TW200737537A - Flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method thereof - Google Patents
Flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method thereofInfo
- Publication number
- TW200737537A TW200737537A TW095109311A TW95109311A TW200737537A TW 200737537 A TW200737537 A TW 200737537A TW 095109311 A TW095109311 A TW 095109311A TW 95109311 A TW95109311 A TW 95109311A TW 200737537 A TW200737537 A TW 200737537A
- Authority
- TW
- Taiwan
- Prior art keywords
- surge
- flip
- package structure
- manufacturing
- chip
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
The invention relates to a flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method. The flip-chip LED package structure includes a carrier, an LED chip, an anti-surge protection layer, a first conduction component, and a second conduction component. The manufacturing method includes the steps of: firstly forming the anti-surge protection layer on the carrier; next forming the first and the second conduction components and then connecting the LED chip with the first and the second conduction components; finally forming the package structure of a flip-chip LED. If the bias voltage of the anti-surge protection layer overtakes a threshold voltage, the surge current flows through the anti-surge protection layer to form a current path for efficiently preventing the current surge or electrostatic charges from damaging the LED chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095109311A TW200737537A (en) | 2006-03-17 | 2006-03-17 | Flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095109311A TW200737537A (en) | 2006-03-17 | 2006-03-17 | Flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200737537A true TW200737537A (en) | 2007-10-01 |
TWI305063B TWI305063B (en) | 2009-01-01 |
Family
ID=45071071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095109311A TW200737537A (en) | 2006-03-17 | 2006-03-17 | Flip-chip LED package structure with anti-surge and electrostatic protection and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200737537A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI461697B (en) * | 2011-11-16 | 2014-11-21 | Advantest Corp | Test carrier |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI474522B (en) * | 2011-05-12 | 2015-02-21 | 矽品精密工業股份有限公司 | Package structure and method of making same |
-
2006
- 2006-03-17 TW TW095109311A patent/TW200737537A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI461697B (en) * | 2011-11-16 | 2014-11-21 | Advantest Corp | Test carrier |
Also Published As
Publication number | Publication date |
---|---|
TWI305063B (en) | 2009-01-01 |
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