095112818A TW 95112818 A TW95112818 A TW 95112818A TW 200739081 A TW200739081 A TW 200739081A
Authority
TW
Taiwan
Prior art keywords
probe
region
pressure
test
inspecting
Prior art date
Application number
TW095112818A
Other languages
Chinese (zh)
Other versions
TWI302201B (en
Inventor
Kuo-Yin Huang
Yun-Han Lin
Original Assignee
Promos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Promos Technologies Inc filed Critical Promos Technologies Inc
Priority to TW95112818A priority Critical patent/TWI302201B/en
Publication of TW200739081A publication Critical patent/TW200739081A/en
Application granted granted Critical
Publication of TWI302201B publication Critical patent/TWI302201B/en

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

A method for inspecting the pressure of a probe is provided. A wafer having a reference region and a test region on a scribe line is provided. When a probe is contacted to the reference region and/or is contacted to at least one sub-region of the test region, a voltage is applied to electrically connect the probe with a first device in the reference region and/or a second device in the sub-region, such that values of a reference current and/or a test current are obtained correspondingly. A data-processing step is performed using the values of the reference current and the test current to obtain a total area of the sub-region. The total area is compared with a standard value to obtain a relationship between the pressure of the probe and a standard pressure of the probe.
TW95112818A 2006-04-11 2006-04-11 Inspecting method and adjusting method of pressure of probe TWI302201B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95112818A TWI302201B (en) 2006-04-11 2006-04-11 Inspecting method and adjusting method of pressure of probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95112818A TWI302201B (en) 2006-04-11 2006-04-11 Inspecting method and adjusting method of pressure of probe

Publications (2)

Publication Number Publication Date
TW200739081A true TW200739081A (en) 2007-10-16
TWI302201B TWI302201B (en) 2008-10-21

Family

ID=45070425

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95112818A TWI302201B (en) 2006-04-11 2006-04-11 Inspecting method and adjusting method of pressure of probe

Country Status (1)

Country Link
TW (1) TWI302201B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103207293A (en) * 2012-01-12 2013-07-17 旺矽科技股份有限公司 Probe needle pressure correction method and correction equipment thereof
CN112014710A (en) * 2020-08-27 2020-12-01 泉芯集成电路制造(济南)有限公司 Needle pressure adapting method and device, needle testing equipment and readable storage medium

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201337287A (en) * 2012-03-01 2013-09-16 Mpi Corp Probe probing force setting method and probing method and system using the method
CN103293503B (en) * 2013-05-24 2017-02-08 上海华虹宏力半导体制造有限公司 Probe card detecting method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103207293A (en) * 2012-01-12 2013-07-17 旺矽科技股份有限公司 Probe needle pressure correction method and correction equipment thereof
CN103207293B (en) * 2012-01-12 2016-01-06 旺矽科技股份有限公司 Probe needle pressure correction method and correction equipment thereof
CN112014710A (en) * 2020-08-27 2020-12-01 泉芯集成电路制造(济南)有限公司 Needle pressure adapting method and device, needle testing equipment and readable storage medium
CN112014710B (en) * 2020-08-27 2023-04-21 泉芯集成电路制造(济南)有限公司 Acupressure adaptation method, acupressure adaptation device, acupressure equipment and readable storage medium

Also Published As

Publication number Publication date
TWI302201B (en) 2008-10-21

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