TW200737537A - Flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method thereof - Google Patents

Flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method thereof

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Publication number
TW200737537A
TW200737537A TW095109311A TW95109311A TW200737537A TW 200737537 A TW200737537 A TW 200737537A TW 095109311 A TW095109311 A TW 095109311A TW 95109311 A TW95109311 A TW 95109311A TW 200737537 A TW200737537 A TW 200737537A
Authority
TW
Taiwan
Prior art keywords
surge
flip
package structure
manufacturing
chip
Prior art date
Application number
TW095109311A
Other languages
Chinese (zh)
Other versions
TWI305063B (en
Inventor
Kuo-Chin Huang
Wen-How Lan
Shri-Ming Pan
Zhi-Wei Yang
Fen-Ren Chien
Original Assignee
Formosa Epitaxy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formosa Epitaxy Inc filed Critical Formosa Epitaxy Inc
Priority to TW095109311A priority Critical patent/TW200737537A/en
Publication of TW200737537A publication Critical patent/TW200737537A/en
Application granted granted Critical
Publication of TWI305063B publication Critical patent/TWI305063B/zh

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  • Led Devices (AREA)

Abstract

The invention relates to a flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method. The flip-chip LED package structure includes a carrier, an LED chip, an anti-surge protection layer, a first conduction component, and a second conduction component. The manufacturing method includes the steps of: firstly forming the anti-surge protection layer on the carrier; next forming the first and the second conduction components and then connecting the LED chip with the first and the second conduction components; finally forming the package structure of a flip-chip LED. If the bias voltage of the anti-surge protection layer overtakes a threshold voltage, the surge current flows through the anti-surge protection layer to form a current path for efficiently preventing the current surge or electrostatic charges from damaging the LED chip.
TW095109311A 2006-03-17 2006-03-17 Flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method thereof TW200737537A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095109311A TW200737537A (en) 2006-03-17 2006-03-17 Flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095109311A TW200737537A (en) 2006-03-17 2006-03-17 Flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200737537A true TW200737537A (en) 2007-10-01
TWI305063B TWI305063B (en) 2009-01-01

Family

ID=45071071

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095109311A TW200737537A (en) 2006-03-17 2006-03-17 Flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TW200737537A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI461697B (en) * 2011-11-16 2014-11-21 Advantest Corp Test carrier

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474522B (en) * 2011-05-12 2015-02-21 矽品精密工業股份有限公司 Package structure and method of making same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI461697B (en) * 2011-11-16 2014-11-21 Advantest Corp Test carrier

Also Published As

Publication number Publication date
TWI305063B (en) 2009-01-01

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